TWI667733B - Sheet laminate for resin film formation - Google Patents
Sheet laminate for resin film formation Download PDFInfo
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- TWI667733B TWI667733B TW104142222A TW104142222A TWI667733B TW I667733 B TWI667733 B TW I667733B TW 104142222 A TW104142222 A TW 104142222A TW 104142222 A TW104142222 A TW 104142222A TW I667733 B TWI667733 B TW I667733B
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- resin film
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- forming layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Condensed Matter Physics & Semiconductors (AREA)
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- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Adhesive Tapes (AREA)
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Abstract
提供提供一種能夠將樹脂膜形成用板片從剝離板片容易放出,且能夠穩定地進行貼附在被著體之樹脂膜形成用板片層積體。 Provided is a laminated sheet for forming a resin film which can be easily attached to a substrate from which a sheet for forming a resin film can be easily released from a release sheet.
本發明的樹脂膜形成用板片積層體,於包含支撐板片與樹脂膜形成層的樹脂膜形成用板片之樹脂膜形成層側層積剝離板片而成,剝離板片不具有從樹脂膜形成層側的面沿著樹脂膜形成層的外周部之切入部。 The sheet laminate for resin film formation of the present invention is obtained by laminating a release sheet from the resin film formation layer side of the resin film formation sheet including the support sheet and the resin film formation layer, and the release sheet does not have a resin. The surface on the side of the film formation layer is along the cut portion of the outer peripheral portion of the resin film forming layer.
Description
本發明有關於一種對被著體之樹脂膜形成用板片的貼附為容易的樹脂膜形成用板片層積體。 The present invention relates to a laminated sheet for forming a resin film which is easy to attach to a sheet for forming a resin film to be formed.
近年來,使用被稱為所謂倒裝(face down)方式之封裝法來進行製造半導體裝置。在倒裝方式中,使用在電路面上具有凸塊等的電極之半導體晶片(以下,亦簡稱為「晶片」)且將該電極與基板接合。因此,晶片之與電路面為相反側的面(晶片背面)具有露出之情形。 In recent years, a semiconductor device has been manufactured using a packaging method called a face down method. In the flip-chip method, a semiconductor wafer (hereinafter also simply referred to as a "wafer") having electrodes such as bumps on a circuit surface is used, and the electrodes are bonded to the substrate. Therefore, the surface of the wafer opposite to the circuit surface (the back surface of the wafer) is exposed.
該露出的晶片背面,具有使用有機膜來保護之情形。先前,具有由該有機膜所構成的保護膜之晶片,係將液狀樹脂使用旋轉塗佈法而塗佈在晶圓背面,進行乾燥、硬化且在將保護膜與晶圓同時切斷而得到。但是,因為如此進行而形成之保護膜的厚度精度不充分,所以製品的產率有低落之情形。 The exposed wafer back surface is protected by an organic film. In the prior art, a wafer having a protective film made of the organic film is applied to a back surface of a wafer by a spin coating method, dried, cured, and simultaneously cut by a protective film and a wafer. . However, since the thickness precision of the protective film formed by doing so is not sufficient, the yield of the product is low.
為了解決此種問題,具有使用保護膜形成用板片之情形,該保護膜形成用板片在具有黏著劑層之黏著板片的黏著劑層上層積半導體背面保護膜形成用薄膜而成。 In order to solve such a problem, in the case of using a sheet for forming a protective film, the sheet for forming a protective film is formed by laminating a film for forming a semiconductor back surface protective film on an adhesive layer of an adhesive sheet having an adhesive layer.
而且,在大徑的狀態下所製造之半導體晶圓,係在被切斷分離(切割)成為元件小片(半導體晶片)之後,亦有被移送至下一個步驟亦即接合(bonding)步驟之情形。此 時,半導體晶圓係在預先被貼附在接著板片的狀態下施行切割、洗淨、乾燥、擴展(expanding)及拾取(pick up)之各步驟之後,被移送至下一個步驟的接合步驟。 Further, the semiconductor wafer manufactured in a state of a large diameter is transferred to the next step, that is, the bonding step, after being cut (separated) into a small piece (semiconductor wafer). . this At this time, the semiconductor wafer is transferred to the bonding step of the next step after each step of cutting, washing, drying, expanding, and picking up in a state of being attached to the subsequent sheet. .
在此些步驟之中,為了將拾取步驟及接合步驟的製程簡略化,有各種提案揭示同時兼備晶圓固定功能與晶粒接著功能之切割.晶粒接合用接著板片。例如,藉由使用前述接著板片,能夠得到在背面貼附有接著劑層之半導體晶片,使得有機基板-晶片間、引線框-晶片間、晶片-晶片間等的直接晶粒接合成為可能。 Among these steps, in order to simplify the process of the picking step and the bonding step, various proposals have revealed that the wafer fixing function and the die attach function are simultaneously cut. The die for bonding the die. For example, by using the above-described adhesive sheet, a semiconductor wafer having an adhesive layer adhered to the back surface can be obtained, and direct die bonding of the organic substrate-wafer, the lead frame-wafer, the wafer-wafer, and the like can be achieved.
於專利文獻1(專利第4677758號)中記載一種晶粒接合切割板片,其具備剝離基材、基材薄膜、以及配置於前述剝離基材與前述基材薄膜之間的黏接著劑層,於剝離基材沿著黏接著劑層的外周從黏接著劑層側的面形成規定深度的切入部。 A die-bonding dicing sheet having a release substrate, a base film, and an adhesive layer disposed between the release substrate and the base film, is disclosed in Patent Document 1 (No. 4,677,758). The peeling base material forms a cut portion having a predetermined depth from the surface of the adhesive layer side along the outer periphery of the adhesive layer.
而且,於專利文獻2(專利第5546985號)中記載一種半導體裝置製造用薄膜,在切割帶上層積有接著劑層的附接著劑層切割帶,前述接著劑層作為貼合面,以規定的間隔層積於分離器,於前述分離片沿著前述切割帶的外周形成有規定深度的切入。 Further, a film for producing a semiconductor device in which a film-attached layer of an adhesive layer is laminated on a dicing tape, and the adhesive layer is used as a bonding surface, and a predetermined film is described in Patent Document 2 (Patent No. 5,546,985). The separator is laminated on the separator, and the separator is formed with a predetermined depth along the outer circumference of the dicing tape.
[先前技術文獻] [Previous Technical Literature]
[專利文獻] [Patent Literature]
【專利文獻1】:日本專利第4677758號 [Patent Document 1]: Japanese Patent No. 4677758
【專利文獻2】:日本專利第5546985號 [Patent Document 2]: Japanese Patent No. 5,546,985
在半導體裝置的製造步驟中,係將具有上述黏接著劑層、接著層等的樹脂膜形成層之樹脂膜形成用板片貼附在半導體晶圓等的被著體。但是,在將樹脂膜形成用板片貼附在被著體之步驟,無法將樹脂膜形成用板片從剝離基材(分離片)順利地進行放出時,樹脂膜形成用板片有無法使用之情形。亦即,樹脂膜形成層與剝離板片密著,具有樹脂膜形成用板片無法貼附於被著體的情形 In the manufacturing process of the semiconductor device, the resin film-forming sheet having the resin film forming layer such as the adhesive layer or the adhesive layer is attached to a semiconductor wafer or the like. However, when the resin film-forming sheet is attached to the object, the resin film-forming sheet cannot be smoothly discharged from the release substrate (separate sheet), and the resin film-forming sheet cannot be used. The situation. In other words, the resin film forming layer is adhered to the peeling sheet, and the resin film forming sheet cannot be attached to the object.
本發明之目的係解決上述課題。亦即,本發明之目的,係提供一種能夠容易從剝離板片將樹脂膜形成用板片放出,且能夠穩定地進行貼附在被著體之樹脂膜形成用板片層積體。 The object of the present invention is to solve the above problems. In other words, it is an object of the present invention to provide a laminate for forming a resin film which can be easily attached to a substrate from a release sheet and which can be stably attached to a substrate.
本發明人們為了達成上述目的而努力研究的結果,發現製造樹脂膜形成用板片層積體時所形成的,於樹脂膜形成層的外周部之對剝離板片的切入,成為了妨礙樹脂膜形成層從剝離板片放出的原因。亦即是,得知於樹脂膜形成用板片層積體的製造步驟中,在進行樹脂膜形成層的模切之際一併切入至剝離板片,則樹脂膜形成層亦卡入剝離板片的切入部,剝離板片與樹脂膜形成層的界面之剝離無法順利的進行。基於此見解,發現藉由使用具有特定構成的樹脂膜形成用板片層積體,可以解決上述課題,從而完成本發明。 As a result of the inventors of the present invention, in order to achieve the above object, it has been found that the cutting of the peeling sheet formed on the outer peripheral portion of the resin film forming layer is formed when the sheet laminate for forming a resin film is formed, thereby hindering the resin film. The reason why the layer is released from the peeling sheet. In the manufacturing step of the laminated sheet for forming a resin film, the resin film forming layer is also stuck into the peeling sheet when the resin film forming layer is die-cut and cut into the peeling sheet. In the cut portion of the sheet, the peeling of the interface between the peeling sheet and the resin film forming layer could not be smoothly performed. Based on this finding, it has been found that the above problems can be solved by using a sheet laminate for forming a resin film having a specific configuration, and the present invention has been completed.
本發明包含以下要旨。 The present invention encompasses the following gist.
〔1〕一種樹脂膜形成用板片層積體,於包含支撐板片與樹脂膜形成層的樹脂膜形成用板片之樹脂膜形成側層積剝離板片而成,剝離板片不具有從樹脂膜形成層側的面沿著樹脂膜形成層的外周部之切入部。 [1] A laminated sheet for forming a resin film, which is formed by laminating a sheet of a resin film forming sheet comprising a supporting sheet and a resin film forming layer, and the peeling sheet does not have a peeling sheet. The surface on the resin film forming layer side is along the cut portion of the outer peripheral portion of the resin film forming layer.
〔2〕如〔1〕所記載的樹脂膜形成用板片層積體,其中支撐板片具有從樹脂膜形成層側的面沿著樹脂膜形成層的外周部之切入部,切入部的切入深度為0μm以上、支撐板片的厚度的2/3以下。 [2] The laminated sheet for forming a resin film according to the above aspect, wherein the support sheet has a cut portion from a surface on the side of the resin film forming layer along an outer peripheral portion of the resin film forming layer, and the cut portion of the cut portion The depth is 0 μm or more, and the thickness of the support sheet is 2/3 or less.
〔3〕如〔1〕或〔2〕所記載的樹脂膜形成用板片層積體,其中樹脂膜形成層的斷裂伸度為1000%以下,且斷裂強度為10N/mm2以下。 [3] The laminated sheet for forming a resin film according to the above [1], wherein the resin film forming layer has an elongation at break of 1000% or less and a breaking strength of 10 N/mm 2 or less.
〔4〕一種樹脂膜形成用板片層積體的製造方法,包括下述步驟:對包含支撐板片以及第1剝離板片的層積體之第1剝離板片進行模切;去除經模切的第1剝離板片,得到具有開口部的第1層積體;將樹脂膜形成層貼附在第1層積體的開口部側,沿著開口部的形狀割斷樹脂膜形成層,在支撐板片上殘留開口部形狀的樹脂膜形成層;於開口部的形狀的樹脂膜形成層側層積第2剝離板片以得到第2層積體;以及 從支撐板片側對第2層積體進行模切。 [4] A method for producing a laminated sheet for forming a resin film, comprising the steps of: die-cutting a first peeling sheet comprising a laminate of a supporting sheet and a first peeling sheet; and removing the mold The first peeled sheet piece is cut to obtain a first layered body having an opening; the resin film forming layer is attached to the opening side of the first layered body, and the resin film forming layer is cut along the shape of the opening. a resin film forming layer having an opening shape remaining on the support sheet; and a second peeling sheet is laminated on the resin film forming layer side of the opening to obtain a second laminate; The second laminate is die-cut from the support sheet side.
如依本發明的樹脂膜形成用板片層積體,在從剝離板片放出樹脂膜形成用板片時,能夠順利的進行樹脂膜形成用板片的放出。 According to the sheet laminate for forming a resin film of the present invention, when the sheet for forming a resin film is discharged from the release sheet, the sheet for forming a resin film can be smoothly discharged.
10‧‧‧樹脂膜形成用板片 10‧‧‧Plastic film forming sheet
11‧‧‧支撐板片(長條黏著板片) 11‧‧‧Support plate (long strip)
11a‧‧‧基材 11a‧‧‧Substrate
11b‧‧‧黏著劑層 11b‧‧‧Adhesive layer
12、12a‧‧‧樹脂膜形成層 12, 12a‧‧‧ resin film forming layer
12b‧‧‧樹脂膜形成層的剩餘部分 12b‧‧‧The remaining part of the resin film forming layer
13‧‧‧剝離板片(第2剝離板片、第2長條剝離板片) 13‧‧‧ peeling sheet (second peeling sheet, second stripping sheet)
14‧‧‧周邊膠帶 14‧‧‧Peripheral tape
15‧‧‧第1剝離板片(第1長條剝離板片) 15‧‧‧1st peeling sheet (1st strip peeling sheet)
15a‧‧‧第1長條剝離板片的剩餘部分 15a‧‧‧The remainder of the first strip peeling sheet
15b‧‧‧所希望形狀的剝離板片 15b‧‧‧ peeling sheets of the desired shape
15c‧‧‧開口部 15c‧‧‧ openings
16‧‧‧剝離板片(樹脂膜形成層轉印用板片) 16‧‧‧ peeling sheet (sheet for resin film forming layer transfer)
17‧‧‧兩緣部 17‧‧‧ Both Edges
32‧‧‧被著體(半導體晶圓) 32‧‧‧Bedding (semiconductor wafer)
34‧‧‧環狀框 34‧‧‧ ring frame
36‧‧‧載物台 36‧‧‧stage
42‧‧‧第1捲 42‧‧‧ Volume 1
44、54‧‧‧捲芯 44, 54‧‧‧core
52‧‧‧第2捲 52‧‧‧ Volume 2
62、66、68‧‧‧輥筒 62, 66, 68‧‧ ‧ rolls
64‧‧‧剝離板 64‧‧‧ peeling board
100‧‧‧樹脂膜形成用板片層積體 100‧‧‧Sheet laminate for resin film formation
D1、D2、D3‧‧‧切入部 D1, D2, D3‧‧‧cutting department
d1、d2、d3‧‧‧切入深度 D1, d2, d3‧‧‧ cut depth
第1a圖為進行將含有支撐板片11及樹脂膜形成層12a之樹脂膜形成用板片10貼附在半導體晶圓32的作業之一系列的步驟圖。 Fig. 1a is a step diagram showing a series of operations for attaching the resin film forming sheet 10 including the supporting sheet 11 and the resin film forming layer 12a to the semiconductor wafer 32.
第1b圖為進行將含有支撐板片11及樹脂膜形成層12a之樹脂膜形成用板片10貼附在半導體晶圓32的作業之一系列的步驟圖。 Fig. 1b is a step diagram showing a series of operations for attaching the resin film forming sheet 10 including the supporting sheet 11 and the resin film forming layer 12a to the semiconductor wafer 32.
第1c圖為進行將含有支撐板片11及樹脂膜形成層12a之樹脂膜形成用板片10貼附在半導體晶圓32的作業之一系列的步驟圖。 1C is a step diagram showing a series of operations for attaching the resin film forming sheet 10 including the supporting sheet 11 and the resin film forming layer 12a to the semiconductor wafer 32.
第1d圖為進行將含有支撐板片11及樹脂膜形成層12a之樹脂膜形成用板片10貼附在半導體晶圓32的作業之一系列的步驟圖。 Fig. 1d is a step diagram showing a series of operations for attaching the resin film forming sheet 10 including the supporting sheet 11 and the resin film forming layer 12a to the semiconductor wafer 32.
第2圖所示為本發明的樹脂膜形成用板片層積體之平面圖。 Fig. 2 is a plan view showing a laminate of a sheet for forming a resin film of the present invention.
第3圖所示為將第2圖所示的樹脂膜形成用板片沿著A-A線切斷時之示意剖面圖(第1態樣的樹脂膜形成用板片層積體)。 Fig. 3 is a schematic cross-sectional view showing the sheet for forming a resin film shown in Fig. 2 taken along the line A-A (the sheet laminate for forming a resin film of the first aspect).
第4圖所示為第2態樣的樹脂膜形成用板片層積體之示意剖面圖。 Fig. 4 is a schematic cross-sectional view showing a laminate sheet for forming a resin film according to a second aspect.
第5a圖所示為第1態樣的樹脂膜形成用板片層積體的製造步驟。 Fig. 5a is a view showing a manufacturing step of the sheet laminate for forming a resin film according to the first aspect.
第5b圖所示為第1態樣的樹脂膜形成用板片層積體的製造步驟。 Fig. 5b is a view showing a manufacturing step of the sheet laminate for forming a resin film according to the first aspect.
第5c圖所示為第1態樣的樹脂膜形成用板片層積體的製造步驟。 Fig. 5c is a view showing a manufacturing step of the sheet laminate for forming a resin film according to the first aspect.
第5d圖所示為第1態樣的樹脂膜形成用板片層積體的製造步驟。 Fig. 5d is a view showing a manufacturing step of the sheet laminate for forming a resin film according to the first aspect.
第5e圖所示為第1態樣的樹脂膜形成用板片層積體的製造步驟。 Fig. 5e is a view showing a manufacturing step of the sheet laminate for forming a resin film according to the first aspect.
第5f圖所示為第1態樣的樹脂膜形成用板片層積體的製造步驟。 Fig. 5f is a view showing a manufacturing step of the sheet laminate for forming a resin film according to the first aspect.
第5g圖所示為第1態樣的樹脂膜形成用板片層積體的製造步驟。 Fig. 5g is a view showing a manufacturing step of the sheet laminate for forming a resin film according to the first aspect.
以下詳細說明本發明的樹脂膜形成用板片層積體。 The sheet laminate for forming a resin film of the present invention will be described in detail below.
本發明的樹脂膜形成用板片層積體,於包含支撐板片與樹脂膜形成層的樹脂膜形成用板片之樹脂膜形成側層積剝離板片而成。而且,剝離板片不具有從樹脂膜形成層側的面沿著樹脂膜形成層的外周部之切入部。於樹脂膜形成用板片層積體的製造步驟中,如從樹脂膜形成層側的面沿著樹脂膜形成層的外 周部於切割板片形成切入部的話,樹脂膜形成層於其外周部卡入剝離板片。其結果,如第1a圖至第1d圖所示,於樹脂膜形成用板片層積體100的樹脂膜形成用板片10貼附於被著體32的步驟(以下亦記載為「被著體貼附步驟」)中,從剝離板片13放出樹脂膜形成用板片10變得困難。此問題不僅止於第1a圖至第1d圖所示的被著體貼附步驟,於被著體貼附樹脂膜形成用板片層積體的樹脂膜形成用板片的情形(例如是利用人工操作去除樹脂膜形成用板片層積體的剝離板片,並將樹脂膜形成用板片貼附於被著體的情形等)亦同樣產生相同的問題。 The laminated sheet for forming a resin film of the present invention is obtained by laminating a sheet from the resin film forming side of the sheet for forming a resin film forming the supporting sheet and the resin film forming layer. Further, the release sheet does not have a cut portion from the surface on the side of the resin film forming layer along the outer peripheral portion of the resin film forming layer. In the manufacturing step of the sheet laminate for forming a resin film, the surface from the resin film forming layer side is formed along the resin film forming layer. When the peripheral portion forms the cut portion in the cut sheet, the resin film forming layer is stuck to the peeling sheet at the outer peripheral portion thereof. As a result, as shown in FIG. 1A to FIG. 1D, the resin film forming sheet 10 of the resin film-forming sheet laminate 100 is attached to the object 32 (hereinafter also referred to as "being In the attaching step "), it is difficult to release the resin film forming sheet 10 from the peeling sheet 13 . This problem is not limited to the case of the resin film forming sheet in which the resin film forming sheet laminate is attached to the object to be adhered to the subject attaching step (for example, by manual operation) The same problem occurs in the same manner as in the case where the peeling sheet of the sheet laminate for resin film formation is removed and the sheet for forming a resin film is attached to the object.
如依本發明的樹脂膜形成用板片層積體,於樹脂膜形成用板片層積體的製造步驟中,由於不從樹脂膜形成層側的面沿著樹脂膜形成層的外周部於剝離板片形成切入部,樹脂膜形成層不會卡入剝離板片的切入部,在如第1a圖至第1d圖所示的被著體貼附步驟,或例如是藉由人工操作對被著體的貼附步驟中,從剝離板片13放出樹脂膜形成用板片10變得容易。其結果,能夠穩定的對被著體32進行樹脂膜形成層12a的貼附。尚且,剝離板片無切入部的確認方法,藉由後述的實施例所記載的方法進行。 In the step of producing the sheet laminate for a resin film, the surface of the resin film forming layer is not along the outer peripheral portion of the resin film forming layer in the manufacturing step of the resin film forming sheet laminate according to the present invention. The peeling sheet forms a cut-in portion, and the resin film forming layer does not get caught in the cut-in portion of the peeling sheet, and is subjected to the attaching step as shown in Figs. 1a to 1d, or is, for example, manually operated. In the attaching step of the body, it is easy to release the resin film forming sheet 10 from the peeling sheet 13 . As a result, the attachment of the resin film forming layer 12a to the object 32 can be stably performed. Further, the method for confirming the peeling-free portion of the peeled sheet is carried out by the method described in the examples below.
而且,如第2圖至第4圖所示,於樹脂膜形成用板片層積體100中,支撐板片11具有從樹脂膜形成層側的面沿著樹脂膜形成層的外周之切入部D1,切入部D1的切入深度d1較佳為0μm以上、支撐板片的厚度的2/3以下,更佳為0μm以上、支撐板片的厚度的1/2以下,再更佳為0μm以上、支撐板片的厚度的1/3以下,特佳為0μm以上、支撐板片的厚度的 1/4以下。尚且,切入部D1的切入深度d1為0μm情形,表示支撐板片11不具有切入部D1。而且,於第2圖至第4圖中,使用基材11a與黏著劑層11b所構成的黏著板片作為支撐板片11。 Further, as shown in FIGS. 2 to 4, in the resin film-forming sheet laminate 100, the support sheet 11 has a surface from the resin film formation layer side along the cut portion of the outer periphery of the resin film formation layer. D1, the cutting depth d1 of the cut portion D1 is preferably 0 μm or more, 2/3 or less of the thickness of the support sheet, more preferably 0 μm or more, 1/2 or less of the thickness of the support sheet, and more preferably 0 μm or more. 1/3 or less of the thickness of the support sheet, particularly preferably 0 μm or more, and the thickness of the support sheet 1/4 or less. Further, the case where the cutting depth d1 of the cut portion D1 is 0 μm indicates that the support sheet 11 does not have the cut portion D1. Further, in Figs. 2 to 4, an adhesive sheet composed of the substrate 11a and the adhesive layer 11b is used as the support sheet 11.
藉由設置規定深度的切入部D1,於使用黏著板片作為支撐板片11的情形,能夠防止支撐板片11的黏著劑層11b卡入基材11a所引起的,樹脂膜形成用板片層積體100的製造步驟或半導體裝置的製造步驟中,基材11a與黏著劑層11b之間的層間剝離。而且,本發明的切入部的切入深度,是藉由光學顯微鏡以倍率300倍進行切入部的剖面觀察,測定任意4點的切入部的切入深度並將此些平均的值。 By using the cut-in portion D1 having a predetermined depth, when the adhesive sheet is used as the support sheet 11, it is possible to prevent the adhesive layer 11b of the support sheet 11 from being caught in the substrate 11a, and the resin film-forming sheet layer is formed. In the manufacturing step of the integrated body 100 or the manufacturing step of the semiconductor device, the interlayer between the substrate 11a and the adhesive layer 11b is peeled off. Further, the incision depth of the incision portion of the present invention is a cross-sectional observation of the incision portion by an optical microscope at a magnification of 300 times, and the incision depth of the incision portion at any four points is measured and the average value is obtained.
而且,如同第2圖至第4圖所示,於樹脂膜形成用板片層積體100中,剝離板片13亦可以從樹脂膜形成層側的面而沿支撐板片11的外周具有切入深度d2的切入部D2。 Further, as shown in FIGS. 2 to 4, in the resin film-forming sheet laminate 100, the peeling sheet 13 may have a cut along the outer periphery of the support sheet 11 from the surface on the resin film forming layer side. The cut portion D2 of the depth d2.
使用黏著板片作為支撐板片11的情形,如於樹脂膜形成用板片層積體100的製造步驟中形成切入部D2的話,具有黏著劑層11b卡入剝離板片13的情形。其結果,於對被著體的貼附步驟中,具有難以從剝離板片13放出樹脂膜形成用板片10的疑慮。但是,一般而言,由於黏著劑層11b與樹脂膜形成層12a相較之下黏著力(接著力)低,黏著劑層11b難以卡入剝離板片13。因此,切入深度d2如為剝離板片13的厚度的2/3以下的話,能夠將黏著劑層11b的對剝離板片13的卡入抑制在最小限度,於對被著體的貼附步驟中,從剝離板片13將樹脂膜形成用板片10的放出變得不困難。尚且,在使 用僅以基材構成的支撐板片時,不會產生上述卡入的問題。 In the case where the adhesive sheet is used as the support sheet 11, the cut-up portion D2 is formed in the manufacturing step of the resin film-forming sheet laminate 100, and the adhesive sheet 11b is stuck in the peeling sheet 13. As a result, it is difficult to release the resin film forming sheet 10 from the peeling sheet 13 in the attaching step to the object. However, in general, since the adhesive force (adhesion force) of the adhesive layer 11b is lower than that of the resin film forming layer 12a, it is difficult for the adhesive layer 11b to be caught in the peeling sheet 13. Therefore, when the cutting depth d2 is 2/3 or less of the thickness of the peeling sheet 13, the engagement of the adhesive sheet 11b with respect to the peeling sheet 13 can be suppressed to a minimum, and in the attaching step to the subject It is not difficult to release the resin film forming sheet 10 from the peeling sheet 13 . Still, in making When the support sheet composed only of the base material is used, the above problem of the jam does not occur.
而且,藉由設置剝離板片13的厚度的1/10以上的切入深度的切入部D2,容易於樹脂膜形成用板片10與剝離板片13的界面做出剝離起點。其結果,樹脂膜形成用板片的放出性提升。 In addition, by providing the cut-in portion D2 having a depth of cut of 1/10 or more of the thickness of the peeling sheet 13, it is easy to form a peeling starting point at the interface between the resin film forming sheet 10 and the peeling sheet 13. As a result, the release property of the sheet for forming a resin film is improved.
而且,藉由使切入部D2為規定深度,能夠防止對被著體32的貼附步驟中剝離板片13的長度方向(流動方向)的應力引起的剝離板片13的斷裂。 Further, by setting the cut portion D2 to a predetermined depth, it is possible to prevent breakage of the peeling sheet piece 13 due to stress in the longitudinal direction (flow direction) of the peeling sheet piece 13 in the attaching step of the object 32.
而且,藉由形成切入部D2,樹脂膜形成用板片層積體100的製造步驟中能夠將樹脂膜形成用板片10確實的切斷為規定的形狀。 By the formation of the cut-in portion D2, the resin film-forming sheet laminate 10 can be surely cut into a predetermined shape in the manufacturing step of the resin film-forming sheet laminate 100.
而且,第1a圖至第1d圖所示的對被著體32的貼附步驟中,於剝離板片13的長度方向(流動方向)施加有應力。於剝離板片13不形成有切入部D2的話,具有該應力傳播至樹脂膜形成層12a,樹脂膜形成層12a於流動方向延伸的情形。樹脂膜形成層12a的變形(延伸),會使其厚度精度降低。其結果,具有成為使用該樹脂膜形成層12a的半導體裝置的可靠度降低的原因的情形。藉由在剝離板片13形成規定深度的切入部D2,能夠緩和施加在樹脂膜形成層12a的應力,抑制樹脂膜形成層12a的變形。 Further, in the attaching step to the subject 32 shown in FIGS. 1a to 1d, stress is applied to the longitudinal direction (flow direction) of the peeling sheet 13 . When the cut-away portion D2 is not formed in the peeling sheet 13, the stress propagates to the resin film forming layer 12a, and the resin film forming layer 12a extends in the flow direction. The deformation (extension) of the resin film forming layer 12a causes the thickness precision to be lowered. As a result, there is a case where the reliability of the semiconductor device using the resin film forming layer 12a is lowered. By forming the cut portion D2 having a predetermined depth in the peeling sheet 13, the stress applied to the resin film forming layer 12a can be alleviated, and the deformation of the resin film forming layer 12a can be suppressed.
依此觀點,切入部D2的切入深度d2,較佳為剝離板片13的厚度的1/10以上、2/3以下,更佳為1/5以上、3/5以下,再更佳為1/2以上、3/5以下,特佳為超過1/2,3/5以下。 From this point of view, the cutting depth d2 of the cut portion D2 is preferably 1/10 or more and 2/3 or less, more preferably 1/5 or more, 3/5 or less, and even more preferably 1 of the thickness of the peeling sheet 13 . /2 or more, 3/5 or less, particularly preferably more than 1/2, 3/5 or less.
支撐板片11與樹脂膜形成層12a,切斷為所希望的平面形狀,於剝離板片13上部分的層積。此處,支撐板片11或樹脂膜形成層12a的所希望平面形狀,例如是如第2圖所示,只要是使支撐板片11或樹脂膜形成層12a於剝離板片13上成為部分的層積的狀態的形狀,並沒有特別的限制。 The support sheet 11 and the resin film forming layer 12a are cut into a desired planar shape, and the upper portion of the peeling sheet 13 is laminated. Here, the desired planar shape of the support sheet 11 or the resin film forming layer 12a is, for example, as shown in Fig. 2, as long as the support sheet 11 or the resin film forming layer 12a is partially formed on the peeling sheet 13. The shape of the laminated state is not particularly limited.
作為支撐板片11的平面形狀,係以容易貼附在後述半導體裝置的製造步驟所使用的環狀框(ringframe)等的治具之形狀為佳,例如,可舉出圓形、大略圓形、四角形、五角形、六角形、八角形、晶圓形狀(圓的外周之一部分為直線之形狀)等。此些之中,為了減少被貼附在環狀框之部分以外的浪費部分,係以圓形和晶圓形狀為佳。 The planar shape of the support sheet 11 is preferably a shape of a jig that is easily attached to a ring frame used in a manufacturing process of a semiconductor device to be described later, and examples thereof include a circular shape and a substantially circular shape. , a quadrangle, a pentagon, a hexagon, an octagon, a wafer shape (one of the outer circumferences of the circle is a straight line shape), and the like. Among these, in order to reduce the wasted portion other than the portion attached to the annular frame, it is preferable to have a circular shape and a wafer shape.
而且,作為樹脂膜形成層12a的平面形狀,係以與半導體晶圓等被著體的平面形狀一致之形狀為佳,例如以圓形、大略圓形、四角形、五角形、六角形、八角形、晶圓形狀(圓的外周之一部分為直線之形狀)等容易貼附在被著體的形狀為佳。此些之中,為了減少被貼附在被著體之部分以外的浪費部分,係以圓形和晶圓形狀為佳。 Further, the planar shape of the resin film forming layer 12a is preferably a shape conforming to a planar shape of a semiconductor wafer or the like, for example, a circle, a substantially circular shape, a quadrangular shape, a pentagon shape, a hexagonal shape, and an octagonal shape. It is preferable that the shape of the wafer (the shape of a straight outer circumference is a straight line) or the like is easily attached to the shape of the object. Among these, in order to reduce the wasted portion other than the portion to be attached to the object, it is preferable to have a circular shape and a wafer shape.
以下,對樹脂膜形成用板片層積體的具體的態樣進行說明。 Hereinafter, a specific aspect of the sheet laminate for resin film formation will be described.
(第1態樣) (1st aspect)
第2圖係顯示本發明的樹脂膜形成用板片層積體100的第1態樣之平面圖,第3圖係將第2圖所顯示的樹脂膜形成用板片層積體100沿著A-A線切斷時的簡略式剖面圖。 2 is a plan view showing a first aspect of the resin film-forming sheet laminate 100 of the present invention, and FIG. 3 is a cross-sectional view of the resin film-forming sheet laminate 100 shown in FIG. A simplified cross-sectional view of the line cut.
如第2圖及第3圖所示,第1態樣之樹脂膜形成 用板片層積體100,其支撐板片11的直徑比樹脂膜形成層12a的直徑更大。而且,支撐板片11為由基材11a及黏著劑層11b所構成之黏著板片。尚且,如同後述,亦可以僅使用基材11a作為支撐板片。 As shown in Fig. 2 and Fig. 3, the resin film formation of the first aspect With the sheet laminate 100, the diameter of the support sheet 11 is larger than the diameter of the resin film forming layer 12a. Further, the support plate piece 11 is an adhesive sheet formed of the base material 11a and the adhesive layer 11b. Further, as will be described later, only the substrate 11a may be used as the support sheet.
(第2態樣) (the second aspect)
第4圖為第2態樣的樹脂膜形成用板片層積體100之簡略式剖面圖。在第2態樣之樹脂膜形成用板片層積體100,在俯視之支撐板片11的直徑係比樹脂膜形成層12a的直徑更大。而且,在樹脂膜形成用板片10的外周部,在剝離板片13與支撐板片11之間設置有環狀的治具接著層14。而且,剝離板片13亦可以沿著環狀的治具接著層14的內周具有切入部D3。 Fig. 4 is a schematic cross-sectional view showing a sheet laminate 100 for forming a resin film according to a second aspect. In the sheet laminate 10 for resin film formation of the second aspect, the diameter of the support sheet 11 in plan view is larger than the diameter of the resin film forming layer 12a. Further, in the outer peripheral portion of the resin film-forming sheet 10, an annular jig-attach layer 14 is provided between the peeling sheet 13 and the supporting sheet 11. Further, the peeling sheet piece 13 may have a cut portion D3 along the inner circumference of the annular jig attachment layer 14.
切入部D3的切入深度d3並沒有特別的限制,可以相同於、大於或小於切入部D2的切入深度d2,但較佳為剝離板片的厚度的1/10以上、2/3以下,更佳為1/10以上、3/5以下,再更佳為1/10以上、1/2以下。 The cutting depth d3 of the cut portion D3 is not particularly limited and may be the same as or greater than or smaller than the cut depth d2 of the cut portion D2, but is preferably 1/10 or more and 2/3 or less of the thickness of the peeling sheet, and more preferably It is 1/10 or more and 3/5 or less, and more preferably 1/10 or more and 1/2 or less.
藉由設置規定深度的切入部D3,變得更容易抑制被著體貼附步驟中於剝離板片13的長度方向(流動方向)施加的應力引起的樹脂膜形成層12a的變形。 By providing the cut portion D3 having a predetermined depth, it is easier to suppress deformation of the resin film forming layer 12a due to stress applied in the longitudinal direction (flow direction) of the peeling sheet 13 in the attaching step.
其次,對於構成樹脂膜形成用板片層積體100的各層進行說明。 Next, each layer constituting the sheet laminate for resin film formation 100 will be described.
(支撐板片) (support plate)
作為支撐板片,例如能夠使用聚乙烯薄膜、聚丙烯薄膜、聚丁烯薄膜、聚丁二烯薄膜、聚甲基戊烯薄膜、聚氯乙烯薄膜、氯乙烯共聚物薄膜、聚對苯二甲酸乙二酯薄膜、聚萘二甲酸乙 二酯薄膜、聚對苯二甲酸丁二酯薄膜、聚胺酯薄膜、乙烯乙酸乙烯酯共聚物薄膜、離子聚合物樹脂薄膜、乙烯.(甲基)丙烯酸共聚物薄膜、乙烯.(甲基)丙烯酸酯共聚物薄膜、聚苯乙烯薄膜、聚碳酸酯薄膜、聚醯亞胺薄膜、氟樹脂薄膜等。而且,亦可使用此些的交聯薄膜。而且亦可為此些的層積薄膜。 As the support sheet, for example, a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, a polymethylpentene film, a polyvinyl chloride film, a vinyl chloride copolymer film, or a polyterephthalic acid can be used. Ethylene glycol film, polyethylene naphthalate Diester film, polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate copolymer film, ionic polymer resin film, ethylene. (Meth)acrylic copolymer film, ethylene. (Meth) acrylate copolymer film, polystyrene film, polycarbonate film, polyimide film, fluororesin film, and the like. Moreover, such crosslinked films can also be used. It is also possible to laminate films for this purpose.
而且,亦能夠在上述薄膜的表面塗佈剝離劑而施行剝離處理。作為在剝離處理所使用的剝離劑,係能夠使用醇酸系、矽酮系、氟系、不飽和聚酯系、聚烯烴系、蠟系等,特別是由於醇酸系、矽酮系、氟系的剝離劑具有耐熱性而較佳。為了使用上述的剝離劑而對薄膜等的表面進行剝離處理,係將剝離劑直接在無溶劑的狀態下、或是使用溶劑稀釋和乳膠化且使用凹版塗佈機、邁耶氏棒(Mayer’s bar)塗佈機、氣動刮刀塗佈機、輥塗佈機等進行塗佈,而且將塗佈剝離劑後的剝離板片移送至常溫下或加熱下,或藉由電子射線使其硬化而形成剝離劑層即可。 Further, a release agent can also be applied to the surface of the film to apply a release agent. As the release agent used in the release treatment, an alkyd type, an anthrone type, a fluorine type, an unsaturated polyester type, a polyolefin type, a wax type, or the like can be used, and in particular, an alkyd type, an anthrone type, and a fluorine type can be used. The release agent is preferably heat resistant. In order to use the above-mentioned release agent to peel off the surface of a film or the like, the release agent is directly diluted in a solvent-free state, or diluted with a solvent, and a gravure coater, Mayer's bar is used. Coating with a coater, a pneumatic blade coater, a roll coater, etc., and transferring the release sheet after the release agent is applied to normal temperature or under heating, or by electron beam hardening to form a peeling The agent layer can be used.
而且,亦可以對上述薄膜的表面施加易接著處理。作為易接著處理並沒有特別的限制,例如是可舉出電暈放電處理。 Moreover, it is also possible to apply an easy subsequent treatment to the surface of the above film. There is no particular limitation on the ease of subsequent treatment, and for example, a corona discharge treatment can be mentioned.
上述薄膜的厚度通常為30~300μm,較佳為50~200μm程度。 The thickness of the above film is usually from 30 to 300 μm, preferably from 50 to 200 μm.
而且,如第2圖至第4圖所示,作為支撐板片11亦可以使用基材11a與黏著劑層11b所構成的黏著板片。 Further, as shown in FIGS. 2 to 4, as the support sheet 11, an adhesive sheet composed of the base material 11a and the adhesive layer 11b can be used.
在使用黏著板片作為支撐板片11時,在樹脂膜形成用板片10上對被著體施行切割等所需要的加工變為容易。 在該態樣,樹脂膜形成層12a被層積在被設置在基材11a上之黏著劑層11b上。作為基材11a,可舉出已例示作為支撐板片之上述的薄膜。 When the adhesive sheet is used as the support sheet 11, it is easy to perform the processing required for cutting or the like on the resin film forming sheet 10. In this aspect, the resin film forming layer 12a is laminated on the adhesive layer 11b provided on the substrate 11a. As the base material 11a, the above-described film which is a support sheet is exemplified.
尚且,如同後述的以紫外線硬化型黏著劑形成黏著劑層11b,並使用紫外線作為用以使黏著劑硬化所照射的能量線的情形,基材11a較佳是對紫外線透明的基材。尚且,使用電子線作為能量線的情形,基材11a不必要為透明。除了上述的薄膜之外,亦可以使用此些著色的透明薄膜、不透明薄膜。 Further, in the case where the adhesive layer 11b is formed of an ultraviolet curable adhesive as described later and ultraviolet rays are used as an energy ray for curing the adhesive, the substrate 11a is preferably a substrate transparent to ultraviolet rays. Further, in the case where an electron beam is used as the energy ray, the substrate 11a is not necessarily transparent. In addition to the above films, such colored transparent films and opaque films can also be used.
黏著劑層11b只要可使形成於其上的樹脂膜形成層12a剝離的話,並沒有特別的限制,可藉由以往公知的種種的黏著劑形成。作為此種的黏著劑,並沒有特別的限制,例如是橡膠系、丙烯酸系、矽酮系、聚乙烯醚等的再剝離性黏著劑。而且,為了使黏著劑層11b與樹脂膜形成層12a的界面剝離容易,亦可以使用能量線硬化型、加熱發泡型或水膨潤型的黏著劑。由於此些的黏著劑藉由規定的操作而使黏著力降低,從黏著劑層11b將樹脂膜形成層12a剝離變得容易。作為能量線硬化(紫外線硬化、電子線硬化)型黏著劑,特佳是使用紫外線硬化型黏著劑。黏著劑層11b的厚度通常為1~100μm,較佳為2~80μm程度。使用紫外線硬化型黏著劑作為用以形成黏著劑層11b的黏著劑的情形,亦可以在將樹脂膜形成層12a層積於黏著劑層11b上之前對黏著劑層11b照射紫外線,亦可以在將樹脂膜形成層12a層積於黏著劑層11b上之後對黏著劑層11b照射紫外線。 The adhesive layer 11b is not particularly limited as long as it can be peeled off from the resin film forming layer 12a formed thereon, and can be formed by various conventionally known adhesives. The adhesive is not particularly limited, and examples thereof include a re-peelable adhesive such as a rubber-based, acrylic-based, anthrone-based or polyvinyl ether. Moreover, in order to facilitate the peeling of the interface between the adhesive layer 11b and the resin film forming layer 12a, an energy ray-curing type, a heat-foaming type, or a water-swellable type of adhesive may be used. Since the adhesive is reduced in adhesion by a predetermined operation, it is easy to peel off the resin film forming layer 12a from the adhesive layer 11b. As an energy ray hardening (ultraviolet curing, electron beam hardening) type adhesive, it is particularly preferable to use an ultraviolet curing adhesive. The thickness of the adhesive layer 11b is usually from 1 to 100 μm, preferably from about 2 to 80 μm. In the case where an ultraviolet curable adhesive is used as the adhesive for forming the adhesive layer 11b, the adhesive layer 11b may be irradiated with ultraviolet rays before the resin film forming layer 12a is laminated on the adhesive layer 11b. After the resin film forming layer 12a is laminated on the adhesive layer 11b, the adhesive layer 11b is irradiated with ultraviolet rays.
而且,於使用黏著板片作為支撐板片的情形,由 使上述切入部D1所引起的效果確實的觀點,基材的厚度與黏著劑層的厚度的比(基材的厚度):(黏著劑層的厚度),較佳為1:1~200:1,更佳為2:1~150:1。 Moreover, in the case of using an adhesive sheet as a support sheet, The ratio of the thickness of the substrate to the thickness of the adhesive layer (thickness of the substrate): (thickness of the adhesive layer) is preferably 1:1 to 200:1 from the viewpoint of the effect of the cut portion D1. More preferably, it is 2:1~150:1.
(樹脂膜形成層12a) (Resin film forming layer 12a)
於支撐板片11上可剝離的層積樹脂膜形成層12a。 The laminated resin film forming layer 12a which is peelable on the support sheet 11 is formed.
樹脂膜形成層的斷裂伸度較佳為1000%以下,且樹脂膜形成層的斷裂強度較佳為10N/mm2以下。藉由使樹脂膜形成層的斷裂伸度與斷裂強度在上述範圍,於後述的樹脂膜形成用板片層積體的製造步驟中,樹脂膜形成層的割斷變得容易。由此觀點,樹脂膜形成層的斷裂伸度較佳為0.5~1000%,更佳為0.5~800%,斷裂強度較佳為0.1~10N/mm2,更佳為0.1~5N/mm2。樹脂膜形成層的斷裂伸度與斷裂強度,例如是可藉由後述的聚合物成分(A)的含量、其重量平均分子量、硬化性成分(B)的重量平均分子量(具體而言,環氧化合物(B11)的重量平均分子量、熱硬化劑(B12)的重量平均分子量等)來控制。尚且,樹脂膜形成層的斷裂伸度與斷裂強度,藉由後述實施例記載的方法測定。 The elongation at break of the resin film forming layer is preferably 1000% or less, and the breaking strength of the resin film forming layer is preferably 10 N/mm 2 or less. When the elongation at break and the breaking strength of the resin film-forming layer are in the above range, the resin film-forming layer can be easily cut in the production step of the sheet laminate for resin film formation to be described later. From this point of view, the elongation at break of the resin film-forming layer is preferably from 0.5 to 1,000%, more preferably from 0.5 to 800%, and the breaking strength is preferably from 0.1 to 10 N/mm 2 , more preferably from 0.1 to 5 N/mm 2 . The elongation at break and the breaking strength of the resin film-forming layer are, for example, the content of the polymer component (A) to be described later, the weight average molecular weight thereof, and the weight average molecular weight of the curable component (B) (specifically, epoxy The weight average molecular weight of the compound (B11), the weight average molecular weight of the thermosetting agent (B12), and the like are controlled. Further, the elongation at break and the breaking strength of the resin film-forming layer were measured by the method described in the examples below.
樹脂膜形成層至少要求的功能,為(1)板片形狀維持性、(2)初期接著性以及(3)硬化性。 At least the required functions of the resin film forming layer are (1) sheet shape maintenance, (2) initial adhesion, and (3) hardenability.
於樹脂膜形成層藉由添加黏合劑成分,能夠賦予(1)板片形狀維持性以及(3)硬化性,作為黏合劑成分,可使用含有聚合物成分(A)以及硬化性成分(B)的第1黏合劑成分,或者是使用含有兼備(A)成分以及(B)成分性質的硬化性聚合物成分(AB)的第2黏合劑成分。 By adding a binder component to the resin film formation layer, (1) sheet shape maintenance property and (3) hardenability can be provided, and as the binder component, a polymer component (A) and a curable component (B) can be used. The first binder component or the second binder component containing the curable polymer component (AB) having both the (A) component and the (B) component property.
尚且,在樹脂膜形成層硬化為止之間、用以使被著體暫時接著的功能之(2)初期接著性,可為感壓接著性,亦可為藉由熱軟化而接著的性質。(2)初期接著性可藉由通常黏合劑成分、後述無機填料(C)的配合量的調整等來控制。 Further, the (2) initial adhesion property between the resin film forming layer and the resin film forming layer to be temporarily adhered may be a pressure-sensitive adhesive property or a property which is followed by thermal softening. (2) The initial adhesion can be controlled by adjusting the amount of the usual binder component, the amount of the inorganic filler (C) to be described later, and the like.
(第1黏合劑成分) (1st binder component)
第1黏合劑成分藉由含有聚合物成分(A)以及硬化性成分(B),對樹脂膜形成層賦予板片形狀維持性與硬化性。尚且,為了方便與第2黏合劑成分區分,第1黏合劑成分不含硬化性聚合物成分(AB)。 The first binder component contains the polymer component (A) and the curable component (B), and imparts shape retention and hardenability to the resin film forming layer. Further, in order to facilitate the distinction between the second adhesive component and the second adhesive component, the first adhesive component does not contain the curable polymer component (AB).
(A)聚合物成分 (A) polymer component
聚合物成分(A)是為了賦予樹脂膜形成層的板片形狀維持性為主要目的,而添加至樹脂膜形成層。 The polymer component (A) is added to the resin film forming layer for the purpose of imparting shape maintenance of the resin film forming layer.
為了達成上述目的,聚合物成分(A)的重量平均分子量(Mw)通常為20,000以上,較佳為20,000~3,000,000。重量平均分子量(Mw)的值為藉由凝膠滲透層析法(GPC)法(聚苯乙烯標準)測定時的值。藉由此方法的測定,例如是在東曹公司製的高速GPC裝置「HLC-8120GPC」,使用以高速管柱「TSK gurd column HXL-H」、「TSK Gel GMHXL」、「TSK Gel G2000 HXL」(以上全部為東曹公司製)依此順序連接者,以管柱溫度:40℃、送液溫度:1.0mL/分的條件,以示差折射率計作為檢測器而進行(以下相同)。 In order to achieve the above object, the weight average molecular weight (Mw) of the polymer component (A) is usually 20,000 or more, preferably 20,000 to 3,000,000. The value of the weight average molecular weight (Mw) is a value measured by a gel permeation chromatography (GPC) method (polystyrene standard). For the measurement by this method, for example, the high-speed GPC device "HLC-8120GPC" manufactured by Tosoh Corporation uses the high-speed column "TSK gurd column H XL -H", "TSK Gel GMH XL ", "TSK Gel G2000". H XL ” (all of which are manufactured by Tosoh Corporation) are connected in this order, and the differential refractometer is used as a detector under the conditions of column temperature: 40° C. and liquid feeding temperature: 1.0 mL/min (the same applies hereinafter) ).
尚且,為了方便與後述的硬化性聚合物成分(AB)區分,聚合物成分(A)不具有後述的硬化功能官能性基。 Further, in order to facilitate the separation from the curable polymer component (AB) to be described later, the polymer component (A) does not have a curing functional group to be described later.
作為聚合物成分(A),可使用丙烯酸系聚合物、 聚酯、苯氧基樹脂(為了與後述的硬化性聚合物成分(AB)方便區分,限於無環氧基者。)、聚碳酸酯、聚醚、聚胺基甲酸酯、聚矽氧烷、橡膠系聚合物等。而且,亦可以使用此些的2種以上結合者,例如是,於具有羥基的丙烯酸系聚合物的丙烯酸多元醇中,藉由在分子末端與具有異氰酸酯基的胺基甲酸酯預聚物反應而得的丙烯酸胺基甲酸酯樹脂等。進而,包含2種以上結合的聚合物,亦可以組合使用此些的2種以上。 As the polymer component (A), an acrylic polymer can be used, Polyester or phenoxy resin (in order to be easily distinguished from the curable polymer component (AB) to be described later, it is limited to an epoxy group-free one), polycarbonate, polyether, polyurethane, polyoxyalkylene oxide , rubber-based polymers, etc. Further, it is also possible to use two or more kinds of such binders, for example, in an acrylic polyol having an acrylic polymer having a hydroxyl group, by reacting with a urethane prepolymer having an isocyanate group at a molecular terminal. The obtained urethane acrylate resin and the like. Further, two or more kinds of the above-mentioned polymers may be used in combination.
(A1)丙烯酸系聚合物 (A1) acrylic polymer
作為聚合物成分(A)較佳使用丙烯酸系聚合物(A1)。丙烯酸系聚合物(A1)的玻璃轉移溫度(Tg)較佳為-60~50℃,更佳為-50~40℃,再更佳為-40~30℃的範圍。丙烯酸聚合物(A1)的玻璃轉移溫度高則樹脂膜形成層的接著性降低,具有產生變得無法轉印至被著體,或轉印後樹脂膜形成層或樹脂膜形成層硬化而得的樹脂膜從被著體剝離等的不良的情形。而且,丙烯酸系聚合物(A1)的玻璃轉移溫度低的話,具有樹脂膜形成層與支撐板片的剝離力變大而產生樹脂膜形成層的轉印不良的情形。 As the polymer component (A), an acrylic polymer (A1) is preferably used. The glass transition temperature (Tg) of the acrylic polymer (A1) is preferably -60 to 50 ° C, more preferably -50 to 40 ° C, still more preferably -40 to 30 ° C. When the glass transition temperature of the acrylic polymer (A1) is high, the adhesion of the resin film forming layer is lowered, and the resulting resin film forming layer cannot be transferred to the object, or the resin film forming layer or the resin film forming layer is cured after transfer. The resin film is inferior from the object to be removed. In addition, when the glass transition temperature of the acrylic polymer (A1) is low, the peeling force of the resin film forming layer and the support sheet becomes large, and the transfer failure of the resin film forming layer may occur.
丙烯酸系聚合物(A1)的重量平均分子量較佳為100,000~2,000,000,更佳為300,000~1,500,000。丙烯酸聚合物(A1)的重量平均分子量高的話則樹脂膜形成層的接著性降低,並具有產生變得無法轉印至被著體,或轉印後樹脂膜形成層或樹脂膜剝離等的不良的情形。而且,丙烯酸系聚合物(A1)的重量平均分子量低的話則樹脂膜形成層與支撐板片的接著性變高,產生樹脂膜形成層的轉印不良的情形。藉由使丙烯酸 聚合物(A1)的重量平均分子量為上述範圍,能夠容易使樹脂膜形成層的斷裂伸度、斷裂強度於規定範圍。 The weight average molecular weight of the acrylic polymer (A1) is preferably from 100,000 to 2,000,000, more preferably from 300,000 to 1,500,000. When the weight average molecular weight of the acrylic polymer (A1) is high, the adhesion of the resin film forming layer is lowered, and there is a problem that the transfer of the resin film forming layer or the resin film is not performed, and the resin film forming layer or the resin film is peeled off after transfer. The situation. In addition, when the weight average molecular weight of the acrylic polymer (A1) is low, the adhesion between the resin film forming layer and the support sheet is increased, and the transfer failure of the resin film forming layer may occur. By making acrylic The weight average molecular weight of the polymer (A1) is in the above range, and the elongation at break and the breaking strength of the resin film forming layer can be easily made within a predetermined range.
丙烯酸系聚合物(A1)至少在構成的單體中包含(甲基)丙烯酸酯。 The acrylic polymer (A1) contains (meth) acrylate at least in the constituent monomers.
作為(甲基)丙烯酸酯,可舉出烷基的碳數為1~18的(甲基)丙烯酸烷基酯,具體而言,可舉(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸2-乙基己酯等;可舉出具有環狀骨架之(甲基)丙烯酸酯,具體而言,可舉(甲基)丙烯酸環烷酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸異冰片酯、二環戊基(甲基)丙烯酸酯、二環戊烯基(甲基)丙烯酸酯、二環戊烯氧乙基(甲基)丙烯酸酯、醯亞胺(甲基)丙烯酸酯等。而且,作為後述具有羥基的單體、具有羧基的單體或具有胺基單體所例示者之中,可例示為(甲基)丙烯酸酯。 The (meth) acrylate may, for example, be an alkyl (meth) acrylate having an alkyl group having 1 to 18 carbon atoms, and specific examples thereof include methyl (meth)acrylate and (meth)acrylic acid B. An ester, a propyl (meth)acrylate, a butyl (meth)acrylate, a 2-ethylhexyl (meth)acrylate, etc., and a (meth)acrylate which has a cyclic skeleton, specifically, Examples thereof include cycloalkyl (meth)acrylate, benzyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentyl (meth)acrylate, and dicyclopentenyl (meth)acrylate. , dicyclopentene oxyethyl (meth) acrylate, quinone imine (meth) acrylate, and the like. Further, among the monomers having a hydroxyl group, a monomer having a carboxyl group, or an amine group-containing monomer, which will be described later, a (meth)acrylate can be exemplified.
尚且,本發明的(甲基)丙烯酸,其含意為包含丙烯酸以及甲基丙烯酸的兩者。 Further, the (meth)acrylic acid of the present invention is intended to include both acrylic acid and methacrylic acid.
作為構成丙烯酸系聚合物(A1)的單體,亦可使用具有羥基的單體。藉由使用此種的單體,於丙烯酸系聚合物(A1)導入羥基,於樹脂膜形成層另外具有能量線硬化性成分(B2)的情形,提升此些與丙烯酸聚合物(A1)的相溶性。作為具有羥基的單體,可舉出(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯等的具有羥基的(甲基)丙烯酸烷基酯;N-羥甲基(甲基)丙烯酸醯胺等。 As the monomer constituting the acrylic polymer (A1), a monomer having a hydroxyl group can also be used. By using such a monomer, a hydroxyl group is introduced into the acrylic polymer (A1), and an energy ray-curable component (B2) is further formed in the resin film forming layer, and the phase with the acrylic polymer (A1) is enhanced. Solubility. Examples of the monomer having a hydroxyl group include an alkyl (meth)acrylate having a hydroxyl group such as 2-hydroxyethyl (meth)acrylate or 2-hydroxypropyl (meth)acrylate; N-hydroxymethyl group; (Methyl) decylamine acrylate and the like.
作為構成丙烯酸聚合物(A1)的單體,亦可以使 用具有羧基的單體。藉由使用此種的單體,於丙烯酸系聚合物(A1)導入羧基,於樹脂膜形成層另外具有能量線硬化性成分(B2)的情形,提升此些與丙烯酸聚合物(A1)的相溶性。作為具有羧基的單體,可舉出2-(甲基)丙烯醯氧基乙基鄰苯二甲酸酯、2-(甲基)丙烯醯氧基丙基鄰苯二甲酸酯等的具有羧基的(甲基)丙烯酸酯;(甲基)丙烯酸、馬來酸、富馬酸、衣康酸等。作為後述的硬化性成分(B),於使用環氧系熱硬化性成分的情形,為了使羧基與環氧系熱硬化性成分中的環氧基反應,較佳是具有羧基的單體的使用量少。 As a monomer constituting the acrylic polymer (A1), it is also possible to A monomer having a carboxyl group is used. By using such a monomer, a carboxyl group is introduced into the acrylic polymer (A1), and an energy ray-curable component (B2) is further formed in the resin film forming layer, thereby enhancing the phase with the acrylic polymer (A1). Solubility. Examples of the monomer having a carboxyl group include 2-(meth)acryloxyethyl phthalate and 2-(meth)acryloxypropyl phthalate. a (meth) acrylate of a carboxyl group; (meth)acrylic acid, maleic acid, fumaric acid, itaconic acid, and the like. When the epoxy-based thermosetting component is used as the curable component (B) to be described later, in order to react the carboxyl group with the epoxy group in the epoxy thermosetting component, it is preferred to use a monomer having a carboxyl group. Less.
作為構成丙烯酸系聚合物(A1)的單體,亦可以使用具有胺基的單體。作為此種的單體,可舉出單乙基胺基(甲基)丙烯酸酯等的具有胺基的(甲基)丙烯酸酯等。 As the monomer constituting the acrylic polymer (A1), a monomer having an amine group can also be used. Examples of such a monomer include a (meth) acrylate having an amine group such as a monoethylamino group (meth) acrylate.
作為構成丙烯酸酯(A1)的單體,除此之外亦可以使用乙酸乙烯酯、苯乙烯、乙烯α-烯烴等。 As the monomer constituting the acrylate (A1), vinyl acetate, styrene, ethylene α-olefin or the like can be used.
於樹脂膜形成層中,相對於構成樹脂膜形成層的全固體成分100質量份,丙烯酸系聚合物(A1)較佳為含有1~95質量份,更佳為含有5~80質量份,再更佳為含有10~60質量份,特佳為含有10~50質量份。藉由使丙烯酸系聚合物(A1)的含量為上述範圍,能夠容易使樹脂膜形成層的斷裂伸度、斷裂強度於規定範圍。 In the resin film forming layer, the acrylic polymer (A1) is preferably contained in an amount of 1 to 95 parts by mass, more preferably 5 to 80 parts by mass, based on 100 parts by mass of the total solid content of the resin film forming layer. More preferably, it contains 10 to 60 parts by mass, and particularly preferably contains 10 to 50 parts by mass. When the content of the acrylic polymer (A1) is in the above range, the elongation at break and the breaking strength of the resin film forming layer can be easily made within a predetermined range.
丙烯酸系聚合物(A1)亦可以交聯。交聯為交聯前的丙烯酸系聚合物(A1)具有羥基等的交聯性官能基,藉由於用以形成樹脂膜形成層的組合物中添加交聯劑,藉由使交聯性官能基與交聯劑所具有的官能基反應以進行。藉由使丙烯酸 系聚合物(A1)交聯,變得能夠調整樹脂膜形成層的凝集力。 The acrylic polymer (A1) can also be crosslinked. Crosslinking is an acrylic polymer (A1) before crosslinking, which has a crosslinkable functional group such as a hydroxyl group, and a crosslinkable functional group is added by a crosslinking agent added to a composition for forming a resin film forming layer. It reacts with a functional group which a crosslinking agent has. By making acrylic The polymer (A1) is crosslinked, and the cohesive force of the resin film forming layer can be adjusted.
作為交聯劑可舉出有機多價異氰酸酯化合物,有機多價亞胺化合物等。 The crosslinking agent may, for example, be an organic polyvalent isocyanate compound or an organic polyvalent imine compound.
作為有機多價異氰酸酯化合物,能夠舉出芳香族多價異氰酸酯化合物、脂肪族多價異氰酸酯化合物、脂環族多價異氰酸酯化合物及此些有機多價異氰酸酯化合物的三聚物、以及使此些有機多價異氰酸酯化合物與多元醇化合物反應而得到之末端異氰酸酯胺基甲酸酯預聚合物等。 Examples of the organic polyvalent isocyanate compound include an aromatic polyvalent isocyanate compound, an aliphatic polyvalent isocyanate compound, an alicyclic polyvalent isocyanate compound, and a terpolymer of such an organic polyvalent isocyanate compound, and organic A terminal isocyanate urethane prepolymer obtained by reacting a valence isocyanate compound with a polyol compound.
作為有機多價異氰酸酯化合物,具體而言係可舉出2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、1,3-苯二甲基二異氰酸酯、1,4-苯二甲基二異氰酸酯、二苯基甲烷-4,4'-二異氰酸酯、二苯基甲烷-2,4'-二異氰酸酯、3-甲基二苯基甲烷二異氰酸酯、六亞甲基二異氰酸酯、異佛爾酮二異氰酸酯、二環己基甲烷-4,4'-二異氰酸酯、二環己基甲烷-2,4'-二異氰酸酯、離胺酸異氰酸酯、及此些的多元醇加成物。 Specific examples of the organic polyvalent isocyanate compound include 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 1,3-benzenedimethyl diisocyanate, and 1,4-benzyldimethyl group. Isocyanate, diphenylmethane-4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone Diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, isocyanuric acid isocyanate, and polyol adducts thereof.
作為有機多價亞胺化合物,具體而言,能夠舉出N,N'-二苯基甲烷-4,4'-雙(1-吖環丙烷羧醯胺)、三羥甲基丙烷-三-β-吖環丙烷基丙酸酯、四羥甲基甲烷-三-β-吖環丙烷基丙酸酯及N,N'-甲苯-2,4-雙(1-吖環丙烷羧醯胺)三伸乙基三聚氰胺等。 Specific examples of the organic polyvalent imine compound include N,N'-diphenylmethane-4,4'-bis(1-indolylcyclopropanecarboxamide) and trimethylolpropane-tri-吖-吖cyclopropanepropionate, tetramethylolmethane-tri-β-noncyclopropanyl propionate and N,N'-toluene-2,4-bis(1-anthracycline carboxamide) Three-extension ethyl melamine and the like.
相對於交聯前的丙烯酸系聚合物(A1)100質量份,交聯劑通常為0.01~20質量份,較佳為0.1~10質量份,更佳為0.5~5質量份的比例。 The crosslinking agent is usually 0.01 to 20 parts by mass, preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass, per 100 parts by mass of the acrylic polymer (A1) before crosslinking.
在本發明中,針對構成樹脂膜形成層的成分之含 量的態樣,將聚合物成分(A)的含量規定作為基準之情形,在聚合物成分(A)為交聯而成之丙烯酸系聚合物時,作為其基準之含量,係交聯前的丙烯酸系聚合物之含量。 In the present invention, the content of the constituents constituting the resin film forming layer In the case of the amount of the polymer component (A) as a standard, when the polymer component (A) is an acrylic polymer which is crosslinked, the content as a standard is before the crosslinking. The content of the acrylic polymer.
(A2)非丙烯酸系樹脂 (A2) non-acrylic resin
而且,作為聚合物成分(A),可使用由聚酯、苯氧基樹脂(為了與後述的硬化性聚合物成分(AB)方便區分,限於無環氧基者。)、聚碳酸酯、聚醚、聚胺基甲酸酯、聚矽氧烷、橡膠系聚合物或此些的2種以上結合者選擇的非丙烯酸系樹脂(A2)的1種單獨或2種以上的組合。作為此種的樹脂,較佳為重量平均分子量為20,000~100,000者,更佳為20,000~80,000者。 Further, as the polymer component (A), a polyester or a phenoxy resin (for convenience of being distinguished from a curable polymer component (AB) to be described later, and being limited to an epoxy group-free one) can be used. One type or a combination of two or more types of the non-acrylic resin (A2) selected from the group consisting of an ether, a polyurethane, a polysiloxane, a rubber polymer, or a combination of two or more of these. As such a resin, those having a weight average molecular weight of 20,000 to 100,000, more preferably 20,000 to 80,000 are preferable.
非丙烯酸系樹脂(A2)的玻璃轉移溫度,較佳為-30~150℃,更佳為-20~120℃的範圍。 The glass transition temperature of the non-acrylic resin (A2) is preferably from -30 to 150 ° C, more preferably from -20 to 120 ° C.
在非丙烯酸系樹脂(A2)併用上述的丙烯酸系聚合物(A1)的情形,在使用樹脂膜形成用板片對被著體轉印樹脂膜形成層之際,能夠使得支撐板片與樹脂膜形成層的層間剝離更容易進行,進而能夠於轉印面使樹脂膜形成層追隨並抑制孔洞等的發生。 In the case where the acrylic polymer (A1) is used in combination with the non-acrylic resin (A2), the support sheet and the resin film can be formed when the resin film-forming sheet is used to form the layer by the transfer resin film. The interlayer peeling of the formation layer is more easily performed, and the resin film formation layer can be followed by the transfer surface to suppress the occurrence of voids or the like.
在非丙烯酸系樹脂(A2)併用上述的丙烯酸系聚合物(A1)的情形,非丙烯酸系樹脂(A2)的含量,於非丙烯酸酯(A2)與丙烯酸系聚合物(A1)的質量比(A2:A1)中,通常為1:99~80:20,較佳為1:99~60:40,更佳為1:99~55:45的範圍。藉由使非丙烯酸系樹脂(A2)的含量於此範圍,能夠得到上述的效果。 In the case where the acrylic polymer (A1) is used in combination with the non-acrylic resin (A2), the content of the non-acrylic resin (A2) is in the mass ratio of the non-acrylate (A2) to the acrylic polymer (A1) ( In A2: A1), it is usually 1:99 to 80:20, preferably 1:99 to 60:40, more preferably 1:99 to 55:45. By setting the content of the non-acrylic resin (A2) in this range, the above effects can be obtained.
硬化性成分(B) Hardening component (B)
硬化性成分(B)是以賦予樹脂膜形成層硬化性為主要目的而添加至樹脂膜形成層。硬化性成分(B)可使用熱硬化性成分(B1)或者是能量線硬化性成分(B2)。而且,亦可以使用此些的組合。熱硬化性成分(B1)至少含有具有藉由加熱反應的官能基的化合物。而且,能量線硬化性成分(B2)含有具有藉由能量線照射反應的官能基的化合物(B21),並接受紫外線、電子線等的能量線的照射則聚合硬化。具有此些的硬化性成分的官能基彼此反應,藉由形成3維網路結構而實現硬化。由用於與聚合物成分(A)組合使用,抑制用於形成樹脂膜形成層之塗佈用組合物的黏度,並提升操作性等的觀點,硬化性成分(B)通常其重量平均分子量(Mw)為10,000以下,更佳為100~10,000。 The curable component (B) is added to the resin film forming layer for the main purpose of imparting layer hardenability to the resin film. As the curable component (B), a thermosetting component (B1) or an energy ray-curable component (B2) can be used. Moreover, combinations of these can also be used. The thermosetting component (B1) contains at least a compound having a functional group which is reacted by heating. Further, the energy ray-curable component (B2) contains a compound (B21) having a functional group which is irradiated by an energy ray, and is polymer-cured by irradiation with an energy ray such as an ultraviolet ray or an electron beam. The functional groups having such curable components react with each other to achieve hardening by forming a three-dimensional network structure. The curable component (B) usually has a weight average molecular weight from the viewpoint of being used in combination with the polymer component (A), suppressing the viscosity of the coating composition for forming the resin film forming layer, and improving workability and the like. Mw) is 10,000 or less, more preferably 100 to 10,000.
(B1)熱硬化性成分 (B1) thermosetting component
作為熱硬化性成分,例如是較佳為環氧系熱硬化性成分。 The thermosetting component is preferably an epoxy thermosetting component, for example.
環氧系熱硬化性成分含有具有環氧基的化合物(B11),且較佳使用具有環氧基的化合物(B11)與熱硬化劑(B12)組合者。 The epoxy thermosetting component contains a compound (B11) having an epoxy group, and a compound (B11) having an epoxy group and a thermosetting agent (B12) are preferably used in combination.
(B11)具有環氧基的化合物 (B11) a compound having an epoxy group
作為具有環氧基的化合物(B11)(以下亦簡稱為「環氧化合物(B11)」),可使用先前習知之化合物。具體而言可舉多官能系環氧樹脂、雙酚A二縮水甘油醚或其氫化物、鄰甲酚酚醛清漆環氧樹脂、二環戊二烯型環氧樹脂、聯苯型環氧樹脂、雙酚A型環氧樹脂、雙酚F型環氧樹脂、伸苯基骨架型環 氧樹脂等,於分子中具有2官能以上的環氧化合物。此些可以1種單獨或組合2種以上使用。 As the epoxy group-containing compound (B11) (hereinafter also simply referred to as "epoxy compound (B11)"), a conventionally known compound can be used. Specific examples thereof include a polyfunctional epoxy resin, bisphenol A diglycidyl ether or a hydrogenated product thereof, an o-cresol novolac epoxy resin, a dicyclopentadiene epoxy resin, and a biphenyl epoxy resin. Bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenyl phenyl skeleton ring An oxygen resin or the like has a bifunctional or higher epoxy compound in the molecule. These may be used alone or in combination of two or more.
使用環氧化合物(B11)的情形,於樹脂膜形成層中,相對於聚合物成分(A)100質量份,較佳為環氧化合物(B11)包含1~1500質量份,更佳為包含3~1200質量份。如環氧化合物(B11)過少,則有樹脂膜形成層的硬化後接著性降低的傾向之情形。而且,環氧化合物(B11)過多的話,則樹脂膜形成層與支撐板片之剝離力變高,有使樹脂膜形成層發生轉印不良之情形。 In the case of using the epoxy compound (B11), the epoxy resin compound (B11) preferably contains 1 to 1500 parts by mass, more preferably 3, based on 100 parts by mass of the polymer component (A). ~1200 parts by mass. When the amount of the epoxy compound (B11) is too small, there is a tendency that the curing property of the resin film forming layer is lowered. In addition, when the amount of the epoxy compound (B11) is too large, the peeling force of the resin film forming layer and the support sheet is increased, and the resin film forming layer may be defective in transfer.
而且,環氧化合物(B11)的重量平均分子量(Mw)較佳為100~2,000,較佳為200~1,500。藉由使環氧化合物(B11)的重量平均分子量於上述範圍,能夠容易使樹脂膜形成層的斷裂伸度、斷裂強度於規定範圍。 Further, the weight average molecular weight (Mw) of the epoxy compound (B11) is preferably from 100 to 2,000, preferably from 200 to 1,500. When the weight average molecular weight of the epoxy compound (B11) is in the above range, the elongation at break and the breaking strength of the resin film forming layer can be easily made within a predetermined range.
(B12)熱硬化劑 (B12) Thermal hardener
熱硬化劑(B12),係對環氧化合物(B11)作為硬化劑的功能。較佳的熱硬化劑,係於1分子中具有2個以上可與環氧基反應之官能基之化合物。作為該官能基,可舉酚性羥基、醇性羥基、胺基、羧基及酸酐等。此些之中,較佳為酚性羥基、胺基、酸酐等,更佳為酚性羥基、胺基。 The heat hardener (B12) functions as a hardener for the epoxy compound (B11). A preferred thermal curing agent is a compound having two or more functional groups reactive with an epoxy group in one molecule. Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amine group, a carboxyl group, and an acid anhydride. Among these, a phenolic hydroxyl group, an amine group, an acid anhydride or the like is preferable, and a phenolic hydroxyl group or an amine group is more preferable.
作為酚系硬化劑之具體例,可舉多官能系酚樹脂、雙酚、聯苯酚樹脂、酚醛清漆型酚樹脂、二環戊二烯系酚樹脂、酚芳烷(Xylok)型酚樹脂、芳烷基酚樹脂。 Specific examples of the phenolic curing agent include polyfunctional phenol resins, bisphenols, biphenol resins, novolac type phenol resins, dicyclopentadiene phenol resins, phenol aralkyl (Xylok) phenol resins, and aromatic phenol resins. Alkyl phenol resin.
作為胺系硬化劑之具體例,可舉DICY(雙氰胺)。 Specific examples of the amine-based curing agent include DICY (dicyandiamide).
此些可以1種單獨或組合2種以上使用。 These may be used alone or in combination of two or more.
熱硬化劑(B12)的重量平均分子量(Mw)並沒有特別的限制,較佳為100~20,000,更佳為200~20,000。而且,熱硬化劑(B12)較佳於180℃以下為液狀,更佳於160℃以下為液狀,特佳為於常溫(23℃)附近為液狀。藉由使熱硬化劑(B12)的重量平均分子量於上述範圍,或是使用上述性狀(軟化點)的熱硬化劑(B12),能夠容易使樹脂膜形成層的斷裂伸度、斷裂強度於規定範圍。尚且,軟化點例如是能夠藉由以JIS K7234:1986所記載的環球法為基準的方法測定。 The weight average molecular weight (Mw) of the heat hardener (B12) is not particularly limited, and is preferably from 100 to 20,000, more preferably from 200 to 20,000. Further, the thermosetting agent (B12) is preferably liquid at 180 ° C or lower, more preferably liquid at 160 ° C or lower, and particularly preferably liquid at around normal temperature (23 ° C). When the weight average molecular weight of the thermosetting agent (B12) is in the above range or the thermal curing agent (B12) having the above properties (softening point) is used, the elongation at break and the breaking strength of the resin film forming layer can be easily specified. range. Further, the softening point can be measured, for example, by a method based on the ring and ball method described in JIS K7234:1986.
熱硬化劑(B12)之含量,相對於環氧化合物(B11)100質量份,較佳為0.1~500質量份,更佳為1~200質量份。熱硬化劑之含量少的話,則有硬化後的接著性降低的傾向。 The content of the thermal curing agent (B12) is preferably 0.1 to 500 parts by mass, more preferably 1 to 200 parts by mass, per 100 parts by mass of the epoxy compound (B11). When the content of the heat curing agent is small, the adhesion after curing tends to decrease.
(B13)硬化促進劑 (B13) hardening accelerator
硬化促進劑(B13)亦可以用於調整樹脂膜形成層之熱硬化的速度。硬化促進劑(B13)特別是較佳在使用環氧系熱硬化性成分作為硬化性成分(B1)的情形。 The hardening accelerator (B13) can also be used to adjust the rate of thermal hardening of the resin film forming layer. In particular, the hardening accelerator (B13) is preferably a case where an epoxy-based thermosetting component is used as the curable component (B1).
作為較佳的硬化促進劑,可舉三亞乙基二胺、苄基二甲基胺、三乙醇胺、二甲基胺基乙醇、三(二甲基胺基甲基)酚等之3級胺類;2-甲基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑、2-苯基-4,5-二羥甲基咪唑、2-苯基-4-甲基-5-羥甲基咪唑等的咪唑類;三丁基膦、二苯膦、三苯膦等的有機膦類;四苯硼酸四苯基膦、四苯硼酸三苯膦等的四苯硼酸鹽等。此些可以1種單獨或組合2種以上使用。 Preferred examples of the curing accelerator include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol. ; 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dimethylolimidazole, 2-phenyl-4-methyl-5 An imidazole such as hydroxymethylimidazole; an organic phosphine such as tributylphosphine, diphenylphosphine or triphenylphosphine; a tetraphenylborate such as tetraphenylphosphonium tetraphenylphosphonate or triphenylphosphine tetraphenylborate; and the like. These may be used alone or in combination of two or more.
相對於環氧化合物(B11)以及熱硬化劑(B12)的合計量100質量份,硬化促進劑(B13)較佳為包含0.01~10 質量份,更佳為0.1~1質量份的量。藉由以上述範圍的量含有硬化促進劑(B13),即使曝露於高溫高濕中亦可具有優良的接著性,即使是曝露於嚴酷的回流條件的情形,亦可達成高可靠度。藉由添加硬化促進劑(B13),能夠提升樹脂膜形成層的硬化後的接著性。此種的作用為硬化促進劑(B13)的含量越多則越強。 The curing accelerator (B13) preferably contains 0.01 to 10 parts by weight based on 100 parts by mass of the total of the epoxy compound (B11) and the thermosetting agent (B12). The mass fraction is more preferably 0.1 to 1 part by mass. When the curing accelerator (B13) is contained in an amount within the above range, it can have excellent adhesion even when exposed to high temperature and high humidity, and high reliability can be achieved even when exposed to severe reflow conditions. By adding the hardening accelerator (B13), the adhesion after curing of the resin film forming layer can be improved. The effect of this is that the more the content of the hardening accelerator (B13), the stronger.
(B2)能量線硬化性成分 (B2) energy line hardening component
藉由在樹脂膜形成層含有能量線硬化性成分,能夠不進行需要多量的能量線與長時間的熱硬化步驟,以進行樹脂膜形成層的硬化。依此,能夠圖謀製造成本的降低。 By including the energy ray-curable component in the resin film forming layer, it is possible to perform hardening of the resin film forming layer without performing a large amount of energy rays and a long-term heat curing step. Accordingly, it is possible to reduce the manufacturing cost.
能量線硬化性成分可以單獨使用具有藉由能量線照射反應的官能基的化合物(B21),但較佳是使用組合具有藉由能量線照射反應的官能基的化合物(B21)與光聚合起始劑(B22)者。 The energy ray hardening component may be a compound (B21) having a functional group irradiated by an energy ray irradiation alone, but it is preferred to use a compound (B21) having a functional group having a reaction by an energy ray irradiation reaction and photopolymerization initiation. Agent (B22).
(B21)具有藉由能量線照射反應的官能基的化合物 (B21) a compound having a functional group irradiated by an energy ray
作為具有藉由能量線照射反應的官能基的化合物(B21)(以下亦稱為「能量線反應性化合物(B21)」),具體而言,可舉三羥甲基丙烷三丙烯酸酯、季戊四醇三丙烯酸酯、季戊四醇四丙烯酸酯、二季戊四醇單羥基五丙烯酸酯、二季戊四醇六丙烯酸酯、或1,4-丁二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯等的丙烯酸酯系化合物,而且,亦可以舉出具有寡聚酯丙烯酸酯、胺基甲酸酯丙烯酸酯系寡聚物、環氧基丙烯酸酯、聚醚丙烯酸酯及伊康酸寡聚物等的丙烯酸系化合物等的聚合結構之 丙烯酸酯化合物,分子量比較低者。此些的化合物,於分子內至少具有1個聚合性雙鍵。 The compound (B21) having a functional group to be reacted by an energy ray (hereinafter also referred to as "energy ray-reactive compound (B21)"), specifically, trimethylolpropane triacrylate or pentaerythritol Acrylate-based compound such as acrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, or 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate Further, an acrylic compound such as an oligoester acrylate, a urethane acrylate oligomer, an epoxy acrylate, a polyether acrylate, or an itaconic acid oligomer may be used. Polymeric structure Acrylate compound, which has a relatively low molecular weight. Such compounds have at least one polymerizable double bond in the molecule.
於使用能量線反應性化合物(B21)的情形,於樹脂膜形成層中,相對於聚合物成分(A)100質量份,能量線反應性化合物(B21)較佳為包含1~1500質量份,更佳為包含3~1200質量份。 In the case of using the energy ray-reactive compound (B21), the energy ray-reactive compound (B21) is preferably contained in an amount of from 1 to 1,500 parts by mass based on 100 parts by mass of the polymer component (A) in the resin film-forming layer. More preferably, it contains 3 to 1200 parts by mass.
(B22)光聚合起始劑 (B22) Photopolymerization initiator
藉由於能量線反應性化合物(B21)組合光聚合起始劑(B22),能夠縮短聚合硬化時間,以及減少光線照射量。 By combining the photopolymerization compound (B21) with the photopolymerization initiator (B22), the polymerization hardening time can be shortened, and the amount of light irradiation can be reduced.
作為如此之光聚合起始劑(B22),具體而言,可舉二苯基酮、苯乙酮、安息香、安息香甲醚、安息香乙醚、安息香異丙醚、安息香異丁醚、苯甲酸苄酯(benzoin benzoic acid)、甲基苯甲酸苄酯(benzoin benzoic acid methyl)、苯偶醯二甲縮酮、2,4-二乙基噻吨酮、α-羥基環己基苯基酮、苄基二苯硫醚、四甲基秋蘭姆單硫醚、偶氮雙異丁腈、聯苯甲醯、二聯苯甲醯、双乙醯、1,2-二苯基甲烷、2-羥基-2-甲基-1-[4-(1-甲基乙烯基)苯基]丙酮、2,4,6-三甲基苯甲醯苯基氧化膦及β-氯蒽醌等。光聚合起始劑(B22),可以1種單獨或組合2種以上使用。 As such a photopolymerization initiator (B22), specifically, diphenyl ketone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl benzoate may be mentioned. (benzoin benzoic acid), benzoin benzoic acid methyl, benzoin dimethyl ketal, 2,4-diethyl thioxanthone, α-hydroxycyclohexyl phenyl ketone, benzyl di Phenyl sulfide, tetramethyl thiuram monosulfide, azobisisobutyronitrile, benzamidine, benzamidine, diacetyl, 1,2-diphenylmethane, 2-hydroxy-2 -Methyl-1-[4-(1-methylvinyl)phenyl]acetone, 2,4,6-trimethylbenzimidylphenylphosphine oxide, and β-chloropurine. The photopolymerization initiator (B22) may be used alone or in combination of two or more.
光聚合起始劑(B22)之配合比例,對能量線反應性化合物(B21)100質量份,較佳為包含0.1~10質量份,更佳為包含1~5質量份。 The blending ratio of the photopolymerization initiator (B22) is preferably 0.1 to 10 parts by mass, more preferably 1 to 5 parts by mass, per 100 parts by mass of the energy ray-reactive compound (B21).
光聚合起始劑(B22)的配合比例未滿0.1質量份,則有光聚合不足而無法得到足夠的硬化性之情形,超過10質量份, 則產生未參與光聚合之殘留物,成為不良的原因之情形。 When the blending ratio of the photopolymerization initiator (B22) is less than 0.1 part by mass, the photopolymerization is insufficient to obtain sufficient hardenability, and more than 10 parts by mass, Then, a residue which does not participate in photopolymerization is generated, which is a cause of failure.
(第2黏合劑成分) (2nd binder component)
第2黏合劑成分藉由含有硬化性聚合物成分(AB),對樹脂膜形成層賦予板片形狀維持性與硬化性。 The second binder component contains the curable polymer component (AB), and imparts shape retention and hardenability to the resin film forming layer.
(AB)硬化性聚合物成分 (AB) hardenable polymer component
硬化性聚合物成分,係具有硬化功能官能基的聚合物。硬化功能官能基為互相反應而可構成三維網路結構的官能基,可舉出藉由加熱反應的官能基、藉由能量線反應的官能基。 The curable polymer component is a polymer having a functional group that hardens. The hardening functional group is a functional group which can react with each other to form a three-dimensional network structure, and examples thereof include a functional group which is reacted by heating and a functional group which is reacted by an energy ray.
硬化功能官能基可以加成至成為硬化性聚合物成分(AB)的骨架之連續結構的單元中,亦可以加成至末端。硬化功能官能基加成至成為硬化性聚合物成分(AB)的骨架之連續結構的單元的情形,硬化功能官能基可以加成至支鏈,亦可以直接加成至主鏈。由達成賦予樹脂膜形成層板片形狀維持性之目的的觀點,硬化性聚合物成分(AB)的重量平均分子量(Mw)通常為20,000以上。 The hardening functional group may be added to a unit which is a continuous structure of the skeleton of the curable polymer component (AB), or may be added to the terminal. In the case where the hardening functional group is added to a unit which is a continuous structure of the skeleton of the curable polymer component (AB), the hardening functional group may be added to the branch or may be directly added to the main chain. The weight average molecular weight (Mw) of the curable polymer component (AB) is usually 20,000 or more from the viewpoint of achieving the purpose of imparting shape retention to the resin film forming layer sheet.
作為藉由加熱反應的官能基可舉出環氧基。作為具有環氧基的硬化性聚合物成分(AB),可舉出含有高分子量的環氧基的化合物、具有環氧基的苯氧基樹脂。含有高分子量的環氧基的化合物例如是揭示於日本專利特開2001-261789。 The functional group which heats a reaction can mention an epoxy group. Examples of the curable polymer component (AB) having an epoxy group include a compound containing a high molecular weight epoxy group and a phenoxy resin having an epoxy group. A compound containing a high molecular weight epoxy group is disclosed, for example, in Japanese Patent Laid-Open No. 2001-261789.
而且,亦可為與上述丙烯酸系聚合物(A1)相同的聚合物,作為單體而使用具有環氧基的單體進行聚合者(含有環氧基的丙烯酸系單體)。作為含有環氧基的單體,例如是可舉出(甲基)丙烯酸縮水甘油酯等的具有縮水甘油基的(甲基)丙烯酸 酯。 Further, the same polymer as the above acrylic polymer (A1) may be used as a monomer, and a monomer having an epoxy group may be used as a monomer (an epoxy group-containing acrylic monomer). Examples of the epoxy group-containing monomer include (meth)acrylic acid having a glycidyl group such as glycidyl (meth)acrylate. ester.
於使用含有環氧基的丙烯酸系聚合物的情形,其較佳的態樣除了環氧基之外與丙烯酸系聚合物(A1)相同。 In the case of using an epoxy group-containing acrylic polymer, the preferred aspect is the same as the acrylic polymer (A1) except for the epoxy group.
於使用含有環氧基的硬化性聚合物成分(AB)的情形,與使用環氧系熱硬化性成分作為硬化性成分(B)的情形相同,亦可以併用熱硬化劑(B12)、硬化促進劑(B13)。 When the epoxy group-containing curable polymer component (AB) is used, as in the case where the epoxy-based thermosetting component is used as the curable component (B), a thermosetting agent (B12) or a curing accelerator may be used in combination. Agent (B13).
作為藉由能量線反應的官能基,可舉出(甲基)丙烯醯基。作為具有藉由能量線反應的官能基的硬化性聚合物成分(AB),能夠使用具有聚醚丙烯酸酯等的聚合結構之丙烯酸酯化合物等的為高分子量者。 The functional group reactive by the energy ray may, for example, be a (meth) acrylonitrile group. As the curable polymer component (AB) having a functional group reactive by an energy ray, an acrylate compound having a polymer structure such as polyether acrylate or the like can be used as a high molecular weight.
而且,例如是亦可以使用將於支鏈具有羥基等的官能基X的原料聚合物,與具有可與官能基X反應的官能基Y(例如是官能基X為羥基的情形則為異氰酸酯基等)以及藉由能量線照射反應的官能基的低分子化合物反應而製備的聚合物。 Further, for example, a base polymer having a functional group X having a hydroxyl group or the like in a branched chain and a functional group Y capable of reacting with the functional group X (for example, a case where the functional group X is a hydroxyl group, an isocyanate group or the like) may be used. And a polymer prepared by reacting a low molecular compound of a functional group irradiated with an energy ray.
於此情形,當原料聚合物相當於上述丙烯酸系聚合物(A1)時,其原料聚合物的較佳態樣與丙烯酸系聚合物(A1)相同。 In this case, when the base polymer corresponds to the above acrylic polymer (A1), the preferred aspect of the base polymer is the same as that of the acrylic polymer (A1).
於使用具有藉由能量線反應的官能基的硬化性聚合物成分(AB)的情形,與使用能量線硬化性成分(B2)的情形相同,亦可以併用光聚合起始劑(B22)。 In the case of using the curable polymer component (AB) having a functional group reactive by energy ray, as in the case of using the energy ray-curable component (B2), a photopolymerization initiator (B22) may be used in combination.
第2黏合劑成分亦可以與硬化性聚合物成分(AB)一併含有聚合物成分(A)、硬化性成分(B)。 The second binder component may contain the polymer component (A) and the curable component (B) together with the curable polymer component (AB).
於樹脂膜形成層除了黏合劑成分之外亦可以含有以下的成分。 The resin film forming layer may contain the following components in addition to the binder component.
(C)無機填料 (C) inorganic filler
於樹脂膜形成層亦可以含有無機填料(C)。藉由將無機填料(C)配合於樹脂膜形成層,變得能夠調整硬化後的樹脂膜的熱膨脹係數,藉由對被著體最佳化硬化後的樹脂膜的熱膨脹係數,而能夠提昇半導體裝置的可靠度。而且,亦能夠降低硬化後的樹脂膜的吸濕性。 The inorganic film (C) may be contained in the resin film forming layer. By blending the inorganic filler (C) with the resin film forming layer, it is possible to adjust the thermal expansion coefficient of the cured resin film, and to improve the semiconductor by the thermal expansion coefficient of the resin film after being cured by the object. The reliability of the device. Moreover, the hygroscopicity of the resin film after hardening can also be reduced.
而且,使本發明的樹脂膜形成層硬化而得的樹脂膜作為被著體或單片化被著體的晶片的保護膜的功能的情形,藉由對保護膜施加雷射標記,於藉由雷射光削除的部分露出無機填料(C),呈現接近用於擴散反射光的白色之顏色。依此,樹脂膜形成層如同後述而含有著色劑(D)時,雷射標記部分與其他部分得到對比差,具有標記成為明顯化的效果。 Further, in the case where the resin film obtained by curing the resin film forming layer of the present invention functions as a protective film of a wafer to be embossed or diced, by applying a laser mark to the protective film, The portion of the laser light removed exposes the inorganic filler (C), exhibiting a white color close to that used to diffuse the reflected light. According to this, when the resin film forming layer contains the coloring agent (D) as will be described later, the laser marking portion is inferior to the other portions, and the marking has an effect of being marked.
作為較佳的無機填料,可舉出二氧化矽(Silica)、氧化鋁、滑石、碳酸鈣、氧化鈦、氧化鐵、碳化矽、氮化硼等的粉末,此些球形化的珠、單結晶纖維以及玻璃纖維等。此些之中,較佳為二氧化矽填料以及氧化鋁填料。而且,此些的無機填料的表面亦能夠以環氧基或(甲基)丙烯醯基等的官能基修飾。上述無機填料(C)可以單獨或2種以上混合使用。 Preferred examples of the inorganic filler include powders of cerium oxide (Silica), alumina, talc, calcium carbonate, titanium oxide, iron oxide, cerium carbide, boron nitride, and the like, and spheroidized beads and single crystals. Fiber and glass fiber. Among these, a cerium oxide filler and an alumina filler are preferred. Further, the surface of such an inorganic filler can also be modified with a functional group such as an epoxy group or a (meth) acryl group. These inorganic fillers (C) may be used singly or in combination of two or more kinds.
為了確實得到上述的效果,相對於構成樹脂膜形成層的全固體成分100質量份,無機填料(C)的含量範圍較佳為1~80質量份、更佳為5~75質量份,特佳為10~70質量份。 In order to obtain the above effect, the content of the inorganic filler (C) is preferably from 1 to 80 parts by mass, more preferably from 5 to 75 parts by mass, per 100 parts by mass of the total solid content of the resin film forming layer. It is 10 to 70 parts by mass.
(D)著色劑 (D) colorant
於樹脂膜形成層中可配合著色劑(D)。藉由配合著色劑,在將半導體裝置組入機器時,可防止周遭裝置所產生的紅外線等所致的半導體裝置之誤動作。而且,藉由雷射標記等的手段 於樹脂膜進行刻印的情形,具有變得容易辨識文字、記號等的標記之效果。亦即是,形成有樹脂膜的半導體裝置或半導體晶片,藉由一般雷射標記法(藉由雷射光削除保護膜表面以進行印字的方法)將產品號碼等印字於樹脂膜的表面,藉由樹脂膜含有著色劑(D),樹脂膜的藉由雷射光削除的部分與未削除的部分能夠得到充分的對比差,提升辨識性。 The colorant (D) can be blended in the resin film forming layer. By incorporating a coloring agent, it is possible to prevent malfunction of the semiconductor device due to infrared rays or the like generated by the surrounding device when the semiconductor device is incorporated into the device. Moreover, by means of laser marking, etc. In the case where the resin film is imprinted, there is an effect that it becomes easy to recognize a mark of a character, a mark, or the like. That is, a semiconductor device or a semiconductor wafer on which a resin film is formed, by printing a product number or the like on the surface of the resin film by a general laser marking method (a method of removing a surface of a protective film by laser light for printing) The resin film contains a coloring agent (D), and a portion of the resin film which is removed by laser light and an uncut portion can be sufficiently contrasted to improve the visibility.
作為著色劑,可使用有機或無機的顏料及染料。此些之中,由電磁波與紅外線遮蔽性之觀點,較佳為黑色顏料。作為黑色顏料,使用碳黑、氧化鐵、二氧化錳、苯胺黑、活性碳等,並不限定於此些。由提升半導體裝置的可靠度的觀點,特佳為碳黑。著色劑(D)可以1種單獨使用,亦可組合2種以上使用。 As the colorant, organic or inorganic pigments and dyes can be used. Among these, from the viewpoint of electromagnetic wave and infrared shielding, a black pigment is preferred. Carbon black, iron oxide, manganese dioxide, aniline black, activated carbon, and the like are used as the black pigment, and are not limited thereto. From the viewpoint of improving the reliability of the semiconductor device, carbon black is particularly preferred. The coloring agent (D) may be used alone or in combination of two or more.
著色劑(D)的配合量,相對於構成樹脂膜形成層之全固體成分100質量份,較佳為0.1~35質量份,更佳為0.5~25質量份,特佳為1~15質量份。 The amount of the coloring agent (D) is preferably 0.1 to 35 parts by mass, more preferably 0.5 to 25 parts by mass, even more preferably 1 to 15 parts by mass, per 100 parts by mass of the total solid content of the resin film forming layer. .
(E)耦合劑 (E) Coupling agent
亦可以使用具有與無機物反應的官能基以及與有機物反應的官能基的耦合劑(E),用以提昇樹脂膜形成層的對被著體的貼附性、接著性以及/或是樹脂膜的凝集性。而且,藉由使用耦合劑(E),能夠不損及樹脂膜形成層硬化所得的樹脂膜的耐熱性而提昇其耐水性。作為此種的耦合劑,可舉出鈦酸酯系耦合劑、鋁酸酯系耦合劑、矽烷耦合劑等。此些之中,較佳為矽烷耦合劑。 It is also possible to use a coupling agent (E) having a functional group reactive with an inorganic substance and a functional group reactive with an organic substance to enhance the adhesion of the resin film forming layer to the adherend, the adhesion, and/or the resin film. Agglutination. Further, by using the coupling agent (E), the water resistance of the resin film obtained by curing the resin film forming layer can be improved without impairing the heat resistance. Examples of such a coupling agent include a titanate coupling agent, an aluminate coupling agent, and a decane coupling agent. Among these, a decane coupling agent is preferred.
作為矽烷耦合劑,較佳為使用其與有機官能基反 應的官能基,係為與聚合物成分(A)、硬化性成分(B)或硬化性聚合物成分(AB)等所具有的官能基反應的基之矽烷耦合劑。 As a decane coupling agent, it is preferred to use it in opposition to an organic functional group. The functional group is a decane coupling agent that reacts with a functional group such as a polymer component (A), a curable component (B), or a curable polymer component (AB).
作為此種的矽烷耦合劑,可舉出γ-環氧丙氧基丙基三甲氧基矽烷、γ-環氧丙氧基丙基甲基二乙氧基矽烷、β-(3,4-環氧基環己基)乙基三甲氧基矽烷、γ-(甲基丙烯醯氧基丙基)三甲氧基矽烷、γ-胺基丙基三甲氧基矽烷、N-6-(胺基乙基)-γ-胺基丙基三甲氧基矽烷、N-6-(胺基乙基)-γ-胺基丙基甲基二乙氧基矽烷、N-苯基-γ-胺基丙基三甲氧基矽烷、γ-脲基丙基三乙氧基矽烷、γ-硫醇基丙基三甲氧基矽烷、γ-硫醇基丙基甲基二甲氧基矽烷、雙(3-三乙氧基矽基丙基)四硫化氫、甲基三甲氧基矽烷、甲基三乙氧基矽烷、乙烯基三甲氧基矽烷、乙烯基三乙醯氧基矽烷、咪唑矽烷等。此些可單獨1種或混合2種以上使用。 Examples of such a decane coupling agent include γ-glycidoxypropyltrimethoxydecane, γ-glycidoxypropylmethyldiethoxydecane, and β-(3,4-ring). Oxycyclohexyl)ethyltrimethoxydecane, γ-(methacryloxypropyl)trimethoxynonane, γ-aminopropyltrimethoxydecane, N-6-(aminoethyl) - γ-aminopropyltrimethoxydecane, N-6-(aminoethyl)-γ-aminopropylmethyldiethoxydecane, N-phenyl-γ-aminopropyltrimethoxy Base decane, γ-ureidopropyl triethoxy decane, γ-thiol propyl trimethoxy decane, γ-thiol propyl methyl dimethoxy decane, bis (3-triethoxy) Mercaptopropyl) tetrahydrogen sulfide, methyltrimethoxydecane, methyltriethoxydecane, vinyltrimethoxydecane, vinyltriethoxydecane, imidazolium, and the like. These may be used alone or in combination of two or more.
相對於聚合物成分(A)、硬化性成分(B)與硬化性聚合物成分(AB)的合計100質量份,矽烷耦合劑通常以0.1~20質量份,較佳為0.2~10質量份,更佳為0.3~5質量份的比例含有。矽烷耦合劑的含量未滿0.1質量份則有可能無法得到上述的效果,超過20質量份則具有成為逸氣原因的可能性。 The decane coupling agent is usually 0.1 to 20 parts by mass, preferably 0.2 to 10 parts by mass, based on 100 parts by mass of the total of the polymer component (A), the curable component (B) and the curable polymer component (AB). More preferably, it is contained in a ratio of 0.3 to 5 parts by mass. When the content of the decane coupling agent is less than 0.1 part by mass, the above effects may not be obtained, and if it exceeds 20 parts by mass, it may be a cause of escape.
(F)泛用添加劑 (F) general purpose additives
於樹脂膜形成層中,除上述之外,亦可以因應需要配合各種添加劑。作為各種添加劑,可舉出整平劑、塑化劑、抗靜電劑、抗氧化劑、離子捕捉劑、捕獲劑(gettering agent)、鏈移動劑或剝離劑等。 In addition to the above, various additives may be blended in the resin film forming layer as needed. As various additives, a leveling agent, a plasticizer, an antistatic agent, an antioxidant, an ion trapping agent, a gettering agent, a chain shifting agent, a release agent, and the like can be given.
樹脂膜形成層例如是使用將上述成分以適當比例混合而得的組合物(樹脂膜形成用組合物)以得到。樹脂膜形成用組合物可以預先以溶媒稀釋,而且亦可以混合時添加溶媒。而且,於樹脂膜形成用組合物的使用時,亦能夠以溶媒稀釋。 The resin film-forming layer is obtained, for example, by using a composition (a composition for forming a resin film) obtained by mixing the above components in an appropriate ratio. The resin film-forming composition may be diluted with a solvent in advance, or a solvent may be added during mixing. Further, when the resin film-forming composition is used, it can be diluted with a solvent.
作為此種溶媒,可舉出乙酸乙酯、乙酸甲酯、二乙基醚、二甲基醚、丙酮、甲基乙基酮、乙腈、己烷、環己烷、甲苯、庚烷等。 Examples of such a solvent include ethyl acetate, methyl acetate, diethyl ether, dimethyl ether, acetone, methyl ethyl ketone, acetonitrile, hexane, cyclohexane, toluene, and heptane.
樹脂膜形成層具有初期接著性與硬化性,未硬化狀態藉由於常溫或者加熱下按壓於被著體而容易接著。而且按壓時亦可以對樹脂膜形成層加熱。然後經硬化最終能夠賦予衝擊性高的樹脂膜,接著強度亦優異,於嚴苛的高溫度濕度條件下亦能夠保持充分的可靠度。尚且,樹脂膜形成層可為單層結構,亦可為多層結構。 The resin film forming layer has initial adhesion and hardenability, and the uncured state is easily adhered to the object by pressing at normal temperature or under heating. Further, the resin film forming layer can be heated during pressing. Then, it is hardened to finally impart a resin film having high impact, and the strength is also excellent, and sufficient reliability can be maintained under severe high temperature and humidity conditions. Further, the resin film forming layer may have a single layer structure or a multilayer structure.
樹脂膜形成層的厚度較佳為1~100μm,較佳為2~90μm,特佳為3~80μm。藉由使樹脂膜形成層的厚度於上述範圍,樹脂膜形成層作為用於接著被著體與基板、其他晶片等的接著劑,或者是保護被著體的背面的保護膜之功能優良。 The thickness of the resin film forming layer is preferably from 1 to 100 μm, preferably from 2 to 90 μm, particularly preferably from 3 to 80 μm. By setting the thickness of the resin film forming layer to the above range, the resin film forming layer is excellent in function as an adhesive for the subsequent object, the substrate, another wafer, or the like, or a protective film for protecting the back surface of the object.
(剝離板片13) (peeling sheet 13)
剝離板片13層積在樹脂膜形成層12a側。剝離板片13係在樹脂膜形成用板片10的使用時,達成作為載體薄膜之作用者,能夠例示作為上述的支撐板片11之薄膜。 The peeling sheet 13 is laminated on the side of the resin film forming layer 12a. When the resin sheet forming sheet 10 is used, the peeling sheet 13 can be used as a carrier film, and the film as the above-mentioned supporting sheet 11 can be exemplified.
剝離板片的與樹脂膜形成層接觸之面的表面張力,較佳為40mN/m以下,更佳為37mN/m以下,特佳為35mN/m 以下。下限值通常為25mN/m左右。此種表面張力比較低的剝離板片,係能夠適當地選擇材質而得到,而且,亦能夠藉由在剝離板片的表面塗佈剝離劑而施行剝離處理來得到。 The surface tension of the surface of the peeling sheet which is in contact with the resin film forming layer is preferably 40 mN/m or less, more preferably 37 mN/m or less, and particularly preferably 35 mN/m. the following. The lower limit is usually about 25 mN/m. Such a peeling sheet having a relatively low surface tension can be obtained by appropriately selecting a material, and can also be obtained by applying a peeling agent to the surface of the peeling sheet to perform a peeling treatment.
作為在剝離處理所使用的剝離劑,係能夠使用醇酸系、矽酮系、氟系、不飽和聚酯系、聚烯烴系、蠟系等,特別是醇酸系、矽酮系、氟系的剝離劑具有耐熱性因而較佳。 As the release agent used in the release treatment, an alkyd type, an anthrone type, a fluorine type, an unsaturated polyester type, a polyolefin type, a wax type, or the like can be used, and particularly an alkyd type, an anthrone type, or a fluorine type can be used. The release agent is preferably heat resistant.
為了使用上述的剝離劑而將當作剝離板片的基體之薄膜等的表面進行剝離處理,係將剝離劑直接在無溶劑的狀態下、或是使用溶劑稀釋和乳化且使用凹版塗佈機、邁耶氏棒(Mayer's bar)塗佈機、氣動刮刀塗佈機、輥塗佈機等進行塗佈,而且將塗佈剝離劑後的剝離板片移送至常溫下或加熱下,或藉由電子射線使其硬化而形成剝離劑層即可。 In order to use the above-mentioned release agent, the surface of the film or the like which is a base of the release sheet is subjected to a release treatment, and the release agent is directly diluted in a solvent-free state or a solvent, and a gravure coater is used. Applying by Mayer's bar coater, pneumatic blade coater, roll coater, etc., and transferring the peeled sheet after the release agent is applied to normal temperature or under heating, or by electrons The radiation is hardened to form a release agent layer.
而且,亦可藉由使用濕式層疊、乾式層疊、熱熔融層疊、熔融擠製層疊、共擠製加工等來進行薄膜的層積以調整剝離板片的表面張力。亦即,可以製造以下的層積體作為剝離板片,該層積體係將至少一面的表面的表面張力為作為上述的剝離板片的與樹脂膜形成層接觸之面的較佳範圍內之薄膜,以該面成為與樹脂膜形成層接觸的面之方式與其他薄膜層積而成。 Further, the film may be laminated by wet lamination, dry lamination, hot melt lamination, melt extrusion lamination, coextrusion processing, or the like to adjust the surface tension of the release sheet. In other words, the following laminate can be produced as a release sheet having a surface tension of at least one surface as a film within a preferred range as a surface of the release sheet which is in contact with the resin film formation layer. The film is laminated on the film in such a manner that the surface is in contact with the resin film forming layer.
剝離板片的厚度沒有特別的限制,較佳為10~200μm,更佳為30~150μm。 The thickness of the release sheet is not particularly limited, and is preferably 10 to 200 μm, more preferably 30 to 150 μm.
(治具接著層) (the jig is next layer)
作為治具接著層,係能夠採用由黏著劑層單體所構成之黏著部件;由基材及黏著劑層所構成之黏著部件;及具有芯材之 兩面黏著部件。治具接著層係例如環狀(ring type),具有空洞部(內部開口)且具有能夠固定在環狀框等的治具之大小。具體而言,環狀框的內徑比治具接著層的外徑更小。而且,環狀框的內徑比治具接著層的內徑稍大。而且,環狀框係通常為金屬或塑膠的成形體。 As an adhesive layer, an adhesive member composed of a single adhesive layer; an adhesive member composed of a substrate and an adhesive layer; and a core material can be used. Adhesive parts on both sides. The jig has a layer, for example, a ring type, has a cavity portion (internal opening), and has a size that can be fixed to a ring frame or the like. Specifically, the inner diameter of the annular frame is smaller than the outer diameter of the subsequent layer of the jig. Moreover, the inner diameter of the annular frame is slightly larger than the inner diameter of the adhesive layer. Moreover, the annular frame is usually a molded body of metal or plastic.
將由黏著劑層單體所構成之黏著部件作為治具接著層的情形,作為形成黏著劑層之黏著劑沒有特別的限制,例如是較佳以由丙烯酸系黏著劑、橡膠系黏著劑、或矽酮黏著劑所構成者。此些之中,考慮在樹脂膜形成用板片的外周部之剝離板片的剝離力和對環狀框的黏著力、及從環狀框的再剝離性時,較佳為含有上述的丙烯酸系聚合物(A1)之丙烯酸系黏著劑。而且,上述黏著劑係可單獨使用,亦可混合二種以上而使用。 In the case where the adhesive member composed of the adhesive layer alone is used as the adhesive layer, the adhesive for forming the adhesive layer is not particularly limited, and for example, an acrylic adhesive, a rubber adhesive, or a crucible is preferably used. The ketone adhesive is composed of. Among these, in view of the peeling force of the peeling sheet at the outer peripheral portion of the sheet for forming a resin film, the adhesion to the ring frame, and the removability from the ring frame, it is preferable to contain the above acrylic. An acrylic adhesive of the polymer (A1). Further, the above-mentioned adhesives may be used singly or in combination of two or more.
構成治具接著層之黏著劑層的厚度,較佳為2~20μm,更佳為3~15μm,再更佳為4~10μm。黏著劑層的厚度未滿2μm時,有未顯現充分的剝離力和黏著力之情形。黏著劑層的厚度大於20μm時,剝離力和黏著力變高。有無法發揮本發明的效果之情形;和在從環狀框剝離時有在環狀框殘留黏著劑的殘渣物而將環狀框污染之情形。 The thickness of the adhesive layer constituting the adhesive layer of the jig is preferably 2 to 20 μm, more preferably 3 to 15 μm, still more preferably 4 to 10 μm. When the thickness of the adhesive layer is less than 2 μm, there is a case where sufficient peeling force and adhesive force are not exhibited. When the thickness of the adhesive layer is more than 20 μm, the peeling force and the adhesive force become high. There is a case where the effect of the present invention is not exhibited. When the film is peeled off from the annular frame, the residue of the adhesive remains in the annular frame to contaminate the annular frame.
將由基材及黏著劑層所構成之黏著部件作為治具接著層時,係將構成黏著部件之黏著劑層與剝離板片層積。 When the adhesive member composed of the substrate and the adhesive layer is used as a jig adhesive layer, the adhesive layer constituting the adhesive member is laminated with the release sheet.
作為形成黏著劑層之黏著劑,係與上述由黏著劑層單體所構成的黏著部件之形成黏著劑層之黏著劑相同。而且,黏著劑層的厚度亦相同。 The adhesive for forming the adhesive layer is the same as the adhesive for forming the adhesive layer of the adhesive member composed of the adhesive layer alone. Moreover, the thickness of the adhesive layer is also the same.
構成治具接著層之基材,係沒有特別限制,例如可舉出聚乙烯薄膜、聚丙烯薄膜、乙烯-乙酸乙烯酯共聚物薄膜、乙烯-(甲基)丙烯酸共聚物薄膜、乙烯-(甲基)丙烯酸酯共聚物薄膜、離子聚合物樹脂薄膜等的聚烯烴薄膜、聚氯乙烯薄膜、聚對苯二甲酸乙二酯薄膜等。此些之中,考慮擴展性時,較佳為聚乙烯薄膜及聚氯乙烯薄膜,更佳為聚氯乙烯薄膜。 The base material constituting the adhesive layer of the jig is not particularly limited, and examples thereof include a polyethylene film, a polypropylene film, an ethylene-vinyl acetate copolymer film, an ethylene-(meth)acrylic copolymer film, and ethylene-(A). A polyolefin film such as an acrylate copolymer film or an ionic polymer resin film, a polyvinyl chloride film, a polyethylene terephthalate film or the like. Among these, in view of expandability, a polyethylene film and a polyvinyl chloride film are preferable, and a polyvinyl chloride film is more preferable.
構成治具接著層之基材的厚度,較佳為15~200μm,更佳為30~150μm,再更佳為40~100μm。 The thickness of the substrate constituting the adhesive layer of the jig is preferably 15 to 200 μm, more preferably 30 to 150 μm, still more preferably 40 to 100 μm.
而且,將具有芯材之兩面黏著部件作為治具接著層時,兩面黏著部件係由芯材、在其一面形成之層積用黏著劑層、及其另一面形成之固定用黏著劑層所構成。層積用黏著劑層為被貼附在支撐板片11側之黏著劑層。而且,固定用黏著劑層,係被貼附在剝離板片13側之黏著劑層,用於在去除剝離板片13後的治具的固定。 Further, when the double-sided adhesive member having the core material is used as the jig adhesive layer, the double-sided adhesive member is composed of a core material, a layering adhesive layer formed on one surface thereof, and a fixing adhesive layer formed on the other surface thereof. . The layering adhesive layer is an adhesive layer attached to the side of the support sheet 11. Further, the fixing adhesive layer is attached to the adhesive layer on the side of the peeling sheet 13 for fixing the jig after the peeling of the peeling sheet 13.
作為兩面黏著部件的芯材,可舉出與上述黏著部件的基材相同者。此些之中,考慮擴展性時,較佳為聚烯烴薄膜及可塑化的聚氯乙烯薄膜。 The core material of the double-sided adhesive member may be the same as the base material of the above-mentioned adhesive member. Among these, in view of expandability, a polyolefin film and a plasticizable polyvinyl chloride film are preferable.
芯材的厚度通常為15~200μm,較佳為30-150μm,更佳為40~100μm。 The thickness of the core material is usually 15 to 200 μm, preferably 30 to 150 μm, more preferably 40 to 100 μm.
兩面黏著部件的層積用黏著劑層及固定用黏著劑層,可以由相同的黏著劑所構成之層,亦可以由不同的黏著劑所構成之層。 The layered adhesive layer for the double-sided adhesive member and the adhesive layer for fixing may be a layer composed of the same adhesive or a layer composed of different adhesives.
構成固定用黏著劑層之黏著劑,係以在樹脂膜形成用板片的外周部之剝離板片的剝離力和對環狀框的黏著力 成為適當範圍之方式,而且以固定用黏著劑層與環狀框的接著力係成為比支撐板片與層積用黏著劑層的接著力更小之方式適當地選擇。作為此種黏著劑,例如可舉出丙烯酸系黏著劑、橡膠系黏著劑、矽酮黏著劑,考慮在樹脂膜形成用板片的外周部之剝離板片的剝離力和對環狀框的黏著力、及從環狀框的再剝離性時,較佳為含有上述的丙烯酸系聚合物(A1)之丙烯酸系黏著劑。而且,形成固定用黏著劑層之黏著劑,係可單獨使用,亦可混合二種以上而使用。 The adhesive constituting the fixing adhesive layer is a peeling force of the peeling sheet at the outer peripheral portion of the resin film forming sheet and adhesion to the ring frame. In a suitable range, the adhesion force between the fixing adhesive layer and the annular frame is appropriately selected so as to be smaller than the adhesion force between the supporting sheet and the layering adhesive layer. Examples of such an adhesive include an acrylic adhesive, a rubber adhesive, and an anthrone adhesive, and the peeling force of the peeling sheet on the outer peripheral portion of the resin film forming sheet and the adhesion to the ring frame are considered. In the case of the force and the removability from the ring frame, an acrylic pressure-sensitive adhesive containing the above acrylic polymer (A1) is preferred. Further, the adhesive for forming the fixing adhesive layer may be used singly or in combination of two or more.
構成層積用黏著劑層之黏著劑係沒有特別限定。例如可舉出丙烯酸系黏著劑、橡膠系黏著劑、矽酮黏著劑。此些之中,從支撐板片之接著力的控制為容易之觀點而言,較佳含有上述的丙烯酸系聚合物(A1)之丙烯酸系黏著劑。而且,形成層積用黏著劑層之黏著劑,係可單獨使用,亦可混合二種以上而使用。 The adhesive system constituting the adhesive layer for lamination is not particularly limited. For example, an acrylic adhesive, a rubber-based adhesive, and an anthrone adhesive can be mentioned. Among these, the acrylic adhesive of the above acrylic polymer (A1) is preferably contained from the viewpoint of easy control of the adhesion of the support sheet. Further, the adhesive for forming the adhesive layer for lamination may be used singly or in combination of two or more.
層積用黏著劑層及固定用黏著劑層的厚度,係與上述黏著部件的黏著劑層之厚度相同。 The thickness of the adhesive layer for lamination and the adhesive layer for fixing is the same as the thickness of the adhesive layer of the above-mentioned adhesive member.
藉由設置治具接著層,將樹脂膜形成用板片接著在環狀框等的治具係變為容易。 By providing a jig-attachment layer, it is easy to form a sheet for forming a resin film and then to a jig for a ring-shaped frame or the like.
包含上述各層之樹脂膜形成用板片層積體100,係能夠將剝離板片13去除之後,將樹脂膜形成層12a貼附在被著體32,且能夠依照情況,隨後在被著體32施行切割等的所需要的加工。然後,使樹脂膜形成層12a固定殘留在被著體32而將支撐板片11剝離。亦即,能夠使用包含將樹脂膜形成層12a從支撐板片11轉印至被著體32的步驟之製程。 The resin film-forming sheet laminate 100 including the above-described layers is capable of adhering the peeling sheet 13 and then attaching the resin film forming layer 12a to the object 32, and can be subsequently placed on the body 32 as the case may be. Perform the required processing such as cutting. Then, the resin film forming layer 12a is fixedly held by the object 32 to peel off the supporting sheet piece 11. That is, a process including a step of transferring the resin film forming layer 12a from the supporting sheet 11 to the object 32 can be used.
作為在本發明能夠應用的被著體,不被其素材限定,例如能夠舉出半導體晶圓、玻璃基板、陶瓷基板、可撓式電路板(FPC)等的有機材料基板、或精密部品等的金屬材料等各種物品、此些的物品單片化的晶片等。 The object to be applied to the present invention is not limited by the material, and examples thereof include an organic material substrate such as a semiconductor wafer, a glass substrate, a ceramic substrate, a flexible circuit board (FPC), or a precision part. Various articles such as metal materials, wafers in which such articles are singulated, and the like.
樹脂膜形成用板片層積體的形狀,係能夠設為在長條剝離板片上,將含有支撐板片及樹脂膜形成層之樹脂膜形成用板片層積而成之帶狀形狀,且能夠將其捲取。特別是如第2圖所示,以將含有配合所需要的形狀而切下的支撐板片11及樹脂膜形成層12a之樹脂膜形成用板片10,在長條剝離板片13上以能夠剝離且一定間隔的方式層積而成之形態為佳。而且,亦能夠將樹脂膜形成用板片層積體的形狀設作單片的形狀。 The shape of the sheet laminate for forming a resin film can be a strip shape in which a sheet for forming a resin film containing a support sheet and a resin film forming layer is laminated on a long peeling sheet, and Can be rolled up. In particular, as shown in FIG. 2, the resin film-forming sheet 10 which is formed by the support sheet piece 11 and the resin film forming layer 12a which are cut out in a shape which is required to be blended is provided on the long peeling sheet 13 It is preferable that the form is formed by lamination and a certain interval. Further, the shape of the sheet laminate for resin film formation can also be set to a single sheet shape.
將配合所需要的形狀而切下之含有支撐板片及樹脂膜形成層之樹脂膜形成用板片,在長條剝離板片上成為以能夠剝離且一定間隔的方式層積而成之形態時,在層積有樹脂膜形成用板片之部分、及未層積有樹脂膜形成用板片之部分,樹脂膜形成用板片層積體的厚度成為不均勻。將此種厚度不均勻之樹脂膜形成用板片層積體捲取成為捲狀時,厚度係不均勻且捲壓亦不均勻,致使捲物有產生捲取崩潰之情形。因而,在此種形態的樹脂膜形成用板片層積體中,係以使厚度均勻為佳。因此,在配合所需要的形狀而切下之樹脂膜形成用板片的外側,如第2圖所顯示,較佳為以空出少許間隔且沿著在長條剝離板片13的短方向之兩緣部17貼合與樹脂膜形成用板片10相同程度的厚度之周邊膠帶14。在此,樹脂膜形成用板片10 與周邊膠帶14之間隔較佳為1~20mm左右,特佳為2~10mm左右。藉由周邊膠帶14來消除厚度的不均勻,而使避免上述的不良變為容易。 When the resin film-forming sheet piece containing the support sheet piece and the resin film forming layer which is cut out in accordance with the desired shape is formed in a form which can be peeled off and spaced at a predetermined interval, In the portion where the resin film-forming sheet is laminated and the portion in which the resin film-forming sheet is not laminated, the thickness of the resin film-forming sheet laminate is uneven. When such a sheet laminate for forming a resin film having a non-uniform thickness is wound into a roll shape, the thickness is uneven and the winding pressure is not uniform, so that the wound may collapse. Therefore, in the laminated sheet for forming a resin film of such a form, it is preferable to make the thickness uniform. Therefore, the outer side of the sheet for forming a resin film which is cut in accordance with the desired shape, as shown in Fig. 2, is preferably spaced apart a little and along the short direction of the strip-like sheet 13 in the strip. The both edge portions 17 are bonded to the peripheral tape 14 having the same thickness as the resin film forming sheet 10 . Here, the resin film forming sheet 10 The distance from the peripheral tape 14 is preferably about 1 to 20 mm, and particularly preferably about 2 to 10 mm. The unevenness of the thickness is eliminated by the peripheral tape 14, and it is easy to avoid the above-mentioned defects.
樹脂膜形成用板片層積體的製造 Manufacture of sheet laminate for resin film formation
其次,針對將配合所需要的形狀而切下之樹脂膜形成用板片,在長條剝離板片上成為以能夠剝離且一定間隔的方式層積而成的形態之樹脂膜形成用板片層積體的製造方法,以第3圖所顯示之第1態樣作為例子而進行說明,但是本發明的樹脂膜形成用板片,係不被限定為使用此種製造方法而得到者。 Then, the sheet for forming a resin film which is cut out in accordance with the shape to be formed is laminated on the strip of the resin film which is formed by being able to be peeled off at a predetermined interval. The method of producing the body is described by taking the first aspect shown in Fig. 3 as an example. However, the sheet for forming a resin film of the present invention is not limited to those obtained by using such a production method.
首先,如第5a圖所示,在基材11a與黏著劑層11b所構成的黏著板片(支撐板片11)的黏著劑層11b上,準備層積有第1剝離板片15的層積體。然後,如第5b圖所示,將第1剝離板片15半切割為所希望的形狀。 First, as shown in Fig. 5a, the laminate of the first peeling sheet 15 is prepared by laminating the adhesive layer 11b of the adhesive sheet (support sheet 11) formed of the base material 11a and the adhesive layer 11b. body. Then, as shown in Fig. 5b, the first peeling sheet 15 is half-cut into a desired shape.
具體而言,係準備長條狀的黏著板片(以下亦記載為「長條黏著板片11」)與長條狀的第1剝離板片15(以下亦記載為「第1長條剝離板片15」)之層積體。尚且,第1長條剝離板片15層積於長條剝離板片11的黏著劑層11b上。 Specifically, a long-shaped adhesive sheet (hereinafter also referred to as "long adhesive sheet 11") and a long strip-shaped first peeling sheet 15 (hereinafter also referred to as "first long peeling sheet" are prepared. A laminate of sheets 15"). Further, the first elongated peeling sheet 15 is laminated on the adhesive layer 11b of the long peeling sheet 11.
其次,如第5b圖所示,以將第1長條剝離板片15完全切割為所希望的形狀、不完全切割長條黏著板片11之方式進行模切(die cutting)(半切割)。模切係使用晶粒切割等的泛用的裝置(旋轉式刀刃或單刀)、方法來進行。此時的切入深度只要能夠將第1長條剝離板片15完全切割並沒有特別的限制。於亦切割長條黏著板片11時,如第3圖或第5b圖,形成切入深度d1的切入部D1。依此形成的切入部D1的切入 深度d1及其效果,如同上述。 Next, as shown in Fig. 5b, die cutting (half cutting) is performed in such a manner that the first long peeling sheet 15 is completely cut into a desired shape and the long adhesive sheet 11 is not completely cut. The die cutting is performed using a general-purpose device (rotary blade or single blade) or the like such as die cutting. The cutting depth at this time is not particularly limited as long as the first long peeling sheet 15 can be completely cut. When the long adhesive sheet 11 is also cut, as shown in Fig. 3 or Fig. 5b, the cut-in portion D1 is cut into the depth d1. The cut-in of the cut-in portion D1 formed thereby The depth d1 and its effect are as described above.
其次,在第1長條剝離板片15的長度方向貼附剝離用黏著膠帶(未圖示)。然後,藉由將剝離用黏著膠帶去除,如第5c圖所示,得到去除模切為所希望形狀的剝離板片15b、並使第1長條剝離板片15的剩餘部分15a殘存於長條黏著板片11上、形成有所希望形狀的開口部15c的層積體(以下亦記載為「第1層積體」)。第1層積體為第1長條剝離板片15的剩餘部分15a與長條黏著板片11的層積體。 Next, an adhesive tape for peeling (not shown) is attached to the longitudinal direction of the first long peeling sheet 15. Then, by removing the adhesive tape for peeling, as shown in Fig. 5c, the peeling sheet 15b which is die-cut into a desired shape is removed, and the remaining portion 15a of the first long peeling sheet 15 remains in the strip. A laminate (hereinafter also referred to as a "first laminate") having an opening 15c having a desired shape is formed on the adhesive sheet 11. The first laminate is a laminate of the remaining portion 15a of the first elongated peeling sheet 15 and the long adhesive sheet 11.
其次,準備在長條狀的剝離板片16(以下亦記載為「樹脂膜形成層轉印用板片16」)上具有樹脂膜形成層12的層積體。作為該層積體的製造方法,亦可以將預先製膜成薄膜狀的樹脂膜形成層12層積於樹脂膜形成層轉印用板片16,而且,亦可以將用以形成樹脂膜形成層12的樹脂膜形成用組合物塗佈於樹脂膜形成層轉印用板片16並乾燥。 Then, a laminate having the resin film forming layer 12 on the strip-shaped peeling sheet 16 (hereinafter also referred to as "the resin film forming layer transfer sheet 16") is prepared. As a method of producing the laminate, the resin film forming layer 12 which has been formed into a film in advance may be laminated on the resin film forming layer transfer sheet 16, and the resin film forming layer may be formed. The resin film forming composition of 12 is applied to the resin film forming layer transfer sheet 16 and dried.
然後,如第5d圖所示,將包含樹脂膜形成層轉印用板片16與樹脂膜形成層12的層積體的樹脂膜形成層12,貼附於第1層積體的開口部15c側。藉由此步驟,將樹脂膜形成層12的一部分擬合於開口部15c。 Then, as shown in Fig. 5d, the resin film forming layer 12 including the laminate of the resin film forming layer transfer sheet 16 and the resin film forming layer 12 is attached to the opening 15c of the first laminate. side. By this step, a part of the resin film forming layer 12 is fitted to the opening 15c.
其次,如第5e圖所示,以第1長條剝離板片15的剩餘部分15a與長條黏著板片11的界面為剝離起點,則樹脂膜膜形成層12切割為擬合於開口部15c的形狀,於長條黏著板片11的黏著劑層11b上,殘留所希望形狀的樹脂膜形成層12a。由於樹脂膜形成層轉印用板片16、樹脂膜形成層12的剩餘部分12b以及第1長條剝離板片15的剩餘部分15a的 層積體於長度方向連續,藉由去除該層積體,得到在長條黏著板片11的黏著劑層11b上排列有所希望形狀的樹脂膜形成層12a的層積體(於長度方向連續的樹脂膜形成用板片10)。藉由使樹脂膜形成層的斷裂伸度、斷裂強度於規定範圍,能夠更為提升樹脂膜形成層的切割性。 Next, as shown in Fig. 5e, the interface between the remaining portion 15a of the first long peeling sheet 15 and the long adhesive sheet 11 is a peeling starting point, and the resin film forming layer 12 is cut to fit the opening 15c. The shape of the resin film forming layer 12a of a desired shape remains on the adhesive layer 11b of the long adhesive sheet 11. The resin film forming layer transfer sheet 16, the remaining portion 12b of the resin film forming layer 12, and the remaining portion 15a of the first elongated peeling sheet 15 The laminate is continuous in the longitudinal direction, and by removing the laminate, a laminate of the resin film forming layer 12a having a desired shape on the adhesive layer 11b of the long adhesive sheet 11 is obtained (continuous in the longitudinal direction) The resin film forming sheet 10). When the elongation at break and the breaking strength of the resin film forming layer are within a predetermined range, the cutting property of the resin film forming layer can be further improved.
然後,如第5f圖所示,上述層積體的具有樹脂膜形成層12a的面,貼附長條狀的第2剝離板片13(以下亦記載為「第2長條剝離板片13」),得到於第2長條剝離板片13與長條黏著板片11之間具有樹脂膜形成層12a的層積體(以下亦記載為「第2層積體」)。然後,從長條黏著板片11側,將第2層積體的長條黏著板片11模切為環狀框的內徑以上、外徑以下的尺寸之所希望形狀。此時,以樹脂膜形成層12a的中心點與模切後的長條黏著板片11的中心點一致的方式進行模切。此時的切入深度,只要能夠完全切割長條黏著板片11則沒有特別的限制。於亦切割第2長條剝離板片13的情形,如第3圖或第5g圖所示,形成切入深度d2的切入部D2。依此形成的切入部D2的切入深度d2及其效果,如同上述。 Then, as shown in Fig. 5f, the second peeling sheet 13 having a long strip shape is attached to the surface of the laminate having the resin film forming layer 12a (hereinafter also referred to as "the second long stripping sheet 13" A laminate (hereinafter also referred to as a "second laminate") having a resin film formation layer 12a between the second long release sheet 13 and the long adhesive sheet 11 is obtained. Then, from the side of the long-length adhesive sheet 11, the long-length adhesive sheet 11 of the second laminate is die-cut into a desired shape having a size equal to or larger than the inner diameter and the outer diameter of the annular frame. At this time, die cutting is performed so that the center point of the resin film forming layer 12a coincides with the center point of the die-cut long adhesive sheet 11. The depth of cut at this time is not particularly limited as long as the long adhesive sheet 11 can be completely cut. In the case where the second long strip peeling sheet 13 is also cut, as shown in Fig. 3 or Fig. 5g, the cut portion D2 having the cut depth d2 is formed. The plunging depth d2 of the cut portion D2 thus formed and its effect are as described above.
然後,使所希望的形狀的黏著板片11殘存於第2長條剝離板片13上,去除剩餘的長條黏著板片。其結果,得到於第2長條剝離板片13上層積有包含規定形狀的樹脂膜形成層12a與黏著板片(支撐板片11)之樹脂膜形成用板片10的本發明的樹脂膜形成用板片層積體100。 Then, the adhesive sheet 11 of a desired shape remains on the second elongated peeling sheet 13, and the remaining long adhesive sheets are removed. As a result, the resin film of the present invention in which the resin film forming layer 12a having the predetermined shape and the resin film forming layer 12a and the adhesive sheet (supporting sheet 11) are laminated on the second long peeling sheet 13 is formed. A slab laminate 100 is used.
尚且,於上述中,進行長條黏著板片的模切之際,在將長條黏著板片切割為所希望的形狀的同時,從該形狀的長 條黏著板片11的外側從黏著板片空出少許的間隔,較佳沿著第2長條剝離板片13的短方向的兩緣部17殘存作為周邊膠帶14的黏著板片的方式進行模切。其後,使所希望的形狀的黏著板片11以及周邊膠帶14殘存於第2長條剝離板片13上,藉由去除剩餘的黏著板片,得到包含黏著板片11與樹脂膜形成層12a的樹脂膜形成用板片10與周邊膠帶14在長條的剝離板片13上連續的貼合之型態的樹脂膜形成用板片層積體100。 Further, in the above, when the die-cut sheet is cut, the long-shaped adhesive sheet is cut into a desired shape, and the shape is long. The outer side of the adhesive sheet 11 is vacantly spaced from the adhesive sheet, and is preferably molded as the adhesive sheet of the peripheral tape 14 remaining along both edge portions 17 of the second elongated peeling sheet 13 in the short direction. cut. Thereafter, the adhesive sheet 11 and the peripheral tape 14 having a desired shape remain on the second elongated peeling sheet 13, and the remaining adhesive sheet is removed to obtain the adhesive sheet 11 and the resin film forming layer 12a. The resin film-forming sheet laminate 10 in which the resin film-forming sheet 10 and the peripheral tape 14 are continuously bonded to each other on the long peeling sheet 13 is formed.
半導體裝置的製造方法 Semiconductor device manufacturing method
其次,針對本發明的樹脂膜形成用板片層積體之利用方法,將第2圖及第3圖所顯示之第1態樣的樹脂膜形成用板片層積體應用在半導體裝置的製造方法之情況,採用作為例子而進行說明。 In the method of using the sheet laminate for forming a resin film of the present invention, the sheet laminate for forming a resin film according to the first aspect shown in Figs. 2 and 3 is applied to the manufacture of a semiconductor device. The case of the method will be described as an example.
第1的半導體裝置的製造方法,係以含有以下的步驟為佳:將樹脂膜形成用板片層積體的樹脂膜形成層黏貼在被著體且將該被著體切割而成為晶片,使該樹脂膜形成層固定殘留在該晶片的任一面且從支撐板片剝離,而且將該晶片透過該樹脂膜形成層而載置在基板上、或另外的晶片上。該樹脂膜形成層為晶片與基板或其他的晶片的接著膜。 In the method of manufacturing the semiconductor device of the first aspect, it is preferable that the resin film forming layer of the resin film-forming sheet laminate is adhered to the object, and the object is cut into a wafer. The resin film forming layer is fixed and left on the surface of the wafer and peeled off from the supporting sheet, and the wafer is placed on the substrate or the other wafer by passing through the resin film forming layer. The resin film forming layer is an adhesive film of a wafer and a substrate or another wafer.
以下,使用以矽晶圓作為被著體之例子而進行說明。 Hereinafter, an example in which a germanium wafer is used as a substrate will be described.
對晶圓表面的電路形成,可利用包含蝕刻法、剝離法(lift off)等以往泛用的方法之各種方法以進行。其次,對半導體晶圓的電路面之相反面(背面)進行研磨。研磨法並沒有特別的限定,亦可以使用研磨器(grinder)等的公知手段 進行研磨。在背面研磨時,為了保護表面的電路而於電路面貼附稱作為表面保護板片之黏著板片。背面研磨是將晶圓的電路面側(亦即是表面保護板片側)以夾頭座(chuck table)等固定,對未形成電路的背面側以研磨器進行研磨。晶圓的研磨後厚度並沒有特別的限定,通常為50~500μm程度。 The circuit formation on the wafer surface can be carried out by various methods including a conventionally used method such as an etching method or a lift off method. Next, the opposite side (back surface) of the circuit surface of the semiconductor wafer is polished. The polishing method is not particularly limited, and a known means such as a grinder can also be used. Grinding. In the case of back grinding, an adhesive sheet called a surface protective sheet is attached to the circuit surface in order to protect the circuit on the surface. In the back surface polishing, the circuit surface side of the wafer (that is, the surface protection sheet side) is fixed by a chuck table or the like, and the back surface side where the circuit is not formed is polished by a grinder. The thickness of the wafer after polishing is not particularly limited, and is usually about 50 to 500 μm.
隨後,按照必要而將背面研磨時所產生的粉碎層去除。粉碎層的去除係能夠使用化學蝕刻、電漿蝕刻等來進行。 Subsequently, the pulverized layer generated at the time of back grinding is removed as necessary. The removal of the pulverized layer can be performed using chemical etching, plasma etching, or the like.
接著電路形成及背面研磨,係在晶圓的背面貼附樹脂膜形成用板片層積體之樹脂膜形成層。貼附方法沒有特別限定,例如藉由第1a圖至第1d圖所顯示的步驟將樹脂膜形成層貼附在半導體晶圓。 Next, the circuit formation and the back surface polishing are performed by attaching a resin film forming layer of the resin film forming sheet laminate to the back surface of the wafer. The attaching method is not particularly limited. For example, the resin film forming layer is attached to the semiconductor wafer by the steps shown in FIGS. 1a to 1d.
第1a圖至第1d圖,係進行將樹脂膜形成用板片10貼附在被著體32之半導體晶圓的作業之一系列的步驟圖。如第1a圖所顯示,樹脂膜形成用板片層積體100之剝離板片13係達成載體薄膜的作用,被2支輥筒62及66、以及剝離板64支撐之同時,其一端係在連接至圓柱狀捲芯44的狀態下被捲繞且形成第1捲42;而另一端係在連接至圓柱狀捲芯54的狀態下被捲繞且形成第2捲52。而且,第2捲52的捲芯54係被連接至用以使該捲芯54旋轉之捲芯驅動用馬達(未圖示),樹脂膜形成用板片10被剝離之後的剝離板片13係以預定速度被捲繞。 1a to 1d are steps showing a series of operations for attaching the resin film forming sheet 10 to the semiconductor wafer of the object 32. As shown in Fig. 1a, the peeling sheet 13 of the sheet laminate for resin film formation 100 functions as a carrier film, and is supported by the two rolls 62 and 66 and the peeling plate 64, and one end thereof is attached thereto. The first roll 42 is wound while being connected to the cylindrical core 44, and the other end is wound in a state of being connected to the cylindrical core 54 to form the second roll 52. Further, the winding core 54 of the second roll 52 is connected to a winding drive motor (not shown) for rotating the winding core 54, and the peeling sheet 13 after the resin film forming sheet 10 is peeled off It is wound at a predetermined speed.
首先,捲芯驅動用馬達旋轉時,第2捲52的捲芯54係旋轉,樹脂膜形成用板片10從被第1捲42的捲芯44捲繞之樹脂膜形成用板片100往第1捲42的外部被拉出。然後, 被拉出的樹脂膜形成用板片10,係被引導至配置在移動式的載物台36上之圓板狀的半導體晶圓32及以將其包圍的方式配置之環狀框34上。 First, when the core driving motor rotates, the winding core 54 of the second roll 52 rotates, and the resin film forming sheet 10 is wound from the resin film forming sheet 100 wound by the winding core 44 of the first roll 42. The outside of the 1 roll 42 is pulled out. then, The sheet 10 for forming a resin film to be drawn is guided to a disk-shaped semiconductor wafer 32 disposed on the movable stage 36 and an annular frame 34 disposed to surround the disk-shaped semiconductor wafer 32.
其次,將樹脂膜形成用板片10從剝離板片13剝離。此時,如第1a圖所示,從樹脂膜形成用板片10的剝離板片13側可被剝離板64碰觸。 Next, the resin film forming sheet 10 is peeled off from the peeling sheet 13 . At this time, as shown in FIG. 1a, the peeling plate 64 can be touched from the side of the peeling sheet 13 of the resin film forming sheet 10.
而且,如第1b圖所示,形成切入部D2時,剝離板片13係以切入部D2作為起點而被往剝離板64側折彎,而能夠容易地在剝離板片13與樹脂膜形成用板片10之間製作出剝離起點。而且,亦可以對剝離板片13與樹脂膜形成用板片10的境界面吹附空氣,來使剝離起點能夠更有效率地製作出。其結果,樹脂膜形成用板片10的放出係變為更容易。 Further, as shown in Fig. 1b, when the cut portion D2 is formed, the peeling sheet 13 is bent toward the peeling plate 64 with the cut portion D2 as a starting point, and can be easily formed in the peeling sheet 13 and the resin film. A peeling starting point is formed between the sheets 10. Further, air may be blown to the interface between the peeling sheet 13 and the resin film forming sheet 10, so that the peeling starting point can be produced more efficiently. As a result, the release system of the resin film forming sheet 10 becomes easier.
其次,如第1c圖所示,樹脂膜形成用板片10係與環狀框34及半導體晶圓32密著的方式進行貼附樹脂膜形成用板片10。此時,藉由輥筒68將樹脂膜形成用板片10壓黏在半導體晶圓32上。然後,如第1d圖所示,樹脂膜形成用板片10貼附在半導體晶圓32上係完成,而能夠得到附有樹脂膜形成用板片的半導體晶圓。 Then, as shown in FIG. 1c, the resin film forming sheet 10 is attached to the resin film forming sheet 10 so as to be in close contact with the annular frame 34 and the semiconductor wafer 32. At this time, the resin film forming sheet 10 is pressure-bonded to the semiconductor wafer 32 by the roller 68. Then, as shown in Fig. 1d, the resin film-forming sheet 10 is attached to the semiconductor wafer 32, and a semiconductor wafer with a resin film-forming sheet can be obtained.
如以上的依照程序,能夠使用自動化的步驟連續地進行將樹脂膜形成用板片10貼附在半導體晶圓32。作為進行此種樹脂膜形成用板片10貼附在半導體晶圓32的作業之裝置,例如可舉出LINTEC(股)製的RAD-2500(商品名)等。 As described above, the resin film forming sheet 10 can be attached to the semiconductor wafer 32 continuously using an automated step. For example, the RAD-2500 (trade name) manufactured by LINTEC Co., Ltd., and the like are used as the apparatus for attaching the resin film forming sheet 10 to the semiconductor wafer 32.
而且,藉由此種步驟,將樹脂膜形成用板片10貼附在半導體晶圓32時,藉由使用本發明的樹脂膜形成用板片 層積體100,樹脂膜形成用板片10係能夠容易從剝離板片13放出。 Further, when the resin film forming sheet 10 is attached to the semiconductor wafer 32 by such a step, the resin film forming sheet of the present invention is used. In the laminate 100, the resin film forming sheet 10 can be easily discharged from the peeling sheet 13.
樹脂膜形成層在室溫係不具有黏性時,亦可以適當地加溫(未限定地,以40~80℃為佳)。 When the resin film forming layer does not have viscosity at room temperature, it may be appropriately heated (unless limitedly, 40 to 80 ° C is preferable).
而且,在樹脂膜形成層配合能量線反應性化合物(B21)和具有藉由能量線反應的官能基的硬化性聚合物成分(AB)時,亦可以從支撐板片側對樹脂膜形成層照射能量線,而將樹脂層形成層預硬化且提升樹脂膜形成層的凝聚力,來使樹脂膜形成層與支撐板片之間的接著力降低。 Further, when the energy ray-reactive compound (B21) and the curable polymer component (AB) having a functional group reactive by an energy ray are blended in the resin film forming layer, the resin film forming layer can be irradiated with energy from the side of the supporting sheet. In the line, the resin layer forming layer is pre-hardened and the cohesive force of the resin film forming layer is raised to lower the adhesion between the resin film forming layer and the supporting sheet.
隨後,使用切割鋸等的切斷手段,將上述的半導體晶圓切割而得到半導體晶片。此時的切斷深度,係考慮半導體晶圓的厚度與樹脂膜形成層的厚度之合計及加上切割鋸的磨耗程度後之深度。而且,作為切割手段亦可以使用雷射光。 Subsequently, the semiconductor wafer is cut by a cutting means such as a dicing saw to obtain a semiconductor wafer. The cutting depth at this time is considered in consideration of the total thickness of the semiconductor wafer and the thickness of the resin film forming layer, and the depth after the degree of wear of the dicing saw is added. Further, laser light can also be used as the cutting means.
而且,能量線照射可以在半導體晶圓的貼附後,半導體晶片的剝離(拾取)前之任一階段進行,例如可以在切割之後進行,而且,亦可以在下述的擴展步驟之後進行,較佳在半導體晶圓的貼附後且切割前進行。而且亦可將能量線照射分成複數次而進行。 Further, the energy ray irradiation may be performed at any stage before the detachment (pickup) of the semiconductor wafer after the attachment of the semiconductor wafer, for example, after the dicing, or may be performed after the expansion step described below, preferably. After the attachment of the semiconductor wafer and before cutting. Furthermore, it is also possible to divide the energy ray irradiation into a plurality of times.
其次,按照必要而進行樹脂膜形成用板片的擴展時,半導體晶片間隔擴張,能夠使半導體晶片的拾取更容易地進行。此時,在樹脂膜形成層與支撐板片之間,產生偏移使得樹脂膜形成層與支撐板片之間的接著力減少且半導體晶片的拾取性提升。如此進行而進行半導體晶片的拾取時,能夠使被切斷後的樹脂膜形成層固定殘留半導體晶片背面而從支撐板 片剝離。 Then, when the sheet for forming a resin film is expanded as necessary, the semiconductor wafer is expanded at intervals, and the pickup of the semiconductor wafer can be performed more easily. At this time, an offset occurs between the resin film forming layer and the supporting sheet, so that the adhesion between the resin film forming layer and the supporting sheet is reduced and the pickup property of the semiconductor wafer is improved. When the semiconductor wafer is picked up in this manner, the resin film forming layer after the cutting can be fixed to the back surface of the residual semiconductor wafer from the support plate. The piece is peeled off.
而且,作為切割半導體晶圓以得到半導體晶片的方法,可使用所謂的先切割法。具體而言,從在表面形成有電路的半導體晶圓表面形成比晶圓厚度更淺的切入深度的溝,於該電路形成面貼附本發明的樹脂膜形成用板片層積體作為表面保護板片。其後,藉由上述半導體晶圓的背面研磨使晶圓的厚度變薄,最終進行個別的晶片的分割。將樹脂膜形成層切切割為晶片尺寸的方法並沒有特別的限制,例如是可是用雷射切割法。 Moreover, as a method of cutting a semiconductor wafer to obtain a semiconductor wafer, a so-called pre-cut method can be used. Specifically, a groove having a shallower depth of cut than the thickness of the wafer is formed on the surface of the semiconductor wafer on which the circuit is formed, and the resin film-forming sheet laminate of the present invention is attached as a surface protection on the circuit formation surface. Plate. Thereafter, the thickness of the wafer is thinned by back surface polishing of the semiconductor wafer, and finally the individual wafers are divided. The method of cutting the resin film forming layer into a wafer size is not particularly limited, and for example, laser cutting is used.
其次,透過樹脂膜形成層而將半導體晶片載置在基板上或另外的半導體晶片(下段晶片)表面(以下,將搭載晶片之基板或下段晶片表面記載為「晶片搭載部」)。 Then, the semiconductor wafer is placed on the substrate or the surface of another semiconductor wafer (lower wafer) through the resin film forming layer (hereinafter, the surface on which the wafer is mounted or the surface of the lower wafer is referred to as "wafer mounting portion").
載置時的壓力通常為1kPa~200MPa。而且,晶片搭載部可以在載置半導體晶片之前進行加熱,或是剛載置後進行加熱。加熱溫度通常為80~200℃,較佳為100~180℃,加熱時間係通常為0.1秒~5分鐘、較佳為0.5秒~3分鐘。 The pressure at the time of mounting is usually 1 kPa to 200 MPa. Further, the wafer mounting portion may be heated before the semiconductor wafer is placed, or may be heated immediately after being placed. The heating temperature is usually 80 to 200 ° C, preferably 100 to 180 ° C, and the heating time is usually 0.1 to 5 minutes, preferably 0.5 to 3 minutes.
將半導體晶片載置在晶片搭載部之後,亦可按照必要而進一步進行加熱。此時的加熱條件係上述加熱溫度的範圍,加熱時間通常為1~180分鐘,較佳為10~120分鐘。 After the semiconductor wafer is placed on the wafer mounting portion, it may be further heated as necessary. The heating condition at this time is in the range of the above heating temperature, and the heating time is usually from 1 to 180 minutes, preferably from 10 to 120 minutes.
而且,亦可不進行載置後的加熱處理而預先設作預接著狀態,利用組件製造時通常所進行的樹脂封裝之加熱使樹脂膜形成層硬化。藉由經過此種步驟,樹脂膜形成層硬化且能夠得到半導體晶片與晶片搭載部堅固地被接著之半導體裝置。因為樹脂膜形成層在晶粒接合條件下流動化,所以亦充分 地埋入晶片搭載部的凹凸且能夠防止產生孔洞,使得半導體裝置可靠性變高。 Further, it is also possible to set the pre-adhesion state in advance without performing the heat treatment after the mounting, and to cure the resin film forming layer by the heating of the resin package which is usually performed during the production of the module. By performing such a procedure, the resin film forming layer is cured, and a semiconductor device in which the semiconductor wafer and the wafer mounting portion are firmly attached can be obtained. Since the resin film forming layer is fluidized under the grain bonding condition, it is also sufficient The unevenness of the wafer mounting portion is buried and the occurrence of holes can be prevented, so that the reliability of the semiconductor device is increased.
而且,第2的半導體裝置的製造方法,較佳是在表面形成有電路之半導體晶圓的背面貼附樹脂膜形成用板片的樹脂膜形成層,隨後,得到在背面具有樹脂膜之半導體晶片。該樹脂膜係半導體晶片的保護膜。而且,本發明之第2的半導體裝置的製造方法,其特徵在於:較佳是進一步含有以下的步驟(1)~(3)且以任意順序進行步驟(1)~(3)。 In the second method of manufacturing the semiconductor device, a resin film forming layer in which a resin film forming sheet is attached to the back surface of the semiconductor wafer on which the circuit is formed is formed, and then a semiconductor wafer having a resin film on the back surface is obtained. . This resin film is a protective film of a semiconductor wafer. Further, in the second method of manufacturing a semiconductor device of the present invention, it is preferable to further include the following steps (1) to (3) and perform the steps (1) to (3) in an arbitrary order.
步驟(1):使樹脂膜形成層硬化而得到樹脂膜,步驟(2):將樹脂膜形成層或樹脂膜與支撐板片剝離,步驟(3):將半導體晶圓與樹脂膜形成層或樹脂膜進行切割。 Step (1): curing the resin film forming layer to obtain a resin film, and step (2): peeling the resin film forming layer or the resin film from the supporting sheet, and step (3): forming a layer of the semiconductor wafer and the resin film or The resin film is cut.
首先,在半導體晶圓的背面,貼附樹脂膜形成用板片的樹脂膜形成層。該步驟係與在上述第1半導體裝置的製造方法之貼附步驟相同。 First, a resin film forming layer of a sheet for forming a resin film is attached to the back surface of the semiconductor wafer. This step is the same as the attaching step in the method of manufacturing the first semiconductor device described above.
隨後,以任意順序進行步驟(1)~(3)。例如,將步驟(1)~(3)以步驟(2)、(1)、(3)的順序,以步驟(1)、(2)、(3)的順序,步驟(1)、(3)、(2)的順序,步驟(3)、(1)、(2)的順序,或以步驟(3)、(2)、(1)的順序之任一順序進行。針對該製程之詳細,在日本特開2002-280329號公報有詳細敘述。作為一個例子,係針對以步驟(2)、(1)、(3)的順序進行的情況進行說明。 Subsequently, steps (1) to (3) are performed in an arbitrary order. For example, steps (1) to (3) are in the order of steps (2), (1), and (3), in the order of steps (1), (2), and (3), steps (1), (3) The order of (2), the order of steps (3), (1), (2), or the order of steps (3), (2), (1) is performed. The details of this process are described in detail in Japanese Laid-Open Patent Publication No. 2002-280329. As an example, the case of performing steps (2), (1), and (3) will be described.
首先,將樹脂膜形成用板片的樹脂膜形成層貼附在表面形成有電路之半導體晶圓的背面。其次,將支撐板片從 樹脂膜形成層剝離,而得到半導體晶圓與樹脂膜形成層的層積體。 First, the resin film forming layer of the resin film forming sheet is attached to the back surface of the semiconductor wafer on which the circuit is formed. Second, the support plate is removed from The resin film forming layer is peeled off to obtain a laminate of a semiconductor wafer and a resin film forming layer.
其次,將樹脂膜形成層硬化而在晶圓的全面形成樹脂膜。在樹脂膜形成層含有環氧化合物(B11)、具有環氧基的硬化性聚合物成分(AB)時,係藉由熱硬化使樹脂膜形成層硬化。在樹脂膜形成層配合有能量線反應性化合物(B21)和具有藉由能量線反應的官能基的硬化性聚合物成分(AB)時,能夠藉由能量線照射來使樹脂膜形成層硬化。而且,將環氧化合物(B11)、具有環氧基的硬化性聚合物成分(AB)、能量線反應性化合物(B21)和具有藉由能量線反應的官能基的硬化性聚合物成分(AB)併用時,可以同時進行藉由加熱及能量線照射來硬化,亦可逐次地進行。作為所照射的能量線,可舉出紫外線(UV)或電子射線(EB)等,較佳是使用紫外線。該結果,能夠在晶圓背面形成由硬化樹脂所構成之樹脂膜,因為相較於晶圓單獨時強度提升,所以能夠減低變薄的晶圓在操作時產生破損。而且,相較於將塗佈樹脂膜用的塗佈液直接塗佈在晶圓和晶片的背面且被膜化之塗佈法,樹脂膜的厚度均勻性優異。 Next, the resin film forming layer is cured to form a resin film over the entire surface of the wafer. When the epoxy resin compound (B11) and the curable polymer component (AB) having an epoxy group are contained in the resin film forming layer, the resin film forming layer is cured by thermal curing. When the energy ray-reactive compound (B21) and the curable polymer component (AB) having a functional group reactive by an energy ray are blended in the resin film forming layer, the resin film forming layer can be cured by energy ray irradiation. Further, an epoxy compound (B11), a curable polymer component (AB) having an epoxy group, an energy ray-reactive compound (B21), and a curable polymer component having a functional group reactive by an energy ray (AB) When used in combination, it can be hardened by heating and energy ray irradiation at the same time, or sequentially. Examples of the energy rays to be irradiated include ultraviolet rays (UV), electron beams (EB), and the like, and ultraviolet rays are preferably used. As a result, a resin film made of a cured resin can be formed on the back surface of the wafer, and the strength is improved as compared with the case where the wafer is alone. Therefore, it is possible to reduce the damage of the thinned wafer during operation. In addition, the resin film is excellent in thickness uniformity as compared with a coating method in which a coating liquid for coating a resin film is directly applied to a back surface of a wafer and a wafer and is film-formed.
隨後,對晶圓表面所形成的每一個電路,將半導體晶圓與樹脂膜之層積體進行切割。切割以將晶圓與樹脂膜同時切斷之方式進行。晶圓的切割藉由使用切割板片之常用的方法來進行。該結果,能夠得到在背面具有樹脂膜之半導體晶片。 Subsequently, a laminate of the semiconductor wafer and the resin film is cut for each circuit formed on the surface of the wafer. The cutting is performed in such a manner that the wafer and the resin film are simultaneously cut. Wafer dicing is performed by a conventional method using a dicing sheet. As a result, a semiconductor wafer having a resin film on the back surface can be obtained.
其次,亦能夠在樹脂膜進行雷射印字。雷射印字使用雷射標記法來進行,藉由照射雷射光將保護膜的表面削除 而在保護膜標記產品號碼等。而且,雷射印字亦能夠在使樹脂膜形成層硬化之前進行。 Secondly, it is also possible to perform laser printing on the resin film. Laser printing is performed using laser marking, which removes the surface of the protective film by irradiating the laser light. And the protective film marks the product number and so on. Moreover, the laser printing can also be performed before the resin film forming layer is hardened.
最後,藉由筒夾(collet)等的泛用手段將切割後的晶片拾取,而得到在背面具有樹脂膜之半導體晶片。然後,能夠藉由以倒裝方式將半導體晶片封裝在預定基座上來製造半導體裝置。而且,藉由將在背面具有樹脂膜之半導體晶片接著在基板或另外的半導體晶片等其他的部件上(晶片搭載部上),亦能夠製造半導體裝置。如此,依照本發明的使用樹脂膜形成用板片的半導體裝置的製造方法,能夠簡便地將厚度均勻性高的樹脂膜形成在晶片背面,且切割步驟和封裝之後不容易產生龜裂。 Finally, the diced wafer is picked up by a general method such as a collet or the like to obtain a semiconductor wafer having a resin film on the back surface. Then, the semiconductor device can be fabricated by flip-chip mounting the semiconductor wafer on a predetermined pedestal. Further, a semiconductor device can be manufactured by attaching a semiconductor wafer having a resin film on the back surface to another member such as a substrate or another semiconductor wafer (on the wafer mounting portion). As described above, according to the method for manufacturing a semiconductor device using the sheet for forming a resin film of the present invention, it is possible to easily form a resin film having a high thickness uniformity on the back surface of the wafer, and cracks are less likely to occur after the dicing step and the package.
而且,在半導體晶圓的背面貼附樹脂膜形成用板片的樹脂膜形成層之後,在步驟(2)之前進行步驟(3)時,樹脂膜形成用板片能夠達成作為切割板片的作用。亦即,在切割步驟的進行中能夠使用作為用以支撐半導體晶圓之板片。此時,將半導體晶圓透過樹脂膜形成層而黏貼在樹脂膜形成用板片的內周部,且藉由樹脂膜形成用板片的外周部與環狀框等的其他治具接合,在半導體晶圓所貼附的樹脂膜形成用板片被固定在裝置以進行切割。 Further, after the resin film forming layer of the resin film forming sheet is attached to the back surface of the semiconductor wafer, when the step (3) is performed before the step (2), the resin film forming sheet can be realized as a dicing sheet. . That is, a sheet for supporting the semiconductor wafer can be used in the progress of the cutting step. At this time, the semiconductor wafer is adhered to the inner peripheral portion of the resin film-forming sheet by the resin film forming layer, and the outer peripheral portion of the resin film-forming sheet is joined to another jig such as a ring frame. The sheet for forming a resin film to which the semiconductor wafer is attached is fixed to the device for cutting.
而且,以步驟(3)、(2)、(1)的順序進行時,將在背面具有樹脂膜形成層之半導體晶片以倒裝方式封裝在規定的晶片搭載部上後,亦能夠利用在組件製造通常所進行的樹脂封裝之加熱而使樹脂膜形成層硬化。 In the order of the steps (3), (2), and (1), the semiconductor wafer having the resin film forming layer on the back surface is flip-chip mounted on a predetermined wafer mounting portion, and can also be utilized in the assembly. Heating of the resin package which is usually performed is performed to harden the resin film forming layer.
以下,藉由實施例來說明本發明,但是本發明不被此些實施例限定。在本發明所採用的測定、評價方法如下。 Hereinafter, the invention is illustrated by the examples, but the invention is not limited by the examples. The measurement and evaluation methods employed in the present invention are as follows.
〈切入部的確認〉 <Confirmation of the cut-in section>
於樹脂膜形成用板片層積體的剝離板片中,從樹脂膜形成層側的面沿著樹脂膜形成層的外周部無切入部的確認,是對沿著樹脂膜形成層的外周部的任意的4點,對剝離板片表面藉由光學顯微鏡以倍率300倍進行觀察。 In the peeling sheet of the resin film forming sheet laminate, the surface from the resin film forming layer side is not cut along the outer peripheral portion of the resin film forming layer, and is the outer peripheral portion along the resin film forming layer. The arbitrary 4 points were observed on the surface of the peeled sheet by an optical microscope at a magnification of 300 times.
〈樹脂膜形成層的斷裂伸度〉 <Elongation and elongation of resin film forming layer>
樹脂膜形成層的斷裂伸度使用萬能拉伸試驗機(Orientec 公司製Tensilon RTA-T-2M),以JIS K 7161:1994(ISO 527-1:1993)為基準,於23℃、濕度50%的環境下以拉伸速度200mm/分測定。 The elongation at break of the resin film-forming layer was measured using a universal tensile tester (Tensilon RTA-T-2M, manufactured by Orientec Co., Ltd.), and based on JIS K 7161:1994 (ISO 527-1:1993) at 23 ° C and a humidity of 50%. The measurement was carried out at a stretching speed of 200 mm/min.
〈樹脂膜形成層的斷裂強度〉 <Fracture Strength of Resin Film Forming Layer>
樹脂膜形成層的斷裂強度,以JIS K7127:1999為基準測定。 The breaking strength of the resin film forming layer was measured in accordance with JIS K7127:1999.
〈樹脂膜形成層的對黏著劑層的轉印性〉 <Transferability of Adhesive Film Forming Layer to Adhesive Layer>
樹脂膜形成層沿著開口部的外周切割為所希望的形狀,能夠轉印至黏著劑層的情形評價為「A」。而且,雖然能夠轉印至黏著劑層,在樹脂膜形成層的端部(外周部)能夠目視到切割所引起缺陷的情形評價為「B」。另一方面,無法轉印至黏著劑層的情形評價為「C」。 The resin film forming layer was cut into a desired shape along the outer periphery of the opening, and the case where the adhesive layer was transferred to the adhesive layer was evaluated as "A". In addition, the adhesive layer was transferred to the adhesive layer, and the case where the defect caused by the dicing was visually observed at the end portion (outer peripheral portion) of the resin film forming layer was evaluated as "B". On the other hand, the case where the adhesive layer could not be transferred was evaluated as "C".
樹脂膜形成用組合物的製備 Preparation of resin film forming composition
下述各成分以第1表記載的量配合,製備樹脂膜形成用組合物1~5。 Each of the following components was blended in an amount described in the first table to prepare compositions 1 to 5 for resin film formation.
(AB)丙烯酸系聚合物:丙烯酸丁酯55質量份、丙烯酸甲酯10質量份、甲基丙烯酸縮水甘油酯20質量份以及丙烯酸2-羥基乙酯15質量份所構成的丙烯酸系聚合物(重量平均分子量:800,000,玻璃轉移溫度:-28℃) (AB) Acrylic polymer: an acrylic polymer composed of 55 parts by mass of butyl acrylate, 10 parts by mass of methyl acrylate, 20 parts by mass of glycidyl methacrylate, and 15 parts by mass of 2-hydroxyethyl acrylate (weight) Average molecular weight: 800,000, glass transition temperature: -28 ° C)
(A1)丙烯酸系聚合物:丙烯酸甲酯95質量份以及丙烯酸2-羥基乙酯5質量份所構成的丙烯酸系聚合物(Toyo-Chem公司製,重量平均分子量:1,200,000,玻璃轉移溫度:8℃) (A1) Acrylic polymer: an acrylic polymer composed of 95 parts by mass of methyl acrylate and 5 parts by mass of 2-hydroxyethyl acrylate (manufactured by Toyo-Chem Co., Ltd., weight average molecular weight: 1,200,000, glass transition temperature: 8 ° C )
(A2)非丙烯酸系樹脂:聚酯樹脂(東洋紡公司製,Vylon 220) (A2) Non-acrylic resin: Polyester resin (Vylon 220, manufactured by Toyobo Co., Ltd.)
(B11-1)環氧化合物:環氧樹脂(DIC公司製,EPICLON EXA-4850-150) (B11-1) Epoxy compound: Epoxy resin (made by DIC Corporation, EPICLON EXA-4850-150)
(B11-2)環氧化合物:環氧樹脂(日本化藥公司製,EPPN-502H) (B11-2) Epoxy compound: Epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EPPN-502H)
(B11-3)環氧化合物:環氧樹脂(日本化藥公司製,CNA-147) (B11-3) Epoxy compound: Epoxy resin (Nippon Chemical Co., Ltd., CNA-147)
(B12-1)熱硬化劑:酚樹脂(明和化成公司製,MEH-7851-4H) (B12-1) Thermal hardener: phenol resin (manufactured by Minghe Chemical Co., Ltd., MEH-7851-4H)
(B12-2)熱硬化劑:酚樹脂(三井化學公司製,Milex XLC-4L) (B12-2) Thermal hardener: phenol resin (Mitui Chemical Co., Ltd., Milex XLC-4L)
(B13)硬化促進劑:四國化成工業公司,2PHZ-PW (B13) Hardening accelerator: Shikoku Chemical Industry Co., Ltd., 2PHZ-PW
(C-1)無機填料:二氧化矽填料(Admatechs公司製,SC2050-MA,粒徑:500nm) (C-1) Inorganic filler: cerium oxide filler (SC2050-MA, manufactured by Admatechs Co., Ltd., particle diameter: 500 nm)
(C-2)無機填料:二氧化矽填料(Admatechs公司製,YA050C-MJA) (C-2) Inorganic filler: cerium oxide filler (manufactured by Admatechs, YA050C-MJA)
(E-1)耦合劑:矽烷耦合劑(信越化學工業公司製,KBM403) (E-1) Coupling agent: decane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., KBM403)
(E-2)耦合劑:矽烷耦合劑(信越化學工業公司製,KBE403) (E-2) Coupling agent: decane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., KBE403)
(E-3)耦合劑:矽烷耦合劑(信越化學工業公司製,X-41-1056) (E-3) Coupling agent: decane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., X-41-1056)
(E-4)耦合劑:矽烷耦合劑(三菱化學公司製,MKC Silicate MSEP2) (E-4) Coupling agent: decane coupling agent (MKC Silicate MSEP2, manufactured by Mitsubishi Chemical Corporation)
交聯劑:芳香族多價異氰酸酯化合物(日本聚胺基甲酸酯工業公司製,Coronate L) Crosslinking agent: aromatic polyvalent isocyanate compound (manufactured by Japan Polyurethane Industry Co., Ltd., Coronate L)
(實施例1) (Example 1)
將所得的樹脂膜形成用組合物1的甲基乙基酮溶液(固體成分濃度61重量%)塗佈於經剝離處理的樹脂膜形成層轉印用 板片(LINTEC公司製,SPPET381031)的剝離處理面上並乾燥(乾燥條件:於烘箱100℃,1分鐘),以於樹脂膜形成層轉印用板片上形成厚度7μm的樹脂膜形成層。 The methyl ethyl ketone solution (solid content concentration: 61% by weight) of the obtained resin film-forming composition 1 was applied to the resin film forming layer for peeling treatment. The peeling-treated surface of the sheet (SPPET381031, manufactured by LINTEC Co., Ltd.) was dried (drying conditions: 100 ° C in an oven, 1 minute) to form a resin film forming layer having a thickness of 7 μm on the sheet for forming a resin film forming layer.
其次,準備作為支撐板片的黏著板片(LINTEC公司製,D-175,黏著劑層厚度:10μm,基材厚度:80μm),於黏著劑層上層積第1剝離板片(SPPET381031,厚度:38μm),得到支撐板片與第1剝離板片的層積體。其次,從該層積體的第1剝離板片側,以切入深度60μm進行直徑330mm的圓形狀之模切。依此,於支撐板片形成切入深度d1約20μm的切入部D1。 Next, an adhesive sheet (D-175, thickness of adhesive layer: 10 μm, thickness of substrate: 80 μm, manufactured by LINTEC Co., Ltd.) was prepared, and a first peeling sheet was laminated on the adhesive layer (SPPET381031, thickness: 38 μm), a laminate of the support sheet and the first release sheet was obtained. Next, a die-cut of a circular shape having a diameter of 330 mm was cut from the side of the first peeling sheet of the laminate by a cutting depth of 60 μm. Accordingly, the cut portion D1 having a depth of cut d1 of about 20 μm is formed on the support sheet.
其次,於上述層積體的剝離板片側貼附剝離用黏著膠帶,其後,去除剝離用黏著膠帶。依此,去除直徑330mm的圓形狀的第1剝離板片,得到於黏著板片上層積有第1剝離板片的殘餘部分,且具有開口部的第1層積體。 Next, an adhesive tape for peeling is attached to the side of the peeling sheet of the laminate, and thereafter, the adhesive tape for peeling is removed. As a result, a circular first peeling sheet having a diameter of 330 mm was removed, and a first laminate having an opening portion in which a residual portion of the first peeling sheet was laminated on the adhesive sheet was obtained.
其次,於第1層積體的開口部側貼附上述得到的樹脂膜形成層轉印用板片與樹脂膜形成層的層積體之樹脂膜形成層,使樹脂膜形成層與開口部擬合。 Then, the resin film forming layer of the laminate of the resin film forming layer transfer sheet and the resin film forming layer obtained as described above is attached to the opening side of the first laminate, and the resin film forming layer and the opening portion are prepared. Hehe.
其後,以第1剝離板片的殘餘部分與黏著板片的界面作為剝離起點進行剝離,樹脂膜形成層割斷為擬合於開口部的形狀,於黏著板片的黏著劑層上殘留直徑330mm的圓形狀的樹脂膜形成層。然後,進行樹脂膜形成層的對黏著劑層的轉印性的評價。結果表示於第2表。 Thereafter, the interface between the remaining portion of the first peeling sheet and the adhesive sheet is peeled off as a peeling starting point, and the resin film forming layer is cut into a shape fitted to the opening, and a diameter of 330 mm remains on the adhesive layer of the adhesive sheet. The circular resin film forms a layer. Then, the transfer property of the resin film forming layer to the adhesive layer was evaluated. The results are shown in the second table.
然後,於黏著板片的具有樹脂膜形成層的面貼附第2剝離板片(SPPET381031,厚度:38μm),以得到第2剝 離板片與黏著板片之間具有樹脂膜形成層的第2層積體。 Then, a second peeling sheet (SPPET381031, thickness: 38 μm) was attached to the surface of the adhesive sheet having the resin film forming layer to obtain the second peeling. A second layered body having a resin film forming layer between the sheet and the adhesive sheet.
其次,從第2層積體的黏著板片側,以切入深度110μm、與樹脂膜形成層的中心點一致的方式進行直徑370mm的圓形狀的模切。依此,於第2剝離板片形成切入深度d2約20μm的切入部D2。最後,藉由使直徑370mm的圓形狀的黏著板片殘存於第2剝離板片上,去除殘餘的黏著板片,得到第3圖的態樣的樹脂膜形成用板片層積體。 Then, a circular die-cutting of a diameter of 370 mm was performed from the side of the adhesive sheet of the second laminate to a depth of 110 μm and a center point of the resin film forming layer. As a result, the cut portion D2 having a depth of cut d2 of about 20 μm is formed in the second peeling sheet. Finally, a circular adhesive sheet having a diameter of 370 mm was left on the second peeling sheet to remove the remaining adhesive sheet, and a sheet laminate for forming a resin film in the third embodiment was obtained.
實施例1的樹脂膜形成用板片層積體的剝離板片(第2剝離板片),能夠確認不具有從樹脂膜形成層側的面沿著樹脂膜形成層的外周之切入部。 In the peeling sheet (second peeling sheet) of the sheet laminate of the resin film formation of the first embodiment, it was confirmed that the surface of the resin film forming layer was not cut along the outer periphery of the resin film forming layer.
(實施例2~5) (Examples 2 to 5)
除了使用樹脂膜形成用組合物2~5取代實施例1中所使用的樹脂膜形成用組合物1之外,與實施例1相同的得到樹脂膜形成用板片層積體。 A sheet laminate for resin film formation was obtained in the same manner as in Example 1 except that the resin film-forming compositions 2 to 5 were used instead of the resin film-forming composition 1 used in Example 1.
實施例2~5的樹脂膜形成用板片層積體的剝離板片,能夠確認不具有從樹脂膜形成層側的面沿著樹脂膜形成層的外周之切入部。 In the peeling sheet of the sheet laminate of the resin film formation of Examples 2 to 5, it was confirmed that the surface of the resin film forming layer was not cut along the outer periphery of the resin film forming layer.
於實施例4、5的樹脂膜形成用板片層積體中,樹脂膜形成層的對黏著劑層的轉印性的評價為「B」。於樹脂膜形成層的端部(外周部)目視到缺陷等的情形,由於端部的樹脂 膜形成層的對被著體的貼附性降低,具有半導體裝置的生產性變差的情形。 In the sheet laminate for forming a resin film of Examples 4 and 5, the transfer property of the resin film forming layer to the adhesive layer was evaluated as "B". In the case where the end portion (outer peripheral portion) of the resin film forming layer is visually observed, etc., due to the resin at the end portion The adhesion of the film formation layer to the object is lowered, and the productivity of the semiconductor device is deteriorated.
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JP2009130320A (en) * | 2007-11-28 | 2009-06-11 | Furukawa Electric Co Ltd:The | Film for chip protection |
TW201428079A (en) * | 2012-10-05 | 2014-07-16 | Lintec Corp | Dicing sheet with protective film forming layer and chip fabrication method |
TW201444945A (en) * | 2013-03-27 | 2014-12-01 | Lintec Corp | Composite sheet for forming protective film |
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- 2015-12-11 WO PCT/JP2015/084790 patent/WO2016098697A1/en active Application Filing
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JP2009130320A (en) * | 2007-11-28 | 2009-06-11 | Furukawa Electric Co Ltd:The | Film for chip protection |
TW201428079A (en) * | 2012-10-05 | 2014-07-16 | Lintec Corp | Dicing sheet with protective film forming layer and chip fabrication method |
TW201444945A (en) * | 2013-03-27 | 2014-12-01 | Lintec Corp | Composite sheet for forming protective film |
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