WO2019146604A1

WO2019146604A1 - Rolled body of elongated laminated sheet

Info

Publication number: WO2019146604A1
Application number: PCT/JP2019/001908
Authority: WO
Inventors: 厚史上道; 岡本　直也; 康喜中石
Original assignee: リンテック株式会社
Priority date: 2018-01-24
Filing date: 2019-01-22
Publication date: 2019-08-01
Also published as: TW201940620A; TWI791742B; KR102637842B1; JPWO2019146604A1; SG11202006914YA; CN111629892A; KR20200112830A

Abstract

Problem: To prevent the occurrence of roll marks on a resin film formation layer in a rolled body formed by winding an elongated laminated sheet into a roll shape, the elongated laminated sheet including: a resin formation layer-having support sheet which has an approximately rectangular support sheet and an approximately rectangular resin film formation layer formed on the support sheet, and which has an approximately rectangular ring frame holding means for holding a ring frame in a region surrounding the resin film formation layer when viewed along a plane; and an elongated release sheet, wherein elongated auxiliary sheets are continuously laminated and thereby formed on a release-treated surface of the release sheet at both ends thereof in the short side direction, and a plurality of the support sheets having the resin film formation layer are independently and temporarily attached releasably along the long side direction of the release sheet and thereby formed on the release-treated surface of the release sheet on the inside thereof in the short side direction. Solution: In the elongated laminated sheet, W2/W1≤1.6 is satisfied, where W1 is the distance between the resin film formation layer and the outer end of the auxiliary sheet when viewed along a plane from the resin film formation layer after removing the release sheet, and W2 is the width of the widest section of the auxiliary sheet when viewed along said plane.

Description

Roll of long laminated sheet

The present invention forms a resin layer such as an adhesive layer or a protective film on a semiconductor package in which a plurality of semiconductor chips are resin-sealed, and a support sheet with a resin film forming layer used to dice the semiconductor package. The present invention relates to a roll body in which the In particular, the present invention relates to a technique for reducing a winding mark that may be generated in a resin film forming layer due to the winding pressure of a winding body.

2. Description of the Related Art In recent years, miniaturization, weight reduction, and high functionality of electronic devices have progressed, and accordingly, semiconductor devices mounted on electronic devices are also required to be smaller, thinner, and higher in density. Semiconductor chips may be packaged in packages close to their size. Such a package is sometimes referred to as a CSP (Chip Scale Package). As CSP, WLP (Wafer Level Package) completed by processing to the package final process with wafer size, PLP (Panel Level Package) completed by processing to the package final process with panel size larger than wafer size, etc. may be mentioned. .

WLP and PLP are classified into fan-in type and fan-out type. In the fan-out type WLP and PLP, the semiconductor chip is covered with a sealing material so as to be a region larger than the chip size to form a sealed body of the semiconductor chip, and the rewiring layer and the external electrode are Not only in the circuit surface of the above, but also in the surface area of the sealing material.

For example, in Patent Document 1, a plurality of semiconductor chips separated from a semiconductor wafer are left surrounding the circuit forming surface, and an expansion wafer is formed using a mold member to form an expanded wafer, and the semiconductor chip is formed outside the semiconductor chip. A method of manufacturing a semiconductor package formed by extending a rewiring pattern is described. In the manufacturing method described in Patent Document 1, a semiconductor wafer is subjected to a dicing step of being separated into pieces in a state of being attached to a pressure-sensitive adhesive tape for dicing (hereinafter, also referred to as a "dicing sheet"). Hereinafter, a resin sealing body including such a plurality of semiconductor chips may be referred to as a "chip group package". Also, the process of dicing this to obtain individual CSPs may be referred to as "package dicing."

In general, in package dicing, a plurality of semiconductor chips are mounted on a rectangular substrate, resin sealing is collectively performed, external terminals are formed, and a rectangular package consisting of a chip group sealed with resin ( Chip group package) is obtained. This is because the rectangular shape is preferable in terms of the efficiency in arranging the chips and the subsequent transfer and storage of the package.

Next, this chip group package is diced to obtain a semiconductor device such as CSP. In the step of dicing the chip group package, a rectangular dicing sheet corresponding to the shape of the package is stretched on a frame for dicing, the chip group package is attached to the dicing sheet, and the package is diced (Patent Document 2) , Patent Document 3).

Various methods for manufacturing a chip group package have been proposed. For example, the semiconductor chip is temporarily attached on a holder such as a resin tape. At this time, the circuit surface and the bump surface of the semiconductor chip face upward, and the back surface side of the chip is temporarily attached on the resin tape. Next, leads are attached to the circuit surface and the bump surface for external connection, and resin sealing is performed collectively. Thereafter, the chip tape is obtained by peeling the resin tape. The chip group package obtained through such a process is obtained with a structure in which the back surface of the chip is exposed. Thereafter, dicing is performed using the dicing sheet as described above to obtain divided semiconductor devices.

If the backside of the chip is exposed, the durability and reliability of the semiconductor device may be impaired. Therefore, a protective film is usually formed on the exposed surface of the chip. This protective film enhances the bending strength and also functions effectively when printing a product number or the like on a semiconductor device. In addition, when mounting the semiconductor device obtained by cutting on another member, an adhesive layer is attached to the exposed surface of the chip of the semiconductor device and bonded to the other member.

It is complicated to individually form the protective film and attach the adhesive layer to the divided semiconductor devices. In addition, since the thickness of the protective film or the adhesive layer is not constant when it is performed separately, the quality of the product may vary. Therefore, it is considered to be advantageous in the process that a protective film and an adhesive layer are collectively formed on a chip group package having a structure in which the back surface of the chip is exposed, and then dicing. Hereinafter, a layer for forming a resin film such as a protective film or an adhesive layer may be described as a “resin film forming layer”.

Various methods for forming a resin film forming layer on a semiconductor chip are known. That is, a resin film forming layer such as a protective film precursor layer or an adhesive layer is attached to one side of a semiconductor wafer, and then the semiconductor wafer and the resin film forming layer are simultaneously diced to form a resin film on one side. A semiconductor chip having a layer is obtained. In order to carry out this process continuously, a wafer processing sheet such as a dicing / die bonding sheet or a dicing sheet with a protective film-forming layer (Patent Document 4) is known. Since it is assumed that these wafer processing sheets are attached to a substantially circular silicon wafer, a circular resin film-forming layer is peelably laminated on a circular dicing sheet.

However, the chip group package is formed in a rectangular shape as described above. This is because the rectangular shape is preferable in terms of the efficiency in arranging the chips and the subsequent transfer and storage of the package.

If a conventional dicing sheet with a resin film-formed layer is applied to such a rectangular chip group package, only the largest square portion of the circular resin film-formed layer can be used, and the surrounding portion is discarded without being used. Ru. Specifically, if the resin film-forming layer is a circle with a radius of 10 cm (area about 314 cm ² ), the maximum area of the square in it is 200 cm ² (2 ^1/2 × 10 cm square), and the resin film is formed The effective area rate of the layer is only 63.7%.

Therefore, the effective area ratio of the resin film forming layer can be increased by using the rectangular resin film forming layer provided supporting sheet in which the rectangular resin film forming layer is formed on the support sheet such as the rectangular dicing sheet described above. Is considered.

In the resin film-formed layer-supporting sheet, a resin film-formed layer having a slightly smaller area may be laminated on a relatively large-area support sheet. An adhesive ring frame holding means for temporarily attaching to the ring frame is provided so as to surround the use area of the resin film forming layer. The support sheet with the resin film formation layer is laminated on a long release sheet. This long laminate sheet is marketed as a roll wound in a roll. The long laminate sheet has a portion on which the support sheet with a resin film-formed layer is laminated and a portion not to be laminated, and a portion having a different thickness inevitably arises. When a long laminate sheet having an uneven thickness is wound into a roll, unrolling may occur. In addition, a gap may be generated on the side of the roll due to the thickness difference, and dust and the like may intrude from the gap to contaminate the resin film-forming layer.

In order to eliminate such a disadvantage, it is considered to leave the auxiliary sheet along the longitudinal direction at both ends in the width direction of the long laminate sheet. By providing the auxiliary sheet, the thickness of the long laminate sheet becomes uniform, the winding collapse of the winding body is prevented, and the running stability at the time of unwinding is also improved. Furthermore, since the auxiliary sheet is present in the gap at the side of the roll, intrusion of dust can be prevented.

However, if the width of the auxiliary sheet is constant, a difference in thickness occurs between the support sheet with the resin film formation layer and the other support sheet with the resin film formation layer adjacent thereto. That is, in the part in which the support sheet with a resin film formation layer was provided, thickness becomes uniform by the auxiliary sheet which exists in the side part. However, no auxiliary sheet is present between the resin film-formed layer-attached support sheet and the other resin film-formed layer-attached support sheet adjacent thereto, only a release sheet is present, and the thickness difference is not eliminated.

Further, the support sheet with resin film formation layer and the auxiliary sheet are made of substantially the same material, and when cutting the support sheet with resin film formation layer into a rectangular shape, in the vicinity of the side of the support sheet with resin film formation layer. Leave the auxiliary sheet. That is, the support sheet with the resin film formation layer and the auxiliary sheet are die-cut into a predetermined shape, and the excess portion (cursed portion) between the support sheet with the resin film formation layer and the auxiliary sheet is removed. Then, a support sheet with a resin film-formed layer having a predetermined shape is obtained, and auxiliary sheets remain at both ends in the width direction of the release sheet 14. The cutting in this case is continuously performed by a roll-shaped punching blade, and the removal of the surplus portion is performed by continuously pulling up the surplus portion (sump up).

If the width of the auxiliary sheet is constant, the area of the surplus portion changes rapidly at the transition from the portion where the support sheet with the resin film forming layer is present to the portion where the sheet is not present. As a result, the surplus portion Peeling force also changes. When the peeling force of the surplus portion rapidly increases, the surplus portion is broken at the time of scrap lifting, and continuous scraping can not be performed.

A part where there is no sheet between the support sheet with resin film formation layer and another support sheet with resin film formation layer adjacent to solve the problem caused by the thickness difference and gradually change the peeling force of the surplus part The auxiliary sheet is extended in the inward direction to form a relatively wide portion. Thereby, the difference in thickness between the portion where the support sheet with the resin film formation layer is present and the portion where the sheet is not present is also alleviated, and the area of the surplus portion gradually changes. The sudden change of the peeling force of the surplus portion is also eliminated, and the waste can be stably raised.

Therefore, as shown in FIG. 5, even in a support sheet with a resin film formation layer having a rectangular resin film formation layer on a rectangular support sheet, an auxiliary sheet is provided in the vicinity of the side of the support sheet with a resin film formation layer. Between the support sheet with the resin film formation layer and the other support sheet with the resin film formation layer adjacent thereto, a wide portion in which the auxiliary sheet is extended in the inside direction is formed.

In order to reduce the difference in thickness between the support sheet with the resin film-formed layer and the portion where the sheet does not exist, and to prevent the rapid change in the area of the surplus portion, the larger the wider portion of the auxiliary sheet, the more preferable. Conceivable.

International Publication WO 2010/058646 Japanese Patent Application Laid-Open No. 2002-3798 JP, 2010-83921, A International Publication WO2013 / 047674

The support sheet with a resin film-formed layer is formed by temporarily attaching a plurality of support sheets with a resin film-formed layer separately along the longitudinal direction of the long release sheet, and both ends of the release sheet in the short direction In order to achieve this, a long laminated sheet in which a long auxiliary sheet is continuously laminated is put on the market as a roll.

However, if the wide part of the auxiliary sheet is too large, winding marks may occur in the resin film-forming layer. When the long laminate sheet is wound into a roll, the radius increases with the progress of winding, so the wide portion sometimes overlaps the upper surface side or the lower surface side of the resin film forming layer. When the winding is continued in this state, the wide portion is pressed against the resin film forming layer by the winding pressure, and a convex portion or a recess corresponding to the shape of the wide portion is generated in the resin film forming layer (see FIG. 5). Such convex portions and concave portions are called winding marks.

When a winding mark is generated in the resin film forming layer, the thickness accuracy of the resin film forming layer is lowered, air biting occurs when the resin film forming layer is attached to the chip group package, and the adhesion of the package becomes insufficient. . In addition, in the method of manufacturing a semiconductor device, adhesion of the divided package is reduced when it is adhered to the mounting portion of the package through the resin film forming layer, and voids are generated. As a result, it becomes difficult to obtain a semiconductor device having excellent reliability. Moreover, when using a resin film as a protective film, the winding mark of a resin film formation layer becomes a cause of an appearance defect.

Therefore, an object of the present invention is to prevent generation of a winding mark in a portion to which a resin film forming layer, particularly a chip group package is attached, even in the case of a wound body in a long laminate sheet of the above structure. is there.

The present invention for solving the above problems provides the following long laminate sheet roll.
A substantially rectangular ring having a substantially rectangular support sheet and a substantially rectangular resin film forming layer formed on the support sheet, and holding the ring frame in a region surrounding the resin film forming layer in plan view A support sheet with a resin film forming layer having a frame holding means;
Including a long release sheet,
A long auxiliary sheet is continuously laminated on both ends in the lateral direction on the release-treated surface of the release sheet.
On the inside in the short direction on the release-treated surface of the release sheet, there is a long laminate sheet in which a plurality of support sheets with a resin film-forming layer are peelably and independently attached temporarily along the longitudinal direction of the release sheet. It is a roll which is rolled up in a roll,
The distance between the resin film forming layer and the outer end of the auxiliary sheet in a plan view from the resin film forming layer side after removal of the release sheet is W1,
The wound body of the long lamination sheet which is W2 / W1 <= 1.6 when the width | variety of the auxiliary sheet in the widest part of the auxiliary sheet in planar view is set to W2.

According to the wound body of the long laminated sheet of the present invention, the wide part of the auxiliary sheet does not overlap with the location (use area) to which the chip group package of the resin film forming layer is attached. No winding marks occur in the area of use. Therefore, the chip group package can be stably attached, and the thickness of the obtained resin film becomes uniform.

The state which partially sent out from the winding body of the elongate laminated sheet of a 1st form is shown. FIG. 1B is a cross-sectional view taken along line AA of FIG. 1A. The BB sectional drawing of FIG. 1A is shown. The state which partially sent out from the winding body of the elongate laminated sheet of a 2nd form is shown. FIG. 2B is a cross-sectional view taken along line AA of FIG. 2A. FIG. 2B is a cross-sectional view taken along the line BB in FIG. 2A. The state which partially sent out from the winding body of the elongate laminated sheet of a 3rd form is shown. FIG. 3B is a cross-sectional view taken along line AA of FIG. 3A. The BB sectional drawing of FIG. 3A is shown. Explanatory drawing of W1 and W2 is shown. Indicates the occurrence of winding marks. The state where the support sheet with a resin film formation layer is transferred to the adherend from the long laminate sheet is shown. FIG. 6B shows a perspective view of FIG. 6A.

Hereinafter, the wound body of the long laminate sheet of the present invention will be described in detail.
In the present invention, "substantially rectangular" includes not only strictly squares and rectangles, but also slightly distorted shapes similar thereto. For example, each side of a square or a rectangle may be curved or bent, and a corner may be a rounded curve, and it is configured to be a short straight line whose direction changes continuously. Also good.
Moreover, a "support sheet" is a sheet-like member which can support a resin film formation layer so that peeling is possible, may be a peeling sheet, and may be an adhesive sheet like a so-called dicing sheet.
The “resin film forming layer” is used in the sense that it includes both a precursor layer for forming a protective film and an adhesive layer. The precursor layer for forming the protective film is cured by a predetermined operation to form a protective film.

The "support sheet with a resin film formation layer" means a laminate of a support sheet and a resin film formation layer. It also includes substantially rectangular ring frame holding means for holding the ring frame.
The “release sheet” is a sheet whose surface peel force is controlled, and may be made of resin, paper or cloth. Although the peeling force of the surface is controlled by a peeling agent etc., it is not limited to this.
"Long" means a rectangular shape having a longitudinal direction sufficiently longer than the lateral direction.
The "auxiliary sheet" means a layered body formed on both ends of the long release sheet in the width direction.
The “long laminate sheet” is a long release sheet, a long auxiliary sheet continuously laminated on both ends of the release sheet in the lateral direction, and a temporary attachment that can be released to the inside of the release sheet in the lateral direction. And a support sheet with a resin film forming layer.
A "rolling body" means what wound up the said long laminated sheet and was made into roll shape.

Hereinafter, a support sheet with a resin film formation layer, a long laminate sheet including the same, and a wound body thereof will be described with reference to the drawings.
The support sheet with resin film formation layer has a substantially rectangular support sheet and a substantially rectangular resin film formation layer formed releasably on the support sheet, and viewed in plan from the resin film formation layer side And a substantially rectangular ring frame holding means for holding the ring frame in a region surrounding the resin film forming layer.

The support sheet with a resin film-forming layer is temporarily attached removably along the longitudinal direction of the release sheet on the inside in the short direction on the release-treated surface of the long release sheet. In addition, a long auxiliary sheet is continuously laminated on both ends in the short direction on the peeling treated surface of the long peeling sheet, to form a long laminated sheet.
Although the specific form of a long laminated sheet is demonstrated below, limitation is not carried out to these.

[Long laminated sheet: First embodiment]
FIG. 1 shows a first embodiment of the long laminate sheet. 1A shows a state in which the long laminated sheet 2 is fed from the winding body 1, FIG. 1B is a sectional view taken along the line AA of FIG. 1A, and FIG. 1C is a sectional view taken along the line BB of FIG. .

As shown in FIG. 1B, the support sheet 10 with a resin film formation layer is formed on the outer periphery of one surface of the support sheet 11, the resin film formation layer 12 laminated on the entire surface of one side, and the resin film formation layer 12. And a ring frame holding means 13. The support sheet 11 and the resin film forming layer 12 are laminated in a peelable manner. When the support sheet 11 is a release sheet, the resin film forming layer 12 is formed on the release treated surface. When the support sheet 11 is a pressure-sensitive adhesive sheet such as a dicing sheet, the resin film forming layer 12 is formed on the pressure-sensitive adhesive layer. When the support sheet 11 is an adhesive sheet, the specific aspect of an adhesive sheet is the same as that of the adhesive sheet of the 2nd form mentioned later.

Along the longitudinal direction of the long release sheet 14, a plurality of support sheets 10 with a resin film-formed layer are temporarily attached so as to be peelable independently, inside the short direction.

A long auxiliary sheet 15 is laminated at both ends in the short direction along the longitudinal direction of the long release sheet 14. The auxiliary sheet 15 has the same laminated structure as the outer peripheral portion of the support sheet 10 with a resin film forming layer. That is, the auxiliary sheet 15 is made of the same material as the support sheet 11, the resin film forming layer 12 and the ring frame holding means 13.

Although the release sheet 14 is exposed between the resin film-formed layer-supporting sheet, the auxiliary sheet 15 extends inward in the short direction between the release sheets 14. That is, the width of the auxiliary sheet is not uniform, and the auxiliary sheet is formed so as to be wider at portions between the resin film-formed support sheet (hereinafter referred to as "wide portion") . A cross-sectional view of the wide portion is shown in FIG. 1C.

Such a long laminate sheet 2 can be manufactured, for example, as follows.
On the long release sheet 14, a pressure-sensitive adhesive layer (which may be a double-sided pressure-sensitive adhesive tape) to be the ring frame holding means 13 is attached. The pressure-sensitive adhesive layer is cut into a rectangular shape. At this time, the pressure-sensitive adhesive layer is completely cut, and the release sheet is cut with a cutting blade to such an extent that a shallow cut occurs. Next, the stamped pressure-sensitive adhesive layer is removed, and the pressure-sensitive adhesive layer having a rectangular opening remains on the release sheet 14.

Separately, a laminate of the support sheet and the resin film forming layer is prepared, and this is laminated on the side of the release sheet 14 having the pressure-sensitive adhesive layer.
The laminate is then cut into the shape of the ring frame. At this time, the cut is formed so that the rectangular opening of the pressure-sensitive adhesive layer is positioned approximately at the center of the die-cut shape. At the same time, a cut is made in accordance with the planned shape of the auxiliary sheet 15. At this time as well, the laminate is completely cut in the same manner as described above, and the release sheet is cut with a punching blade to such an extent that a shallow cut occurs. Thereafter, by removing the excess portion (cursed portion) between the support sheet with the resin film formation layer and the auxiliary sheet, the support sheet 10 with the resin film formation layer of a predetermined shape is obtained on the release sheet 14 The auxiliary sheet 15 remains at both ends of the sheet 14 in the width direction, and the long laminate sheet 2 having the above structure is obtained.

[Long laminated sheet: Second embodiment]
In FIG. 2, the 2nd form of a long laminated sheet is shown. 2A shows a state in which the long laminated sheet 4 is fed out from the winding body 3, FIG. 2B is a sectional view taken along the line AA of FIG. 2A, and FIG. 2C is a sectional view taken along the line BB of FIG. .

As shown to FIG. 2B, the support sheet 20 with a resin film formation layer has the support sheet 21 and the resin film formation layer 22 laminated | stacked on the inner peripheral part of the single side | surface. The support sheet 21 and the resin film forming layer 22 are laminated in a peelable manner. The support sheet 21 in the second embodiment is an adhesive sheet such as a dicing sheet. The pressure-sensitive adhesive sheet has a substrate 21A and a pressure-sensitive adhesive layer 21B. When the release sheet 24 is removed, the adhesive layer 21 B is exposed on the outer periphery of the resin film forming layer 22 and functions as a ring frame holding means 23.

Along the longitudinal direction of the long release sheet 24, a plurality of support sheets 20 with a resin film formed layer are temporarily attached so as to be peelable independently, inside the short direction.

A long auxiliary sheet 25 is laminated at both ends in the short direction along the longitudinal direction of the long release sheet 24. The auxiliary sheet 25 has the same laminated structure as the outer peripheral portion of the support sheet 20 with a resin film formation layer. That is, the auxiliary sheet 25 is made of the same material as the base 21A and the adhesive layer 22B.

Although the release sheet 24 is exposed between the resin film-formed layer-supporting sheet, the auxiliary sheet 25 extends inward in the short direction between the release sheets 24. That is, the width of the auxiliary sheet is not uniform, and the auxiliary sheet is formed so as to be wider at portions between the resin film-formed support sheet (hereinafter referred to as "wide portion") . A cross-sectional view of the wide portion is shown in FIG. 2C.

Such a long laminate sheet 4 can be manufactured, for example, as follows.
A resin layer constituting the resin film forming layer is formed on the entire surface of the long release sheet 24, and the resin layer is cut into a rectangular shape. At this time, the resin film-forming layer is completely cut, and the release sheet is cut with a punching blade to such an extent that a shallow cut occurs. Then, the outer periphery of the resin film forming layer which has been stamped out is removed, and the rectangular resin film forming layer 22 is left on the release sheet 24.

Separately, an adhesive sheet having a base 21A and an adhesive layer 21B is prepared, and this is laminated on the surface of the release sheet 24 having the resin film forming layer 22.
Then, the pressure-sensitive adhesive sheet is cut into a ring frame shape. At this time, the resin film forming layer 22 is cut after being positioned so as to be positioned approximately at the center of the cut shape. At the same time, cuts are made in the adhesive sheet in accordance with the shape of the auxiliary sheet 25 scheduled. At this time, the pressure-sensitive adhesive sheet is completely cut, and the peeling sheet is cut into an extent that a shallow cut occurs in the release sheet. Thereafter, by removing the excess portion (cursing portion) between the support sheet with the resin film formation layer and the auxiliary sheet, the support sheet 20 with the resin film formation layer of a predetermined shape is obtained on the release sheet 24 The auxiliary sheet 25 remains at both ends of the sheet 24 in the width direction, and the long laminated sheet 4 having the above structure is obtained.

[Long laminated sheet: Third embodiment]
In FIG. 3, the 3rd form of a long laminated sheet is shown. 3A shows a state in which the long laminated sheet 6 is fed out from the winding body 5, FIG. 3B is a sectional view taken along the line AA of FIG. 3A, and FIG. 3C is a sectional view taken along the line BB of FIG. .

As shown in FIG. 3B, the support sheet 30 with the resin film formation layer is formed on the support sheet 31, the resin film formation layer 32 laminated on the inner periphery of one side thereof, and the outer periphery of the resin film formation layer 32. And a ring frame holding means 33. The support sheet 31 and the resin film forming layer 32 are laminated in a peelable manner. When the support sheet 31 is a release sheet, the resin film forming layer 32 is formed on the release treated surface. When the support sheet 31 is an adhesive sheet such as a dicing sheet, the resin film forming layer 32 is formed on the adhesive layer. When the support sheet 31 is an adhesive sheet, the specific aspect of an adhesive sheet is the same as that of the adhesive sheet of a 2nd form mentioned above.

Along the longitudinal direction of the long release sheet 34, a plurality of support sheets 30 with a resin film-formed layer are temporarily attached so as to be peelable independently, inside the short direction.

A long auxiliary sheet 35 is laminated at both ends in the short direction along the longitudinal direction of the long release sheet 34. The auxiliary sheet 35 has the same laminated structure as the outer peripheral portion of the support sheet 30 with a resin film formation layer. That is, the auxiliary sheet 35 is made of the same material as the support sheet 31 and the ring frame holding means 33.

The release sheet 34 is exposed between the resin film-formed layer-supported support sheets, and the auxiliary sheet 35 extends inward in the short direction between the release sheets 34. That is, the width of the auxiliary sheet is not uniform, and the auxiliary sheet is formed so as to be wider at portions between the resin film-formed support sheet (hereinafter referred to as "wide portion") . A cross-sectional view of the wide portion is shown in FIG. 3C.

Such a long laminate sheet 6 can be manufactured, for example, as follows.
A resin layer constituting a resin film forming layer is formed on the entire surface of the long release sheet 34, and the resin layer is cut into a rectangular shape. At this time, the resin film-forming layer is completely cut, and the release sheet is cut with a punching blade to such an extent that a shallow cut occurs. Then, the outer periphery of the resin film forming layer which has been stamped out is removed, and the rectangular resin film forming layer 32 is left on the release sheet 34.

A pressure-sensitive adhesive layer (which may be a double-sided pressure-sensitive adhesive tape) to be the ring frame holding means 33 is attached onto the long support sheet separately. The pressure-sensitive adhesive layer is cut into a rectangular shape. At this time, the pressure-sensitive adhesive layer is completely cut, and the support sheet is cut with a cutting blade to such an extent that a shallow cut occurs. Next, the stamped pressure-sensitive adhesive layer is removed, and the pressure-sensitive adhesive layer having a rectangular opening remains on the long support sheet.

Next, the resin film forming layer 32 matches the rectangular opening with the long release sheet 34 having the resin film forming layer 32 and the long support sheet on which the pressure-sensitive adhesive layer having the rectangular opening is laminated. Align and paste the two together.

Then, the laminate is cut from the side of the support sheet to the shape of the ring frame. At this time, the resin film forming layer 32 is cut after being positioned so as to be positioned approximately at the center of the cut shape. At the same time, cuts are made in the laminate in accordance with the shape of the auxiliary sheet 35 scheduled. At this time, the laminate is completely cut, and the release sheet is cut with a punching blade to such an extent that a shallow cut occurs. Thereafter, by removing the excess portion (cursed portion) between the support sheet with the resin film formation layer and the auxiliary sheet, the support sheet 30 with the resin film formation layer of a predetermined shape is obtained on the release sheet 34 The auxiliary sheet 35 remains at both ends in the width direction of the sheet 34, and the long laminate sheet 6 having the above-mentioned structure is obtained.

[Wide part]
In the present invention, when the

auxiliary sheets

15, 25 and 35 are formed, the auxiliary sheet is extended in the internal direction between the support sheet with the resin film formation layer and the other support sheet with the resin film formation layer adjacent thereto. To form a relatively wide portion (wide portion) (see FIG. 4). As a result, the difference in thickness between the resin film-formed support sheet and the other adjacent resin film-formed support sheet is also alleviated, and the area of the surplus portion gradually changes, so the surplus at the time of raising the waste Abrupt change of the peeling force of the part is also eliminated, and scrap removal can be performed stably.

When making a winding body, a wide part is formed so that it may not overlap with the use field of a resin film formation layer. The entire surface of the resin film-forming layer is not used, and the resin film-forming layer is formed with a slight margin in the peripheral portion. The size of the resin film forming layer is set to be slightly larger than that of the chip group package, and even when the chip group package is bonded, there are places not used for bonding at the peripheral portion of the resin film forming layer. The resin film forming layer and the wide portion may overlap with each other in the portion where this is not used. Further, even if the wide portion overlaps with a part of the used region of the resin film forming layer and a winding mark is produced, the present invention allows this when the winding mark is small and does not affect the adhesion.

In the first to third embodiments, FIG. 4 shows a plan view from the resin film forming layer side after the release sheet is removed from the laminated sheet. In FIG. 4, a portion surrounded by a dotted line indicates a use area of the resin film forming layer. Although FIG. 4 shows the first embodiment as an example, the plan view from the resin film forming layer side after removing the release sheet is the same in the first to third embodiments. Therefore, the explanation will be made along the reference numerals used in the first embodiment.

In any case, there is a ring frame holding means 13 surrounding the exposed resin film forming layer 12, and there are auxiliary sheets 15 at both ends in the short direction.
Here, the distance between the resin film forming layer 12 and the outer end of the auxiliary sheet 14 is W1 in a plan view shown in FIG. 4, and the width of the auxiliary sheet in the widest portion of the auxiliary sheet is W2 in a plan view. In this case, W1 and W2 form an auxiliary sheet so as to satisfy W2 / W1 ≦ 1.6. Preferably, W2 / W1 ≦ 1.4 and W2 / W1 ≦ 1.2 are satisfied. The lower limit of W2 / W1 is 0.2, and preferably 0.4 ≦ W2 / W1.
Note that W1 in the first embodiment is shown in FIG. 1B, and W2 is shown in FIG. 1C. W1 in the second embodiment is shown in FIG. 2B and W2 is shown in FIG. 2C. W1 in the third embodiment is shown in FIG. 3B and W2 is shown in FIG. 3C.

According to the wound body of the long laminated sheet of the present invention, the wide part of the auxiliary sheet does not overlap with the location (use area) to which the chip group package of the resin film forming layer is attached. No winding marks occur in the area of use. In addition, even if the wide portion and the resin film forming layer overlap, the winding marks generated in the resin film forming layer are small, and the adhesion is not affected. Therefore, the chip group package can be stably attached, and the thickness of the obtained resin film becomes uniform.

Next, although a support sheet, a resin film formation layer, a ring frame holding means, and a long exfoliation sheet are explained, all are non-limiting illustrations.
[Support sheet]
As the

support sheets

11 and 31, release sheets can be mentioned, and pressure-sensitive adhesive sheets such as dicing sheets described later can also be used. Moreover, an adhesive sheet is used as the support sheet 21 in a 2nd form.

As the release sheet, for example, polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, Polyurethane film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene (meth) acrylic acid copolymer film, ethylene (meth) acrylic acid ester copolymer film, polystyrene film, polycarbonate film, polyimide film, fluorine A resin film or the like is used. Moreover, these crosslinked films are also used. Furthermore, these laminated films may be sufficient.

The surface tension of the surface of the release sheet in contact with the resin film-forming layer is preferably 40 mN / m or less, more preferably 37 mN / m or less, particularly preferably 35 mN / m or less. The lower limit is usually about 25 mN / m. However, it is preferable to use a heavy release type rather than the “long release sheet” described later. Such a release sheet having a relatively low surface tension can be obtained by appropriately selecting the material, and can also be obtained by applying a release agent to the surface of the release sheet and performing a release treatment. .

Alkyd-based, silicone-based, fluorine-based, unsaturated polyester-based, polyolefin-based, wax-based, etc. are used as the release agent used for the release treatment, but particularly the alkyd-based, silicone-based and fluorine-based release agents are heat resistant It is preferable because it has

In order to release the surface of a film or the like to be a substrate of a release sheet using the above release agent, the release agent may be used as it is with no solvent, or diluted with solvent or emulsified to form a gravure coater, Mayer bar coater, air knife coater. The release sheet may be coated by a roll coater or the like, and the release sheet coated with the release agent may be provided at normal temperature or under heating, or may be cured by an electron beam to form a release layer.

In addition, the surface tension of the release sheet may be adjusted by laminating films by wet lamination, dry lamination, hot melt lamination, melt extrusion lamination, coextrusion processing, or the like. That is, a film whose surface tension of at least one surface is in a preferable range as that of the surface in contact with the resin film-forming layer of the above-mentioned release sheet is the other surface so that the surface is in contact with the resin film-forming layer The laminated body laminated | stacked with the film of 4 may be manufactured, and it is good also as a peeling sheet.

As a support sheet, you may use adhesive sheets, such as a dicing sheet which formed the adhesive layer on the base film. In this aspect, the resin film-forming layer is laminated on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet. As a base material of an adhesive sheet, the above-mentioned film illustrated as a peeling sheet is mentioned. The pressure-sensitive adhesive layer may be a weak adhesive having a degree of adhesion capable of peeling the resin film-forming layer, or an energy ray-curable one whose adhesion is reduced by energy ray irradiation. It is also good. The pressure-sensitive adhesive layer may be any of various known pressure-sensitive adhesives (for example, general-purpose pressure-sensitive adhesives such as rubber, acrylic, silicone, urethane, vinyl ether, etc., pressure-sensitive adhesives with uneven surface, energy ray-curable pressure-sensitive adhesive, thermal It can be formed by an expansion component-containing pressure-sensitive adhesive and the like.

The thickness of the support sheet is usually 10 to 500 μm, preferably 15 to 300 μm, and particularly preferably 20 to 250 μm. In the case of a pressure-sensitive adhesive sheet in which the support sheet has a pressure-sensitive adhesive layer formed on a substrate, the thickness of the pressure-sensitive adhesive layer is 3 to 50 μm in the support sheet.

[Resin film forming layer]
The resin

film forming layers

12, 22, 32 are precursor layers for forming a protective film, or consist of an adhesive layer. The functions required at least for the resin film-forming layer are (1) sheet shape maintainability, (2) initial adhesion and (3) curability.

The resin film-forming layer can be given (1) sheet shape maintainability and (3) curability by addition of a binder component, and as the binder component, a polymer component (A) and a curable component (B) And a second binder component containing a curable polymer component (AB) having both the properties of the components (A) and (B).
In addition, it is a function for temporarily attaching to a package until it hardens a resin film formation layer. (2) Initial adhesion may be pressure-sensitive adhesion, and it softens and adheres by heat. It may be a property. (2) The initial adhesiveness is usually controlled by various characteristics of the binder component, adjustment of the blending amount of the inorganic filler (C) described later, and the like.

(First binder component)
The first binder component contains the polymer component (A) and the curable component (B) to impart sheet shape maintainability and curability to the resin film-forming layer. In addition, a 1st binder component does not contain a curable polymer component (AB) for convenience of distinguishing with a 2nd binder component.

(A) Polymer Component The polymer component (A) is added to the resin film forming layer mainly for the purpose of imparting the sheet shape maintaining property to the resin film forming layer.
In order to achieve the above object, the weight average molecular weight (Mw) of the polymer component (A) is usually 20,000 or more, and preferably 20,000 to 3,000,000. The value of weight average molecular weight (Mw) is a value as measured by gel permeation chromatography (GPC) (polystyrene standard). For example, a high-speed GPC apparatus "HLC-8120GPC" manufactured by Tosoh Corp., a high-speed column "TSK gurd column H _XL -H", "TSK Gel GMH _XL ", "TSK Gel G2000 H _XL " A detector is used as a differential refractometer at a column temperature of 40 ° C., a liquid transfer rate of 1.0 mL / min, using a combination of (all manufactured by Tosoh Corporation) in this order.
In addition, the polymer component (A) does not have a curing functional group which will be described later, for the sake of distinction from the curable polymer (AB) which will be described later.

As a polymer component (A), an acrylic polymer, polyester, a phenoxy resin (It limits to the thing which does not have an epoxy group for convenience to distinguish with the curable polymer (AB) mentioned later.), A polycarbonate, a polyether, a polyurethane And polysiloxane, rubber polymers and the like can be used. In addition, acrylic urethane resin having an isocyanate group at the molecular terminal is obtained by reacting an acrylic polyol having an hydroxyl group with an acrylic polymer having a hydroxyl group, for example, an acrylic urethane resin having an isocyanate group at the molecular terminal. May be Furthermore, you may use combining these 2 or more types including the polymer which 2 or more types couple | bonded.

(A1) As the acrylic polymer polymer component (A), acrylic polymer (A1) is preferably used. The glass transition temperature (Tg) of the acrylic polymer (A1) is preferably in the range of -60 to 50 ° C, more preferably -50 to 40 ° C, and still more preferably -40 to 30 ° C. When the glass transition temperature of the acrylic polymer (A1) is high, the adhesiveness of the resin film forming layer is lowered and it can not be transferred to the work, or the resin film forming layer or the resin film forming layer is cured from the work after transfer. Problems such as peeling of the resulting resin film may occur. In addition, when the glass transition temperature of the acrylic polymer (A1) is low, the peeling force between the resin film forming layer and the support sheet may be increased to cause a transfer failure of the resin film forming layer.

The weight average molecular weight of the acrylic polymer (A1) is preferably 100,000 to 1,500,000. When the weight-average molecular weight of the acrylic polymer (A1) is high, the adhesiveness of the resin film-forming layer is lowered, and transfer to the work becomes impossible, and problems such as peeling of the resin film-forming layer or resin film from the work after transfer May occur. In addition, when the weight average molecular weight of the acrylic polymer (A1) is low, the adhesion between the resin film forming layer and the support sheet becomes high, and transfer failure of the resin film forming layer may occur.

An acrylic polymer (A1) contains (meth) acrylic acid ester in the monomer which comprises at least.
As the (meth) acrylic acid ester, an alkyl (meth) acrylate having 1 to 18 carbon atoms in the alkyl group, specifically methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl ( (Meth) acrylates, 2-ethylhexyl (meth) acrylates and the like; (meth) acrylates having a cyclic skeleton, specifically, cycloalkyl (meth) acrylates, benzyl (meth) acrylates, isobornyl (meth) acrylates, dicyclopentanyl ( Examples include meta) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyl oxyethyl (meth) acrylate, imide (meth) acrylate and the like. Moreover, what is a (meth) acrylic acid ester can be illustrated among what is illustrated as a monomer which has a hydroxyl group mentioned later, a monomer which has a carboxyl group, and a monomer which has an amino group.

In the present specification, (meth) acrylic may be used in a meaning including both acrylic and methacrylic.

As a monomer which comprises acrylic polymer (A1), you may use the monomer which has a hydroxyl group. When such a monomer is used, a hydroxyl group is introduced into the acrylic polymer (A1), and the resin film forming layer separately contains an energy ray curable component (B2), and this and the acrylic polymer The compatibility with (A1) is improved. Examples of the monomer having a hydroxyl group include (meth) acrylic acid esters having a hydroxyl group such as 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate; and N-methylol (meth) acrylamide.

As a monomer which comprises acrylic polymer (A1), you may use the monomer which has a carboxyl group. When such a monomer is used, a carboxyl group is introduced into the acrylic polymer (A1), and when the resin film forming layer separately contains an energy ray curable component (B2), this and the acrylic resin The compatibility with the polymer (A1) is improved. Examples of the monomer having a carboxyl group include (meth) acrylic acid esters having a carboxyl group such as 2- (meth) acryloyloxyethyl phthalate and 2- (meth) acryloyloxypropyl phthalate; (meth) acrylic acid, Maleic acid, fumaric acid, itaconic acid etc. are mentioned. When an epoxy-based thermosetting component is used as a curable component (B) to be described later, the carboxyl group and the epoxy group in the epoxy-based thermosetting component react with each other, and therefore a monomer having a carboxyl group The amount used is preferably small.

As a monomer which comprises acrylic polymer (A1), you may use the monomer which has an amino group. As such a monomer, (meth) acrylic acid ester etc. which have amino groups, such as monoethylamino (meth) acrylate, etc. are mentioned.

As monomers constituting the acrylic polymer (A1), vinyl acetate, styrene, ethylene, α-olefin or the like may be used.

The acrylic polymer (A1) may be crosslinked. For crosslinking, the acrylic polymer (A1) before crosslinking has a crosslinkable functional group such as a hydroxyl group, and is crosslinked by adding a crosslinking agent to the composition for forming a resin film-forming layer The reaction is carried out by reacting the functional group with the functional group possessed by the crosslinking agent. By crosslinking the acrylic polymer (A1), it becomes possible to control the cohesion of the resin film-forming layer.

Examples of the crosslinking agent include organic polyvalent isocyanate compounds and organic polyvalent imine compounds.

As organic polyvalent isocyanate compounds, aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds, trimers of these organic polyvalent isocyanate compounds, and these organic polyvalent isocyanate compounds The terminal isocyanate urethane prepolymer etc. which are obtained by making a polyol compound react can be mentioned.

As the organic polyvalent isocyanate compound, specifically, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4'- Diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, lysine diisocyanate, and the like Examples include polyhydric alcohol adducts.

Specifically, N, N'-diphenylmethane-4,4'-bis (1-aziridine carboxamide), trimethylolpropane-tri-β-aziridinyl propionate, and tetramethylol as organic polyvalent imine compounds Mention may be made of methane-tri-β-aziridinyl propionate and N, N′-toluene-2,4-bis (1-aziridine carboxamide) triethylene melamine and the like.

The crosslinking agent is usually 0.01 to 20 parts by mass, preferably 0.1 to 10 parts by mass, and more preferably 0.5 to 5 parts by mass, per 100 parts by mass of the acrylic polymer (A1) before crosslinking. Used in proportions.

When the content of the component constituting the resin film forming layer is determined based on the content of the polymer component (A), when the polymer component (A) is a cross-linked acrylic polymer, the reference The content to be contained is the content of the acrylic polymer before being crosslinked.

(A2) Non-acrylic resin Also, as the polymer component (A), polyester, phenoxy resin (limited to those having no epoxy group for the sake of distinction from the curable polymer (AB) described later), polycarbonate, poly It is also possible to use one or a combination of two or more non-acrylic resins (A2) selected from ethers, polyurethanes, polysiloxanes, rubber polymers or those in which two or more of these are bonded. As such a resin, one having a weight average molecular weight of 20,000 to 100,000 is preferable, and one having a weight average molecular weight of 20,000 to 80,000 is more preferable.

The glass transition temperature of the non-acrylic resin (A2) is preferably in the range of -30 to 150.degree. C., more preferably -20 to 120.degree.

When a non-acrylic resin (A2) is used in combination with the above-mentioned acrylic polymer (A1), when transferring the resin film forming layer to the package, delamination between the support sheet and the resin film forming layer is facilitated In addition, the resin film forming layer can follow the transfer surface to suppress the generation of voids and the like.

When using non-acrylic resin (A2) in combination with the above-mentioned acrylic polymer (A1), the content of non-acrylic resin (A2) corresponds to non-acrylic resin (A2) and acrylic polymer (A The mass ratio (A2: A1) to A1) is usually in the range of 1:99 to 60:40, preferably 1:99 to 30:70. When the content of the non-acrylic resin (A2) is in this range, the above-described effects can be obtained.

(B) Curable Component The curable component (B) is added mainly for the purpose of imparting curability to the resin film-forming layer. As the curable component (B), a thermosetting component (B1) or an energy ray curable component (B2) can be used. Moreover, you may use combining these. The thermosetting component (B1) contains a compound having at least a functional group that reacts by heating. Further, the energy ray curable component (B2) contains a compound (B21) having a functional group that reacts by energy ray irradiation, and polymerizes and hardens when it is irradiated with energy rays such as ultraviolet rays and electron beams. The functional groups possessed by these curable components react with one another to form a three-dimensional network structure, whereby curing is realized. Since the curable component (B) is used in combination with the polymer component (A), from the viewpoint of suppressing the viscosity of the coating composition for forming the resin film-forming layer and improving the handleability, etc. Usually, the weight average molecular weight (Mw) is 10,000 or less, preferably 100 to 10,000.

(B1) Thermosetting Component As the thermosetting component, for example, an epoxy-based thermosetting component is preferable.
It is preferable that an epoxy-type thermosetting component contains the compound (B11) which has an epoxy group, and it uses what combined the compound (B11) and thermosetting agent (B12) which have an epoxy group.

(B11) Compound Having an Epoxy Group As the compound having an epoxy group (B11) (hereinafter sometimes referred to as “epoxy compound (B11)”), conventionally known compounds can be used. Specifically, polyfunctional epoxy resin, bisphenol A diglycidyl ether or a hydrogenated product thereof, ortho cresol novolac epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type The epoxy compound which has bifunctional or more in a molecule | numerator, such as an epoxy resin and a phenylene frame type | mold epoxy resin, is mentioned. These can be used singly or in combination of two or more.

When the epoxy compound (B11) is used, the resin film forming layer preferably contains 1 to 1500 parts by mass of the epoxy compound (B11) with respect to 100 parts by mass of the polymer component (A), and more preferably Is contained in an amount of 3 to 1200 parts by mass. When the amount of the epoxy compound (B11) is small, the adhesiveness after curing of the resin film-forming layer tends to decrease. Moreover, when there are many epoxy compounds (B11), the peeling force of a resin film formation layer and a support sheet may become high, and the transfer defect of a resin film formation layer may occur.

(B12) Thermosetting agent The thermosetting agent (B12) functions as a curing agent for the epoxy compound (B11). As a preferable thermosetting agent, the compound which has 2 or more of functional groups which can react with an epoxy group in 1 molecule is mentioned. Examples of the functional group include phenolic hydroxyl group, alcoholic hydroxyl group, amino group, carboxyl group and acid anhydride. Among these, preferred are phenolic hydroxyl group, amino group, acid anhydride and the like, and more preferred are phenolic hydroxyl group and amino group.

Specific examples of the phenolic curing agent include polyfunctional phenolic resins, biphenols, novolac phenolic resins, dicyclopentadiene phenolic resins, zyloc phenolic resins, and aralkyl phenolic resins.
Specific examples of the amine curing agent include DICY (dicyandiamide).
These can be used singly or in combination of two or more.

The content of the thermosetting agent (B12) is preferably 0.1 to 500 parts by mass, and more preferably 1 to 200 parts by mass with respect to 100 parts by mass of the epoxy compound (B11). When the content of the thermosetting agent is low, the adhesiveness after curing tends to be lowered.

(B13) Curing accelerator The curing accelerator (B13) may be used to adjust the rate of heat curing of the resin film-forming layer. The curing accelerator (B13) is preferably used particularly when an epoxy-based thermosetting component is used as the thermosetting component (B1).

Preferred curing accelerators include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol and tris (dimethylaminomethyl) phenol; 2-methylimidazole, 2-phenylimidazole, 2-phenyl- Imidazoles such as 4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole; Organic phosphines such as tributylphosphine, diphenylphosphine, triphenylphosphine and the like Tetraphenyl boron salts such as tetraphenyl phosphonium tetraphenyl borate, triphenyl phosphine tetraphenyl borate and the like can be mentioned. These can be used singly or in combination of two or more.

The curing accelerator (B13) is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 1 parts by mass, per 100 parts by mass of the total amount of the epoxy compound (B11) and the thermosetting agent (B12). Included in the amount of By containing the curing accelerator (B13) in an amount in the above range, it has excellent adhesion even when exposed to high temperature and high humidity, and has high reliability even when exposed to severe reflow conditions. Can be achieved. By adding a curing accelerator (B13), the adhesiveness after hardening of a resin film formation layer can be improved. Such an effect is intensified as the content of the curing accelerator (B13) increases.

(B2) The energy ray-curable component resin film-forming layer contains the energy ray-curable component, so that the resin film-forming layer can be cured without performing a thermosetting process requiring a large amount of energy and a long time. . Thereby, the manufacturing cost can be reduced.
As the energy ray-curable component, a compound (B21) having a functional group that reacts by energy ray irradiation may be used alone, but a compound (B21) having a functional group that reacts by energy ray irradiation and a photopolymerization initiator ( It is preferable to use a combination of B22).

(B21) A compound having a functional group that reacts by energy ray irradiation A specific example of the compound (B21) having a functional group that reacts by energy ray irradiation (hereinafter sometimes referred to as "energy ray reactive compound (B21)") Specifically, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate or 1,4-butylene glycol diacrylate, 1,6-hexanediol di And acrylate compounds such as acrylates, oligoester acrylates, urethane acrylate oligomers, epoxy acrylates, polyether acrylates and A acrylate compound having a polymerizable structure acrylate compounds such as Con acid oligomer include those of relatively low molecular weight. Such compounds have at least one polymerizable double bond in the molecule.

When the energy ray reactive compound (B21) is used, the resin film forming layer preferably contains 1 to 1500 parts by mass of the energy ray reactive compound (B21) with respect to 100 parts by mass of the polymer component (A). And more preferably 3 to 1200 parts by mass.

(B22) Photopolymerization Initiator By combining the energy ray reactive compound (B21) with the photopolymerization initiator (B22), the polymerization curing time can be shortened and the light irradiation dose can be reduced.

Specific examples of such a photopolymerization initiator (B22) include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, benzoin dimethyl ketal 2,4-diethylthioxanthone, α-hydroxycyclohexyl phenyl ketone, benzyl diphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl, 1,2-diphenylmethane, 2-hydroxy- 2-Methyl-1- [4- (1-methylvinyl) phenyl] propanone, 2,4,6-trimethylbenzoyl diphenyl phosphine oxide and Such as β- crawl anthraquinone, and the like. A photoinitiator (B22) can be used individually by 1 type or in combination of 2 or more types.

The blending ratio of the photopolymerization initiator (B22) is preferably 0.1 to 10 parts by mass, and more preferably 1 to 5 parts by mass with respect to 100 parts by mass of the energy ray reactive compound (B21). .
If the blending ratio of the photopolymerization initiator (B22) is less than 0.1 parts by mass, sufficient curability may not be obtained due to insufficient photopolymerization, and if it exceeds 10 parts by mass, residues not contributing to the photopolymerization May cause problems.

(Second binder component)
The second binder component imparts sheet shape maintainability and curability to the resin film-forming layer by containing the curable polymer component (AB).

(AB) Curable Polymer Component The curable polymer component is a polymer having a curable functional group. The curing functional group is a functional group that can react with each other to form a three-dimensional network structure, and includes a functional group that reacts by heating and a functional group that reacts by energy rays.
The curing functional group may be added in the unit of the continuous structure which becomes the skeleton of the curable polymer (AB) or may be added at the end. When a curable functional group is added in a unit of a continuous structure to be a skeleton of the curable polymer component (AB), the curable functional group may be attached to a side chain or directly added to the main chain It may be done. The weight average molecular weight (Mw) of the curable polymer component (AB) is usually 20,000 or more from the viewpoint of achieving the purpose of imparting sheet shape maintainability to the resin film forming layer.

An epoxy group is mentioned as a functional group which reacts by heating. Examples of the curable polymer component (AB) having an epoxy group include high molecular weight epoxy group-containing compounds and phenoxy resins having an epoxy group. High molecular weight epoxy group-containing compounds are disclosed, for example, in JP-A-2001-261789.
Moreover, it is a polymer similar to the above-mentioned acrylic polymer (A1), and is a polymer polymerized using a monomer having an epoxy group as a monomer (epoxy group-containing acrylic polymer) It is also good. Examples of the monomer having an epoxy group include (meth) acrylic acid esters having a glycidyl group such as glycidyl (meth) acrylate.
When using an epoxy-group-containing acrylic polymer, the preferable aspect is the same as that of acrylic polymer (A1) except an epoxy group.

When using a curable polymer component (AB) having an epoxy group, as in the case of using an epoxy-based thermosetting component as the curable component (B), a thermosetting agent (B12) or a curing accelerator (B13) ) May be used in combination.

Examples of functional groups that react with energy radiation include (meth) acryloyl groups. As a curable polymer component (AB) having a functional group that reacts with energy rays, acrylate compounds having a polymerized structure such as polyether acrylate can be used, and those having a high molecular weight can be used.
Also, for example, a raw material polymer having a functional group X such as a hydroxyl group in a side chain, a functional group Y capable of reacting with the functional group X (for example, isocyanate group etc. when the functional group X is a hydroxyl group) and energy ray irradiation A polymer prepared by reacting a low molecular weight compound having a functional group to be reacted by the reaction may be used.
In this case, when the raw material polymer corresponds to the above-mentioned acrylic polymer (A1), the preferable embodiment of the raw material polymer is the same as the acrylic polymer (A1).

In the case of using a curable polymer component (AB) having a functional group that reacts with energy rays, a photopolymerization initiator (B22) may be used in combination as in the case of using an energy ray curable component (B2) .

The second binder component may contain the above-mentioned polymer component (A) or curable component (B) in combination with the curable polymer component (AB).

The resin film forming layer may contain the following components in addition to the binder component.

(C) Inorganic filler resin film formation layer may contain the inorganic filler (C). By blending the inorganic filler (C) in the resin film forming layer, it becomes possible to adjust the thermal expansion coefficient of the resin film after curing, and optimize the thermal expansion coefficient of the resin film after curing for the package. Thus, the reliability of the semiconductor device can be improved. Moreover, it also becomes possible to reduce the hygroscopicity of the resin film after hardening.

In addition, when the resin film obtained by curing the resin film-forming layer in the present invention is made to function as a protective film, the protective film is subjected to laser marking to remove inorganic fillers (C ) Is exposed and takes on a color close to white as the reflected light diffuses. Therefore, when the resin film forming layer contains a colorant (D) described later, a contrast difference is obtained between the laser marking portion and the other portion, and the printing becomes clear.

Preferred examples of the inorganic filler include powders of silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide and boron nitride, beads obtained by spheroidizing them, single crystal fibers, glass fibers and the like. Among these, silica fillers and alumina fillers are preferable. The said inorganic filler (C) can be used individually or in mixture of 2 or more types.

The range of the content of the inorganic filler (C) for obtaining the above-mentioned effects more reliably is preferably 1 to 80 parts by mass, relative to 100 parts by mass of the total solids constituting the resin film forming layer. The amount is preferably 20 to 75 parts by mass, particularly preferably 40 to 70 parts by mass.

(D) Colorant resin film forming layer may be transparent. Further, a coloring agent (D) may be blended in the resin film forming layer to color it. By blending a coloring agent, there is an effect that when marking is performed on a resin film by means such as laser marking, marks such as characters and symbols can be easily recognized. That is, in the package in which the resin film is formed, the product number etc. is usually printed on the surface of the resin film by the laser marking method (a method of scraping the surface of the protective film with laser light and performing printing). By containing the above, the contrast difference between the portion scraped off by the laser beam of the resin film and the portion not scraped is sufficiently obtained, and the visibility is improved.

Organic or inorganic pigments and dyes are used as colorants. Among these, black pigments are preferable in terms of electromagnetic wave and infrared shielding properties. As a black pigment, although carbon black, iron oxide, manganese dioxide, aniline black, activated carbon etc. are used, it is not limited to these. From the viewpoint of enhancing the reliability of the semiconductor device, carbon black is particularly preferable. A coloring agent (D) may be used individually by 1 type, and may be used in combination of 2 or more type. In addition, when the inspection of the semiconductor device is performed by infrared light, an infrared-transparent colorant may be used.
The compounding amount of the colorant (D) is preferably 0.1 to 35 parts by mass, more preferably 0.5 to 25 parts by mass, particularly preferably 100 parts by mass of the total solids constituting the resin film forming layer. Is 1 to 15 parts by mass.

(E) Coupling agent Coupling agent (E) having a functional group that reacts with an inorganic substance and a functional group that reacts with an organic functional group, adhesion of the resin film forming layer to the package, adhesion, and / or aggregation of the resin film It may be used to improve the quality. Moreover, the water resistance can be improved by using a coupling agent (E), without impairing the heat resistance of the resin film obtained by hardening | curing a resin film formation layer. As such a coupling agent, a titanate coupling agent, an aluminate coupling agent, a silane coupling agent and the like can be mentioned. Among these, silane coupling agents are preferred.

As a silane coupling agent, the functional group which reacts with the organic functional group is a group which reacts with the functional group which a polymer component (A), a curable component (B), a curable polymer component (AB), etc. have. Certain silane coupling agents are preferably used.
As such a silane coupling agent, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ- (methacryloxy) Propyl) trimethoxysilane, γ-aminopropyltrimethoxysilane, N-6- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-6- (aminoethyl) -γ-aminopropylmethyldiethoxysilane, N -Phenyl-γ-aminopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, bis (3-triethoxysilylpropyl) tetrasulfane, methyltri Methoxysilane Methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, imidazole silane and the like. These can be used singly or in combination of two or more.

The amount of the silane coupling agent is usually 0.1 to 20 parts by mass, preferably 0.1 to 20 parts by mass with respect to a total of 100 parts by mass of the polymer component (A), the curable component (B) and the curable polymer component (AB). It is contained in a proportion of 2 to 10 parts by mass, more preferably 0.3 to 5 parts by mass. If the content of the silane coupling agent is less than 0.1 parts by mass, the above effect may not be obtained, and if it exceeds 20 parts by mass, it may cause outgassing.

(F) In addition to the above, various additives may be blended in the general-purpose additive resin film-forming layer as required. As various additives, a leveling agent, a plasticizer, an antistatic agent, an antioxidant, an ion scavenger, a gettering agent, a chain transfer agent, a release agent and the like can be mentioned.

The resin film forming layer is obtained, for example, using a composition (a composition for forming a resin film) obtained by mixing the above-mentioned respective components in an appropriate ratio. The composition for resin film formation may be previously diluted with a solvent, or may be added to the solvent at the time of mixing. Moreover, you may dilute with a solvent at the time of use of the composition for resin film formation.

Such solvents include ethyl acetate, methyl acetate, diethyl ether, dimethyl ether, acetone, methyl ethyl ketone, acetonitrile, hexane, cyclohexane, toluene, heptane and the like.

The resin film-forming layer has initial adhesiveness and curability, and in the uncured state, easily adheres to the chip group package by pressing on the chip group package at normal temperature or under heating. In addition, when pressing, the resin film forming layer may be heated. Then, after curing, a resin film having high impact resistance can be finally given, the adhesive strength is also excellent, and sufficient reliability can be maintained even under severe high temperature and high humidity conditions. The resin film forming layer may have a single layer structure or a multilayer structure.

The thickness of the resin film-forming layer is preferably 1 to 100 μm, more preferably 2 to 90 μm, and particularly preferably 3 to 80 μm. By setting the thickness of the resin film forming layer to the above range, the resin film forming layer functions as a highly reliable protective film or adhesive.

[Ring frame holding means]
In the support sheet with a resin film formation layer of the second embodiment, the support sheet 21 is an adhesive sheet, and the adhesive layer 21B exposed at the outer peripheral portion of the resin film formation layer 22 functions as a ring frame holding means.

In the first embodiment, the ring frame holding means 13 is provided on the outer peripheral portion of the surface of the resin film forming layer, and in the third embodiment, the ring frame holding means 33 is provided to surround the resin film forming layer. As the ring frame holding means, a pressure-sensitive adhesive member comprising a single pressure-sensitive adhesive layer, a pressure-sensitive adhesive member comprising a base and a pressure-sensitive adhesive layer, or a double-sided pressure-sensitive adhesive member having a core material can be employed.

The ring frame holding means 13 and 33 have a substantially rectangular outer peripheral shape, and have a rectangular hollow portion (inner opening) at the inner peripheral portion. Externally, it has a size that can be fixed to the ring frame. The internal opening is larger than the chip group package. The ring frame is usually a molded body of metal or plastic.

When a pressure-sensitive adhesive member consisting of a single pressure-sensitive adhesive layer is used as the ring frame holding means, it is not particularly limited, but preferably made of, for example, an acrylic pressure-sensitive adhesive, a rubber pressure-sensitive adhesive, or a silicone pressure-sensitive adhesive. Among these, acrylic pressure-sensitive adhesives are preferable in consideration of removability from the ring frame. The above-mentioned pressure-sensitive adhesives may be used alone or in combination of two or more.

The thickness of the pressure-sensitive adhesive layer constituting the ring frame holding means is preferably 2 to 20 μm, more preferably 3 to 15 μm, and still more preferably 4 to 10 μm. When the thickness of the pressure-sensitive adhesive layer is less than 2 μm, sufficient adhesion may not be exhibited. When the thickness of the pressure-sensitive adhesive layer exceeds 20 μm, when peeling from the ring frame, the residue of the pressure-sensitive adhesive may remain on the ring frame to contaminate the ring frame.

In the case where a pressure-sensitive adhesive member composed of a substrate and a pressure-sensitive adhesive layer is used as ring frame holding means, the ring frame is attached to the pressure-sensitive adhesive layer constituting the pressure-sensitive adhesive member.
As an adhesive which forms an adhesive layer, it is the same as that of the adhesive which forms the adhesive layer in the adhesive member which consists of said adhesive layer single-piece | unit. Moreover, the thickness of an adhesive layer is also the same.

The base material constituting the ring frame holding means is not particularly limited. For example, polyethylene film, polypropylene film, ethylene-vinyl acetate copolymer film, ethylene- (meth) acrylic acid copolymer film, ethylene- (meth) Examples thereof include polyolefin films such as acrylic acid ester copolymer films and ionomer resin films, polyvinyl chloride films, and polyethylene terephthalate films. Among them, polyethylene films and polyvinyl chloride films are preferable in consideration of expandability, and polyvinyl chloride films are more preferable.

The thickness of the substrate constituting the ring frame holding means is preferably 5 to 200 μm, more preferably 10 to 150 μm, and still more preferably 20 to 100 μm.

When the double-sided adhesive member having the core material is used as ring frame holding means, the double-sided adhesive member is formed on the core material, the pressure-sensitive adhesive layer for lamination formed on one surface, and the other surface. And a fixing pressure-sensitive adhesive layer. The laminating pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer attached to the resin film-forming layer, and the fixing pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer attached to the ring frame.

As a core material of a double-sided adhesive member, the thing similar to the base material of the said adhesive member is mentioned. Among these, polyolefin films and plasticized polyvinyl chloride films are preferred in consideration of expandability.

The thickness of the core material is usually 5 to 200 μm, preferably 10 to 150 μm, more preferably 20 to 100 μm.

The laminating pressure-sensitive adhesive layer and the fixing pressure-sensitive adhesive layer of the double-sided pressure-sensitive adhesive member may be layers formed of the same pressure-sensitive adhesive or layers formed of different pressure-sensitive adhesives. The adhesion between the fixing pressure-sensitive adhesive layer and the ring frame is appropriately selected so as to be smaller than the adhesion between the resin film-forming layer and the lamination pressure-sensitive adhesive layer. Examples of such pressure-sensitive adhesives include acrylic pressure-sensitive adhesives, rubber-based pressure-sensitive adhesives, and silicone pressure-sensitive adhesives. Among these, acrylic pressure-sensitive adhesives are preferable in consideration of removability from the ring frame. The pressure-sensitive adhesive forming the fixing pressure-sensitive adhesive layer may be used alone or in combination of two or more. The same applies to the pressure-sensitive adhesive layer for lamination.

The thicknesses of the laminating pressure-sensitive adhesive layer and the fixing pressure-sensitive adhesive layer are the same as the thickness of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive member.

By providing the ring frame holding means, it becomes easy to bond the support sheet with the resin film forming layer to a jig such as a ring frame.

[Long Release Sheet]
The

long release sheets

14, 24, 34 play a role as a carrier film when the resin film forming sheet is used, and the release sheets exemplified as the above-mentioned support sheet can be used.

The surface tension of the surface of the long release sheet in contact with the resin film-forming layer is preferably 40 mN / m or less, more preferably 37 mN / m or less, particularly preferably 35 mN / m or less. The lower limit is usually about 25 mN / m. However, when using a peeling sheet as a support sheet, it is preferable to make the direction of a long peeling sheet into a light peeling type.
The specific example of a long peeling sheet, a peeling agent, the peeling processing method, etc. are the same as that of the peeling sheet demonstrated as an example of the support sheet mentioned above.

The thickness of the long release sheet is not particularly limited, but is preferably 30 μm or more, more preferably 50 to 200 μm. When the release film is less than 30 μm, when the resin film forming sheet is wound in a roll, winding marks may be generated in the resin film forming layer.

The usage aspect of the winding body of the long laminated sheet as described above will be briefly described with reference to FIGS. 6A and 6B, taking the long laminated sheet according to the first embodiment as an example.
First, the long laminated sheet 2 is sent out from the winding body 1, and while being bent at a sharp angle by the peel plate 40, the support sheet 10 with the resin film formation layer is peeled from the long release sheet 14, and the support with the resin film formation layer The sheet 10 is attached to the chip group package 44. At the same time, the ring frame 45 is fixed to the ring frame holding means 13. The surplus sheets (the release sheet 14 and the auxiliary sheet 15) are taken up through the

guide rollers

42 and 43 and collected as a disposal tape 46. The auxiliary sheet 15 is omitted in FIG. 6A. Next, the resin film forming layer 12 and the chip group package 44 are completely cut, and the support sheet 11 is diced so as not to be completely cut. The package divided after dicing is peeled off from the support sheet 11 together with the resin film forming layer 12 to obtain a package to which the resin film forming layer is transferred. When the resin film forming layer is used as a protective film, the resin film forming layer may be cured to be a protective film prior to dicing, or may be cured after dicing. Moreover, when using a resin film formation layer as an adhesive bond layer, a package is stuck on a predetermined to-be-adhered body through a resin film formation layer, and a resin film formation layer is hardened as needed.
Such a process is carried out according to the method described in WO 2015/146254 for forming a protective film on a semiconductor wafer or chip or transferring an adhesive layer.

1, 3, 5

Roll collection body

2, 4, 6 Long laminated sheet 10 Support sheet with resin film forming layer according to the first embodiment 11 Support sheet 12 Resin film forming layer 13 Ring frame holding means 14 ... Long release sheet 15 ... Auxiliary sheet 20 ... Support sheet with resin film formation layer according to the second embodiment 21 ... Support sheet 21 A ... Base material 21 B ... Adhesive layer 22 ... Resin film formation layer 23 ... Ring frame holding means 24 ... Long peel sheet 25: Auxiliary sheet 30: Support sheet with resin film formation layer according to the third embodiment 31: Support sheet 32: Resin film formation layer 33: Ring frame holding means 34: Long peel sheet 35: Auxiliary sheet 40:

Peel plate

41, 42, 43 Guide roller 44 Chip group package 45 Ring frame 46 Waste tape

Claims

A substantially rectangular ring having a substantially rectangular support sheet and a substantially rectangular resin film forming layer formed on the support sheet, and holding the ring frame in a region surrounding the resin film forming layer in plan view A support sheet with a resin film forming layer having a frame holding means;
Including a long release sheet,
A long auxiliary sheet is continuously laminated on both ends in the lateral direction on the release-treated surface of the release sheet.
On the inside in the short direction on the release-treated surface of the release sheet, there is a long laminate sheet in which a plurality of support sheets with a resin film-forming layer are peelably and independently attached temporarily along the longitudinal direction of the release sheet. It is a roll which is rolled up in a roll,
The distance between the resin film forming layer and the outer end of the auxiliary sheet in a plan view from the resin film forming layer side after removal of the release sheet is W1,
The wound body of the long lamination sheet which is W2 / W1 <= 1.6 when the width | variety of the auxiliary sheet in the widest part of the auxiliary sheet in planar view is set to W2.