WO2015146254A1

WO2015146254A1 - Laminate for resin film formation sheet

Info

Publication number: WO2015146254A1
Application number: PCT/JP2015/051660
Authority: WO
Inventors: 泰紀柄澤; 正憲山岸
Original assignee: リンテック株式会社
Priority date: 2014-03-26
Filing date: 2015-01-22
Publication date: 2015-10-01
Also published as: KR20210088767A; CN105793035B; KR20160137506A; TW201544324A; JPWO2015146254A1; JP6600297B2; TWI651205B; KR102544301B1; CN105793035A

Abstract

The present invention makes it possible to provide a laminate for a resin film formation sheet with which it is easy to dispense the resin film formation sheet from the release sheet and application on a workpiece can be performed stably. This laminate for a resin film formation sheet is obtained by laminating a release sheet on the resin film-forming layer of a resin film formation sheet comprising a support sheet and a resin film-forming layer. Peel force of the release sheet at the periphery of the resin film formation sheet is not more than 0.05 N/25 mm. Force of adhesion to SUS at the periphery of the resin film formation sheet is not more than 1.0 N/25 mm.

Description

Sheet laminate for resin film formation

The present invention relates to a resin film forming sheet laminate in which the resin film forming sheet can be easily attached to a workpiece.

In recent years, semiconductor devices have been manufactured using a so-called “face-down” mounting method. In the face-down method, a semiconductor chip (hereinafter simply referred to as “chip”) having electrodes such as bumps on a circuit surface is used, and the electrodes are bonded to a substrate. For this reason, the surface (chip back surface) opposite to the circuit surface of the chip may be exposed.

The exposed chip back surface may be protected by an organic film. Conventionally, a chip having a protective film made of an organic film is obtained by applying a liquid resin to the back surface of a wafer by spin coating, drying and curing, and cutting the protective film together with the wafer. However, since the thickness accuracy of the protective film formed in this way is not sufficient, the product yield may be lowered.

In order to solve such a problem, a protective film forming sheet in which a film for forming a semiconductor back surface protective film is laminated on an adhesive layer of an adhesive sheet having an adhesive layer may be used.

In addition, a semiconductor wafer manufactured in a large diameter state may be cut and separated (diced) into element pieces (semiconductor chips) and then transferred to the next bonding process. At this time, the semiconductor wafer is subjected to dicing, cleaning, drying, expanding, and pick-up processes in a state of being adhered to the adhesive sheet in advance, and then transferred to the next bonding process.

Among these processes, various dicing / die bonding adhesive sheets having both a wafer fixing function and a die bonding function have been proposed in order to simplify the pick-up process and the bonding process. For example, by using the adhesive sheet, it is possible to obtain a semiconductor chip having an adhesive layer attached to the back surface, and direct die bonding such as between an organic substrate and a chip, between a lead frame and a chip, and between a chip and a chip is possible. It becomes.

Patent Document 1 (Japanese Patent Application Laid-Open No. 2005-350520) describes an adhesive sheet having a structure in which a release substrate, an adhesive layer, an adhesive layer, and a substrate film are sequentially laminated as an adhesive sheet for dicing and die bonding. ing.

JP 2005-350520 A

In the manufacturing process of a semiconductor device, a resin film forming sheet having a resin film forming layer such as a film for forming a semiconductor back surface protective film or an adhesive layer is attached to a workpiece such as a semiconductor wafer. However, in the process of attaching the resin film forming sheet to the workpiece, the resin film forming sheet is used when the end of the resin film forming sheet is not smoothly fed out from the release substrate (release sheet). Sometimes it was impossible. In other words, the drawn-out resin film forming sheet itself is bent and adhered in the overlapping direction, or the resin film-forming sheet fed out from the release sheet is in close contact (transferred) to the release sheet, or the resin film-forming sheet is In some cases, the sheet could not be fed out from the release sheet.

The present invention aims to solve the above problems. That is, an object of the present invention is to provide a resin film-forming sheet laminate in which the resin film-forming sheet can be easily fed out from the release sheet and can be stably attached to a workpiece.

As a result of intensive studies to achieve the above object, the present inventors have controlled the above-mentioned object by controlling the peeling force of the release sheet and the adhesive force against SUS at the end (outer peripheral part) of the resin film-forming sheet. It was found that the above can be achieved, and the present invention has been completed.

The present invention includes the following gist.
[1] A release sheet is laminated on a resin film forming layer of a resin film forming sheet including a support sheet and a resin film forming layer,
The peeling force of the release sheet at the outer periphery of the resin film forming sheet is 0.05 N / 25 mm or less,
A resin film-forming sheet laminate in which the adhesive strength to SUS is 1.0 N / 25 mm or less at the outer peripheral portion of the resin film-forming sheet.

[2] In the release sheet, a cut portion is formed along the outer periphery of the resin film forming sheet from the surface on the resin film forming layer side,
The sheet laminate for forming a resin film according to [1], wherein a cut depth of the cut portion is more than ½ of the thickness of the release sheet.

[3] The resin film-forming sheet laminate according to [1] or [2], wherein the release sheet has a thickness of 50 μm or more.

[4] In the release sheet, a cut portion is formed along the outer periphery of the resin film forming sheet from the surface on the resin film forming layer side,
The sheet laminate for forming a resin film according to [3], wherein the cut depth of the cut portion is greater than 25 μm.

According to the resin film-forming sheet laminate of the present invention, when the resin film-forming sheet is fed out from the release sheet, the drawn-out resin film-forming sheet itself is bent and adhered in the overlapping direction, or the resin film-forming sheet Can be prevented from being transferred to the release sheet.

FIG. 4 is a series of process diagrams for performing an operation of attaching a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 to a semiconductor wafer 32. FIG. 4 is a series of process diagrams for performing an operation of attaching a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 to a semiconductor wafer 32. FIG. 4 is a series of process diagrams for performing an operation of attaching a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 to a semiconductor wafer 32. FIG. 4 is a series of process diagrams for performing an operation of attaching a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 to a semiconductor wafer 32. The top view of the sheet | seat laminated body for resin film formation which concerns on this invention is shown. FIG. 2 shows a schematic cross-sectional view (the resin film forming sheet of the first embodiment) when the resin film forming sheet shown in FIG. 1 is cut along the line AA. The schematic cross section of the sheet | seat for resin film formation of a 2nd aspect is shown. The schematic cross section of the sheet | seat for resin film formation of a 3rd aspect is shown. The schematic cross section of the sheet | seat for resin film formation of a 4th aspect is shown. FIG. 11 is a series of process diagrams for performing a conventional operation of attaching a laminated body including a support sheet and a resin film forming layer to a semiconductor wafer 32.

Hereinafter, the detail of the sheet | seat laminated body for resin film formation which concerns on this invention is demonstrated.
The sheet laminate for resin film formation according to the present invention is an embodiment in which a release sheet is laminated on a resin film formation layer of a resin film formation sheet including a support sheet and a resin film formation layer. In the sheet laminate for resin film formation having such a configuration, the peeling force of the release sheet at the outer periphery of the resin film formation sheet is 0.05 N / 25 mm or less, and the adhesion to SUS at the outer periphery of the resin film formation sheet The force is 1.0 N / 25 mm or less.

When the peel force of the release sheet at the outer periphery of the resin film forming sheet exceeds 0.05 N / 25 mm and / or when the adhesive force against SUS at the outer periphery of the resin film forming sheet exceeds 1.0 N / 25 mm In FIG. 1, from the release sheet in the step of sticking the resin film-forming sheet 10 of the resin film-forming sheet laminate 100 to the work 32 (hereinafter sometimes referred to as “work sticking step”). When feeding out the resin film forming sheet, the support sheets of the drawn out resin film forming sheets or the resin film forming layers are bent and adhered in the overlapping direction, or the resin film forming sheet is transferred to the release sheet. End up. As a result, the resin film forming sheet becomes unusable. This problem occurs when the resin film forming sheet laminate of the resin film forming sheet laminate is affixed to the workpiece (for example, manually by the manual operation). This also occurs when the release sheet is removed and the resin film forming sheet is affixed to the workpiece.

According to the laminated sheet for resin film formation according to the present invention, it becomes easy to feed out the sheet 10 for resin film formation from the release sheet 13 even in the workpiece pasting step shown in FIG. Since the sticking to the workpiece 32 can be performed stably, the above problem can be solved.

Further, as shown in FIGS. 2 to 6, in the resin film forming sheet laminate 100, the release sheet 13 has a cut portion along the outer periphery of the resin film forming sheet 10 from the surface on the resin film forming layer side. D1 is formed, and the cut depth d1 of the cut portion D1 is preferably more than 1/2 of the thickness of the release sheet, and more preferably 3/5 to 4/5. By providing the cut portion D1 having a predetermined depth, it becomes easy to create a peeling start point at the interface between the resin film forming sheet 10 and the peeling sheet 13. As a result, the feeding property of the resin film forming sheet is improved. Moreover, it can prevent that a peeling sheet fractures | ruptures by making the notch part D1 into predetermined depth resulting from the stress concerning the longitudinal direction (flow direction) of a peeling sheet during a workpiece | work sticking process.

Further, by forming the cut portion D1, the resin film forming sheet can be reliably cut into a predetermined shape in the manufacturing process of the resin film forming sheet laminate. Moreover, by forming the cut portion D1 having a predetermined depth in the release sheet, for example, even when the thickness of the release sheet is 50 μm or more, the resin film-forming sheet laminate can be easily wound into a roll shape, Excellent storage during storage.

Moreover, in the workpiece | work sticking process shown in FIG. 1, stress is applied to the peeling sheet in the longitudinal direction (flow direction). If the cut portion D1 is not formed in the release sheet, the stress may propagate to the resin film forming layer and the resin film forming layer may extend in the flow direction. The deformation (elongation) of the resin film forming layer reduces the thickness accuracy. As a result, the reliability of a semiconductor device obtained using the resin film forming layer may be reduced. By forming a cut portion having a predetermined depth in the release sheet, stress applied to the resin film forming layer can be relaxed, and deformation of the resin film forming layer can be suppressed.

In addition, when the thickness of the release sheet is 50 μm or more, the release sheet becomes stronger and tends to be difficult to bend. In general, the stiffness of the resin film-forming sheet tends to be weaker than that of the release sheet. Therefore, in the workpiece pasting step, the peel plate 64 shown in FIG. 1 is applied to the release sheet 13 of the resin film forming sheet laminate 100 and the release sheet 13 is not bent at an acute angle toward the peel plate 64 side. It may be difficult to create a peeling start point at the interface between the sheet 10 and the release sheet 13, and the resin film forming sheet may not be fed out. However, a peeling sheet having a thickness of 50 μm or more is difficult to bend to the peel plate side at an acute angle due to its thickness even when a peel plate is used. As shown in FIG. Is difficult.

In the present invention, by setting the peel strength of the release sheet and the adhesive strength to SUS at the outer peripheral portion of the resin film forming sheet within the above range, the release sheet can be used even when the thickness of the release sheet is 50 μm or more. The resin film forming sheet 10 can be easily fed out from the sheet 13, and the resin film forming sheet can be stably attached to the workpiece. From the above viewpoint, the peeling force of the release sheet at the outer peripheral portion of the resin film forming sheet is preferably 0.001 to 0.05 N / 25 mm, more preferably 0.01 to 0.04 N / 25 mm. The adhesive strength against SUS at the outer periphery of the forming sheet is preferably 0.01 to 1.0 N / 25 mm, more preferably 0.1 to 0.8 N / 25 mm.

When the thickness of the release sheet is 50 μm or more, the cut depth d1 of the cut portion D1 is preferably more than 25 μm. Specifically, when the thickness of the release sheet is 50 μm, the cut depth d1 of the cut portion D1 is preferably more than 25 μm, more preferably 30 to 40 μm, and the thickness of the release sheet is 100 μm. The cut depth d1 of the cut portion D1 is preferably more than 50 μm, more preferably 60 to 80 μm. In addition, the cutting depth in this invention measures the depth of the thickness direction of the peeling sheet of the notch | incision part formed in the peeling sheet arbitrarily by the optical microscope with a magnification of 300, and averages this. Calculated.

Embodiment of Resin Film Forming Sheet Laminate Support sheet 11 and resin film forming layer 12 are cut into a desired planar shape and partially laminated on release sheet 13. Here, the desired planar shape in the support sheet 11 and the resin film forming layer 12 is a state in which the support sheet 11 and the resin film forming layer 12 are partially laminated on the release sheet 13 as shown in FIG. If it becomes the shape used as it, it will not specifically limit.

The planar shape of the support sheet 11 is preferably a shape that can be easily attached to a jig such as a ring frame used in the manufacturing process of a semiconductor device to be described later. For example, a circular shape, a substantially circular shape, a rectangular shape, a pentagonal shape, a hexagonal shape, Examples thereof include a rectangular shape, an octagonal shape, and a wafer shape (a shape in which a part of the outer periphery of the circle is a straight line). Among these, in order to reduce useless parts other than the part attached to the ring frame, a circular shape or a wafer shape is preferable.

The planar shape of the resin film forming layer 12 is preferably a shape that matches the planar shape of a workpiece such as a semiconductor wafer. For example, a circular shape, a substantially circular shape, a quadrangular shape, a pentagonal shape, a hexagonal shape, an octagonal shape, a wafer shape. It is preferable that the shape be easy to stick to the workpiece, such as (a shape in which a part of the outer periphery of the circle is a straight line). Among these, a circular shape or a wafer shape is preferable in order to reduce useless portions other than the portion attached to the workpiece.

(First aspect)
FIG. 2 is a plan view showing a first embodiment of the resin film-forming sheet laminate 100 according to the present invention, and FIG. 3 shows the resin film-forming sheet laminate 100 shown in FIG. It is a schematic sectional drawing at the time of cutting along.

2 and 3, in the resin film forming sheet laminate 100 according to the first aspect, the diameter of the support sheet 11 is larger than the diameter of the resin film forming layer 12. The support sheet 11 is a pressure-sensitive adhesive sheet composed of a base material 11a and a pressure-sensitive adhesive layer 11b. Further, in the release sheet 13, a cut portion D 2 may be formed along the outer periphery of the resin film forming layer 12 in addition to the cut portion D 1.

In the first aspect, the depth of cut d2 of the cut portion D2 is not particularly limited, and may be the same as, larger or smaller than the depth of cut d1 of the cut portion D1, but the thickness of the release sheet It is preferably more than 1/2 of the above, more preferably 3/5 to 4/5. Moreover, when the thickness of a peeling sheet is 50 micrometers or more, it is preferable that the cutting depth d2 of the cutting part D2 is more than 25 micrometers. Specifically, when the thickness of the release sheet is 50 μm, the cut depth d2 of the cut portion D2 is preferably more than 25 μm, more preferably 30 to 40 μm, and the thickness of the release sheet is 100 μm. The cut depth d2 of the cut portion D2 is preferably more than 50 μm, more preferably 60 to 80 μm. Depending on the composition of the resin film forming layer, the adhesiveness to the release sheet may be increased, and the resin film forming layer may not be fed out in the work pasting process. Even in such a case, by providing the cut portion D2 having a predetermined depth, it is possible to create a peeling start point at the interface between the resin film forming layer 12 and the peeling sheet 13, so that the resin film forming layer 12 Extendability is improved.

Also, by providing the cut portion D2 having a predetermined depth, it becomes easy to suppress deformation of the resin film forming layer due to stress applied in the longitudinal direction (flow direction) of the release sheet during the work pasting process.

1st aspect WHEREIN: The peeling force of the peeling sheet in the outer peripheral part of the sheet | seat for resin film formation, or the adhesive force with respect to SUS is a physical-property value measured in the interface of the outer peripheral part of the adhesive layer 11b and the peeling sheet 13. FIG. . These physical property values in the first aspect can be controlled by adjusting components constituting the pressure-sensitive adhesive layer 11b described later and the thickness of the pressure-sensitive adhesive layer 11b. In addition, the said physical-property value in a 1st aspect WHEREIN: When an energy-beam curable compound (B) and an energy-beam curable polymer (AB) are included as a component which comprises the adhesive layer 11b, it is before energy beam irradiation. It is a physical property value.

(Second aspect)
FIG. 4 is a schematic cross-sectional view of the resin film forming sheet laminate 100 of the second embodiment. In the resin film forming sheet 10 of the resin film forming sheet laminate 100 according to the second aspect, the support sheet 11 and the resin film forming layer 12 in the plan view have the same shape.

As shown in FIG. 4, an adhesive sheet composed of a base material 11a and an adhesive layer 11b may be used as a support sheet, or only the base material 11a may be used as a support sheet.

2nd aspect WHEREIN: The peeling force of the peeling sheet in the outer peripheral part of the resin film formation sheet or the adhesive force with respect to SUS is a physical-property value measured in the interface of the outer peripheral part of the resin film forming layer 12, and the peeling sheet 13. is there. These physical property values in the second aspect are obtained by using an energy ray curable compound (B) or an energy ray curable polymer (AB) as a component constituting the resin film forming layer, and only on the outer peripheral portion of the resin film forming layer. It can be controlled by means such as irradiation with energy rays. As such means, for example, an energy ray shielding layer is provided by printing or the like on the inner peripheral portion of the support sheet, and energy beam irradiation is performed from the support sheet side to the resin film formation layer, or the outer periphery of the resin film formation layer in advance. Examples include a method of irradiating only the part with energy rays and then laminating with a support sheet.

(Third aspect)
FIG. 5 is a schematic cross-sectional view of the resin film forming sheet laminate 100 of the third aspect. In the resin film forming sheet 10 of the resin film forming sheet laminate 100 according to the third aspect, the support sheet 11 and the resin film forming layer 12 in the plan view have the same shape. Further, a jig adhesive layer 14 is provided between the release sheet 13 and the resin film forming layer 12 in the outer peripheral portion of the resin film forming sheet 10. Further, in the release sheet 13, a cut portion D 3 may be formed along the inner periphery of the annular jig adhesive layer 14 in addition to the cut portion D 1.

As shown in FIG. 5, an adhesive sheet composed of a base material 11a and an adhesive layer 11b may be used as a support sheet, or only the base material 11a may be used as a support sheet.

In the third aspect, the depth of cut d3 of the cut portion D3 is not particularly limited, and may be the same as, larger or smaller than the depth of cut d1 of the cut portion D1, but the thickness of the release sheet It is preferably more than 1/2 of the above, more preferably 3/5 to 4/5. Moreover, when the thickness of a peeling sheet is 50 micrometers or more, it is preferable that the cutting depth d3 of the cutting part D3 is more than 25 micrometers. Specifically, when the thickness of the release sheet is 50 μm, the cut depth d3 of the cut portion D3 is preferably more than 25 μm, more preferably 30 to 40 μm, and the thickness of the release sheet is 100 μm. The cut depth d3 of the cut portion D3 is preferably more than 50 μm, more preferably 60 to 80 μm. By providing the cut portion D3 having a predetermined depth, it becomes easy to suppress the deformation of the resin film forming layer due to the stress applied in the longitudinal direction (flow direction) of the release sheet during the work sticking process.

3rd aspect WHEREIN: The peeling force of the peeling sheet and the adhesive force with respect to SUS in the outer peripheral part of the sheet | seat for resin film formation are a physical-property value measured in the interface of the jig | tool adhesion layer 14 and the peeling sheet 13. FIG. These physical property values in the third aspect can be controlled by adjusting the components constituting the jig bonding layer described later and the thickness of the jig bonding layer. In addition, the said physical-property value in a 3rd aspect is an energy-beam irradiating compound (AB) and an energy-beam curable polymer (AB) as a component which comprises a jig | tool adhesion layer, before energy-beam irradiation. It is a physical property value.

(Fourth aspect)
FIG. 6 is a schematic cross-sectional view of the resin film forming sheet laminate 100 of the fourth aspect. In the resin film forming sheet laminate 100 according to the fourth aspect, the diameter of the support sheet 11 is larger than the diameter of the resin film forming layer 12 in plan view. Further, a jig adhesive layer 14 is provided between the release sheet 13 and the support sheet 11 on the outer peripheral portion of the resin film forming sheet. Further, in the release sheet 13, a cut portion D 2 may be formed along the outer periphery of the resin film forming layer 12 in addition to the cut portion D 1. Furthermore, a cut portion D3 may be formed in the release sheet 13 along the inner periphery of the annular jig adhesive layer 14. The cut depth d2 of the cut portion D2, the cut depth d3 of the cut portion D3, and the effects resulting from these are as described in the first mode and the third mode. The jig adhesive layer 14 is the same as that in the third aspect, and the configuration thereof will be described later.

The pressure-sensitive adhesive sheet composed of the base material 11a and the pressure-sensitive adhesive layer 11b may be used as a support sheet, or only the base material 11a may be used as a support sheet as shown in FIG.

4th aspect WHEREIN: The peeling force of the peeling sheet and the adhesive force with respect to SUS in the outer peripheral part of the sheet | seat for resin film formation are a physical-property value measured in the interface of the jig | tool adhesion layer 14 and the peeling sheet 13. FIG. These physical property values in the fourth aspect can be controlled by adjusting components constituting the jig bonding layer described later and the thickness of the jig bonding layer. In addition, the said physical-property value in a 4th aspect WHEREIN: When an energy-beam curable compound (B) and an energy-beam curable polymer (AB) are included as a component which comprises a jig | tool adhesion layer, before an energy beam irradiation. It is a physical property value.

Configuration of Resin Film Forming Sheet Laminate A resin film forming sheet laminate according to the present invention is obtained by laminating a release sheet on a resin film forming layer of a resin film forming sheet including a support sheet and a resin film forming layer. Become. Further, as described in the third aspect and the fourth aspect, the resin film forming sheet may include a jig adhesive layer. Hereinafter, each layer which comprises the sheet | seat laminated body for resin film formation is demonstrated.

(Support sheet)
Examples of the support sheet include polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, Polyurethane film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene / (meth) acrylic acid copolymer film, ethylene / (meth) acrylic acid ester copolymer film, polystyrene film, polycarbonate film, polyimide film, fluorine A resin film or the like is used. These crosslinked films are also used. Furthermore, these laminated films may be sufficient.

Further, as shown in FIGS. 3 to 5, as the support sheet 11, an adhesive sheet composed of a base material 11a and an adhesive layer 11b can be used.

When an adhesive sheet is used as the support sheet, it becomes easy to perform necessary processing such as dicing on the workpiece on the resin film forming sheet. In this embodiment, the resin film forming layer is laminated on the pressure-sensitive adhesive layer provided on the base material. Examples of the substrate include the films exemplified as the support sheet.

The pressure-sensitive adhesive layer can be formed of various conventionally known pressure-sensitive adhesives. The pressure-sensitive adhesive usually contains a polymer (A). In the present invention, since it is preferable to use an energy ray-curable pressure-sensitive adhesive, it is preferable to contain an energy ray-curable compound (B) in addition to the polymer (A).

The energy ray-curable compound (B) contains an energy ray-polymerizable group and has a function of being polymerized and cured when irradiated with energy rays such as ultraviolet rays and electron beams and reducing the adhesiveness of the pressure-sensitive adhesive. The energy beam polymerizable group in the present invention is a functional group having a polymerizable carbon-carbon double bond, and specific examples thereof include a vinyl group, an allyl group, a (meth) acryloyl group, and the like. (Meth) acryloyl group is mentioned. The energy beam polymerizable group in the present invention does not mean a double bond having no polymerizability because it generates a radical in the presence of a radical and easily causes a polyaddition reaction. For example, each component constituting the energy ray-curable pressure-sensitive adhesive may contain an aromatic ring, but the unsaturated structure of the aromatic ring does not mean the energy ray polymerizable group in the present invention.

Moreover, as what has the property of said component (A) and (B), it describes as an energy-beam curable polymer (henceforth component (AB)) by which an energy-beam polymeric group is couple | bonded with the principal chain or the side chain. May be used). Such an energy beam curable polymer (AB) has the property of having both a function as a polymer and energy beam curability.

The energy ray-curable pressure-sensitive adhesive is not particularly limited, but will be specifically described with an acrylic pressure-sensitive adhesive as an example. The acrylic pressure-sensitive adhesive contains an acrylic polymer (A1) as the polymer (A).

As the acrylic polymer (A1), a conventionally known acrylic polymer can be used. The weight average molecular weight (Mw) of the acrylic polymer (A1) is preferably 10,000 to 2,000,000, more preferably 100,000 to 1,500,000. The glass transition temperature (Tg) of the acrylic polymer (A1) is preferably in the range of −70 to 30 ° C., more preferably in the range of −60 to 20 ° C. When the weight average molecular weight and glass transition temperature of the acrylic polymer (A1) are increased, the above-described peeling force and adhesive force are decreased, and when the weight average molecular weight and glass transition temperature are decreased, the peeling force and the adhesive force are increased. There is a tendency.

The monomer constituting the acrylic polymer (A1) includes at least one (meth) acrylic acid ester monomer or a derivative thereof.
Specifically, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl ( Alkyl groups such as (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, tetradecyl (meth) acrylate, octadecyl (meth) acrylate and the like have 1 carbon atom Alkyl (meth) acrylate which is -18; cycloalkyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (Meth) acrylates having a cyclic skeleton such as (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, imide (meth) acrylate; hydroxymethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl Hydroxyl group-containing (meth) acrylates such as (meth) acrylate and 2-hydroxybutyl (meth) acrylate; Epoxy group-containing (meth) acrylates such as glycidyl (meth) acrylate and 3,4-epoxycyclohexylmethyl (meth) acrylate; monomethyl Amino group-containing (meth) acrylates such as amino (meth) acrylate, monoethylamino (meth) acrylate, diethylamino (meth) acrylate; 2- (meth) acryloyloxyethyl phthalate And carboxyl group-containing (meth) acrylates such as 2- (meth) acryloyloxypropyl phthalate.
Further, (meth) acrylic acid, itaconic acid, vinyl acetate, (meth) acrylonitrile, styrene or the like may be copolymerized.
These may be used alone or in combination of two or more.

In addition, in this specification, (meth) acryl may be used in the meaning including both acryl and methacryl.

The acrylic polymer (A1) may be cross-linked. In the case of crosslinking the acrylic polymer (A1), the acrylic polymer (A1) before being crosslinked has a crosslinkable functional group such as a hydroxyl group, and in the composition for forming the pressure-sensitive adhesive layer Add a cross-linking agent. The acrylic polymer (A1) is crosslinked by the reaction between the crosslinkable functional group and the functional group of the crosslinking agent. By crosslinking the acrylic polymer (A1), the cohesive force of the pressure-sensitive adhesive layer can be adjusted.

Examples of the crosslinking agent include organic polyvalent isocyanate compounds and organic polyvalent imine compounds.

Examples of organic polyvalent isocyanate compounds include aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds, trimers of these organic polyvalent isocyanate compounds, and these organic polyvalent isocyanate compounds. Examples thereof include terminal isocyanate urethane prepolymers obtained by reacting with a polyol compound.

Specific examples of the organic polyvalent isocyanate compound include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4′-. Diisocyanate, diphenylmethane-2,4′-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4′-diisocyanate, dicyclohexylmethane-2,4′-diisocyanate, and lysine isocyanates thereof Examples thereof include polyhydric alcohol adducts (for example, trimethylolpropane adduct tolylene diisocyanate).

Specific examples of organic polyvalent imine compounds include N, N′-diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane-tri-β-aziridinylpropionate, tetramethylol. Mention may be made of methane-tri-β-aziridinylpropionate and N, N′-toluene-2,4-bis (1-aziridinecarboxamide) triethylenemelamine.

The crosslinking agent is usually blended at a ratio of 0.01 to 20 parts by weight, preferably 0.1 to 15 parts by weight, more preferably 0.5 to 12 parts by weight with respect to 100 parts by weight of the acrylic polymer before crosslinking. Is done. When the blending amount of the crosslinking agent is increased, the above-described peeling force and adhesive strength are lowered, and when the blending amount of the crosslinking agent is decreased, the peeling force and the tackiness tend to increase.

In the present invention, when the content of the component constituting the pressure-sensitive adhesive layer is determined based on the content of the acrylic polymer, when the acrylic polymer is a crosslinked acrylic polymer, the standard The content of is the content of the acrylic polymer before being crosslinked.

The energy ray-curable compound (B) is a compound that is polymerized and cured when irradiated with energy rays such as ultraviolet rays and electron beams. Examples of the energy ray curable compounds include low molecular weight compounds (monofunctional and polyfunctional monomers and oligomers) having an energy ray polymerizable group, and specifically include trimethylolpropane triacrylate and tetramethylolmethane. Acrylates such as tetraacrylate, pentaerythritol triacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate, dicyclopentadiene dimethoxydiacrylate, Cyclic aliphatic skeleton-containing acrylates such as isobornyl acrylate, polyethylene glycol diacrylate, oligoester acrylate, urethane acrylate Goma, epoxy-modified acrylates, polyether acrylates, acrylate compounds such as itaconic acid oligomer is used. Such a compound has an energy ray polymerizable group in the molecule and usually has a molecular weight of about 100 to 30,000, preferably about 300 to 10,000.

In general, the amount of the low molecular weight compound having an energy ray polymerizable group is preferably 0 to 200 parts by mass relative to 100 parts by mass of the component (A) (including the energy ray curable polymer (AB) described later). The ratio is preferably 1 to 100 parts by mass, more preferably about 1 to 30 parts by mass.

The energy beam curable polymer (AB) having the properties of the components (A) and (B) is formed by bonding an energy beam polymerizable group to the main chain, side chain or terminal of the polymer.

The energy ray curable polymer bonded to the main chain, side chain or terminal of the energy ray curable polymer is an alkylene group, alkyleneoxy group or polyalkyleneoxy group via the main chain or side chain of the energy ray curable polymer. Or you may couple | bond with the terminal.

The weight average molecular weight (Mw) of the energy beam curable polymer (AB) is preferably 10,000 to 2,000,000, and more preferably 100,000 to 1,500,000. The glass transition temperature (Tg) of the energy beam curable polymer (AB) is preferably in the range of −70 to 30 ° C., more preferably −60 to 20 ° C. In the case of an energy ray curable polymer (AB) obtained by reacting an acrylic polymer containing a functional group such as a hydroxy group described later with a polymerizable group-containing compound, Tg is a polymerizable group. It is Tg of the acrylic polymer before making it react with a containing compound. When the weight average molecular weight and glass transition temperature of the energy ray curable polymer (AB) are increased, the above-described peeling force and adhesive force are lowered, and when the weight average molecular weight and glass transition temperature are lowered, the peeling force and the adhesive force are reduced. It tends to rise.

The energy ray curable polymer (AB) includes, for example, an acrylic polymer containing a functional group such as a hydroxy group, a carboxyl group, an amino group, a substituted amino group, and an epoxy group, and a substituent that reacts with the functional group. It is obtained by reacting a polymerizable group-containing compound having 1 to 5 energy beam polymerizable carbon-carbon double bonds per molecule. The acrylic polymer includes a (meth) acrylic acid ester monomer having a functional group such as a hydroxy group, a carboxyl group, an amino group, a substituted amino group, and an epoxy group or a derivative thereof, and a monomer constituting the component (A) described above. A copolymer consisting of Examples of the polymerizable group-containing compound include (meth) acryloyloxyethyl isocyanate, meta-isopropenyl-α, α-dimethylbenzyl isocyanate, (meth) acryloyl isocyanate, allyl isocyanate, glycidyl (meth) acrylate, and (meth) acrylic acid. Etc.

When the energy ray curable polymer (AB) is obtained by reacting an acrylic polymer containing a functional group such as a hydroxy group with a polymerizable group-containing compound, the energy ray curable polymer (AB) is Like the above-mentioned acrylic polymer (A1), it may be crosslinked.

The acrylic pressure-sensitive adhesive containing the acrylic polymer (A1), the energy ray curable compound (B) and / or the energy ray curable polymer (AB) as described above is cured by irradiation with energy rays. Specifically, ultraviolet rays, electron beams, etc. are used as the energy rays.

Also, by combining a photopolymerization initiator with the energy beam curable compound (B) or the energy beam curable polymer (AB), the polymerization curing time can be shortened and the amount of light irradiation can be decreased.

Examples of such photopolymerization initiators include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin benzoic acid methyl, benzoin dimethyl ketal, 2,4-diethyl Thioxanthone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxycyclohexyl phenyl ketone, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl 1,2-diphenylmethane, 2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone, 2,4,6-trimethylbenzoy Diphenyl phosphine oxide and β- crawl anthraquinone and the like. A photoinitiator can be used individually by 1 type or in combination of 2 or more types.

The blending ratio of the photopolymerization initiator is preferably 0.1 to 10 parts by mass with respect to 100 parts by mass in total of the energy beam curable compound (B) and the energy beam curable polymer (AB). More preferably, 5 parts by mass is included.
If the blending ratio of the photopolymerization initiator is less than 0.1 parts by mass, satisfactory curability may not be obtained due to insufficient photopolymerization, and if it exceeds 10 parts by mass, a residue that does not contribute to photopolymerization is generated. May cause malfunctions.

The thickness of the support sheet is usually 10 to 500 μm, preferably 15 to 300 μm, more preferably 20 to 250 μm. When the pressure-sensitive adhesive layer is provided, the thickness of the pressure-sensitive adhesive layer is preferably 2 to 20 μm in the support sheet, more preferably 3 to 15 μm, still more preferably 4 to 10 μm. If the thickness of the pressure-sensitive adhesive layer is too small, sufficient peel strength or pressure-sensitive adhesive strength may not be expressed. If the thickness of the pressure-sensitive adhesive layer is too large, the peel strength or pressure-sensitive adhesive strength increases, and the effect of the present invention. May not be possible.

(Resin film forming layer)
The resin film forming layer in the present invention is appropriately selected from resins having various functions such as a film adhesive, an adhesive layer, and a protective film forming layer, which will be described later, according to the use of the sheet.

<Film adhesive>
The resin film forming layer may be a film adhesive. Such film adhesives are frequently used in the die bonding process of chips in recent years. Such a film adhesive is preferably an epoxy adhesive or polyimide adhesive formed into a film and semi-cured (B-stage state), and is formed to be peelable on the above support sheet.

The film adhesive is affixed to the workpiece. By dicing the workpiece and the film-like adhesive into a chip size, an adhesive-attached chip is obtained, which is picked up from the support sheet, and the chip is fixed to a predetermined position via the adhesive. It is preferable to perform expansion when picking up the chip with adhesive.

<Adhesive layer>
The sheet for forming a resin film in the present invention may be a dicing / die-bonding sheet having both a wafer fixing function during dicing and a die bonding function during die bonding.

When the resin film forming sheet is a sheet for both dicing and die bonding, the resin film forming layer holds a work or a chip obtained by separating the work in the dicing process, and is cut together with the work during dicing and has the same shape as the chip. A resin film forming layer is formed. When the chip is picked up after the dicing is completed, the resin film forming layer is peeled off from the support sheet together with the chip. The resin film forming layer functions as an adhesive for fixing the chip during die bonding. A chip with a resin film forming layer is placed on a substrate, heated, etc., and the chip and an adherend such as a substrate or another chip are bonded via the resin film forming layer.

When the resin film forming sheet is such a dicing / die bonding sheet, an adhesive having a pressure-sensitive adhesive property as a resin film forming layer on the support sheet and having a die bonding function A layer is formed. The resin film forming layer having both the wafer fixing function and the die bonding function includes, for example, the above-described acrylic polymer (A1) and an epoxy adhesive, and, if necessary, an energy ray curable compound. (B), an energy beam curable polymer (AB), a curing aid and the like. In addition, when picking up the chip | tip with an adhesive layer, it is preferable to expand like the above.

<Protective film forming layer>
Further, when the resin film forming sheet is used as a protective film forming sheet for forming a protective film on the back surface of the chip, the resin film forming layer is a protective film for forming the protective film on the back surface of the chip. It may be a forming layer.
In this case, a work is stuck on the protective film forming layer, the protective film forming layer is cured to form a protective film, and then the work and the protective film are diced to obtain a chip with a protective film. In addition, even if a workpiece is attached to the protective film forming layer, the workpiece and the protective film forming layer are diced to obtain a chip with a protective film forming layer, and then the protective film forming layer is cured to obtain a chip with a protective film. Good.
Such a protective film forming sheet has an adhesive resin layer (protective film forming layer) serving as a protective film as a resin film forming layer on the support sheet. The resin film forming layer serving as such a protective film includes, for example, the above-described acrylic polymer (A1), an epoxy adhesive and a curing aid, and, if necessary, an energy ray curable compound (B), An energy beam curable polymer (AB), a filler, or the like may be contained.

The thickness of the resin film-forming layer varies depending on the application, but is approximately 1 to 300 μm, preferably 10 to 200 μm, particularly preferably 20 to 100 μm.

(Jig adhesive layer)
As a jig | tool adhesion layer, the adhesive member which consists of an adhesive layer single-piece | unit, the adhesive member comprised from a base material and an adhesive layer, and the double-sided adhesive member which has a core material are employable. The jig adhesive layer is, for example, an annular shape (ring shape), has a hollow portion (internal opening), and has a size that can be fixed to a jig such as a ring frame. Specifically, the inner diameter of the ring frame is smaller than the outer diameter of the jig adhesive layer. Further, the inner diameter of the ring frame is slightly larger than the inner diameter of the jig adhesive layer. The ring frame is usually a molded body of metal or plastic.

When a pressure-sensitive adhesive member made of a single pressure-sensitive adhesive layer is used as a jig bonding layer, the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is not particularly limited, but for example, it is made of an acrylic pressure-sensitive adhesive, a rubber pressure-sensitive adhesive, or a silicone pressure-sensitive adhesive. Is preferred. Among these, the acrylic containing the acrylic polymer (A1) described above is taken into consideration in the outer peripheral portion of the resin film forming sheet in consideration of the peeling force of the release sheet, the adhesive strength against SUS, and the removability from the ring frame. System adhesives are preferred. In addition, the said adhesive may be used independently or may be used in mixture of 2 or more types.

The thickness of the pressure-sensitive adhesive layer constituting the jig adhesion layer is preferably 2 to 20 μm, more preferably 3 to 15 μm, and further preferably 4 to 10 μm. When the thickness of the pressure-sensitive adhesive layer is less than 2 μm, sufficient peeling force or adhesive force may not be exhibited. When the thickness of the pressure-sensitive adhesive layer exceeds 20 μm, the peeling force and the pressure-sensitive adhesive force are increased, and the effect of the present invention cannot be exhibited, or a residue of the pressure-sensitive adhesive remains on the ring frame when peeling from the ring frame, May contaminate the ring frame.

When the adhesive member composed of the base material and the adhesive layer is used as the jig adhesive layer, the adhesive layer and the release sheet constituting the adhesive member are laminated.
The pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is the same as the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer in the pressure-sensitive adhesive member composed of the above pressure-sensitive adhesive layer alone. The same applies to the thickness of the pressure-sensitive adhesive layer.

The base material constituting the jig adhesive layer is not particularly limited. For example, polyethylene film, polypropylene film, ethylene-vinyl acetate copolymer film, ethylene- (meth) acrylic acid copolymer film, ethylene- (meth) Examples thereof include polyolefin films such as acrylate copolymer films and ionomer resin films, polyvinyl chloride films, and polyethylene terephthalate films. Among these, in consideration of expandability, a polyethylene film and a polyvinyl chloride film are preferable, and a polyvinyl chloride film is more preferable.

The thickness of the base material constituting the jig adhesion layer is preferably 15 to 200 μm, more preferably 30 to 150 μm, and still more preferably 40 to 100 μm.

When a double-sided pressure-sensitive adhesive member having a core material is used as a jig adhesive layer, the double-sided pressure-sensitive adhesive member is formed on the core material, a laminating pressure-sensitive adhesive layer formed on one surface thereof, and the other surface. It consists of an adhesive layer for fixing. The pressure-sensitive adhesive layer for laminating is the pressure-sensitive adhesive layer on the side attached to the resin film-forming layer in the third aspect, and is the pressure-sensitive adhesive layer on the side attached to the support sheet in the fourth aspect. Further, the fixing pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer on the side attached to the release sheet.

As the core material of the double-sided pressure-sensitive adhesive member, the same material as the base material of the pressure-sensitive adhesive member can be mentioned. Of these, polyolefin film and plasticized polyvinyl chloride film are preferred in view of expandability.

The thickness of the core material is usually 15 to 200 μm, preferably 30 to 150 μm, more preferably 40 to 100 μm.

The double-sided pressure-sensitive adhesive layer and the fixing pressure-sensitive adhesive layer may be the same pressure-sensitive adhesive layer or different pressure-sensitive adhesive layers.

The pressure-sensitive adhesive constituting the fixing pressure-sensitive adhesive layer is formed so that the peeling force of the release sheet and the pressure-sensitive adhesive force against SUS are within a predetermined range at the outer peripheral portion of the resin film-forming sheet, and the pressure-sensitive adhesive layer for fixing and the ring frame Is suitably selected so that the adhesive strength between the resin film forming layer or the support sheet and the adhesive layer for lamination is smaller. Examples of such pressure-sensitive adhesives include acrylic pressure-sensitive adhesives, rubber-based pressure-sensitive adhesives, and silicone pressure-sensitive adhesives. In the outer peripheral portion of the resin film-forming sheet, the peel strength of the release sheet, the adhesive strength against SUS, and the ring frame In view of the removability from the above, an acrylic pressure-sensitive adhesive containing the above-mentioned acrylic polymer (A1) is preferable. Moreover, the pressure-sensitive adhesive forming the fixing pressure-sensitive adhesive layer may be used alone or in combination of two or more.

The pressure-sensitive adhesive constituting the lamination pressure-sensitive adhesive layer is not particularly limited, and examples thereof include an acrylic pressure-sensitive adhesive, a rubber pressure-sensitive adhesive, and a silicone pressure-sensitive adhesive. Among these, the acrylic pressure-sensitive adhesive containing the above-mentioned acrylic polymer (A1) is preferable from the viewpoint of easy control of the adhesive force with the resin film forming layer or the support sheet. Moreover, the adhesive which forms the adhesive layer for lamination | stacking may be used independently, or 2 or more types may be mixed and used for it.

The thickness of the laminating pressure-sensitive adhesive layer and the fixing pressure-sensitive adhesive layer is the same as the thickness of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive member.

By providing the jig adhesive layer, it becomes easy to bond the resin film forming sheet to a jig such as a ring frame.

(Peeling sheet)
The release sheet serves as a carrier film when the resin film-forming sheet is used, and the film exemplified as the support sheet described above can be used.

The surface tension of the surface in contact with the resin film forming layer of the release sheet is preferably 40 mN / m or less, more preferably 37 mN / m or less, and particularly preferably 35 mN / m or less. The lower limit is usually about 25 mN / m. Such a release sheet having a relatively low surface tension can be obtained by appropriately selecting the material, and can also be obtained by applying a release agent to the surface of the release sheet and performing a release treatment. .

As the release agent used for the release treatment, alkyd, silicone, fluorine, unsaturated polyester, polyolefin, wax, and the like are used. In particular, alkyd, silicone, and fluorine release agents are heat resistant. This is preferable.

In order to release the surface of a film or the like as a substrate of a release sheet using the above release agent, the release agent can be used without any solvent, or can be diluted or emulsified in a solvent to obtain a gravure coater, Mayer bar coater, air knife coater. The release sheet coated with a release coater may be applied at room temperature or under heating, or may be cured with an electron beam to form a release agent layer.

Further, the surface tension of the release sheet may be adjusted by laminating films by wet lamination, dry lamination, hot melt lamination, melt extrusion lamination, coextrusion processing, or the like. That is, a film in which the surface tension of at least one surface is in a preferable range as the surface in contact with the resin film forming layer of the release sheet described above is set so that the surface is in contact with the resin film forming layer. It is good also as a peeling sheet by manufacturing the laminated body laminated | stacked with this film.

The thickness of the release sheet is not particularly limited, but is preferably 50 μm or more, more preferably 50 to 200 μm. When the release film is less than 50 μm, when the resin film-forming sheet is wound into a roll, winding marks may occur in the resin film-forming layer. When a winding mark is generated in the resin film forming layer, the thickness accuracy of the resin film forming layer is lowered, and in the air biting when the resin film forming layer is attached to the workpiece or in the method of manufacturing a semiconductor device described later, the chip is attached to the resin film. This may cause a decrease in adhesiveness and void generation when bonded to a chip mounting portion (a substrate or another chip) via the formation layer. As a result, it becomes difficult to obtain a semiconductor device having excellent reliability. In addition, when the resin film forming layer is used as a protective film for protecting the back surface of the chip, the traces of the resin film forming layer cause an appearance defect in addition to the above. By making the thickness of the release sheet within the above range, the above problem can be solved.

The sheet laminate for forming a resin film having the above-described configuration / configuration is obtained by removing the release sheet, and then attaching the resin film forming layer to the work. Applied. Then, the support film is peeled off while the resin film forming layer remains fixed to the workpiece. That is, it is used in a process including a step of transferring a resin film forming layer from a support sheet to a workpiece.

The workpiece applicable in the present invention is not limited to the material, and examples thereof include various articles such as a semiconductor wafer, a glass substrate, a ceramic substrate, an organic material substrate such as an FPC, or a metal material such as precision parts. .

The shape of the resin film-forming sheet laminate can be a belt-like shape in which a resin film-forming sheet including a support sheet and a resin film-forming layer is laminated on a long release sheet, which can be rolled up. In particular, as shown in FIG. 2, a form in which a resin film forming sheet including a support sheet and a resin film forming layer cut out in accordance with a desired shape is laminated on a long release sheet so as to be peeled at regular intervals. Is preferred. Moreover, the shape of the resin film-forming sheet laminate can also be a single wafer.

When a sheet for forming a resin film including a support sheet and a resin film forming layer cut out in accordance with a desired shape is laminated on a long release sheet so as to be peeled at regular intervals, a resin film is formed. The thickness of the sheet laminate for resin film formation becomes nonuniform between the portion where the sheet for application is laminated and the portion where the sheet for resin film formation is not laminated. When such a laminated sheet for forming a resin film having a non-uniform thickness is wound up in a roll shape, the thickness becomes non-uniform, the non-uniform winding pressure may occur, and the roll may collapse. Therefore, it is preferable to make the thickness uniform in the sheet laminate for forming a resin film in such a form. For this reason, on the outside of the resin film forming sheet cut out in accordance with a desired shape, as shown in FIG. 2, there is a little space along the both edges 15 in the short direction of the long release sheet 13. Thus, it is preferable that the peripheral tape 14 having the same thickness as the resin film forming sheet is bonded. Here, the distance between the resin film forming sheet and the peripheral tape 14 is preferably about 1 to 20 mm, and particularly preferably about 2 to 10 mm. The peripheral tape 14 makes it easier to avoid the above problems by eliminating the uneven thickness.

Production of resin film-forming sheet laminate Next, a resin film-forming sheet laminate in which a resin film-forming sheet cut out in accordance with a desired shape is laminated on a long release sheet so as to be peeled at regular intervals. The manufacturing method of the body will be described by taking the first mode shown in FIG. 3 and the third mode shown in FIG. 5 as an example. The resin film forming sheet of the present invention is obtained by such a manufacturing method. It is not limited.

(Manufacture of sheet laminate for resin film formation according to first aspect)
First, the resin film forming layer on the release sheet is half-cut into a desired shape.

Specifically, two long release sheets (hereinafter referred to as a first long release sheet and a second long release sheet. The second long release sheet is the release sheet 13 in FIG. 3. ) To prepare a laminate having a resin film forming layer. A resin film forming layer formed in advance in a film shape may be sandwiched between two long release sheets, and a resin film forming composition for forming a resin film forming layer is used as one long release sheet. The laminate may be formed by coating, drying, and pasting the other long release sheet on the coating film.

Next, the first long release sheet is removed. Then, the resin film forming layer is completely cut into a desired shape, and the resin film forming layer is die-cut (half cut) so as to reach the second long release sheet 13. Die cutting is performed by a general-purpose apparatus (rotary blade or flat blade) and method such as die cutting. The cutting depth at this time is the total depth of the thickness of the resin film forming layer and the cutting depth d2 in order to completely cut the resin film forming layer and form the cutting portion D2 having the cutting depth d2. Cut in. For this reason, the cut part D2 of the cut depth d2 is formed in the surface of a 2nd elongate peeling sheet.

Next, an adhesive tape for peeling is applied in the longitudinal direction of the resin film forming layer. Then, by removing the peeling adhesive tape, the resin film forming layer 12 having a desired shape is left on the second long release sheet 13, and the remaining resin film forming layer is removed. The remaining portions other than the resin film forming layer having a desired shape are continuous. For this reason, when the interface between the second long release sheet and the resin film forming layer is a starting point of peeling, the remaining resin film forming layer is removed, and the resin film forming layer 12 having a desired shape is formed into the second long film. It remains on the scale release sheet 13. As a result, a laminated body in which the resin film forming layers 12 having a desired shape are arranged on the second long release sheet 13 is obtained.

Next, the support sheet 11 is attached to the surface of the second long release sheet 13 having the resin film forming layer 12 so as to be in contact with the second long release sheet 13 and the resin film forming layer 12. In the first aspect, the support sheet 11 is a pressure-sensitive adhesive sheet composed of a base material 11a and a pressure-sensitive adhesive layer 11b. The method for forming the pressure-sensitive adhesive layer 11b on the base material 11a is not particularly limited. For example, a method for forming the pressure-sensitive adhesive layer 11b on the base material 11a by applying and drying the composition (pressure-sensitive adhesive), Examples include a method in which an adhesive is provided on a release sheet different from the release sheet, and the adhesive is transferred to the base material 11a.

Then, the support sheet is die-cut into a desired shape that is larger than the inner diameter of the ring frame and smaller than the outer diameter. At this time, the resin film forming layer 12 is punched so that the center point of the resin film forming layer 12 coincides with the center point of the support sheet 11 after punching. Moreover, in order to cut the support sheet completely and form the cut part D1 of the cut depth d1, the cut depth is cut by the total depth of the thickness of the support sheet and the cut depth d1. For this reason, the cut part D1 of the cut depth d1 is formed in the surface of a 2nd elongate peeling sheet.

Next, the support sheet 11 having a desired shape is left on the second long release sheet 13 and the remaining support sheet is removed. As a result, the resin film forming sheet laminate according to the first aspect, in which a resin film forming sheet including a resin film forming layer having a desired shape and the support sheet 11 is laminated on the second long release sheet 13. Is obtained.

In the above, when the support sheet is die cut, the support sheet is cut into a desired shape, and a small interval is provided outside the support sheet 11 of the shape so as to form the second long release sheet. It is preferable to perform die cutting so that the supporting sheet as the peripheral tape 14 remains along both edges 15 in the short direction. Thereafter, the support sheet 11 and the peripheral tape 14 having a desired shape are left on the second long release sheet 13 and the remaining support sheet is removed, thereby including the support sheet 11 and the resin film forming layer 12. The resin film forming sheet laminate 100 in a form in which the resin film forming sheet 10 and the peripheral tape 14 are continuously bonded onto the long release sheet 13 is obtained.

(Manufacture of sheet laminate for resin film formation according to the third aspect)
A case where the jig adhesive layer is a double-sided pressure-sensitive adhesive member having a core material will be described.

First, the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer (laminating pressure-sensitive adhesive layer and fixing pressure-sensitive adhesive layer) of the jig adhesive layer is prepared. In addition, in the jig | tool adhesive layer, when the adhesive for forming the adhesive layer for lamination | stacking differs from the adhesive for forming the adhesive layer for fixation, each adhesive is prepared. In the following, the pressure-sensitive adhesive constituting the lamination pressure-sensitive adhesive layer is referred to as “laminating pressure-sensitive adhesive”, and the pressure-sensitive adhesive for forming the fixation pressure-sensitive adhesive layer is referred to as “fixation pressure-sensitive adhesive”. When the pressure-sensitive adhesive for lamination and the pressure-sensitive adhesive for fixing are the same, it is not necessary to prepare two types of pressure-sensitive adhesives, and the work efficiency can be improved because they can be used without distinguishing both surfaces of the jig adhesive layer.

Next, the lamination pressure-sensitive adhesive is applied onto a long release sheet (hereinafter referred to as a third long release sheet) and dried to form a lamination pressure-sensitive adhesive layer. Thereafter, the pressure-sensitive adhesive layer for lamination is bonded to the core material to obtain a laminate in which the core material, the pressure-sensitive adhesive layer for lamination, and the third long release sheet are laminated in this order.
Further, the fixing adhesive is applied onto a long release sheet (hereinafter referred to as a fourth long release sheet. The fourth long release sheet is the release sheet 13 in FIG. 5) and dried. A fixing pressure-sensitive adhesive layer is formed. Thereafter, the pressure-sensitive adhesive layer for lamination is bonded to the core material of the laminate obtained above, and the third long release sheet, the pressure-sensitive adhesive layer for lamination, the core material, the pressure-sensitive adhesive layer for fixation, and the fourth long-length material. A laminate in which release sheets are laminated in this order (a jig adhesive layer sandwiched between long release sheets) is obtained.

Next, the third long release sheet is removed. Then, the laminate in which the jig adhesive layer and the fourth long release sheet are laminated in this order is cut into a desired shape, and the laminate is die-cut (half-cut) so as to reach the fourth long release sheet. ) Die cutting is performed by a general-purpose apparatus (rotary blade or flat blade) and method such as die cutting. In this case, the depth of cut is that the laminate is completely cut to form a cut portion D3 having a depth of cut d3. . For this reason, the cutting part D3 of the cutting depth d3 is formed in the surface of a 4th elongate peeling sheet.

Next, an adhesive tape for peeling is applied in the longitudinal direction of the jig adhesive layer. Then, the jig adhesive layer having a desired shape is removed from the fourth long release sheet 13 by removing the peeling adhesive tape. As a result, a laminated body is obtained in which a jig adhesive layer having an internal opening of a desired shape is laminated on the fourth long release sheet 13.

Moreover, the support sheet 11 in which the adhesive layer 11b is formed on the base material 11a is prepared. The method for obtaining the support sheet is as described in the first aspect.

Then, the resin film forming layer 12 is formed on the pressure-sensitive adhesive layer 11 b of the support sheet 11. The method for forming the resin film forming layer 12 on the pressure-sensitive adhesive layer 11b is not particularly limited. For example, a method for forming the resin film-forming composition on the pressure-sensitive adhesive layer 11b by applying and drying, or a method for forming a resin film. Examples include a method of forming the composition on a release sheet different from the release sheet and transferring the composition to the pressure-sensitive adhesive layer 11b. In this way, a laminate composed of the support sheet 11 and the resin film forming layer 12 is obtained.

Next, the support sheet 11 and the resin film forming layer 12 are formed so that the surface of the fourth long release sheet 13 having the jig adhesive layer is in contact with the fourth long release sheet 13 and the jig adhesive layer. The resin film forming layer 12 of the laminate is affixed, and the resin film forming sheet 10 is formed on the fourth long release sheet 13.

Then, the resin film forming sheet 10 is die-cut into a desired shape that is not less than the inner diameter of the ring frame and not more than the outer diameter. At this time, the die is cut so that the center point of the internal opening of the jig adhesive layer coincides with the center point of the resin film forming sheet 10 after die cutting. In addition, the depth of cut is the total depth of the thickness of the resin film forming sheet and the depth of cut d1 in order to completely cut the resin film formed sheet and form the cut portion D1 of the depth of cut d1. Cut in. For this reason, the cut part D1 of the cut depth d1 is formed in the surface of a 4th elongate peeling sheet.

Next, the resin film forming sheet 10 having a desired shape is left on the fourth long release sheet 13 and the remaining resin film forming sheet is removed. As a result, the resin film forming sheet laminate of the third aspect in which the resin film forming sheet 10 having a desired shape is laminated on the fourth long release sheet 13 is obtained. In addition, when performing the die cutting of the resin film forming sheet, it is preferable to perform the die cutting so that the peripheral tape 14 remains as in the first embodiment.

Method for Manufacturing Semiconductor Device Next, as for the method of using the resin film forming sheet laminate according to the present invention, the resin film forming sheet laminate of the first embodiment shown in FIGS. 2 and 3 is applied to the semiconductor device manufacturing method. This will be described as an example.

According to a first aspect of the present invention, there is provided a method of manufacturing a semiconductor device using a resin film-forming sheet laminate. The resin film-forming layer of the laminate is attached to a work, and the work is diced into chips. It is preferable that the method includes a step of leaving the resin film forming layer fixedly remaining on the surface and peeling the resin film from the support sheet, and placing the chip on the die pad portion or another chip via the resin film forming layer. .

Hereinafter, an example using a silicon wafer as a workpiece will be described.

The formation of a circuit on the wafer surface can be performed by various methods including conventionally used methods such as an etching method and a lift-off method. Next, the opposite surface (back surface) of the circuit surface of the wafer is ground. The grinding method is not particularly limited, and grinding may be performed by a known means using a grinder or the like. At the time of back surface grinding, an adhesive sheet called a surface protection sheet is attached to the circuit surface in order to protect the circuit on the surface. In the back surface grinding, the circuit surface side (that is, the surface protection sheet side) of the wafer is fixed by a chuck table or the like, and the back surface side on which no circuit is formed is ground by a grinder. The thickness of the wafer after grinding is not particularly limited, but is usually about 50 to 500 μm.

After that, if necessary, the crushed layer generated during back grinding is removed. The crushed layer is removed by chemical etching, plasma etching, or the like.

After the circuit formation and back surface grinding, the resin film forming layer of the resin film forming sheet laminate is pasted on the back surface of the wafer. The attaching method is not particularly limited. For example, the resin film forming layer is attached to the semiconductor wafer in the step shown in FIG.

FIGS. 1A to 1D are a series of process diagrams in which the operation of attaching the resin film forming sheet 10 to the semiconductor wafer 32 is performed. As shown in FIG. 1A, in the sheet laminate 100 for forming a resin film, the release sheet 13 plays the role of a carrier film, while being supported by two

rolls

62 and 66 and a peel plate 64, The first roll 42 is wound with one end connected to the cylindrical core 44, and the second roll 52 is wound with the other end connected to the cylindrical core 54. Forming. Then, a core driving motor (not shown) for rotating the core 54 is connected to the core 54 of the second roll 52, and the resin film forming sheet 10 is peeled off. The release sheet 13 is wound at a predetermined speed.

First, when the winding core driving motor rotates, the winding core 54 of the second roll 52 rotates and the resin film forming sheet 100 is wound around the winding core 44 of the first roll 42. The sheet 10 is pulled out of the first roll 42. The drawn resin film forming sheet 10 is guided onto a disk-shaped semiconductor wafer 32 disposed on a movable stage and a ring frame 34 disposed so as to surround the semiconductor wafer 32.

Next, the resin film forming sheet 10 is peeled from the release sheet 13. At this time, as shown to Fig.1 (a), the peel plate 64 is applied from the peeling sheet 13 side of the sheet | seat 10 for resin film formation. In the present invention, since the peeling force of the release sheet and the adhesive force to SUS at the outer peripheral portion of the resin film forming sheet 10 are within a predetermined range, the resin film forming sheet can be easily fed out. Moreover, as shown in FIG.1 (b), when the notch part D1 is formed, the peeling sheet 13 is bend | folded from the notch part D1 to the peel plate 64 side, and the peeling sheet 13 and resin film A peeling start point is easily created between the forming sheet 10 and the sheet. Furthermore, air may be blown to the boundary surface between the release sheet 13 and the resin film forming sheet 10 so that the release start point is more efficiently created. As a result, the feeding of the resin film forming sheet 10 is further facilitated.

Next, as shown in FIG. 1C, the resin film forming sheet 10 is attached so that the resin film forming sheet 10 is in close contact with the ring frame 34 and the semiconductor wafer 32. At this time, the resin film forming sheet 10 is pressed against the semiconductor wafer 32 by the roll 68. Then, as shown in FIG. 1D, the attachment of the resin film forming sheet 10 onto the semiconductor wafer 32 is completed, and a semiconductor wafer with a resin film forming sheet is obtained.

By the procedure as described above, the resin film forming sheet 10 can be attached to the semiconductor wafer 32 continuously in an automated process. An example of an apparatus for performing the operation of attaching the resin film forming sheet 10 to the semiconductor wafer 32 is RAD-2500 (trade name) manufactured by Lintec Corporation.

Then, when the resin film forming sheet 10 is attached to the semiconductor wafer 32 by such a process, the resin film forming sheet is used by using the resin film forming sheet laminate having desired physical properties according to the present invention. When the outer periphery of 10 reaches the tip of the peel plate, even if it is a thick release sheet, the resin film-forming sheet is released from the release sheet at the outer periphery and is fed out. As a result, it is possible to prevent a problem that the support sheets or the resin film forming layers of the drawn out resin film forming sheets are bent in close contact with each other or the resin film forming sheet is transferred to the release sheet.

When the resin film forming layer does not have tackiness at room temperature, it may be heated appropriately (although it is not limited, 40 to 80 ° C. is preferable).

Further, when the energy ray curable compound (B) or the energy ray curable polymer (AB) is blended in the resin film forming layer, the resin film forming layer is irradiated with energy rays from the support sheet side, and the resin is formed. The layer-forming layer may be preliminarily cured to increase the cohesive force of the resin film-forming layer and reduce the adhesive force between the resin film-forming layer and the support sheet.

Thereafter, the semiconductor wafer is cut using a cutting means such as a dicing saw to obtain a semiconductor chip. The cutting depth at this time is a depth that takes into account the sum of the thickness of the semiconductor wafer and the thickness of the resin film forming layer and the amount of wear of the dicing saw.
The energy beam irradiation may be performed at any stage after the semiconductor wafer is pasted and before the semiconductor chip is peeled off (pickup). For example, the irradiation may be performed after dicing or after the following expanding step. Although it is good, it is preferably performed after the semiconductor wafer is attached and before dicing. Further, the energy beam irradiation may be performed in a plurality of times.

Then, if necessary, when the resin film forming sheet is expanded, the interval between the semiconductor chips is expanded, and the semiconductor chips can be picked up more easily. At this time, a deviation occurs between the resin film forming layer and the support sheet, the adhesive force between the resin film forming layer and the support sheet is reduced, and the pick-up property of the semiconductor chip is improved. When the semiconductor chip is picked up in this manner, the cut resin film forming layer can be adhered to the back surface of the semiconductor chip and peeled off from the support sheet.

Next, the semiconductor chip is placed on the die pad of the lead frame or on the surface of another semiconductor chip (lower chip) through the resin film forming layer (hereinafter, the die pad or lower chip surface on which the chip is mounted is referred to as “chip mounting portion”. ).

The pressure when mounting is usually 1 kPa to 200 MPa. Further, the chip mounting portion may be heated before mounting the semiconductor chip or heated immediately after mounting. The heating temperature is usually 80 to 200 ° C., preferably 100 to 180 ° C., and the heating time is usually 0.1 seconds to 5 minutes, preferably 0.5 seconds to 3 minutes.

After the semiconductor chip is placed on the chip mounting portion, further heating may be performed as necessary. The heating conditions at this time are in the above heating temperature range, and the heating time is usually 1 to 180 minutes, preferably 10 to 120 minutes.

Alternatively, the resin film forming layer may be cured by using a heat in resin sealing that is normally performed in package manufacturing, without temporarily performing the heat treatment after placement. By passing through such a process, the resin film formation layer hardens | cures and the semiconductor device with which the semiconductor chip and the chip mounting part were adhere | attached firmly can be obtained. Since the resin film forming layer is fluidized under die bonding conditions, the resin film forming layer is sufficiently embedded in the unevenness of the chip mounting portion, and generation of voids can be prevented and the reliability of the semiconductor device is improved.

Further, in the method for manufacturing a semiconductor device according to the second aspect of the present invention, the resin film forming layer of the resin film forming sheet is pasted on the back surface of the semiconductor wafer having a circuit formed on the surface, and then the resin film is applied on the back surface. It is preferable to obtain a semiconductor chip having the same. The resin film is a protective film for a semiconductor chip. The method for manufacturing a semiconductor device according to the present invention preferably further includes the following steps (1) to (3), wherein the steps (1) to (3) are performed in an arbitrary order.
Step (1): peeling the resin film forming layer or resin film and the support sheet,
Step (2): The resin film forming layer is cured to obtain a resin film.
Step (3): dicing the semiconductor wafer and the resin film forming layer or resin film.

First, the resin film forming layer of the resin film forming sheet is attached to the back surface of the semiconductor wafer. This step is the same as the attaching step in the first method for manufacturing a semiconductor device.

Thereafter, steps (1) to (3) are performed in an arbitrary order. For example, the steps (1) to (3) are performed in the order of steps (1), (2), (3), the steps (2), (1), (3), the steps (2), (3), The order is (1), steps (3), (2), (1), or steps (3), (1), (2). Details of this process are described in detail in JP-A-2002-280329. As an example, the case where it performs in order of process (1), (2), (3) is demonstrated.

First, a resin film forming layer of a resin film forming sheet is attached to the back surface of a semiconductor wafer having a circuit formed on the front surface. Next, the support sheet is peeled from the resin film forming layer to obtain a laminate of the semiconductor wafer and the resin film forming layer.
Next, the resin film forming layer is cured to form a resin film on the entire surface of the wafer. When the resin film forming layer contains an epoxy adhesive, the resin film forming layer is cured by thermosetting. When the energy ray curable compound (B) and the energy ray curable polymer (AB) are blended, the resin film forming layer can be cured by energy ray irradiation, and an epoxy adhesive, energy When the linear curable compound (B) and the energy beam curable polymer (AB) are used in combination, curing by heating and energy beam irradiation may be performed simultaneously or sequentially. Examples of the energy rays to be irradiated include ultraviolet rays (UV) and electron beams (EB), and preferably ultraviolet rays are used. As a result, a resin film made of a cured resin is formed on the back surface of the wafer, and the strength is improved as compared with the case of the wafer alone, so that damage during handling of the thinned wafer can be reduced. Further, compared with a coating method in which a coating solution for a resin film is directly applied to the back surface of a wafer or chip, the thickness of the resin film is excellent.

Thereafter, the laminated body of the semiconductor wafer and the resin film is diced for each circuit formed on the wafer surface. Dicing is performed so as to cut both the wafer and the resin film. The wafer is diced by a conventional method using a dicing sheet. As a result, a semiconductor chip having a resin film on the back surface is obtained.

Next, laser printing can be performed on the resin film. Laser printing is performed by a laser marking method, and the surface of the protective film is scraped off by laser light irradiation to mark a product number or the like on the protective film. Laser printing can also be performed before the resin film forming layer is cured.

Finally, by picking up the diced chip by a general means such as a collet, a semiconductor chip having a resin film on the back surface can be obtained. Then, the semiconductor device can be manufactured by mounting the semiconductor chip on a predetermined base by the face-down method. In addition, a semiconductor device can be manufactured by bonding a semiconductor chip having a resin film on the back surface to another member (on a chip mounting portion) such as a die pad portion or another semiconductor chip. According to the present invention, a highly uniform resin film can be easily formed on the back surface of the chip, and cracks after the dicing process and packaging are less likely to occur.

In addition, after sticking the resin film formation layer of the resin film formation sheet on the back surface of the semiconductor wafer, when performing the step (3) before the process (1), the resin film formation sheet serves as a dicing sheet. Can fulfill. That is, it can be used as a sheet for supporting the semiconductor wafer during the dicing process. In this case, the semiconductor wafer is bonded to the inner peripheral portion of the resin film forming sheet via the resin film forming layer, and the outer peripheral portion of the resin film forming sheet is bonded to another jig such as a ring frame, A resin film forming sheet affixed to the semiconductor wafer is fixed to the apparatus, and dicing is performed.

When the steps (3), (1), and (2) are performed in this order, a semiconductor chip having a resin film forming layer on the back surface is mounted on a predetermined base by a face-down method, and is usually used in package manufacturing. The resin film forming layer can also be cured by utilizing heating in the resin sealing performed.

Hereinafter, the present invention will be described by way of examples, but the present invention is not limited to these examples. The measurement and evaluation methods employed in the present invention are as follows.

<Peeling force>
Using a tensile tester (Autograph AG-IS, manufactured by Shimadzu Corporation), the peeling force of the release sheet at the outer periphery of the resin film-forming sheet was measured using a tensile rate of 300 mm / min, a T peel method, and temperature / humidity = 23 ° C. / The measurement was performed under the condition of 50% RH.

<Adhesive strength>
The outer peripheral portion of the resin film forming sheet was cut into 15 mm × 25 mm to obtain a sample, which was attached to SUS (stainless steel plate). Next, using a tensile testing machine (Autograph AG-IS manufactured by Shimadzu Corporation) in accordance with JIS Z0237: 2009, the adhesive strength of the sample was measured at a tensile speed of 300 mm / min, 180 ° peel method, temperature / humidity = 23 ° C. / The measurement was performed under the condition of 50% RH.

<Adhesion between support sheets or resin film-forming layers and transfer to release sheet>
Adhesion between support sheets or resin film forming layers (hereinafter referred to as adhesion evaluation) and transfer to a release sheet (hereinafter referred to as transfer evaluation) were performed as follows.
When removing the release sheet from the resin film-forming sheet laminate, the support sheets of the resin film-forming sheets or the resin film-forming layers are bent in close contact with each other, or the resin film-forming sheet is attached to the release sheet. It was confirmed visually whether or not the transfer was performed.

Preparation of adhesive for lamination and adhesive for fixing Acrylic polymer (2-ethylhexyl acrylate / methyl methacrylate / 2-hydroxyethyl acrylate = 80/10/10 (mass ratio), weight average molecular weight: 800,000) And a methyl ethyl ketone (MEK) solution (solid content concentration 25%) added with 1 part by mass of trimethylolpropane adduct tolylene diisocyanate with respect to 100 parts by mass of the solid content of the main raw material to obtain a pressure-sensitive adhesive for lamination. .
Moreover, the same thing as the adhesive for lamination was prepared as an adhesive for fixing.

Production of Support Sheet A A polyolefin base material (thickness: 80 μm) was prepared as a base material constituting the support sheet.
Further, an acrylic polymer (lauryl acrylate / 2-hydroxyethyl acrylate = 80/20 (mass ratio), weight average molecular weight: 800,000) is added to 21.4 g (acrylic polymer 2) per 100 g of the acrylic polymer. -Methacryloyloxyethyl isocyanate (80 moles per 100 moles of hydroxyethyl acrylate units) was reacted to obtain an energy ray curable polymer (weight average molecular weight: 700,000).

A MEK solution (solid content concentration 25%) is prepared by adding 8 parts by mass of trimethylolpropane adduct tolylene diisocyanate and 3 parts by mass of 1-hydroxycyclohexyl phenyl ketone to 100 parts by mass of the solid content of the energy ray curable polymer. And the adhesive for forming the adhesive layer of the support sheet A was obtained.

Subsequently, it coated so that the thickness of an adhesive layer might be set to 10 micrometers on the peeling process surface of PET film (thickness: 50 micrometers) which peel-processed said adhesive.
Then, the base material and the adhesive layer were bonded together and the support sheet A was obtained.

Production of Support Sheet B As a base material constituting the support sheet, a polyolefin base material (thickness: 70 μm) was prepared.
Further, an acrylic polymer (2-ethylhexyl acrylate / 2-hydroxyethyl acrylate = 80/20 (mass ratio), weight average molecular weight: 800,000) is added to 13.4 g (acrylic polymer) per 100 g of the acrylic polymer. Methacryloyloxyethyl isocyanate (50 mol per 100 mol of 2-hydroxyethyl acrylate unit) was reacted to obtain an energy ray curable polymer (weight average molecular weight: 800,000).

Trimethylolpropane adduct tolylene diisocyanate, 2,2-dimethoxy-1,2-diphenylethane-1-one, and 1-hydroxycyclohexyl phenyl ketone are added to 100 parts by mass of the solid content of the energy ray curable polymer. The MEK solution (solid content concentration 25%) to which 1 part by mass of each was added was prepared, and an adhesive for forming the adhesive layer of the support sheet B was obtained.

Subsequently, it apply | coated so that the thickness of an adhesive layer might be set to 30 micrometers on the peeling process surface of PET film (thickness: 50 micrometers) which peel-processed said adhesive.
Then, the base material and the adhesive layer were bonded together, and the support sheet B was obtained.

Preparation of resin film-forming composition Acrylic polymer (butyl acrylate / methyl methacrylate / glycidyl methacrylate / 2-hydroxyethyl acrylate = 55/10/20/15 (mass ratio), weight average molecular weight: 800,000) 15 parts by mass , 25 parts by mass of bisphenol A type epoxy resin (Nippon Shokubai BPA328), 25 parts by mass of triphenylene type epoxy resin (Nippon Kayaku EPPN-502H), 34 parts by mass of phenol resin (Showa Polymer BRG556) and imidazole compound (Shikoku Chemicals 2PHZ) -PW) A resin film forming composition comprising 1 part by mass was prepared.

Example 1
Preparation of Jig Adhesive Layer A release-treated PET film (thickness: 50 μm) was prepared as a long release sheet.
The pressure-sensitive adhesive for lamination was applied on the release-treated surface of the release sheet so that the thickness of the pressure-sensitive adhesive layer for lamination was 5 μm. Next, the pressure-sensitive adhesive layer for lamination and the core material (polypropylene base material, thickness: 40 μm) were bonded together.

According to the same procedure as described above, a fixing pressure-sensitive adhesive layer having a thickness of 5 μm is formed on the release-treated surface of another release sheet, and bonded to the core material, and then the release sheet, the pressure-sensitive adhesive layer for lamination, and the core material Then, a laminate (laminate for jig adhesive layer) in which the fixing adhesive layer and the release sheet were laminated in this order was obtained.

Production Sheet Production of Resin Film Forming Sheet The release sheet on the laminating pressure-sensitive adhesive layer side was removed from the laminated body for bonding jig adhesive layer, and the mold was punched from the laminating pressure-sensitive adhesive layer side into a circle having a diameter of 330 mm. The die cutting was performed so that the pressure-sensitive adhesive layer for lamination, the core material, and the pressure-sensitive adhesive layer for fixing were completely cut, and 30 μm was cut into the release sheet on the side of the pressure-sensitive adhesive layer for fixing. That is, a cut portion D3 having a cut depth d3 of 30 μm was formed.

Thereafter, the laminate composed of the pressure-sensitive adhesive layer for lamination cut into a circle, the core material, and the pressure-sensitive adhesive layer for fixing was removed, a circular internal opening was formed, and a jig adhesive layer was produced on the release sheet.

Moreover, it apply | coated so that the thickness of a resin film formation layer might be set to 20 micrometers on the peeling process surface of PET film (thickness: 50 micrometers) which peel-processed said composition for resin film formation.
Thereafter, the resin film-forming layer and the pressure-sensitive adhesive layer of the support sheet A obtained above were bonded together to obtain a laminate composed of the support sheet A and the resin film-forming layer.

Subsequently, a resin film forming layer of a laminate composed of the support sheet A and the resin film forming layer was attached to the jig adhesive layer on the release sheet, and a resin film forming sheet was formed on the release sheet.

Finally, the resin film forming sheet is die-cut into a circular shape with a diameter of 370 mm concentrically with the circular inner opening of the jig adhesive layer, unnecessary portions are removed, and the resin film forming sheet stack of the third aspect is laminated. Got the body. The die cutting was performed so that the resin film-forming sheet was completely cut and 30 μm was cut into the release sheet. That is, a cut portion D1 having a cut depth d1 of 30 μm was formed. Each evaluation was performed using this sheet laminate for resin film formation. The results are shown in Table 1.

(Example 2)
A sheet laminate for forming a resin film was obtained in the same manner as in Example 1 except that the cut depth of the cut portion D1 was set to 35 μm, and each evaluation was performed. The results are shown in Table 1.

Example 3
Production of Resin Film Forming Sheet Laminate A release-treated PET film (thickness: 50 μm) was prepared as a long release sheet.
The above resin film-forming composition is applied onto the release-treated surface of the release sheet so that the thickness of the resin film-forming layer is 20 μm, and another release sheet (PET film, thickness: 50 μm) is applied to the resin film. Laminated on the forming layer.

Next, one release sheet was removed, and the resin film forming layer was die-cut into a circle having a diameter of 330 mm. The die cutting was performed so that the resin film forming layer was completely cut and 30 μm was cut into the release sheet. That is, a cut portion D2 having a cut depth d2 of 30 μm was formed. Thereafter, the remaining resin film forming layer was removed to obtain a circular resin film forming layer on the release sheet.

Then, the pressure-sensitive adhesive layer of the support sheet A was pasted on the resin film forming layer on the release sheet to form a resin film forming sheet on the release sheet.

Finally, the resin film forming layer was cut into a circle having a diameter of 370 mm concentrically with the circular resin film forming layer, and unnecessary portions were removed to obtain the resin film forming sheet laminate of the first aspect. . The die cutting was performed so that the resin film-forming sheet was completely cut and 30 μm was cut into the release sheet. That is, a cut portion D1 having a cut depth d1 of 30 μm was formed. Each evaluation was performed using this sheet laminate for resin film formation. The results are shown in Table 1.

Example 4
Except having made the cutting depth of the cutting part D1 into 35 micrometers, it carried out similarly to Example 3, and obtained the sheet | seat laminated body for resin film formation, and performed each evaluation. The results are shown in Table 1.

(Comparative Example 1)
A sheet laminate for forming a resin film was obtained in the same manner as in Example 3 except that the support sheet B was used instead of the support sheet A, and each evaluation was performed. The results are shown in Table 1.

(Comparative Example 2)
A sheet laminate for forming a resin film was obtained in the same manner as in Example 4 except that the support sheet B was used instead of the support sheet A, and each evaluation was performed. The results are shown in Table 1.

DESCRIPTION OF SYMBOLS 100: Sheet | seat laminated body for resin film formation 10: Sheet | seat for resin film formation 11: Support sheet 12: Resin film formation layer 13: Release sheet D1: Cut part D2: Cut part D3: Cut part

Claims

A release sheet is laminated on the resin film forming layer of the resin film forming sheet including the support sheet and the resin film forming layer,
The peeling force of the release sheet at the outer periphery of the resin film forming sheet is 0.05 N / 25 mm or less,
A resin film-forming sheet laminate in which the adhesive strength to SUS is 1.0 N / 25 mm or less at the outer peripheral portion of the resin film-forming sheet.
In the release sheet, a cut portion is formed along the outer periphery of the resin film forming sheet from the surface on the resin film forming layer side,
The sheet laminate for forming a resin film according to claim 1, wherein the cut depth of the cut portion is more than ½ of the thickness of the release sheet.
The resin film-forming sheet laminate according to claim 1 or 2, wherein the release sheet has a thickness of 50 µm or more.
In the release sheet, a cut portion is formed along the outer periphery of the resin film forming sheet from the surface on the resin film forming layer side,
The sheet laminate for forming a resin film according to claim 3, wherein the cut depth of the cut portion is more than 25 μm.