KR20210088767A - Laminate for resin film formation sheet - Google Patents

Abstract

This invention made it possible to provide the sheet|seat laminated body for resin film formation which can easily unwind the sheet|seat for resin film formation from a release sheet, and can stick to a workpiece|work stably. The sheet laminate for forming a resin film according to the present invention is obtained by laminating a release sheet on a resin film forming layer of a sheet for forming a resin film comprising a support sheet and a resin film forming layer, and in the outer periphery of the sheet for forming a resin film The peeling force of the release sheet is 0.05 N/25 mm or less, and the adhesive force with respect to SUS in the outer peripheral part of the sheet|seat for resin film formation is 1.0 N/25 mm or less.

Description

Sheet laminate for resin film formation {LAMINATE FOR RESIN FILM FORMATION SHEET}

This invention relates to the sheet|seat laminated body for resin film formation with which pasting of the sheet|seat for resin film formation with respect to a workpiece|work is easy.

In recent years, manufacturing of a semiconductor device using a mounting method called a so-called face down method has been carried out. In the face-down method, a semiconductor chip having electrodes such as bumps on a circuit surface (hereinafter also simply referred to as a “chip”) is used, and the electrodes are joined to the substrate. For this reason, the surface on the opposite side to the circuit surface of a chip (chip back surface) may be exposed.

The exposed back surface of the chip may be protected by an organic film. Conventionally, a chip having a protective film made of this organic film is obtained by applying a liquid resin to the back surface of a wafer by a spin coating method, drying and curing, and cutting the protective film together with the wafer. However, since the thickness precision of the protective film formed in this way is not enough, the yield of a product may fall.

In order to solve such a problem, the sheet|seat for protective film formation by which the film for semiconductor back surface protective film formation was laminated|stacked on the adhesive layer of the adhesive sheet which has an adhesive layer may be used.

Moreover, after the semiconductor wafer manufactured in a large-diameter state is cut and separated (dicing) into element small pieces (semiconductor chip), it may be transferred to the bonding process which is the next process. At this time, after each process of dicing, washing|cleaning, drying, expanding, and picking-up is applied to the semiconductor wafer in a state previously adhered to the adhesive sheet, it is transferred to the bonding process which is the next process.

Among these processes, in order to simplify the process of a pick-up process and a bonding process, various adhesive sheets for dicing and die bonding which have a wafer holding function and a die-bonding function simultaneously are proposed. For example, by using the said adhesive sheet, the semiconductor chip by which the adhesive bond layer was affixed on the back surface can be obtained, and direct die bonding, such as between organic board|substrate-chip, lead frame-chip, chip-chip, becomes possible.

Patent Document 1 (Japanese Patent Application Laid-Open No. 2005-350520) describes an adhesive sheet having a structure in which a release substrate, an adhesive layer, an adhesive layer, and a base film are sequentially laminated as an adhesive sheet for dicing and die bonding.

Japanese Laid-Open Patent Publication No. 2005-350520

In the manufacturing process of a semiconductor device, the sheet|seat for resin film formation which has resin film forming layers, such as the said semiconductor back surface protective film formation film and an adhesive layer, is affixed to workpiece|works, such as a semiconductor wafer. However, in the step of affixing the sheet for forming a resin film to a work, the sheet for forming a resin film is used when the sheet for forming a resin film is not smoothly unwound from the release substrate (release sheet) at the end of the sheet for forming a resin film. There were cases where it became impossible. That is, the unrolled sheet for forming a resin film itself is bent in the overlapping direction and adhered, or the sheet for forming a resin film unrolled from the release sheet is further adhered (electrodeposited) to the release sheet, or for forming a resin film The sheet could not be released from the release sheet in some cases.

An object of this invention is to solve the said subject. That is, an object of this invention is to provide the sheet|seat laminated body for resin film formation which it is easy to take out the sheet|seat for resin film formation from a release sheet, and can stick to a workpiece|work stably.

As a result of intensive research to achieve the above object, the present inventors have achieved the above object by controlling the peeling force of the release sheet and the adhesive force to SUS at the end (outer peripheral portion) of the sheet for forming a resin film. found out, and came to complete the present invention.

The present invention includes the following summary.

[1] A release sheet is laminated on a resin film forming layer of a sheet for forming a resin film comprising a support sheet and a resin film forming layer,

The peeling force of the peeling sheet in the outer peripheral part of the sheet|seat for resin film formation is 0.05 N/25 mm or less,

The sheet laminated body for resin film formation whose adhesive force with respect to SUS in the outer peripheral part of the sheet|seat for resin film formation is 1.0 N/25 mm or less.

[2] In the release sheet, a cutout is formed along the outer periphery of the sheet for forming a resin film from the surface on the resin film forming layer side,

The sheet laminate for forming a resin film according to [1], wherein the depth of cut of the cut is more than 1/2 of the thickness of the release sheet.

[3] The sheet laminate for forming a resin film according to [1] or [2], wherein the release sheet has a thickness of 50 µm or more.

[4] In the release sheet, a cutout is formed along the outer periphery of the sheet for forming a resin film from the surface on the resin film forming layer side,

The sheet laminate for resin film formation according to [3], wherein the cutting depth of the cut portion is more than 25 µm.

According to the sheet laminate for forming a resin film of the present invention, when the sheet for forming a resin film is unwound from the release sheet, the unrolled sheet for forming a resin film itself is bent in the overlapping direction and adhered, or the sheet for forming a resin film is Electrodeposition on the release sheet can be prevented.

FIG. 1A is a series of process diagrams of attaching the sheet 10 for forming a resin film including the support sheet 11 and the resin film forming layer 12 to the semiconductor wafer 32 .
FIG. 1B is a series of process diagrams of attaching the sheet 10 for forming a resin film including the support sheet 11 and the resin film forming layer 12 to the semiconductor wafer 32 .
FIG. 1C is a series of process diagrams of attaching the sheet 10 for forming a resin film including the support sheet 11 and the resin film forming layer 12 to the semiconductor wafer 32 .
FIG. 1D is a series of process diagrams of attaching the sheet 10 for forming a resin film including the support sheet 11 and the resin film forming layer 12 to the semiconductor wafer 32 .
2 : shows the top view of the sheet|seat laminated body for resin film formation which concerns on this invention.
FIG. 3 : shows the schematic cross section (sheet for resin film formation of a 1st aspect) when the sheet|seat for resin film formation shown in FIG. 1 is cut|disconnected along line AA.
4 : shows the schematic sectional drawing of the sheet|seat for resin film formation of a 2nd aspect.
5 : shows the schematic sectional drawing of the sheet|seat for resin film formation of a 3rd aspect.
6 : shows the schematic sectional drawing of the sheet|seat for resin film formation of a 4th aspect.
7 : is a series of process diagrams of performing the operation|work of sticking the conventional laminated body which consists of a support sheet and a resin film forming layer to the semiconductor wafer 32. As shown in FIG.

Hereinafter, the detailed content of the sheet|seat laminated body for resin film formation which concerns on this invention is demonstrated.

The sheet laminate for resin film formation which concerns on this invention is the aspect which laminated|stacked the release sheet on the resin film forming layer of the sheet|seat for resin film formation which consists of a support sheet and a resin film forming layer. In the sheet laminate for forming a resin film having such a configuration, the peeling force of the release sheet at the outer periphery of the sheet for forming a resin film is 0.05 N/25 mm or less, and SUS at the outer periphery of the sheet for forming a resin film is Adhesive force to 1.0 N/25 mm or less.

When the peeling force of the peeling sheet in the outer peripheral part of the sheet for resin film formation exceeds 0.05 N/25 mm, and/or the adhesive force with respect to SUS in the outer peripheral part of the sheet|seat for resin film formation is 1.0 N/25 mm When exceeding, the step of attaching the sheet 10 for forming a resin film of the sheet laminate 100 for forming a resin film shown in FIG. 1 to the work 32 (hereinafter referred to as “work pasting step”) When the sheet for forming a resin film is unwound from the release sheet in ), the supporting sheets of the sheet for forming a resin film that have been unrolled or the resin film forming layers are bent in the overlapping direction to adhere to each other, or for forming a resin film The sheet is electrodeposited on the release sheet. As a result, the sheet for resin film formation becomes unusable. This problem arises when the sheet for resin film formation of the sheet laminate for resin film formation is attached to the work, not by the work sticking step shown in FIG. 1 (for example, peeling of the sheet laminate for resin film formation by hand) This is a problem that similarly occurs in cases where the sheet is removed and the sheet for forming a resin film is affixed to the work, etc.).

According to the sheet laminate for forming a resin film according to the present invention, the sheet 10 for forming a resin film is removed from the release sheet 13 in the work attaching step shown in FIG. 1 or, for example, in the manual work attaching step, for example. Since unwinding becomes easy and sticking to the workpiece|work 32 can be performed stably, the said problem can be eliminated.

Moreover, as shown in FIGS. 2-6, in the sheet|seat laminated body 100 for resin film formation, in the release sheet 13, the outer periphery of the sheet|seat 10 for resin film formation from the surface on the side of a resin film forming layer is provided. The cut-out D1 is formed along it, and, as for the cut-out depth d1 of the cut-out D1, it is preferable that it is more than 1/2 of peeling sheet thickness, More preferably, it is 3/5 - 4/5. By providing the cutout D1 of a predetermined depth, it becomes easy to create a peeling origin in the interface of the sheet|seat 10 for resin film formation, and the peeling sheet 13. As a result, the unwinding property of the sheet|seat for resin film formation improves. Moreover, it originates in the stress applied to the longitudinal direction (flow direction) of a peeling sheet during a work sticking process by making the cutout D1 into a predetermined depth, and it can prevent that a peeling sheet fracture|ruptures.

Moreover, in the manufacturing process of the sheet|seat laminated body for resin film formation by providing the cutout part D1, the sheet|seat for resin film formation can be cut|disconnected reliably in a predetermined shape. Moreover, by forming the cutout D1 of a predetermined depth in the release sheet, for example, even when the thickness of the release sheet is 50 µm or more, the sheet laminate for forming a resin film is easily wound in a roll shape, and the storage property at the time of storage is improved. great.

Moreover, in the work sticking process shown in FIG. 1, stress is applied to the peeling sheet in the longitudinal direction (flow direction). When the cutout D1 is not formed in the release sheet, the stress may propagate to the resin film forming layer, and the resin film forming layer may extend in the flow direction. Deformation (stretching) of the resin film forming layer lowers the thickness accuracy. As a result, it may become a cause of reducing the reliability of the semiconductor device obtained using this resin film forming layer. By forming the cutout of a predetermined depth in the release sheet, the stress applied to the resin film forming layer can be relieved, and the deformation of the resin film forming layer can be suppressed.

Moreover, when the thickness of a release sheet is 50 micrometers or more, there exists a tendency for the rigidity of a release sheet to become strong and to become difficult to bend|fold a release sheet. Moreover, in general, the rigidity of the sheet for forming a resin film tends to be weaker than that of the release sheet. Therefore, in the work pasting step, the peel plate 64 shown in Fig. 1 is applied to the release sheet 13 of the sheet laminate 100 for forming a resin film, and the release sheet 13 is moved to the peel plate 64 side. If it is not bent at an acute angle, it will become difficult to create a peeling origin in the interface of the sheet|seat 10 for resin film formation, and the peeling sheet 13, and the sheet|seat for resin film formation may not be able to be unwound. However, a release sheet having a thickness of 50 µm or more is difficult to bend at an acute angle to the peel plate side due to its thickness even when a peel plate is used, and as shown in FIG. 7 , it is difficult to unwind the sheet for forming a resin film.

In the present invention, by setting the peeling force and the adhesive force to SUS of the release sheet in the outer periphery of the sheet for resin film formation within the above ranges, even when the thickness of the release sheet is 50 µm or more, Unwinding of the sheet|seat 10 for resin film formation can be made easy, and the sheet|seat for resin film formation can be stuck to a work piece stably. The peeling force of the peeling sheet in the outer peripheral part of the sheet|seat for resin film formation from said viewpoint becomes like this. Preferably it is 0.001-0.05 N/25 mm, More preferably, it is 0.01-0.04 N/25 mm, For resin film formation The adhesive force with respect to SUS in the outer peripheral part of a sheet|seat becomes like this. Preferably it is 0.01-1.0 N/25 mm, More preferably, it is 0.1-0.8 N/25 mm.

When the thickness of a peeling sheet is 50 micrometers or more, it is preferable that cut-out depth d1 of cut-out part D1 is more than 25 micrometers. Specifically, when the thickness of the release sheet is 50 µm, the cut depth d1 of the cut-out portion D1 is preferably more than 25 µm, more preferably 30 to 40 µm, and the thickness of the release sheet is 100 When it is micrometer, the cut depth d1 of the cut part D1 becomes like this. Preferably it is more than 50 micrometers, More preferably, it is 60-80 micrometers. In addition, the depth of cut in this invention is computed by measuring the depth of the thickness direction of the peeling sheet of the cutout formed in the peeling sheet arbitrarily at 300 times with an optical microscope, and averaging this.

Aspect of the sheet laminated body for resin film formation

The support sheet 11 and the resin film forming layer 12 are cut|disconnected to a desired planar shape, and are laminated|stacked partially on the release sheet 13. As shown in FIG. Here, the desired planar shape of the support sheet 11 and the resin film forming layer 12 is, for example, as shown in FIG. 2 , the support sheet 11 or the resin film forming layer 12 on the release sheet 13 . ) is not particularly limited as long as it is a shape used in a partially laminated state.

The planar shape of the support sheet 11 is preferably a shape that can be easily attached to a jig such as a ring frame used in a manufacturing process of a semiconductor device to be described later. For example, a circular shape, a substantially circular shape, a rectangular shape, A pentagon, a hexagon, an octagon, and a wafer shape (a shape in which a part of the outer periphery of a circle is a straight line) etc. are mentioned. Among these, in order to reduce useless parts other than the part affixed to a ring frame, a circular shape and a wafer shape are preferable.

Moreover, as a planar shape of the resin film forming layer 12, it is preferable that it is a shape conforming to the planar shape of workpieces, such as a semiconductor wafer, For example, circular, substantially circular, square, pentagon, hexagon, octagon, wafer shape. It is preferable that it is a shape easily attaching to a workpiece|work, such as (a shape in which a part of the outer periphery of a circle is a straight line). Among these, in order to reduce useless parts other than the part affixed to a workpiece|work, a circular shape or a wafer shape is preferable.

(first aspect)

2 : is a top view which shows the 1st aspect of the sheet|seat laminated body 100 for resin film formation which concerns on this invention, and FIG. 3 is a sheet|seat laminated body 100 for resin film formation shown in FIG. 2 along the AA line. It is an abbreviated cross-sectional view when cut.

2 and 3 , in the sheet laminate 100 for forming a resin film according to the first aspect, the diameter of the support sheet 11 is larger than the diameter of the resin film forming layer 12 . Moreover, the support sheet 11 is an adhesive sheet which consists of the base material 11a and the adhesive layer 11b. Moreover, the cutout part D2 may be formed in the peeling sheet 13 along the outer periphery of the resin film forming layer 12 other than the cutout part D1.

1st aspect WHEREIN: The cutting depth d2 of the cut-out part D2 is not specifically limited, It may be the same as the cut-out depth d1 of the cut-out part D1, may be large, or may be small, but 1 of the peeling sheet thickness It is preferable that it is more than /2, More preferably, it is 3/5 - 4/5. Moreover, when the thickness of a peeling sheet is 50 micrometers or more, it is preferable that cut-out depth d2 of cut-out part D2 is more than 25 micrometers. Specifically, when the thickness of the release sheet is 50 µm, the cut depth d2 of the cut-out portion D2 is preferably more than 25 µm, more preferably 30 to 40 µm, and the thickness of the release sheet is 100 µm. When it is micrometer, the cut depth d2 of the cut part D2 becomes like this. Preferably it is more than 50 micrometers, More preferably, it is 60-80 micrometers. Depending on the composition of the resin film forming layer, adhesiveness with the release sheet becomes high, and in the work sticking step, the resin film forming layer cannot be released in some cases. Even in such a case, since a peeling origin can be created at the interface between the resin film forming layer 12 and the release sheet 13 by forming the cutout D2 of a predetermined depth, the resin film forming layer 12 is unwound. resilience is improved

Moreover, by forming the cutout D2 of a predetermined depth, it becomes easy to suppress the deformation|transformation of the resin film forming layer resulting from the stress applied to the longitudinal direction (flow direction) of a peeling sheet during a work sticking process.

In the first aspect, the peel force of the release sheet and the adhesive force to SUS on the outer periphery of the sheet for forming a resin film are physical property values measured at the interface between the outer periphery of the pressure-sensitive adhesive layer 11b and the release sheet 13 . These physical-property values in a 1st aspect are controllable by adjusting the thickness of the component which comprises the adhesive layer 11b mentioned later, and the adhesive layer 11b. In addition, the said physical-property value in a 1st aspect is a physical-property value before energy-beam irradiation, when an energy-beam curable compound (B) and an energy-beam curable polymer (AB) are included as a component which comprises the adhesive layer 11b.

(Second aspect)

4 : is a schematic sectional drawing of the sheet|seat laminated body 100 for resin film formation of a 2nd aspect. In the sheet|seat 10 for resin film formation of the sheet|seat laminated body 100 for resin film formation which concerns on 2nd aspect, the support sheet 11 and the resin film forming layer 12 in planar view have the same shape.

As shown in FIG. 4, the adhesive sheet which consists of the base material 11a and the adhesive layer 11b may be used as a support sheet, and only the base material 11a may be used as a support sheet.

In the second aspect, the peeling force of the release sheet and the adhesive force to SUS on the outer periphery of the sheet for forming a resin film are physical property values measured at the interface between the outer periphery of the resin film forming layer 12 and the release sheet 13 . These physical property values in the second aspect use an energy ray-curable compound (B) or an energy ray-curable polymer (AB) as a component constituting the resin film forming layer, and only the outer periphery of the resin film forming layer is irradiated with energy rays, such as can be controlled by means. As such means, for example, a method of forming an energy ray shielding layer on the inner periphery of the support sheet by printing or the like and irradiating the resin film forming layer with energy ray from the support sheet side, or the outer periphery of the resin film forming layer in advance A method of irradiating only with an energy ray, and then laminating with a support sheet, etc. are mentioned.

(Third aspect)

5 : is a schematic sectional drawing of the sheet|seat laminated body 100 for resin film formation of a 3rd aspect. In the sheet|seat 10 for resin film formation of the sheet|seat laminated body 100 for resin film formation which concerns on 3rd aspect, the support sheet 11 and the resin film forming layer 12 in planar view have the same shape. Moreover, it is an outer peripheral part of the sheet|seat 10 for resin film formation, and the jig|tool adhesive layer 14 is formed between the release sheet 13 and the resin film forming layer 12. As shown in FIG. Moreover, the cutout part D3 may be provided in the peeling sheet 13 along the inner periphery of the annular jig contact bonding layer 14 other than the cutout part D1.

As shown in FIG. 5, the adhesive sheet which consists of the base material 11a and the adhesive layer 11b may be used as a support sheet, and only the base material 11a may be used as a support sheet.

3rd aspect WHEREIN: The cut-out depth d3 of the cut-out part D3 is not specifically limited, It may be the same as the cut-out depth d1 of the cut-out part D1, may be large, or may be small, but 1 of the peeling sheet thickness It is preferable that it is more than /2, More preferably, it is 3/5 - 4/5. Moreover, when the thickness of a peeling sheet is 50 micrometers or more, it is preferable that cut-out depth d3 of cut-out part D3 is more than 25 micrometers. Specifically, when the thickness of the release sheet is 50 µm, the cut depth d3 of the cut-out portion D3 is preferably more than 25 µm, more preferably 30 to 40 µm, and the thickness of the release sheet is 100 µm. In the case of micrometer, the cut depth d3 of the cut part D3 becomes like this. Preferably it is more than 50 micrometers, More preferably, it is 60-80 micrometers. By forming the cutout D3 of a predetermined depth, it becomes easy to suppress the deformation|transformation of the resin film forming layer resulting from the stress applied in the longitudinal direction (flow direction) of a peeling sheet during a work sticking process.

3rd aspect WHEREIN: The peeling force of the peeling sheet and the adhesive force with respect to SUS in the outer peripheral part of the sheet|seat for resin film formation are the physical property values measured at the interface of the jig|tool adhesive layer 14 and the peeling sheet 13. These physical-property values in a 3rd aspect are controllable by adjusting the thickness of the component which comprises the jig|tool adhesive layer mentioned later, and a jig|tool adhesive layer. In addition, the said physical-property value in a 3rd aspect is a physical-property value before energy-beam irradiation when an energy-beam curable compound (B) and an energy-beam curable polymer (AB) are included as a component which comprises a jig|tool adhesive layer.

(Fourth aspect)

6 : is a schematic sectional drawing of the sheet|seat laminated body 100 for resin film formation of a 4th aspect. As for the sheet|seat laminated body 100 for resin film formation which concerns on 4th aspect, the diameter of the support sheet 11 in planar view is larger than the diameter of the resin film forming layer 12. As shown in FIG. Moreover, it is an outer peripheral part of the sheet|seat for resin film formation, and the jig|tool adhesive layer 14 is formed between the release sheet 13 and the support sheet 11. As shown in FIG. Moreover, the cutout part D2 may be formed in the peeling sheet 13 along the outer periphery of the resin film forming layer 12 other than the cutout part D1. In addition, in the peeling sheet 13, the cutout part D3 may be formed along the inner periphery of the annular jig contact bonding layer 14. As shown in FIG. The cut depth d2 of the cut part D2, the cut depth d3 of the cut part D3, and the effect resulting from these are as having demonstrated in a 1st aspect or a 3rd aspect. In addition, as the jig contact bonding layer 14, it is the same as that of a 3rd aspect, and the structure is mentioned later.

The adhesive sheet which consists of the base material 11a and the adhesive layer 11b may be used as a support sheet, and as shown in FIG. 6, only the base material 11a may be used as a support sheet.

The fourth aspect WHEREIN: The peeling force of the peeling sheet in the outer peripheral part of the sheet|seat for resin film formation, and adhesive force with respect to SUS are the physical property values measured at the interface of the jig|tool adhesive layer 14 and the peeling sheet 13. These physical-property values in a 4th aspect are controllable by adjusting the thickness of the component which comprises a jig|tool adhesive layer mentioned later, and a jig|tool adhesive layer. In addition, the said physical-property value in a 4th aspect is a physical-property value before energy-beam irradiation when an energy-beam curable compound (B) and an energy-beam curable polymer (AB) are included as a component which comprises a jig|tool adhesive layer.

Structure of sheet laminate for resin film formation

The sheet laminate for resin film formation which concerns on this invention laminates|stacks a release sheet on the resin film forming layer of the sheet|seat for resin film formation which contains a support sheet and a resin film forming layer. Moreover, as demonstrated in a 3rd aspect or a 4th aspect, the sheet|seat for resin film formation may contain the jig|tool adhesive layer. Hereinafter, each layer which comprises the sheet|seat laminated body for resin film formation is demonstrated.

(support sheet)

Examples of the support sheet include a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, a polymethylpentene film, a polyvinyl chloride film, a vinyl chloride copolymer film, a polyethylene terephthalate film, a polyethylene naphthalate film, Polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene/(meth)acrylic acid copolymer film, ethylene/(meth)acrylic acid ester copolymer film, polystyrene film, polycarbonate film , a polyimide film, a fluororesin film, etc. are used. Moreover, these crosslinked films are also used. Moreover, these laminated|multilayer films may be sufficient.

Moreover, as shown to FIGS. 3-5, as the support sheet 11, the adhesive sheet which consists of the base material 11a and the adhesive layer 11b can also be used.

When using an adhesive sheet as a support sheet, it becomes easy to perform necessary processes, such as dicing, to a workpiece|work on the sheet|seat for resin film formation. In this aspect, the resin film forming layer is laminated|stacked on the adhesive layer formed on the base material. As a base material, the said film illustrated as a support sheet is mentioned.

The pressure-sensitive adhesive layer may be formed by conventionally known various pressure-sensitive adhesives. An adhesive contains a polymer (A) normally. In this invention, since it is preferable to use an energy-beam curable adhesive, it is preferable to contain an energy-beam curable compound (B) other than a polymer (A).

An energy-beam curable compound (B) contains an energy-beam polymeric group, and when irradiated with energy rays, such as an ultraviolet-ray and an electron beam, polymerization-hardens and has the function of reducing the adhesiveness of an adhesive. The energy-beam polymerizable group in the present invention is a functional group having a polymerizable carbon-carbon double bond, and specific examples thereof include a vinyl group, an allyl group, a (meth)acryloyl group, and the like, preferably (meth) An acryloyl group is mentioned. Since the energy-beam polymeric group in this invention produces|generates a radical in radical presence and raise|generates a polyaddition reaction easily, it does not mean the double bond which does not have polymerizability. For example, although an aromatic ring may be contained in each component which comprises an energy-beam curable adhesive, the unsaturated structure of an aromatic ring does not mean the energy-beam polymeric group in this invention.

Moreover, as what has the property of the said component (A) and (B), it may describe as an energy-beam curable polymer (Hereinafter, it describes as a component (AB) by which an energy-beam polymeric group is couple|bonded with a main chain or a side chain). ) can also be used. Such an energy-beam curable polymer (AB) has the property of having both the function as a polymer, and energy-beam sclerosis|hardenability.

Although it does not specifically limit as an energy ray-curable adhesive, An acrylic adhesive is demonstrated concretely as an example. An acrylic adhesive contains an acrylic polymer (A1) as a polymer (A).

As the acrylic polymer (A1), a conventionally known acrylic polymer can be used. It is preferable that it is 10,000-2 million, and, as for the weight average molecular weight (Mw) of an acrylic polymer (A1), it is more preferable that it is 100,000-1,500,000. Moreover, the glass transition temperature (Tg) of an acrylic polymer (A1) becomes like this. Preferably it is -70-30 degreeC, More preferably, it exists in the range of -60-20 degreeC. When the weight average molecular weight or the glass transition temperature of the acrylic polymer (A1) is increased, the above-mentioned peeling force and adhesive force are decreased, and when the weight average molecular weight or the glass transition temperature is decreased, the peeling strength and the adhesive strength are increased. have.

At least 1 type of (meth)acrylic acid ester monomer or its derivative(s) is contained in the monomer which comprises an acrylic polymer (A1).

Specifically, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) Acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, tetradecyl (meth) acrylate, Alkyl (meth) acrylates having 1 to 18 carbon atoms in the alkyl group such as octadecyl (meth) acrylate; cycloalkyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, dicyclo (meth)acrylates having a cyclic skeleton such as fentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, and imide (meth)acrylate; Hydroxyl group-containing (meth)acrylates, such as methyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 2-hydroxybutyl (meth)acrylate; Epoxy group-containing (meth)acrylates such as cydyl (meth)acrylate and 3,4-epoxycyclohexylmethyl (meth)acrylate; monomethylamino (meth)acrylate, monoethylamino (meth)acrylate, di Amino group-containing (meth)acrylates, such as ethylamino (meth)acrylate; Carboxyl group-containing (meth)acrylates, such as 2-(meth)acryloyloxyethyl phthalate and 2-(meth)acryloyloxypropyl phthalate; can be heard

Moreover, (meth)acrylic acid, itaconic acid, vinyl acetate, (meth)acrylonitrile, styrene, etc. may be copolymerized.

These may be used individually by 1 type, and may use 2 or more types together.

In addition, in this specification, (meth)acryl may be used by the meaning containing both acryl and methacryl.

The acrylic polymer (A1) may be crosslinked. When crosslinking an acrylic polymer (A1), the acrylic polymer (A1) before crosslinking has a crosslinkable functional group, such as a hydroxyl group, and adds a crosslinking agent in the composition for forming an adhesive layer. When a crosslinkable functional group and the functional group which a crosslinking agent has are reacted, the acrylic polymer (A1) is crosslinked. By crosslinking the acrylic polymer (A1), it becomes possible to adjust the cohesive force of the pressure-sensitive adhesive layer.

As a crosslinking agent, an organic polyhydric isocyanate compound, an organic polyvalent imine compound, etc. are mentioned.

Examples of the organic polyvalent isocyanate compound include an aromatic polyvalent isocyanate compound, an aliphatic polyvalent isocyanate compound, an alicyclic polyvalent isocyanate compound, a trimer of these organic polyvalent isocyanate compounds, and a terminal isocyanate urethane prepolymer obtained by reacting these organic polyvalent isocyanate compounds with a polyol compound and the like.

As the organic polyvalent isocyanate compound, specifically, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4 '-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dish Chlohexylmethane-2,4'-diisocyanate, lysine isocyanate, and these polyhydric alcohol adducts (for example, trimethylolpropane adduct tolylene diisocyanate) are mentioned.

As the organic polyvalent imine compound, specifically, N,N'-diphenylmethane-4,4'-bis(1-aziridinecarboxamide), trimethylolpropane-tri-β-aziridinylpropionate, tetra and methylolmethane-tri-β-aziridinylpropionate and N,N'-toluene-2,4-bis(1-aziridinecarboxamide)triethylenemelamine.

A crosslinking agent is normally 0.01-20 mass parts with respect to 100 mass parts of acrylic polymers before bridge|crosslinking, Preferably it is 0.1-15 mass parts, More preferably, it mix|blends in the ratio of 0.5-12 mass parts. When there is much compounding quantity of a crosslinking agent, the peeling force and adhesive force mentioned above will fall, and when the compounding quantity of a crosslinking agent is reduced, there exists a tendency for the peeling force and its adhesive force to rise.

In the present invention, when determining the content of the component constituting the pressure-sensitive adhesive layer on the basis of the content of the acrylic polymer, when the acrylic polymer is a crosslinked acrylic polymer, the standard content is the acrylic polymer before crosslinking. content of the polymer.

An energy-beam-curable compound (B) is a compound which polymerization-hardens when irradiated with energy rays, such as an ultraviolet-ray and an electron beam. Examples of this energy-ray-curable compound include low-molecular-weight compounds (monofunctional and polyfunctional monomers and oligomers) having an energy-beam polymerizable group, and specifically, trimethylolpropane triacrylate, tetramethylolmethanetetra Acrylate, pentaerythritol triacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate, etc. acrylates, dicyclopentadienedimethoxydiacrylate, and cyclic aliphatic skeleton-containing acrylates such as isobornyl acrylate, polyethylene glycol diacrylate, oligoester acrylate, urethane acrylate oligomer, epoxy-modified acrylate, polyether Acrylate-based compounds such as acrylates and itaconic acid oligomers are used. Such a compound has an energy-beam polymerizable group in a molecule|numerator, and molecular weight is 100-30000 normally, Preferably it is about 300-10000.

In general, the low molecular weight compound having an energy ray polymerizable group is preferably 0 to 200 parts by mass, more preferably 0 to 200 parts by mass relative to 100 parts by mass of the component (A) (including the energy ray-curable polymer (AB) described later). It is 1-100 mass parts, More preferably, it is used in the ratio of about 1-30 mass parts.

As for the energy-beam curable polymer (AB) which has the property of the said component (A) and (B), the energy-beam polymeric group couple|bonds with the principal chain, a side chain, or the terminal of a polymer.

The energy ray polymerizable group bonded to the main chain, side chain or terminal of the energy ray curable polymer is bonded to the main chain, side chain or terminal of the energy ray curable polymer via an alkylene group, an alkyleneoxy group, or a polyalkyleneoxy group, there may be

It is preferable that it is 10,000-2 million, and, as for the weight average molecular weight (Mw) of an energy-beam curable polymer (AB), it is more preferable that it is 100,000-1,500,000. Moreover, the glass transition temperature (Tg) of an energy ray-curable polymer (AB) becomes like this. Preferably it is -70-30 degreeC, More preferably, it exists in the range of -60-20 degreeC. In the case of an energy ray-curable polymer (AB) obtained by reacting an acrylic polymer containing a functional group such as a hydroxyl group and a polymerizable group-containing compound, which will be described later, Tg is the Tg of the acrylic polymer before reacting with the polymerizable group-containing compound . When the weight average molecular weight or glass transition temperature of the energy ray-curable polymer (AB) is increased, the above-described peeling force and adhesive strength are lowered, and when the weight average molecular weight or the glass transition temperature is decreased, the peel strength and the adhesive strength are increased. tends to

The energy ray-curable polymer (AB) is, for example, an acrylic polymer containing a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, and an epoxy group, and a substituent reactive with the functional group and energy ray polymerizable carbon-carbon double It is obtained by reacting a polymerizable group-containing compound having 1 to 5 bonds per molecule. The acrylic polymer is preferably a copolymer comprising a (meth)acrylic acid ester monomer or derivative thereof having a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, and an epoxy group, and a monomer constituting the component (A) described above. Examples of the polymerizable group-containing compound include (meth)acryloyloxyethyl isocyanate, meta-isopropenyl-α,α-dimethylbenzyl isocyanate, (meth)acryloyl isocyanate, allyl isocyanate, glycidyl (meth)acryl. a rate, (meth)acrylic acid, etc. are mentioned.

When the energy ray-curable polymer (AB) is obtained by reacting an acrylic polymer containing a functional group such as a hydroxyl group with a polymerizable group-containing compound, the energy ray-curable polymer (AB) is similar to the above-mentioned acrylic polymer (A1). , may be crosslinked.

The acryl-type adhesive containing the above acrylic polymer (A1), an energy-beam curable compound (B), and/or an energy-beam curable polymer (AB) is hardened|cured by energy-beam irradiation. As an energy beam, an ultraviolet-ray, an electron beam, etc. are specifically used.

Moreover, by combining a photoinitiator with an energy-beam curable compound (B) and an energy-beam curable polymer (AB), polymerization hardening time can be shortened, and a light irradiation amount can be reduced.

Examples of such a photopolymerization initiator include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, and benzoin. Dimethyl ketal, 2,4-diethylthioxanthone, 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxycyclohexylphenylketone, benzyldiphenylsulfide, tetramethylthiuram Monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl, 1,2-diphenylmethane, 2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propane on, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, β-chloranthraquinone, and the like. A photoinitiator can be used individually by 1 type or in combination of 2 or more types.

As for the compounding ratio of a photoinitiator, it is preferable that 0.1-10 mass parts is contained with respect to a total of 100 mass parts of an energy-beam sclerosing|hardenable compound (B) and an energy-beam curable polymer (AB), and it is more preferable that 1-5 mass parts is contained. desirable.

When the blending ratio of the photopolymerization initiator is less than 0.1 parts by mass, satisfactory curability may not be obtained due to insufficient photopolymerization, and when it exceeds 10 parts by mass, residues that do not contribute to photopolymerization are generated, causing problems there may be cases

The thickness of a support sheet is 10-500 micrometers normally, Preferably it is 15-300 micrometers, More preferably, it is 20-250 micrometers. When forming an adhesive layer, it is preferable that 2-20 micrometers is the thickness of an adhesive layer in a support sheet, More preferably, it is 3-15 micrometers, More preferably, it is 4-10 micrometers. When the thickness of an adhesive layer is too small, sufficient peeling force and adhesive force may not express, and when the thickness of an adhesive layer is too large, peeling force and adhesive force become high, and the effect of this invention may not be exhibited.

(resin film forming layer)

The resin film forming layer in the present invention is appropriately selected from resins having various functions, such as a film adhesive, an adhesive layer, and a protective film forming layer, which will be described later, depending on the use of the sheet.

<Film-like adhesive>

The resin film forming layer may be a film adhesive. Such a film adhesive has recently been widely used in the die bonding process of a chip. Such a film adhesive is preferably a film formed and semi-cured of an epoxy-based adhesive or a polyimide-based adhesive (B-stage state), and is formed so as to be peelable on the above-mentioned support sheet.

The film adhesive is affixed to the work. By dicing the work and the film adhesive to a chip size, a chip with an adhesive is obtained, which is picked up from a support sheet, and the chip is fixed at a predetermined position through an adhesive. In addition, when picking up the chip|tip with adhesive agent, it is preferable to implement expansion.

<Adhesive layer>

The sheet for forming a resin film in the present invention may be a dicing and die-bonding combined sheet having both a wafer fixing function at the time of dicing and a die bonding function at the time of die bonding.

When the sheet for forming a resin film is a sheet for dicing and die bonding, the resin film forming layer holds a work or a chip obtained by dividing the work into pieces in the dicing step, and at the time of dicing, the work is cut together, and a resin film forming layer having the same shape as the chip is formed. And when a chip|tip is picked up after completion|finish of dicing, the resin film forming layer will peel from a support sheet together with a chip|tip. The resin film forming layer functions as an adhesive for fixing chips during die bonding. The chip with a resin film forming layer is mounted on a board|substrate, and heating etc. are performed, and a chip|tip and to-be-adhered bodies, such as a board|substrate and another chip|tip, are adhere|attached through the resin film forming layer.

When the sheet for forming a resin film is such a sheet for dicing and die bonding as described above, an adhesive layer having pressure-sensitive adhesiveness and having a die bonding function is formed as a resin film forming layer on the support sheet. The resin film forming layer having such a wafer fixing function and a die bonding function includes, for example, the above-described acrylic polymer (A1) and an epoxy adhesive, and if necessary, an energy ray-curable compound (B), energy precurable polymers (AB), curing aids, and the like. In addition, at the time of picking up the chip|tip with an adhesive bond layer, it is preferable to expand similarly to the above.

<Protective film forming layer>

In addition, when the sheet for forming a resin film is used as a sheet for forming a protective film for forming a protective film on the back surface of a chip, the resin film forming layer may be a protective film forming layer for forming a protective film on the back surface of the chip.

In this case, the work is affixed to the protective film forming layer, the protective film forming layer is cured to form a protective film, and then the work and the protective film are diced to obtain a chip with a protective film. Further, the work may be affixed to the protective film forming layer, the work and the protective film forming layer may be diced to obtain a chip with a protective film forming layer, and then the protective film forming layer may be cured to obtain a chip with a protective film.

Such a sheet for forming a protective film has, as a resin film forming layer, an adhesive resin layer (protective film forming layer) serving as a protective film on the support sheet. The resin film forming layer serving as such a protective film contains, for example, the above-described acrylic polymer (A1), an epoxy adhesive and a curing aid, and, if necessary, an energy ray-curable compound (B), an energy ray-curable polymer ( AB), a filler, etc. may be contained.

Although the thickness of the resin film forming layer varies according to the use, it is about 1-300 micrometers, Preferably it is 10-200 micrometers, Especially preferably, it is 20-100 micrometers.

(Jig adhesive layer)

As a jig adhesive layer, the adhesive member which consists of an adhesive layer single-piece|unit, the adhesive member comprised from a base material and an adhesive layer, and the double-sided adhesive member which has a core material are employable. The jig adhesive layer is, for example, annular (ring shape), has a cavity (internal opening), and has a size capable of being fixed to a jig such as a ring frame. Specifically, the inner diameter of the ring frame is smaller than the outer diameter of the jig adhesive layer. In addition, the inner diameter of the ring frame is somewhat larger than the inner diameter of the jig adhesive layer. In addition, the ring frame is a molded object of metal or plastic normally.

When the pressure-sensitive adhesive member consisting of the pressure-sensitive adhesive layer alone is used as the jig adhesive layer, the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer is not particularly limited, but, for example, it is preferably made of an acrylic pressure-sensitive adhesive, a rubber pressure-sensitive adhesive, or a silicone pressure-sensitive adhesive. Among these, when the peeling force of the peeling sheet in the outer peripheral part of the sheet|seat for resin film formation, the adhesive force with respect to SUS, and re-peelability from a ring frame are considered, the acrylic adhesive containing the above-mentioned acrylic polymer (A1) is preferable In addition, the said adhesive may be used independently and may be used in mixture of 2 or more types.

The thickness of the adhesive layer which comprises a jig|tool adhesive layer becomes like this. Preferably it is 2-20 micrometers, More preferably, it is 3-15 micrometers, More preferably, it is 4-10 micrometers. When the thickness of an adhesive layer is less than 2 micrometers, sufficient peeling force and adhesive force may not express. When the thickness of the pressure-sensitive adhesive layer exceeds 20 µm, the peeling force or adhesive force increases and the effect of the present invention cannot be exhibited, or when peeling from the ring frame, residues of the pressure-sensitive adhesive remain on the ring frame and contaminate the ring frame There are cases where

When the pressure-sensitive adhesive member composed of the base material and the pressure-sensitive adhesive layer is used as the jig adhesive layer, the pressure-sensitive adhesive layer and the release sheet constituting the pressure-sensitive adhesive member are laminated.

As an adhesive which forms an adhesive layer, it is the same as that of the adhesive which forms the adhesive layer in the adhesive member which consists of said adhesive layer single-piece|unit. Moreover, the thickness of an adhesive layer is also the same.

The base material constituting the jig adhesive layer is not particularly limited, but for example, polyethylene film, polypropylene film, ethylene-vinyl acetate copolymer film, ethylene-(meth)acrylic acid copolymer film, ethylene-(meth)acrylic acid ester aerial Polyolefin films, such as a coalescing film and an ionomer resin film, a polyvinyl chloride film, a polyethylene terephthalate film, etc. are mentioned. Among these, when expandability is considered, a polyethylene film and a polyvinyl chloride film are preferable, and a polyvinyl chloride film is more preferable.

The thickness of the base material constituting the jig adhesive layer is preferably 15 to 200 µm, more preferably 30 to 150 µm, still more preferably 40 to 100 µm.

Further, when the double-sided pressure-sensitive adhesive member having a core material is used as a jig adhesive layer, the double-sided pressure-sensitive adhesive member includes a core material, an adhesive layer for lamination formed on one surface thereof, and a pressure-sensitive adhesive layer for fixing formed on the other surface thereof. . The adhesive layer for lamination|stacking is an adhesive layer on the side affixed to the resin film forming layer in a 3rd aspect, and is an adhesive layer on the side affixed on a support sheet in a 4th aspect. Moreover, the adhesive layer for fixing is an adhesive layer on the side affixed to a peeling sheet.

As a core material of a double-sided adhesive member, the thing similar to the base material of the said adhesive member is mentioned. Among these, in consideration of expandability, a polyolefin film and a plasticized polyvinyl chloride film are preferable.

The thickness of a core material is 15-200 micrometers normally, Preferably it is 30-150 micrometers, More preferably, it is 40-100 micrometers.

The adhesive layer for lamination|stacking and the adhesive layer for fixing of a double-sided adhesive member may be the layer which consists of the same adhesive, or the layer which consists of different adhesives may be sufficient as it.

The pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer for fixing, in the outer periphery of the sheet for forming a resin film, has a peel strength of the peeling sheet and adhesive strength to SUS within a predetermined range, and the adhesive strength between the pressure-sensitive adhesive layer for fixing and the ring frame, It selects suitably so that it may become smaller than the adhesive force of a resin film forming layer or a support sheet, and the adhesive layer for lamination|stacking. Examples of such a pressure-sensitive adhesive include an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, and a silicone pressure-sensitive adhesive, and in the outer periphery of the sheet for forming a resin film, the peeling force of the peeling sheet, the adhesive strength to SUS, and the ash from the ring frame When peelability is considered, the acrylic adhesive containing the acrylic polymer (A1) mentioned above is preferable. Moreover, the adhesive which forms the adhesive layer for fixing may be used independently and may be used in mixture of 2 or more types.

The pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer for lamination is not particularly limited, and examples thereof include an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, and a silicone pressure-sensitive adhesive. Among these, the acrylic adhesive containing the above-mentioned acrylic polymer (A1) from a viewpoint that control of adhesive force with a resin film forming layer or a support sheet is easy is preferable. Moreover, the adhesive which forms the adhesive layer for lamination|stacking may be used independently and may be used in mixture of 2 or more types.

The thickness of the adhesive layer for lamination|stacking and the adhesive layer for fixing is the same as the thickness of the adhesive layer of the said adhesive member.

By forming the jig adhesive layer, it becomes easy to adhere the sheet for forming a resin film to a jig such as a ring frame.

(Releasable sheet)

A release sheet plays a role as a carrier film at the time of use of the sheet|seat for resin film formation, The film illustrated as above-mentioned support sheet can be used.

The surface tension of the surface of the release sheet in contact with the resin film forming layer is preferably 40 mN/m or less, more preferably 37 mN/m or less, and particularly preferably 35 mN/m or less. The lower limit is usually about 25 mN/m. A release sheet having such a relatively low surface tension can be obtained by appropriately selecting a material, and can also be obtained by applying a release agent to the surface of the release sheet and performing a release treatment.

As the release agent used in the peeling treatment, an alkyd-based, silicone-based, fluorine-based, unsaturated polyester-based, polyolefin-based, wax-based release agent, etc. are used, but alkyd-based, silicone-based, and fluorine-based release agents are particularly preferable because they have heat resistance.

In order to peel the surface of the film or the like that becomes the base of the release sheet by using the release agent, the release agent is used as it is without a solvent, or by diluting or emulsifying it with a solvent, such as a gravure coater, Mayer bar coater, air knife coater, roll coater, etc. What is necessary is just to provide the release sheet coated with the release agent under normal temperature or heating, or to harden|cure with an electron beam to form a release agent layer.

Moreover, you may adjust the surface tension of a release sheet by laminating|stacking a film by wet lamination, dry lamination, hot melt lamination, melt extrusion lamination, coextrusion processing, etc. That is, a film in which the surface tension of at least one surface of the release sheet as described above is within a preferable range as that of the surface in contact with the resin film forming layer is laminated with another film such that the surface is the surface in contact with the resin film forming layer. A sieve may be manufactured and it is good also as a release sheet.

Although the thickness of a release sheet is not specifically limited, Preferably it is 50 micrometers or more, More preferably, it is 50-200 micrometers. When a peeling film is less than 50 micrometers and the sheet|seat for resin film formation is wound up in roll shape, the wound mark may generate|occur|produce in the resin film forming layer. When wound marks are generated in the resin film forming layer, the thickness accuracy of the resin film forming layer decreases, air entrapment when the resin film forming layer is pasted to a work, and in the method for manufacturing a semiconductor device described later, the chip is formed by removing the resin film forming layer. It becomes a cause of the fall of adhesiveness at the time of adhering to a chip mounting part (a board|substrate, another chip, etc.) and generation|occurrence|production of a void. As a result, it becomes difficult to obtain a semiconductor device having excellent reliability. Moreover, when using the resin film forming layer as a protective film for protecting the back surface of a chip|tip, the wound mark of the resin film forming layer becomes a cause of appearance defect other than the above-mentioned. By making the thickness of a peeling sheet into the said range, said problem can be eliminated.

In the sheet laminate for resin film formation having the above aspect and configuration, after the release sheet is removed, the resin film forming layer is affixed to the work, and in some cases, thereafter, the work is subjected to required processing such as dicing. is carried out And the resin film forming layer is made to remain fixed to the work, and the support sheet is peeled off. That is, it is used for a process including the process of transferring a resin film forming layer from a support sheet to a work.

The work applicable in the present invention is not limited in its material, for example, various articles such as semiconductor wafers, glass substrates, ceramic substrates, organic material substrates such as FPC, and metal materials such as precision parts. have.

The shape of the sheet laminate for forming a resin film is a band-like shape in which a sheet for forming a resin film including a support sheet and a resin film forming layer is laminated on a long release sheet, and this is wound. can do. In particular, as shown in FIG. 2, the form in which the sheet|seat for resin film formation containing the support sheet cut out according to a desired shape and a resin film forming layer was laminated|stacked on the elongate release sheet at regular intervals so that peeling was possible is preferable. Moreover, the shape of the sheet|seat laminated body for resin film formation can also be made into sheet-leaf shape.

When a sheet for forming a resin film comprising a support sheet cut out to a desired shape and a resin film forming layer is laminated on a long release sheet at regular intervals so that it can be peeled off, the portion where the sheet for forming a resin film is laminated And in the part where the sheet|seat for resin film formation is not laminated|stacked, the thickness of the sheet|seat laminated body for resin film formation becomes nonuniform|heterogenous. When such a thickness nonuniform|heterogeneous sheet laminated body for resin film formation is wound up in roll shape, thickness becomes non-uniform|heterogenous, winding pressure becomes non-uniform|heterogenous, and winding collapse of a roll may occur. Therefore, in the sheet|seat laminated body for resin film formation of such an aspect, it is preferable to make thickness uniform. For this reason, as shown in FIG. 2, on the outer side of the sheet|seat for resin film formation cut out according to a desired shape, it space|intervals a little, and along the both edge part 15 in the width direction of the elongate release sheet 13, , it is preferable that the peripheral tape 14 of the same thickness as the sheet for resin film formation is bonded together. Here, it is preferable that it is about 1-20 mm, and, as for the space|interval of the sheet|seat for resin film formation and the peripheral tape 14, it is especially preferable that it is about 2-10 mm. With the peripheral tape 14, it becomes easy to avoid said problem by eliminating the nonuniformity of thickness.

Manufacture of sheet laminate for resin film formation

Next, about the manufacturing method of the sheet|seat laminated body for resin film formation of the form in which the sheet|seat for resin film formation cut out according to a desired shape was laminated|stacked at fixed intervals on a long release sheet so that peeling was possible, the 1st shown in FIG. Although the aspect and the 3rd aspect shown in FIG. 5 are demonstrated as an example, the sheet|seat for resin film formation of this invention is not limited to what is obtained by such a manufacturing method.

(Manufacture of the sheet|seat laminated body for resin film formation which concerns on 1st aspect)

First, the resin film forming layer on the release sheet is half-cut into a desired shape.

Specifically, resin between two long release sheets (hereinafter referred to as a first long release sheet and a second long release sheet. The second long release sheet is the release sheet 13 in FIG. 3 .) A laminate having a film-forming layer is prepared. The resin film forming layer previously formed into a film may be sandwiched between two long release sheets, and a composition for forming a resin film for forming the resin film forming layer is coated on one elongated release sheet, dried, and a coating film The other elongate release sheet may be bonded together on it, and you may form a laminated body.

Next, the first long release sheet is removed. And the resin film forming layer is molded (half-cut) so that the resin film forming layer may be cut completely into a desired shape, and it may reach the 2nd elongate peeling sheet 13. Mold molding is performed by a general-purpose device (rotary blade or flat blade) such as a die cut and method. The cutting depth at this time cuts in the total depth of the thickness of a resin film forming layer and cut-out depth d2, in order to cut into the resin film forming layer completely, and to form cut-out part D2 of cut-out depth d2. For this reason, cut part D2 of cut depth d2 is formed in the surface of a 2nd elongate peeling sheet.

Next, the adhesive tape for peeling is affixed in the longitudinal direction of a resin film forming layer. And the resin film forming layer 12 of a desired shape is made to remain on the 2nd elongate release sheet 13 by removing the adhesive tape for peeling, and the residual resin film forming layer is removed. The remaining portions other than the desired shape of the resin film forming layer are continuous. For this reason, when the interface between the second long release sheet and the resin film forming layer is taken as the peeling starting point, the remaining resin film forming layer is removed, and the resin film forming layer 12 having a desired shape is placed on the second long release sheet 13 . remains As a result, on the 2nd elongate peeling sheet 13, the laminated body which the resin film forming layer 12 of a desired shape lined up is obtained.

Next, on the surface of the 2nd elongate release sheet 13 which has the resin film forming layer 12, the support sheet 11 is affixed so that the 2nd elongate release sheet 13 and the resin film forming layer 12 may contact. In a 1st aspect, the support sheet 11 is an adhesive sheet which consists of the base material 11a and the adhesive layer 11b. The method of forming the pressure-sensitive adhesive layer 11b on the base material 11a is not particularly limited, and for example, a method of forming by coating and drying a composition (adhesive agent) constituting the pressure-sensitive adhesive layer 11b on the base material 11a. However, the method of forming an adhesive on a release sheet separate from the said release sheet, and transcribe|transferring this to the base material 11a, etc. are mentioned.

Then, the support sheet is molded into a desired shape having a size greater than or equal to the inner diameter of the ring frame and smaller than the outer diameter. At this time, molding is performed so that the center point of the resin film forming layer 12 and the center point of the support sheet 11 after shaping|molding may match. Moreover, in order to cut a support sheet completely, and to form cut-out D1 of cut-out depth d1, cut depth cuts in the total depth of the thickness of a support sheet, and cut-out depth d1. For this reason, the cut-out part D1 of the cut-out depth d1 is formed in the surface of a 2nd elongate peeling sheet.

Next, the support sheet 11 of a desired shape is made to remain|survive on the 2nd elongate release sheet 13, and the residual support sheet is removed. As a result, the sheet|seat laminated body for resin film formation of the 1st aspect in which the sheet|seat for resin film formation containing the resin film forming layer of a desired shape and the support sheet 11 was laminated|stacked on the 2nd elongate release sheet 13 is obtained. .

In addition, in the above, when the support sheet is molded, the support sheet is cut into a desired shape, and while the support sheet 11 of the shape is slightly spaced from the support sheet, the second long release sheet It is preferable to mold so that the supporting sheet as the peripheral tape 14 remains along both edge portions 15 in the width direction of the . Thereafter, the supporting sheet 11 and the peripheral tape 14 of the desired shape are left on the second long release sheet 13, and the remaining supporting sheet is removed, whereby the supporting sheet 11 and the resin film forming layer ( The sheet laminate 100 for resin film formation in the form in which the sheet|seat 10 for resin film formation containing 12) and the peripheral tape 14 were continuously bonded on the elongate release sheet 13 was obtained lose

(Manufacture of the sheet|seat laminated body for resin film formation which concerns on 3rd aspect)

The case where the jig adhesive layer is a double-sided adhesive member having a core material will be described.

First, the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer (the pressure-sensitive adhesive layer for lamination and the pressure-sensitive adhesive layer for fixing) of the jig adhesive layer is prepared. Moreover, in a jig|tool adhesive layer, when the adhesive for forming the adhesive layer for lamination|stacking differs from the adhesive for forming the adhesive layer for fixing, each adhesive is prepared. Below, the adhesive which comprises the adhesive layer for lamination|stacking is described as "adhesive for lamination", and the adhesive for forming the adhesive layer for fixation is described as "adhesive for fixation." When the pressure-sensitive adhesive for lamination and the pressure-sensitive adhesive for fixing are the same, there is no need to prepare two types of pressure-sensitive adhesive, and since it can be used without distinction of both surfaces of the jig adhesive layer, the working efficiency is improved.

Next, the adhesive for lamination|stacking is apply|coated and dried on the elongate release sheet (Hereinafter, it is called a 3rd elongate release sheet.), and the adhesive layer for lamination|stacking is formed. Then, the adhesive layer for lamination|stacking is bonded together to a core material, and the laminated body in which the core material, the adhesive layer for lamination|stacking, and the 3rd elongate peeling sheet were laminated|stacked in this order is obtained.

Moreover, the adhesive for fixing is apply|coated on a long release sheet (Hereinafter, it is called a 4th long release sheet. The 4th long release sheet is the release sheet 13 in FIG. 5.), it is made to apply|coat and dry, and the adhesive layer for fixing. to form Thereafter, the adhesive layer for lamination was bonded to the core material of the laminate obtained above, and the third long release sheet, the adhesive layer for lamination, the core material, the adhesive layer for fixing, and the fourth long release sheet were laminated in this order. (The jig adhesive layer pinched|interposed by the elongate release sheet) is obtained.

Next, the 3rd long release sheet is removed. And the laminated body in which the jig adhesive layer and the 4th elongate release sheet were laminated|stacked in this order is cut into a desired shape, and the said laminated body is mold-shaped (half-cut) so that it may reach|attain a 4th elongate release sheet. Mold molding is performed by a general-purpose device (rotary blade or flat blade) such as a die cut and method. The cutting depth at this time cuts the said laminated body completely, in order to form the cutout part D3 of the cutting depth d3, it cuts in the total depth of the thickness of the said laminated body, and the cutting depth d3. For this reason, cut part D3 of cut depth d3 is formed in the surface of a 4th elongate peeling sheet.

Next, the adhesive tape for peeling is affixed in the longitudinal direction of a jig|tool adhesive layer. And the jig adhesive layer of a desired shape is removed from the 4th elongate peeling sheet 13 top by removing the adhesive tape for peeling. As a result, on the 4th elongate release sheet 13, the laminated body which laminated|stacked the jig|tool adhesive layer which has an internal opening of a desired shape is obtained.

Moreover, the support sheet 11 in which the adhesive layer 11b was formed on the base material 11a is prepared. A method of obtaining this support sheet is as described in the first aspect.

Then, the resin film forming layer 12 is formed on the pressure-sensitive adhesive layer 11b of the support sheet 11 . The method of forming the resin film forming layer 12 on the adhesive layer 11b is not specifically limited, For example, the method of forming by coating-drying the composition for resin film formation on the adhesive layer 11b, or a resin film The method of forming by forming the composition for formation on a release sheet separate from the said release sheet, and transcribe|transferring this to the adhesive layer 11b, etc. are mentioned. In this way, the laminated body which consists of the support sheet 11 and the resin film forming layer 12 is obtained.

Next, on the side having the jig adhesive layer of the fourth long release sheet 13, in contact with the fourth long release sheet 13 and the jig adhesive layer, the laminate comprising the support sheet 11 and the resin film forming layer 12 The resin film forming layer 12 is affixed, and the sheet 10 for resin film formation is formed on the 4th elongate release sheet 13.

Then, the sheet 10 for forming a resin film is molded into a desired shape having a size greater than or equal to the inner diameter of the ring frame and less than or equal to the outer diameter. At this time, it molds so that the center point of the internal opening of a jig|tool adhesive layer and the center point of the sheet|seat 10 for resin film formation after shaping|molding may correspond. Moreover, in order to cut the sheet|seat for resin film formation completely, and to form cut-out D1 of cut-out depth d1, cut-out depth cuts in the total depth of the thickness of the sheet|seat for resin film formation, and cut-out depth d1. do. For this reason, cut part D1 of cut depth d1 is formed in the surface of a 4th elongate peeling sheet.

Next, the sheet|seat 10 for resin film formation of a desired shape is made to remain|survive on the 4th elongate release sheet 13, and the remaining sheet|seat for resin film formation is removed. As a result, the sheet|seat laminated body for resin film formation of the 3rd aspect in which the sheet|seat 10 for resin film formation of a desired shape was laminated|stacked on the 4th elongate release sheet 13 is obtained. In addition, when performing molding of the sheet|seat for resin film formation, it is preferable similarly to a 1st aspect to mold so that the peripheral tape 14 may remain|survive.

Method of manufacturing a semiconductor device

Next, with respect to the method of using the sheet laminate for forming a resin film according to the present invention, the case where the sheet laminate for forming a resin film of the first aspect shown in Figs. 2 and 3 is applied to the method for manufacturing a semiconductor device is taken as an example. Explain.

In the method for manufacturing a semiconductor device using the sheet laminate for forming a resin film according to the first aspect, the resin film forming layer of the laminate is adhered to a work, the work is diced to form a chip, and the chip is placed on any surface of the chip. It is preferable to include the process of making the resin film forming layer remain fixed and peeling from a support sheet, and mounting the chip|tip on a die pad part or another chip|tip with the resin film forming layer interposed therebetween.

Hereinafter, an example using a silicon wafer as a work is demonstrated.

Formation of the circuit on the wafer surface can be performed by various methods including methods commonly used in the past such as an etching method and a lift-off method. Next, the opposite surface (back surface) of the circuit surface of the wafer is ground. The grinding method is not specifically limited, You may grind by well-known means using a grinder etc. At the time of back surface grinding, in order to protect a circuit on the surface, the adhesive sheet called a surface protection sheet is affixed to a circuit surface. In the back surface grinding, the circuit surface side of the wafer (that is, the surface protection sheet side) is fixed with a chuck table or the like, and the back surface side on which the circuit is not formed is ground with a grinder. Although the thickness after grinding of a wafer is not specifically limited, Usually, it is about 50-500 micrometers.

Then, if necessary, the crushing layer generated at the time of back surface grinding is removed. Removal of the crushing layer is performed by chemical etching, plasma etching, or the like.

Following circuit formation and backside grinding, the resin film forming layer of the sheet laminate for resin film formation is affixed to the back surface of the wafer. The affixing method is not specifically limited, For example, it is the process shown in FIG. 1, and sticks a resin film forming layer to a semiconductor wafer.

1A-1D are a series of process diagrams of performing the operation|work of sticking the sheet|seat 10 for resin film formation to the semiconductor wafer 32. FIG. As shown in FIG. 1A , in the sheet laminate 100 for forming a resin film, the release sheet 13 serves as a carrier film, and is supported by two rolls 62 and 66 and a peel plate 64 . , is wound with one end connected to a cylindrical core 44 to form a first roll 42, and the other end is wound while connected to a cylindrical core 54 to form a second A roll 52 is formed. And to the winding core 54 of the 2nd roll 52, the motor (not shown) for winding core drive for rotating the said winding core 54 is connected, and peeling after the sheet|seat 10 for resin film formation peels. The sheet 13 is wound at a predetermined speed.

First, when the motor for winding core drive rotates, the winding core 54 of the 2nd roll 52 rotates, and resin is removed from the sheet|seat 100 for resin film formation wound by the winding core 44 of the 1st roll 42. The sheet 10 for film formation is drawn out to the outside of the 1st roll 42. As shown in FIG. And the sheet 10 for resin film formation taken out is guided onto the disk-shaped semiconductor wafer 32 arranged on the movable stage and the ring frame 34 arranged so as to surround it.

Next, the sheet 10 for forming a resin film is peeled from the release sheet 13 . At this time, as shown to FIG. 1A, the peel plate 64 is facing from the peeling sheet 13 side of the sheet|seat 10 for resin film formation. In this invention, since the peeling force of the peeling sheet in the outer peripheral part of the sheet|seat 10 for resin film formation and the adhesive force with respect to SUS are predetermined ranges, the sheet|seat for resin film formation is easy to unwind. Moreover, as shown in FIG. 1B, when the cutout D1 is formed, the peeling sheet 13 is bent toward the peel plate 64 side with the cutout D1 as a starting point, and the peeling sheet 13 and A peeling origin is easily created between the sheets 10 for resin film formation. Moreover, you may blow air to the interface of the peeling sheet 13 and the sheet|seat 10 for resin film formation so that a peeling origin may be created more efficiently. As a result, unwinding of the sheet|seat 10 for resin film formation becomes further easy.

Next, as shown in FIG. 1C, the sheet|seat 10 for resin film formation is pasted so that the sheet|seat 10 for resin film formation may closely_contact|adhere with the ring frame 34 and the semiconductor wafer 32. As shown in FIG. At this time, the sheet 10 for resin film formation is pressed against the semiconductor wafer 32 by the roll 68 . And as shown to FIG. 1D, pasting of the sheet|seat 10 for resin film formation with respect to the semiconductor wafer 32 is completed, and the semiconductor wafer with a sheet|seat for resin film formation is obtained.

By the above procedure, pasting of the sheet|seat 10 for resin film formation with respect to the semiconductor wafer 32 can be performed continuously by an automated process. As an apparatus which performs the pasting operation|work of the sheet|seat 10 for resin film formation with respect to such a semiconductor wafer 32, RAD-2500 (trade name) by Lintec Co., Ltd. product etc. is mentioned, for example.

And when the sheet 10 for resin film formation is affixed to the semiconductor wafer 32 by such a process, the resin film formation by using the sheet|seat laminated body for resin film formation which has the desired physical property which concerns on this invention. When the outer periphery of the sheet for use 10 reaches the tip of the peel plate, the sheet for forming a resin film is peeled off from the release sheet in the outer periphery, even if it is a thick release sheet, and is pulled out. As a result, it is possible to prevent problems that the supporting sheets of the sheet for forming a resin film that have been unrolled or that the resin film forming layers overlap each other and are bent and adhered, or that the sheet for forming a resin film is electrodeposited on the release sheet.

When a resin film forming layer does not have tackiness at room temperature, you may heat suitably (Although it is not limited, 40-80 degreeC is preferable).

Moreover, when an energy-beam-curable compound (B) or an energy-beam curable polymer (AB) is mix|blended with the resin film forming layer, the resin film forming layer is irradiated with energy rays from the support sheet side, and the resin layer forming layer is preliminarily cured. and the cohesive force of the resin film forming layer may be raised, and the adhesive force between the resin film forming layer and the support sheet may be reduced.

Then, the said semiconductor wafer is cut|disconnected using cutting means, such as a dicing saw, and a semiconductor chip is obtained. The cutting depth at this time is the depth in which the sum total of the thickness of a semiconductor wafer, the thickness of a resin film forming layer, and the abrasion powder of a dicing saw were taken into account.

In addition, energy-beam irradiation may be performed at any stage after affixing of a semiconductor wafer and before peeling (pick-up) of a semiconductor chip, for example, may be performed after dicing, and may be performed after the following expand process. , It is preferable to carry out after affixing of a semiconductor wafer and before dicing. Moreover, you may divide and implement energy-beam irradiation into multiple times.

Subsequently, if the sheet for resin film formation is expanded as needed, the semiconductor chip interval is extended, and the semiconductor chip can be picked up more easily. At this time, a shift arises between the resin film forming layer and the support sheet, the adhesive force between the resin film forming layer and the support sheet decreases, and the pickup property of the semiconductor chip is improved. When a semiconductor chip is picked up in this way, the cut|disconnected resin film forming layer can be made to stick and remain on the back surface of a semiconductor chip, and can be peeled from a support sheet.

Next, the semiconductor chip is placed on the die pad of the lead frame or on the surface of another semiconductor chip (lower chip) through the resin film forming layer (hereinafter, the die pad or the lower chip surface on which the chip is mounted is referred to as "chip mounting part") do).

The pressure at the time of mounting is 1 kPa - 200 Mpa normally. Moreover, the chip mounting part may be heated before mounting a semiconductor chip, or may be heated immediately after mounting. Heating temperature is 80-200 degreeC normally, Preferably it is 100-180 degreeC, and heating time is 0.1 second - 5 minutes normally, Preferably they are 0.5 second - 3 minutes.

After mounting a semiconductor chip in a chip mounting part, you may heat further as needed. The heating conditions at this time are the range of the said heating temperature, and a heating time is 1-180 minutes normally, Preferably it is 10-120 minutes.

Moreover, you may make it a temporary bonding state without performing the heat processing after mounting, and may harden the resin film forming layer using the heating in the resin encapsulation normally performed in package manufacture. By passing through such a process, the resin film forming layer hardens|cures, and the semiconductor device in which the semiconductor chip and the chip mounting part adhere|attached firmly can be obtained. Since the resin film forming layer is fluidized under die-bonding conditions, it is sufficiently filled in the unevenness of the chip mounting portion, and generation of voids can be prevented, and the reliability of the semiconductor device is increased.

Moreover, in the manufacturing method of the semiconductor device which concerns on the 2nd this invention, the resin film forming layer of the sheet|seat for resin film formation is affixed on the back surface of the semiconductor wafer in which the circuit was formed on the surface, and thereafter, the semiconductor chip which has a resin film on the back surface. It is desirable to obtain The resin film is a protective film of the semiconductor chip. Further, the method for manufacturing a semiconductor device according to the present invention preferably further includes the following steps (1) to (3), and the steps (1) to (3) are performed in an arbitrary order. is doing

Process (1): peeling off a resin film forming layer or a resin film, and a support sheet,

Step (2): curing the resin film forming layer to obtain a resin film,

Step (3): Dicing the semiconductor wafer and the resin film forming layer or the resin film.

First, the resin film forming layer of the sheet|seat for resin film formation is affixed on the back surface of a semiconductor wafer. The said process is the same as the pasting process in the manufacturing method of the said 1st semiconductor device.

Thereafter, steps (1) to (3) are performed in an arbitrary order. For example, the steps (1) to (3) are performed in the order of steps (1), (2), (3), the order of steps (2), (1), (3), steps (2), (3) ), the sequence of (1), the sequence of steps (3), (2), and (1), or the sequence of steps (3), (1), and (2) in any order. The details of this process are described in detail in Japanese Patent Laid-Open No. 2002-280329. As an example, the case where it implements in order of process (1), (2), (3) is demonstrated.

First, the resin film forming layer of the sheet|seat for resin film formation is affixed on the back surface of the semiconductor wafer in which the circuit was formed in the surface. Next, the support sheet is peeled from the resin film forming layer, and the laminated body of a semiconductor wafer and a resin film forming layer is obtained.

Next, the resin film forming layer is cured to form a resin film on the entire surface of the wafer. When the resin film forming layer contains an epoxy adhesive, the resin film forming layer is cured by thermal curing. When the energy ray-curable compound (B) or the energy ray-curable polymer (AB) is blended, the resin film forming layer can be cured by irradiating an energy ray, and the epoxy adhesive and the energy ray-curable compound (B) When using together an energy-beam hardening type polymer (AB), you may perform hardening by a heating and energy-beam irradiation simultaneously, and you may implement it sequentially. As an energy ray to be irradiated, an ultraviolet-ray (UV), an electron beam (EB), etc. are mentioned, Preferably, an ultraviolet-ray is used. As a result, a resin film made of a cured resin is formed on the back surface of the wafer, and the strength is improved compared to the case of the wafer alone, so that damage when handling a thin wafer can be reduced. Moreover, the thickness uniformity of a resin film is excellent compared with the coating method which apply|coats and forms the coating liquid for resin films directly on the back surface of a wafer or a chip|tip.

Thereafter, the laminate of the semiconductor wafer and the resin film is diced for each circuit formed on the wafer surface. Dicing is performed so that the wafer and the resin film may be cut together. Dicing of a wafer is performed by the normal method using a dicing sheet. As a result, a semiconductor chip having a resin film on the back surface is obtained.

Next, laser printing may be performed on the resin film. Laser printing is performed by a laser marking method, and a part number or the like is marked on the protective film by scraping the surface of the protective film by irradiation of laser light. In addition, laser printing can also be performed before hardening the resin film forming layer.

Finally, by picking up the diced chip by a general-purpose means such as a collet, a semiconductor chip having a resin film on the back surface is obtained. Then, the semiconductor device can be manufactured by mounting the semiconductor chip on a predetermined base in a face-down manner. Moreover, a semiconductor device can also be manufactured by adhering the semiconductor chip which has a resin film on the back surface on other members, such as a die pad part or another semiconductor chip (on a chip mounting part). According to the present invention as described above, a resin film with high uniformity in thickness can be easily formed on the back surface of a chip, and cracks after a dicing process or packaging are less likely to occur.

In addition, when the resin film forming layer of the sheet for forming a resin film is affixed on the back surface of the semiconductor wafer and then the step (3) is performed before the step (1), the resin film forming sheet serves as a dicing sheet. can That is, it can be used as a sheet for supporting a semiconductor wafer in the middle of a dicing process. In this case, a semiconductor wafer is adhered to the inner periphery of the sheet for forming a resin film with a resin film forming layer interposed therebetween, and the outer periphery of the sheet for forming a resin film is joined to another jig such as a ring frame to form a resin film adhered to the semiconductor wafer. The dragon sheet is fixed to the apparatus, and dicing is performed.

In the case of carrying out steps (3), (1), and (2) in this order, a semiconductor chip having a resin film forming layer on its back surface is mounted on a predetermined base by a face-down method, and then, normally in package manufacturing. The resin film forming layer can also be hardened using the heating in the resin encapsulation performed.

Example

Hereinafter, although an Example demonstrates this invention, this invention is not limited to these Examples. The measurement and evaluation methods employed in the present invention are as follows.

<Peeling power>

Using a tensile tester (Autograph AG-IS manufactured by Shimadzu Corporation), the peeling force of the release sheet in the outer periphery of the sheet for forming a resin film was measured at a tensile rate of 300 mm/min, T peel method, temperature/humidity = 23°C It measured under the conditions of /50%RH.

<Adhesive force>

The outer peripheral part of the sheet|seat for resin film formation was cut out to 15 mm x 25 mm, it was set as the sample, and it affixed to SUS (stainless steel board). Next, using a tensile tester (Autograph AG-IS manufactured by Shimadzu Corporation), according to JIS Z0237:2009, the adhesive force of the sample was measured for the tensile rate of 300 mm/min, 180° peeling method, temperature/humidity = 23°C/50 It measured under the conditions of %RH.

<Adhesive adhesion between support sheets or resin film forming layers and electrodeposition to a release sheet>

The adhesion between the supporting sheets or the resin film forming layers (hereinafter, adhesion evaluation) and electrodeposition to the release sheet (hereinafter, electrodeposition evaluation) were performed as follows.

When the release sheet is removed from the sheet laminate for forming a resin film, whether the supporting sheets of the sheet for forming a resin film or the resin film forming layers are bent in a direction in which they overlap and adhere to each other, or the sheet for forming a resin film is electrodeposited on the release sheet. Whether or not was visually confirmed.

Preparation of adhesive for lamination and adhesive for fixing

Acrylic polymer (2-ethylhexyl acrylate / methyl methacrylate / 2-hydroxyethyl acrylate = 80/10/10 (mass ratio), weight average molecular weight: 800,000) as a main raw material, the solid content of the main raw material 100 mass With respect to the part, the methyl ethyl ketone (MEK) solution (25% of solid content concentration) which added 1 mass part of trimethylol propane adduct tolylene diisocyanate was adjusted, and it was set as the adhesive for lamination|stacking.

Moreover, as an adhesive for fixation, the thing similar to the adhesive for lamination|stacking was prepared.

Preparation of support sheet A

As a base material constituting the support sheet, a polyolefin base material (thickness: 80 µm) was prepared.

In addition, 21.4 g (2-hydroxyl of the acrylic polymer) per 100 g of the acrylic polymer (lauryl acrylate/2-hydroxyethyl acrylate = 80/20 (mass ratio), weight average molecular weight: 800,000) An energy-beam curable polymer (weight average molecular weight: 700,000) was obtained by making methacryloyloxyethyl isocyanate of 80 mol per 100 mol of ethyl acrylate units react.

With respect to 100 mass parts of solid content of an energy ray-curable polymer, 8 mass parts of trimethylolpropane adduct tolylene diisocyanate and 3 mass parts of 1-hydroxycyclohexylphenyl ketone MEK solution (25% of solid content concentration) which added were adjusted and supported The adhesive for forming the adhesive layer of sheet A was obtained.

Next, it coated so that the thickness of an adhesive layer might be set to 10 micrometers on the peeling process surface of the PET film (thickness: 50 micrometers) which carried out the peeling process of the said adhesive.

Then, the base material and the adhesive layer were bonded together, and the support sheet A was obtained.

Preparation of support sheet B

As a base material constituting the support sheet, a polyolefin base material (thickness: 70 µm) was prepared.

In addition, 13.4 g (2-ethylhexyl acrylate/2-hydroxyethyl acrylate = 80/20 (mass ratio), weight average molecular weight: 800,000) of the acrylic polymer per 100 g of the acrylic polymer (2-ethylhexyl acrylate/2-hydroxyethyl acrylate) Methacryloyloxyethyl isocyanate of 50 mol per 100 mol of hydroxyethyl acrylate units) was made to react, and the energy-beam curable polymer (weight average molecular weight: 800,000) was obtained.

Trimethylolpropane adduct tolylene diisocyanate, 2,2-dimethoxy-1,2-diphenylethan-1-one, and 1-hydroxycyclohexylphenyl ketone with respect to 100 parts by mass of the solid content of the energy ray-curable polymer MEK solution (25% of solid content concentration) which added 1 mass part of each was adjusted, and the adhesive for forming the adhesive layer of the support sheet B was obtained.

Next, it coated so that the thickness of an adhesive layer might be set to 30 micrometers on the peeling process surface of the PET film (thickness: 50 micrometers) which carried out the peeling process of the said adhesive.

Then, the base material and the adhesive layer were bonded together, and the support sheet B was obtained.

Preparation of a composition for forming a resin film

Acrylic polymer (butyl acrylate / methyl methacrylate / glycidyl methacrylate / 2-hydroxyethyl acrylate = 55/10/20/15 (mass ratio), weight average molecular weight: 800,000) 15 parts by mass, bisphenol 25 parts by mass of A-type epoxy resin (Nippon Catalyst BPA328), 25 parts by mass of triphenylene-type epoxy resin (Nippon Kayaku EPPN-502H), 34 parts by mass of phenolic resin (Showa Polymer BRG556) and an imidazole-based compound (Shikoku Chemical 2PHZ- PW) The composition for resin film formation which consists of 1 mass part was adjusted.

(Example 1)

Preparation of jig adhesive layer

As a long release sheet, the PET film (thickness: 50 micrometers) which carried out the peeling process was prepared.

The adhesive for lamination|stacking was coated on the peeling process surface of the said release sheet so that the thickness of the adhesive layer for lamination|stacking might be set to 5 micrometers. Next, the adhesive layer for lamination|stacking and the core material (polypropylene base material, thickness: 40 micrometers) were bonded together.

In the same procedure as described above, on the release-treated surface of another release sheet, a fixing pressure-sensitive adhesive layer having a thickness of 5 μm is formed and bonded to the core material, and the release sheet, the lamination pressure-sensitive adhesive layer, the core material, and the fixing pressure-sensitive adhesive layer are formed. A laminate in which the layers and the release sheet were laminated in this order (laminate for a jig adhesive layer) was obtained.

Manufacture of sheet laminate for resin film formation

The release sheet on the side of the adhesive layer for lamination|stacking was removed from the laminated body for jig|tool adhesive layers, and it molded in the circular shape of diameter 330mm from the side of the adhesive layer for lamination|stacking. Molding was performed so that the adhesive layer for lamination|stacking, a core material, and the adhesive layer for fixing were cut completely, and it performed so that 30 micrometers might be cut in the release sheet by the side of the adhesive layer for fixing. That is, the cut-out depth d3 formed the cut-out part D3 which is 30 micrometers.

Then, the laminated body which consists of the adhesive layer for lamination|stacking cut out circularly, a core material, and the adhesive layer for fixing was removed, the circular internal opening was formed, and the jig|tool adhesive layer was manufactured on the peeling sheet.

Moreover, on the peeling process surface of the PET film (thickness: 50 micrometers) which carried out the peeling process of said composition for resin film formation, it coated so that the thickness of the resin film forming layer might be set to 20 micrometers.

Then, the resin film forming layer and the adhesive layer of the support sheet A obtained above were bonded together, and the laminated body which consists of the support sheet A and the resin film forming layer was obtained.

Next, the resin film forming layer of the laminated body which consists of a support sheet A and a resin film forming layer was affixed to the jig|tool adhesive layer on the release sheet, and the sheet|seat for resin film formation was formed on the release sheet.

Finally, a sheet for forming a resin film was molded into a circle having a diameter of 370 mm in a circular inner opening and concentric circle shape with the circular inner opening of the jig adhesive layer, unnecessary parts were removed, and a sheet laminate for forming a resin film of a third aspect was obtained. Molding was performed so that the sheet for resin film formation was cut completely, and 30 micrometers was cut in the release sheet. That is, the cut-out depth d1 formed the cut-out part D1 of 30 micrometers. Each evaluation was performed using this sheet|seat laminated body for resin film formation. A result is shown in Table 1.

(Example 2)

Except having made the cutting depth of the cut part D1 into 35 micrometers, it carried out similarly to Example 1, the sheet|seat laminated body for resin film formation was obtained, and each evaluation was performed. A result is shown in Table 1.

(Example 3)

Manufacture of sheet laminate for resin film formation

As a long release sheet, the PET film (thickness: 50 micrometers) which carried out the peeling process was prepared.

The above-mentioned composition for forming a resin film was coated on the release-treated surface of the release sheet so that the thickness of the resin film forming layer was set to 20 µm, and another release sheet (PET film, thickness: 50 µm) was laminated on the resin film forming layer. .

Next, one release sheet was removed, and the resin film forming layer was molded into the circular shape of diameter 330mm. Molding was performed so that the resin film forming layer was completely cut and 30 micrometers cut into the release sheet. That is, the cut-out depth d2 formed the cut-out part D2 which is 30 micrometers. Thereafter, the remaining resin film forming layer was removed to obtain a circular resin film forming layer on the release sheet.

And the adhesive layer of the support sheet A was affixed to the resin film forming layer on a release sheet, and the sheet|seat for resin film formation was formed on the release sheet.

Finally, the resin film forming layer was formed concentrically with the circular resin film forming layer in a circular shape with a diameter of 370 mm, unnecessary portions were removed, and the sheet laminate for resin film forming according to the first aspect was obtained. Molding was performed so that the sheet for resin film formation was cut completely, and 30 micrometers was cut in the release sheet. That is, the cutting depth d1 formed the cut-out part D1 of 30 micrometers. Each evaluation was performed using this sheet|seat laminated body for resin film formation. A result is shown in Table 1.

(Example 4)

Except having made the cutting depth of the cut part D1 into 35 micrometers, it carried out similarly to Example 3, the sheet|seat laminated body for resin film formation was obtained, and each evaluation was performed. A result is shown in Table 1.

(Comparative Example 1)

Instead of the support sheet A, except having used the support sheet B, it carried out similarly to Example 3, the sheet|seat laminated body for resin film formation was obtained, and each evaluation was performed. A result is shown in Table 1.

(Comparative Example 2)

Instead of the support sheet A, except having used the support sheet B, it carried out similarly to Example 4, the sheet|seat laminated body for resin film formation was obtained, and each evaluation was performed. A result is shown in Table 1.

100: sheet laminate for resin film formation
10: sheet for forming a resin film
11: support sheet
12: resin film forming layer
13: peeling sheet
D1: Cut-out
D2: Cut-out
D3: Cut-out

Claims (4)

It is made by laminating a release sheet on a resin film forming layer of a sheet for forming a resin film comprising a support sheet and a resin film forming layer,
The peeling force of the peeling sheet in the outer peripheral part of the sheet|seat for resin film formation is 0.05 N/25 mm or less,
The sheet laminated body for resin film formation whose adhesive force with respect to SUS in the outer peripheral part of the sheet|seat for resin film formation is 1.0 N/25 mm or less. The method of claim 1,
In the release sheet, a cutout is formed along the outer periphery of the sheet for forming a resin film from the surface on the side of the resin film forming layer,
The sheet laminated body for resin film formation whose cutting depth of a cut part is more than 1/2 of a peeling sheet thickness. 3. The method according to claim 1 or 2,
A sheet laminate for forming a resin film, wherein the release sheet has a thickness of 50 µm or more. 4. The method of claim 3,
In the release sheet, a cutout is formed along the outer periphery of the sheet for forming a resin film from the surface on the side of the resin film forming layer,
The sheet laminated body for resin film formation whose cutting depth of a cut part is more than 25 micrometers.

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