CN111655470A

CN111655470A - Long laminated sheet and roll thereof

Info

Publication number: CN111655470A
Application number: CN201980010181.7A
Authority: CN
Inventors: 上道厚史; 冈本直也; 中石康喜
Original assignee: Lintec Corp
Current assignee: Lintec Corp
Priority date: 2018-01-24
Filing date: 2019-01-22
Publication date: 2020-09-11
Also published as: KR102637843B1; JP7153034B2; TW201942280A; KR20200112831A; WO2019146605A1; JPWO2019146605A1; TWI797238B

Abstract

The present invention provides a long laminated sheet including a support sheet with a resin film forming layer and a long peeling sheet, wherein the support sheet with the resin film forming layer has a substantially rectangular support sheet and a substantially rectangular resin film forming layer formed on the support sheet, and has a substantially rectangular ring frame holding member for holding a ring frame in a region surrounding the resin film forming layer in a plan view, a plurality of support sheets with the resin film forming layer are temporarily adhered to an inner side of a peeling treatment surface of the peeling sheet in a short side direction in a peelable manner along a long side direction of the peeling sheet, and auxiliary sheets are continuously laminated at both ends of the peeling treatment surface of the peeling sheet in a short side direction in order to eliminate a thickness difference of the long laminated sheet, and the long laminated sheet can prevent a tunnel phenomenon from occurring on the auxiliary sheets. In the long laminated sheet, the average peeling force between the auxiliary sheet and the peeling sheet is 50mN/100mm or more, or the auxiliary sheet is not provided.

Description

Long laminated sheet and roll thereof

Technical Field

The present invention relates to a long laminated sheet including a support sheet with a resin film formation layer for forming a resin layer such as an adhesive layer or a protective film on a semiconductor package formed by resin-sealing a plurality of semiconductor chips, a long release sheet, and an auxiliary sheet, and a roll material in which the long laminated sheet is wound in a roll shape. In particular, the present invention relates to a technique for eliminating a tunnel phenomenon that may occur in an auxiliary sheet when a long laminated sheet is bent at a large angle and a support sheet with a resin film forming layer is peeled from a long peeling sheet.

Background

In recent years, electronic devices have been made smaller, lighter, and more sophisticated, and accordingly, semiconductor devices mounted in electronic devices have been also required to be made smaller, thinner, and more dense. Semiconductor chips are sometimes mounted in packages that are close to their size. Such a Package is sometimes called a CSP (Chip Scale Package). Examples of the CSP include a WLP (Wafer Level Package) completed in a Wafer-scale process to a final packaging process, a PLP (Panel Level Package) completed in a Panel-scale process larger than a Wafer-scale process to a final packaging process, and the like.

WLP and PLP can be classified into Fan-In (Fan-In) type and Fan-Out (Fan-Out) type. In the fan-out WLP and PLP, a semiconductor chip is covered with a sealing material so as to be an area larger than the chip size, and a sealing body of the semiconductor chip is formed, and a rewiring layer and an external electrode are formed not only on a circuit surface of the semiconductor chip but also on a surface area of the sealing material.

For example, patent document 1 describes a method of manufacturing a semiconductor package in which a semiconductor package is formed by forming an extended wafer by surrounding a plurality of semiconductor chips formed by singulating (singulating) a semiconductor wafer with a mold member and leaving a circuit formation surface, and by extending a rewiring pattern to a region other than the semiconductor chips. In the manufacturing method described in patent document 1, a dicing step is performed in which the semiconductor wafer is singulated while being attached to an adhesive tape for dicing (hereinafter, also referred to as a "dicing sheet"). Such a resin sealing body including a plurality of semiconductor chips is hereinafter sometimes referred to as a "chip set package". The process of obtaining the individual CSPs by dicing may be referred to as "package dicing".

In the package dicing method, a plurality of semiconductor chips are generally placed on a rectangular substrate, collectively sealed with resin, and external terminals are formed, thereby obtaining a rectangular package (chip set package) made of a chip set sealed with resin. This is because a rectangular shape is preferable from the viewpoint of efficiency in arranging chips and transportation and storage of subsequent packages.

Then, the chip package is diced to obtain a semiconductor device such as a CSP. In the step of dicing the chip group package, a rectangular dicing sheet corresponding to the shape of the package is placed on a frame for dicing, and the chip group package is attached to the dicing sheet, and the package is diced (patent documents 2 and 3).

Various proposals have been made for methods of manufacturing chipset packages. For example, the semiconductor chip is temporarily adhered to a holding tool such as a resin tape. At this time, the circuit surface and bump (bump) surface of the semiconductor chip are faced upward, and the back surface side of the chip is temporarily adhered to the resin tape. Then, a lead (lead) is attached to the circuit surface and the bump surface for external connection, and resin sealing is performed together. Then, the resin tape is peeled off, thereby obtaining a chip set package. The chip set package obtained through such a step is obtained in a structure in which the back surface of the chip is exposed. Then, dicing is performed using the dicing sheet as described above, and a divided semiconductor device is obtained.

When the back surface of the chip is exposed, the durability and reliability of the semiconductor device may be impaired. Therefore, a protective film is generally formed on the exposed surface of the chip. The protective film can improve the breaking strength and can effectively play a role in printing product numbers and the like on semiconductor devices. When the semiconductor device obtained by dicing is mounted on another member, an adhesive layer is provided on the exposed surface of the chip of the semiconductor device, and the semiconductor device can be bonded to another member.

It is troublesome to form a protective film and mount an adhesive layer on each of the divided semiconductor devices. Further, when the respective treatments are performed, the thicknesses of the protective film and the adhesive layer are not constant, and thus variation in product quality may occur. Therefore, it is considered that a process of collectively forming a protective film and an adhesive layer on a chip package having a structure in which the rear surface of a chip is exposed and then performing dicing is advantageous in terms of the process. Hereinafter, a layer for forming a resin film such as a protective film or an adhesive layer may be referred to as a "resin film-forming layer".

Various methods of forming a resin film-forming layer on a semiconductor chip are known. That is, a resin film-forming layer such as a precursor layer of a protective film or an adhesive layer is attached to one surface of a semiconductor wafer, and then the semiconductor wafer and the resin film-forming layer are simultaneously diced to obtain a semiconductor chip having the resin film-forming layer on one surface. In order to continuously perform this step, a sheet for wafer processing such as a dicing die or a dicing sheet with a protective film forming layer (patent document 4) is known. Since these wafer processing sheets are assumed to be attached to a substantially circular silicon wafer, a circular resin film-forming layer is peelably laminated on a circular dicing sheet.

However, as described above, the chipset package is formed in a rectangular shape. This is because a rectangular shape is preferable from the viewpoint of efficiency in arranging chips and transportation and storage of subsequent packages.

When a conventional circular dicing sheet with a resin film forming layer is applied to such a rectangular chip package, only the maximum square portion of the circular resin film forming layer can be used, and the peripheral portion is not used and is discarded as it is. Specifically, the resin film-forming layer is assumed to be circular with a radius of 10cm (area of about 314 cm)²) In the case where the maximum area of the square is 200cm²(2^1/2× 10cm square), the effective area ratio of the resin film-forming layer was only 63.7%.

Therefore, it has been studied to increase the effective area ratio of the resin film forming layer by using a rectangular support sheet with the resin film forming layer, in which the rectangular resin film forming layer is formed on the rectangular support sheet such as the rectangular dicing sheet.

In the support sheet with a resin film-forming layer, a resin film-forming layer having a slightly smaller area than the support sheet may be stacked on a support sheet having a larger area. An adhesive ring frame holding member for temporarily adhering to the ring frame is provided in a manner to surround a use area of the resin film forming layer. The support sheet with the resin film forming layer is laminated on the long release sheet. The long laminated sheet is marketed as a material wound in a roll form. In the long laminated sheet, there are a portion where the support sheet with the resin film forming layer is laminated and a portion where the support sheet with the resin film forming layer is not laminated, and a portion having a different thickness is inevitably generated. If a long laminate sheet having an uneven thickness is wound in a roll shape, winding collapse may occur. Further, a gap is generated at the side of the roll due to the difference in thickness, and dust or the like enters from the gap to contaminate the resin film-forming layer.

In order to solve such a problem, it has been studied to leave auxiliary sheets at both ends of the long laminated sheet in the short direction along the long direction. Through setting up the auxiliary sheet, the thickness of rectangular lamination piece becomes even, has prevented the coiling of coil stock and has collapsed, has still improved the stability of transporting when unreeling in addition. Further, since the auxiliary sheet exists in the gap of the side portion of the roll, the entry of dust can also be prevented. Fig. 1A shows a typical example of the long laminated sheet 2 in which long auxiliary sheets 15 are continuously laminated on both ends in the short-side direction of one surface of a long release sheet 14, and a plurality of support sheets 10 with resin film forming layers are temporarily bonded to the inner side in the short-side direction so as to be peelable along the long-side direction of the release sheet and to be independent. Fig. 1A shows a state in which a long laminate 2 is unwound from a roll 1.

However, when the support sheet 10 with a resin film forming layer is peeled from the long laminated sheet 2 as described above and transferred to an adherend such as a chip set package, a tunnel phenomenon may occur in the auxiliary sheet 15.

When the support sheet 10 with the resin film forming layer is peeled from the long laminated sheet 2, as shown in fig. 6A and 6B, the long laminated sheet 2 is unwound from the roll 1, conveyed by a guide roller 41, and the long laminated sheet 2 is bent at a large angle by a peeling plate (peel plate) 40. By bending at a large angle, the tip portion of the support sheet 10 with the resin film forming layer rises from the long release sheet 14 to become a release starting point. Only the support sheet 10 with the resin film forming layer is peeled from the long laminated sheet 2 and transferred to a chip package 44, a ring frame 45, and the like, which are an adherend. The auxiliary sheet 15 passes through the

guide rollers

42 and 43 together with the long release sheet 14, and is wound up and collected as a waste tape 46. In fig. 6A, the auxiliary piece is omitted.

Here, focusing on the auxiliary sheet 15 and the long peeling sheet 14, fig. 6C shows an enlarged view of the vicinity of the peeling plate 40 and the

guide rollers

42 and 43.

At the time of peeling, the long peeling sheet 14 is in contact with the peeling plate 40, and the auxiliary sheet 15 is located on the long peeling sheet 14. Since both are simultaneously bent at a large angle and the distance from the peeling plate is different, the auxiliary sheet 15 is stretched longer than the long peeling sheet 14. Since the elongation of the auxiliary sheet 15 is not eliminated until reaching the

guide rollers

42 and 43, the elongation of the auxiliary sheet 15 accumulates between the peeling plate 40 and the

guide rollers

42 and 43. As a result, the length of the long release sheet 14 and the length of the auxiliary sheet 15 are different. In order to eliminate the difference in length, the auxiliary sheet 15 is peeled off from the long release sheet 14. This phenomenon is referred to as "tunneling".

Documents of the prior art

Patent document

Patent document 1: international patent publication No. WO2010/058646

Patent document 2: japanese patent laid-open publication No. 2002-3798

Patent document 3: japanese patent laid-open No. 2010-83921

Patent document 4: international patent publication No. WO2013/047674

Disclosure of Invention

Technical problem to be solved by the invention

If the support sheet 10 with the resin film forming layer is continuously peeled from the long laminated sheet 2, the tunnel phenomenon continues to occur and the tunnel expands. Eventually, the hanging auxiliary piece 15 may contact other components of the mechanical device, causing the mechanical device to stop operating.

Therefore, an object of the present invention is to prevent the occurrence of a tunnel phenomenon when a support sheet having a resin film forming layer is peeled from a long laminate sheet as described above.

Means for solving the problems

The present invention for solving the above problems includes the following gist.

The long laminated sheet of the first aspect of the present invention is characterized by comprising a support sheet having a resin film forming layer and a long release sheet,

the support sheet with the resin film forming layer has a substantially rectangular support sheet and a substantially rectangular resin film forming layer formed on the support sheet, and has a substantially rectangular ring-shaped frame holding member for holding the ring-shaped frame in a region surrounding the resin film forming layer in a plan view,

a long auxiliary sheet is continuously laminated on both ends of the stripping processing surface of the stripping sheet in the short side direction,

a plurality of support sheets with resin film forming layers are temporarily adhered to the inner side of the peeling treatment surface of the peeling sheet in the short side direction in a manner of being peelable along the long side direction of the peeling sheet and independently,

the average peeling force between the auxiliary sheet and the peeling sheet is 50mN/100mm or more.

The long laminated sheet of the second aspect of the present invention is characterized by comprising a support sheet having a resin film forming layer and a long release sheet,

the release-treated surface of the release sheet is exposed at both ends in the short-side direction on the release-treated surface of the release sheet,

the support sheets with the resin film forming layer are temporarily bonded to the inner side of the release-treated surface of the release sheet in the short-side direction so as to be peelable along the long-side direction of the release sheet and independently.

The long laminated sheet according to the third aspect of the present invention is characterized by comprising a support sheet having a resin film forming layer and a long release sheet,

a plurality of support sheets with resin film forming layers are temporarily adhered to the peeling treatment surface of the peeling sheet in a manner of being peelable along the longitudinal direction of the peeling sheet and independently,

both end portions in the short side direction of the support sheet with the resin film forming layer are located on the same straight line as both end portions in the short side direction of the release sheet.

The web of the present invention is formed by winding the long laminated sheet according to any of the first to third aspects into a roll shape.

Effects of the invention

According to the roll of the long laminated sheet of the present invention, it is possible to prevent the occurrence of the tunnel phenomenon when the support sheet with the resin film forming layer is peeled from the long laminated sheet.

Drawings

Fig. 1A shows a state in which a part of the material is unwound from the long laminated sheet in the first embodiment.

FIG. 1B shows a cross-sectional view taken along line A-A of FIG. 1A.

FIG. 1C shows a cross-sectional view taken along line B-B of FIG. 1A.

Fig. 2A shows a state in which a part of the material is unwound from the long laminated sheet in the second embodiment of the first embodiment.

Fig. 2B shows a cross-sectional view along line a-a of fig. 2A.

Fig. 2C shows a cross-sectional view along line B-B of fig. 2A.

Fig. 3A shows a state in which a part of the material is unwound from the long laminated sheet in the third embodiment of the first embodiment.

Fig. 3B shows a cross-sectional view taken along line a-a of fig. 3A.

Fig. 3C shows a cross-sectional view along line B-B of fig. 3A.

Fig. 4 shows a state in which a part of the web is unwound from the long laminate in the second mode.

Fig. 5 shows a state in which a part of the web is unwound from the long laminated sheet in the third embodiment.

Fig. 6A shows a state in which the support sheet with the resin film forming layer is transferred from the long laminated sheet to an adherend.

Fig. 6B shows a perspective view of fig. 6A.

Fig. 6C shows a state where the tunnel phenomenon occurs.

Detailed Description

Hereinafter, the web of the long laminated sheet of the present invention will be described in detail.

In the present invention, "substantially rectangular" includes not only precise squares and rectangles but also slightly deformed shapes similar thereto. For example, each side of a square or rectangle may be curved or bent, and the corner may be a curved line with a circular arc, or may be formed with a short straight line with a circular arc whose direction changes continuously.

The "support sheet" is a sheet-like member capable of supporting the resin film-forming layer in a releasable manner, and may be a release sheet or an adhesive sheet such as a so-called dicing sheet.

The "resin film-forming layer" includes both a precursor layer for forming a protective film and an adhesive layer. The precursor layer for forming the protective film can be cured by a prescribed operation to form the protective film.

The "support sheet with a resin film-forming layer" refers to a laminate of the support sheet and the resin film-forming layer. Further included is a generally rectangular ring frame retaining member for retaining the ring frame.

The "release sheet" is a sheet whose surface release force is controlled, and may be made of resin, paper, or cloth. The surface peeling force is controlled by a peeling agent or the like, but is not limited thereto.

The "long" is a rectangular shape and is a shape sufficiently longer in the longitudinal direction than in the short-side direction.

The "auxiliary sheet" is a layered body formed at both ends in the short side direction of the long release sheet.

The "long laminated sheet" includes a long release sheet, long auxiliary sheets continuously laminated on both ends of the release sheet in the short-side direction, and a support sheet with a resin film forming layer temporarily adhered to the inner side of the release sheet in the short-side direction in a releasable manner.

The "web" refers to an object obtained by winding the long laminated sheet into a roll.

Hereinafter, a support sheet with a resin film forming layer, a long laminated sheet including the support sheet with a resin film forming layer, and a roll thereof will be described with reference to the drawings.

The support sheet with the resin film forming layer has a substantially rectangular support sheet and a substantially rectangular resin film forming layer formed peelably on the support sheet, and has a substantially rectangular annular frame holding member for holding an annular frame in a region surrounding the resin film forming layer when viewed from the resin film forming layer side.

The support sheet with the resin film forming layer is temporarily bonded to the inner side of the long release sheet in the short side direction on the release treated surface thereof so as to be peelable along the long side direction of the release sheet. Hereinafter, a specific embodiment of the long laminated sheet will be described, but the present invention is not limited thereto.

(first mode)

As shown in fig. 1 to 3, in the long laminated sheet of the first embodiment, the long

auxiliary sheets

15, 25, 35 are continuously laminated on both ends in the short-side direction on the release treated surface of the

long release sheets

14, 24, 34, and the

support sheets

10, 20, 30 with the resin film forming layer are temporarily adhered to the inner side in the short-side direction on the release treated surface of the long release sheets, thereby constituting the long laminated sheets 2,4, 6. The long laminated sheet of the first embodiment can be classified into the following 3 types depending on the structure of the support sheet with the resin film forming layer.

[ long laminate sheet: first embodiment

Fig. 1 shows a first configuration of an elongate laminate. Fig. 1A shows a state in which a long laminate sheet 2 is unwound from a roll 1, fig. 1B is a sectional view taken along line a-a of fig. 1A, and fig. 1C is a sectional view taken along line B-B of fig. 1A.

As shown in fig. 1B, the support sheet 10 with a resin film forming layer includes a support sheet 11, a resin film forming layer 12 laminated on the entire one surface of the support sheet 11, and a ring-shaped frame holding member 13 formed on the outer peripheral portion of one surface of the resin film forming layer 12. The support sheet 11 and the resin film formation layer 12 are laminated in a peelable manner. When the support sheet 11 is a release sheet, the resin film formation layer 12 is formed on the release-treated surface. When the support sheet 11 is an adhesive sheet such as a dicing sheet, the resin film forming layer 12 is formed on the adhesive layer. When the support sheet 11 is an adhesive sheet, the specific form of the adhesive sheet is the same as that of the second form described later.

The support sheets 10 with the resin film forming layer are temporarily bonded to the inner side in the short side direction so as to be separated and peelable from each other along the long side direction of the long release sheet 14.

The long auxiliary pieces 15 are stacked on both ends in the short direction along the long direction of the long peeling piece 14. The auxiliary sheet 15 has the same laminated structure as the outer peripheral portion of the support sheet 10 with the resin film formation layer. That is, the auxiliary sheet 15 is made of the same material as the support sheet 11, the resin film formation layer 12, and the ring frame holding member 13.

The release sheet 14 is exposed between the support sheets with the resin film forming layer, and the auxiliary sheet 15 may extend inward in the short side direction between the support sheets. That is, the width of the auxiliary sheet is not uniform, and the auxiliary sheet may be formed so as to have a larger width in a portion between the support sheets of the resin film-formed layer (hereinafter, this may be referred to as "width-enlarged portion"). Fig. 1C shows a cross-sectional view of the expanded width portion.

Such an elongate laminate 2 can be manufactured, for example, in the following manner.

An adhesive layer (may be a double-sided adhesive tape) to be the ring-shaped frame holding member 13 is attached to the long release sheet 14. The adhesive layer was die cut into rectangles. At this time, the die was cut to such an extent that the adhesive layer was completely cut and a shallow cut was made in the release sheet. Next, the adhesive layer subjected to die cutting was removed, and the adhesive layer having a rectangular opening was left on the release sheet 14.

A laminate of a support sheet and a resin film-forming layer is prepared in advance, and is laminated on the surface of the release sheet 14 having the adhesive layer.

Next, the laminated body is cut in accordance with the shape of the ring frame. At this time, the cuts were formed so that the rectangular opening of the adhesive layer was almost at the center of the die-cut shape. At the same time, the cuts are made according to the shape of the auxiliary piece 15 determined in advance. In this case, the die was cut into the laminate to such an extent that the laminate was completely cut and a shallow cut was formed in the release sheet, as described above. Then, by removing the remaining portion (scrap portion) between the support sheet with the resin film forming layer and the auxiliary sheet, the support sheet 10 with the resin film forming layer having a predetermined shape is obtained on the release sheet 14, and the auxiliary sheets 15 are left at both ends in the short side direction of the release sheet 14, thereby obtaining the long laminated sheet 2 having the above-described structure.

[ long laminate sheet: second embodiment

Fig. 2 shows a second configuration of an elongate laminate. Fig. 2A shows a state where the long laminated sheet 4 is unwound from the roll 3, fig. 2B shows a cross-sectional view taken along line a-a of fig. 2A, and fig. 2C shows a cross-sectional view taken along line B-B of fig. 2A.

As shown in fig. 2B, the support sheet 20 with a resin film forming layer includes a support sheet 21 and a resin film forming layer 22 laminated on an inner peripheral portion of one surface of the support sheet 21. The support sheet 21 and the resin film formation layer 22 are laminated in a peelable manner. The support sheet 21 in the second embodiment is an adhesive sheet such as a dicing sheet. The adhesive sheet has a base material 21A and an adhesive layer 21B. When the release sheet 24 is removed, the adhesive layer 21B is exposed on the outer periphery of the resin film formation layer 22, and functions as the ring frame holding member 23.

The support sheets 20 with the resin film forming layer are temporarily bonded to the inner side in the short side direction so as to be separated and peelable from each other along the long side direction of the long release sheet 24.

The long auxiliary pieces 25 are stacked on both ends in the short direction along the long direction of the long peeling piece 24. The auxiliary sheet 25 has the same laminated structure as the outer peripheral portion of the support sheet 20 with a resin film forming layer. That is, the auxiliary sheet 25 is made of the same material as the base material 21A and the adhesive layer 22B.

The peeling sheet 24 is exposed between the support sheets of the resin film-formed layer, and the auxiliary sheet 25 may extend inward in the short-side direction between the support sheets. That is, the width of the auxiliary sheet is not uniform, and the auxiliary sheet may be formed so as to have a larger width in a portion between the support sheets of the resin film-formed layer (hereinafter, this may be referred to as "width-enlarged portion"). Fig. 2C shows a cross-sectional view of the expanded width portion.

Such an elongate laminate 4 can be manufactured, for example, in the following manner.

A resin layer constituting the resin film forming layer is formed on the entire surface of the long release sheet 24, and the resin layer is die-cut into a rectangular shape. At this time, the die cutter was cut into the release sheet to such an extent that the resin film-forming layer was completely cut and a shallow cut was formed. Next, the periphery of the die-cut resin film forming layer is removed, and a rectangular resin film forming layer 22 is left on the release sheet 24.

An adhesive sheet having the base material 21A and the adhesive layer 21B is prepared in advance, and is laminated on the surface of the release sheet 24 having the resin film-forming layer 22.

Then, the adhesive sheet is cut in accordance with the shape of the ring frame. At this time, the resin film forming layer 22 is aligned so as to be almost at the center of the slit shape, and then cut. At the same time, a cut is made in the adhesive sheet according to the shape of the auxiliary sheet 25 determined in advance. At this time, the die cutter was cut into the release sheet to such an extent that the adhesive sheet was completely cut and a shallow cut was formed in the release sheet. Then, by removing the remaining portion (scrap portion) between the support sheet with the resin film forming layer and the auxiliary sheet, the support sheet 20 with the resin film forming layer having a predetermined shape is obtained on the release sheet 24, and the auxiliary sheets 25 remain at both ends in the short side direction of the release sheet 24, thereby obtaining the long laminated sheet 4 having the above-described structure.

[ long laminate sheet: third embodiment

Fig. 3 shows a third configuration of an elongate laminate. Fig. 3A shows a state where the long laminated sheet 6 is unwound from the web 5, fig. 3B is a sectional view taken along line a-a of fig. 3A, and fig. 3C is a sectional view taken along line B-B of fig. 3A.

As shown in fig. 3B, the support sheet 30 with a resin film forming layer includes a support sheet 31, a resin film forming layer 32 laminated on an inner peripheral portion of one surface thereof, and a ring-shaped frame holding member 33 formed on an outer peripheral portion of the resin film forming layer 32. The support sheet 31 and the resin film formation layer 32 are laminated in a peelable manner. When the support sheet 31 is a release sheet, the resin film formation layer 32 is formed on the release-treated surface. When the support sheet 31 is an adhesive sheet such as a dicing sheet, the resin film formation layer 32 is formed on the adhesive layer. When the support sheet 31 is an adhesive sheet, the specific form of the adhesive sheet is the same as that of the second form described above.

The support sheets 30 with the resin film forming layer are temporarily bonded to the inner side in the short side direction so as to be separated and peelable from each other along the long side direction of the long release sheet 34.

The long auxiliary pieces 35 are stacked on both ends in the short side direction along the long side direction of the long release sheet 34. The auxiliary sheet 35 has the same laminated structure as the outer peripheral portion of the support sheet 30 with the resin film formation layer. That is, the auxiliary sheet 35 is made of the same material as the support sheet 31 and the ring frame holding member 33.

The peeling sheet 34 is exposed between the support sheets of the resin film-formed layer, and the auxiliary sheet 35 may extend inward in the short-side direction between the support sheets. That is, the width of the auxiliary sheet is not uniform, and the auxiliary sheet may be formed so as to have a larger width in a portion between the support sheets of the resin film-formed layer (hereinafter, this may be referred to as "width-enlarged portion"). Fig. 3C shows a cross-sectional view of the expanded width portion.

Such an elongate laminate 6 can be manufactured, for example, in the following manner.

A resin layer constituting the resin film forming layer is formed on the entire surface of the long release sheet 34, and the resin layer is die-cut into a rectangular shape. At this time, the die cutter was cut into the release sheet to such an extent that the resin film-forming layer was completely cut and a shallow cut was formed. Next, the periphery of the die-cut resin film-forming layer is removed, and a rectangular resin film-forming layer 32 is left on the peeling sheet 34.

An adhesive layer (may be a double-sided adhesive tape) to be the ring frame holding member 33 is attached to another long support sheet. The adhesive layer was die cut into rectangles. At this time, the die was cut into the adhesive layer to such an extent that the adhesive layer was completely cut and a shallow cut was formed in the support sheet. Next, the adhesive layer subjected to die cutting was removed, and the adhesive layer having a rectangular opening portion was left on the long support sheet.

Next, the long release sheet 34 having the resin film forming layer 32 and the long support sheet having the adhesive agent layer having the rectangular opening are aligned and attached to each other so that the resin film forming layer 33 is aligned with the rectangular opening.

Next, the laminated body is cut from the support sheet side in accordance with the shape of the ring frame. At this time, the resin film forming layer 32 is aligned so as to be almost at the center of the slit shape, and then cut. At the same time, cuts are made in the laminate according to the shape of the auxiliary sheet 35 determined in advance. At this time, the die cutter was cut into the laminate to such an extent that the laminate was completely cut and a shallow cut was made in the release sheet. Then, by removing the remaining portion (scrap portion) between the support sheet with the resin film forming layer and the auxiliary sheet, the support sheet 30 with the resin film forming layer having a predetermined shape is obtained on the release sheet 34, and the auxiliary sheets 35 remain at both ends of the release sheet 34 in the short-side direction, thereby obtaining the long laminated sheet 6 having the above-described structure.

[ peeling force between the long-length peeling sheet and the auxiliary sheet ]

In the first aspect of the present invention, the average peel force between the long peel sheet 14 and the auxiliary sheet 15, the average peel force between the long peel sheet 24 and the auxiliary sheet 25, and the average peel force between the long peel sheet 34 and the auxiliary sheet 35 in the above 3 modes are 50mN/100mm or more, preferably 60mN/100mm or more, more preferably 70 to 400mN/100mm, and particularly preferably 80 to 300mN/100 mm.

Since the average peeling force between the long peeling sheet and the auxiliary sheet is high, even if the peeling plate is bent and then flattened, peeling does not occur between the long peeling sheet and the auxiliary sheet, and a tunnel phenomenon is prevented.

Here, the average peel force between the long release sheet and the auxiliary sheet is an average value of peel forces when the auxiliary sheet stacked on the end portion of the long release sheet is continuously pulled. When the width of the auxiliary sheet is increased, the peeling force of the auxiliary sheet is also increased. In the present invention, the peeling force when the auxiliary sheet having a length of 100mm or more is pulled by the pulling device is continuously measured, and the average value thereof is referred to as an average peeling force.

The average peeling force between the long release sheet and the auxiliary sheet can be controlled by appropriately selecting the release agent of the long release sheet and the material of the lowermost surface of the auxiliary sheet.

In the first embodiment, the materials of the long release sheet 14 and the ring frame holding member 13 are selected so that the release force at the interface between the release treated surface and the surface becomes large, whereby the above-described average release force can be achieved. Specifically, by blending a release agent for the release treatment of the long release sheet 14 and an adhesive for the annular frame holding member 13 with components having high compatibility with both of them, the release force at the interface between the release treated surface of the long release sheet 14 and the annular frame holding member 13 can be increased.

In the second embodiment, the materials of the long release sheet 24 and the adhesive agent layer 21B are selected so that the peeling force at the interface between the release-treated surface and the adhesive agent layer is large.

In the third embodiment, as in the first embodiment, the materials of the long release sheet 34 and the ring frame holding member 33 are selected so that the release force at the interface between the release treated surface and the ring frame holding member is large.

The resin film forming layer and the ring frame holding member are made of different materials. That is, a material that is easily peeled from the peel-treated surface of the long release sheet (incompatible material) is used for the resin film-forming layer. In this way, by selecting the material of each structural layer, the resin film-forming layer can be easily peeled from the long release sheet, and the peeling force between the long release sheet and the auxiliary sheet can be increased.

(second mode)

The long laminated sheet of the second aspect is not provided with auxiliary sheets at both ends in the short direction of the long release sheet as in the first to third aspects shown in the first aspect, but is characterized in that as shown in fig. 4, support sheets (10, 20, 30) with a resin film forming layer are temporarily adhered to the inner sides in the short direction of release sheets (14, 24, 34), and the release treated surface is exposed at both ends in the short direction.

In the production of the long laminated sheet of the first aspect, the entire outer peripheral portion of the support sheet with the resin film forming layer is removed as a surplus region (scrap portion), and the long laminated sheet of the second aspect is obtained.

Since the long laminated sheet of the second aspect does not include the auxiliary sheet, a tunnel phenomenon of the auxiliary sheet does not occur.

Since the long laminated sheet of the second embodiment does not include the auxiliary sheet, the uniformity of the thickness is impaired. However, since the resin film-forming layer and the support sheet are substantially rectangular, they can be formed on the surface of the release sheet in a large area. That is, the resin film-forming layer and the support sheet are laminated on most of the surface of the release sheet.

On the other hand, if the wafer is circular, the area is inevitably limited. That is, the area of the non-thickness region on the surface of the release sheet is larger than that in the case of the above-described rectangular shape, and the problem due to the difference in thickness becomes serious.

In the present invention, since the resin film forming layer and the support sheet are both formed in a substantially rectangular shape, the difference in irregularities on the surface of the release sheet is reduced as compared with the case of a circular shape, and therefore, a serious problem (such as winding collapse) due to the difference in thickness is less likely to occur, and the conveyance stability can be maintained relatively well.

Further, the thickness uniformity can be improved by shortening the interval between the support sheets with the resin film forming layer.

(third mode)

The long laminated sheet of the third aspect is not provided with auxiliary sheets at both ends in the short direction of the long release sheet as in the first to third aspects shown in the first aspect, but is configured such that both ends in the short direction of the support sheets (10, 20, 30) with the resin film forming layer and both ends in the short direction of the release sheets (14, 24, 25) are positioned on the same straight line as shown in fig. 5.

In order to obtain the long laminated sheet of the third aspect, in the case of manufacturing the long laminated sheet of the first aspect, as shown in fig. 5, the support sheet with the resin film formation layer may be formed in a large area, or after the support sheet with the resin film formation layer is manufactured in the same manner as in the first aspect, the outer portions may be cut along both end portions in the short side direction of the support sheet with the resin film formation layer.

Since the long laminated sheet of the third aspect does not include the auxiliary sheet, a tunnel phenomenon of the auxiliary sheet does not occur.

Since the long laminated sheet of the third aspect does not include the auxiliary sheet, the uniformity of the thickness is impaired. However, since the resin film-forming layer and the support sheet are substantially rectangular, they can be formed on the surface of the release sheet in a large area. That is, the resin film-forming layer and the support sheet are laminated on most of the surface of the release sheet.

On the other hand, if the wafer is circular, the area is inevitably limited. That is, the area of the non-thickness region on the surface of the release sheet is larger than that in the case of the rectangular shape, and the problem due to the difference in thickness becomes serious.

In the present invention, since the resin film forming layer and the support sheet are both formed in a substantially rectangular shape, the difference in irregularities on the surface of the release sheet is reduced as compared with the case of a circular shape, so that a serious problem (such as winding collapse) due to the difference in thickness is less likely to occur, and the conveyance stability can be maintained relatively well.

The long laminated sheet of the first to third aspects is generally marketed as a material roll wound in a roll shape.

Next, the support sheet, the resin film formation layer, the ring frame holding member, and the long peeling sheet will be described, but the following are non-limiting examples.

[ supporting sheet ]

The

support sheets

11 and 31 may be release sheets, or adhesive sheets such as dicing sheets described later may be used. Further, an adhesive sheet is used as the support sheet 21 in the second embodiment.

Examples of the release sheet include a polyethylene film, a polypropylene film, a polybutylene film, a polybutadiene film, a polymethylpentene film, a polyvinyl chloride film, a vinyl chloride copolymer film, a polyethylene terephthalate film, a polyethylene naphthalate film, a polybutylene terephthalate film, a polyurethane film, an ethylene-vinyl acetate copolymer film, an ionomer resin film, an ethylene- (meth) acrylic acid copolymer film, an ethylene- (meth) acrylate copolymer film, a polystyrene film, a polycarbonate film, a polyimide film, and a fluororesin film. In addition, crosslinked films of these films may also be used. Further, a laminated film of these films may also be used.

The surface tension of the surface of the release sheet in contact with the resin film formation layer is preferably 40mN/m or less, more preferably 37mN/m or less, and particularly preferably 35mN/m or less. The lower limit is usually about 25 mN/m. However, a heavy release type release sheet is more preferable than a "long release sheet" described later. Such a release sheet having a relatively low surface tension can be obtained by appropriately selecting a material, or can be obtained by applying a release agent to the surface of the release sheet and performing a release treatment.

As the release agent used for the release treatment, alkyd, silicone, fluorine, unsaturated polyester, polyolefin, wax, and the like can be used, and alkyd, silicone, fluorine-based release agents are particularly preferable because of their heat resistance.

In order to peel off the surface of a film or the like serving as a base material of a release sheet using the above-mentioned release agent, the release agent may be used as it is without a solvent, or may be diluted or emulsified with a solvent, and coated using a gravure coater, a meyer bar coater, an air knife coater, a roll coater or the like, and the release sheet coated with the release agent may be left at normal temperature or under heating, or cured by an electron beam to form a release agent layer.

Further, the surface tension of the release sheet may be adjusted by laminating films by wet lamination, dry lamination, hot melt lamination, melt extrusion lamination, coextrusion processing, or the like. That is, a laminate may be produced as the release sheet by laminating a film having a surface tension of at least one side within a preferable range as a surface of the release sheet which is in contact with the resin film formation layer with another film so that the surface is in contact with the resin film formation layer.

As the support sheet, an adhesive sheet such as a dicing sheet in which an adhesive layer is formed on a base film may be used. In this embodiment, the resin film forming layer is laminated on the adhesive layer of the adhesive sheet. Examples of the substrate of the pressure-sensitive adhesive sheet include the films described above as release sheets. The adhesive layer may be a material having weak adhesiveness to the extent that the adhesive layer can be peeled off from the resin film-forming layer, or may be an energy ray-curable material whose adhesive force is reduced by irradiation with an energy ray. The adhesive layer can be formed by using various known adhesives (for example, general-purpose adhesives such as rubbers, acrylics, silicones, urethanes, vinyl ethers, etc., adhesives having irregularities on the surface, energy ray-curable adhesives, adhesives containing a thermal expansion component, etc.).

The thickness of the support sheet is usually 10 to 500 μm, preferably 15 to 300 μm, and particularly preferably 20 to 250 μm. When the support sheet is an adhesive sheet having an adhesive layer formed on a base material, the thickness of the adhesive layer in the support sheet is 3 to 50 μm.

[ resin film-forming layer ]

The resin

film forming layers

12, 22, and 32 are precursor layers for forming a protective film, or are formed of an adhesive layer. The functions required for the resin film-forming layer include at least (1) sheet-form retention, (2) initial adhesion, and (3) curability.

By adding an adhesive component to the resin film-forming layer, (1) sheet-like retention property and (3) curability can be imparted, and as the adhesive component, a first adhesive component containing a polymer component (a) and a curability component (B), or a second adhesive component containing a curability polymer component (AB) having properties of both the components (a) and (B) can be used.

The (2) initial adhesiveness, which is a function of temporarily adhering to the package in advance until the resin film-forming layer is cured, may be pressure-sensitive adhesiveness or a property of softening and adhering by heating. The initial adhesiveness (2) can be controlled by various properties of the binder component, adjustment of the blending amount of the inorganic filler (C) described later, and the like.

(first Binder component)

By containing the polymer component (a) and the curable component (B) in the first binder component, sheet-like retention and curability can be imparted to the resin film-forming layer. In addition, the first adhesive component does not contain the curable polymer component (AB) for the sake of easy distinction from the second adhesive component.

(A) Polymer component

The polymer component (a) is added to the resin film-forming layer for the main purpose of imparting sheet-like retention to the resin film-forming layer.

In order to achieve the above object, the weight average molecular weight (Mw) of the polymer component (A) is usually 20,000 or more, preferably 20,000 to 3,000,000. The weight average molecular weight (Mw) is a value measured by a Gel Permeation Chromatography (GPC) method (standard polystyrene). Based on the measurement of this method, for example, a high-speed column "TSK gurd column H" is used in a high-speed GPC apparatus "HLC-8120 GPC" manufactured by TOSOH CORPORATION_XL-H”、“TSK Gel GMH_XL”、“TSK GelG2000 H_XL"(all above are TOSOH CORPORATION manufacturing) connected in proper order and become the device, at chromatographic column temperature: 40 ℃, liquid transport speed: the measurement was performed under the condition of 1.0 mL/min using a differential refractometer as a detector.

For the sake of convenience, the polymer component (a) does not have a curing functional group described later, so as to be distinguished from the curable polymer (AB) described later.

As the polymer component (a), an acrylic polymer, a polyester, a phenoxy resin (for convenience of distinction from the curable polymer (AB) described later, it is limited to a material having no epoxy group), a polycarbonate, a polyether, a polyurethane, a polysiloxane, a rubber-based polymer, or the like can be used. The material may be one in which two or more kinds of the above are bonded, and for example, an acrylic urethane resin obtained by reacting an acrylic polyol which is an acrylic polymer having a hydroxyl group with a urethane prepolymer having an isocyanate group at a molecular end thereof, or the like may be used. Further, two or more kinds of polymers bonded to each other may be contained, or two or more kinds of the above may be used in combination.

(A1) Acrylic polymer

As the polymer component (a), an acrylic polymer (a1) is preferably used. The glass transition temperature (Tg) of the acrylic polymer (A1) is preferably in the range of-60 to 50 ℃, more preferably-50 to 40 ℃, and still more preferably-40 to 30 ℃. When the glass transition temperature of the acrylic polymer (a1) is high, there may be a case where the adhesiveness of the resin film-forming layer is lowered and the resin film cannot be transferred to a workpiece, or the resin film-forming layer after transfer or the resin film obtained by curing the resin film-forming layer is peeled from the workpiece. Further, when the glass transition temperature of the acrylic polymer (a1) is low, the peel force between the resin film-forming layer and the support sheet becomes large, and transfer failure of the resin film-forming layer may occur.

The weight average molecular weight of the acrylic polymer (A1) is preferably 100,000 to 1,500,000. When the weight average molecular weight of the acrylic polymer (a1) is high, there may be a case where the adhesion of the resin film-forming layer is lowered and the resin film-forming layer cannot be transferred to a workpiece, or the resin film-forming layer or the resin film is peeled from the workpiece after transfer. Further, when the weight average molecular weight of the acrylic polymer (a1) is low, the adhesion between the resin film-forming layer and the support sheet becomes high, and transfer failure of the resin film-forming layer may occur.

The acrylic polymer (a1) contains at least a (meth) acrylate in the constituent monomers.

Examples of the (meth) acrylic acid ester include alkyl (meth) acrylates having an alkyl group of 1 to 18 carbon atoms, specifically methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and the like; specific examples of the (meth) acrylic acid ester having a cyclic skeleton include cycloalkyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, and imide (meth) acrylate. Examples of the monomer include (meth) acrylate monomers exemplified as a monomer having a hydroxyl group, a monomer having a carboxyl group, and a monomer having an amine group, which will be described later.

In the present specification, the term (meth) acrylic acid means acrylic acid and methacrylic acid.

As the monomer constituting the acrylic polymer (a1), a monomer having a hydroxyl group may be used. By using such a monomer, a hydroxyl group can be introduced into the acrylic polymer (a1), and when the resin film-forming layer additionally contains the energy ray-curable component (B2), the compatibility with the acrylic polymer (a1) can be improved. Examples of the monomer having a hydroxyl group include (meth) acrylates having a hydroxyl group such as 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate; n-methylol (meth) acrylamide and the like.

As the monomer constituting the acrylic polymer (a1), a monomer having a carboxyl group may be used. By using such a monomer, a carboxyl group can be introduced into the acrylic polymer (a1), and when the resin film-forming layer additionally contains the energy ray-curable component (B2), the compatibility with the acrylic polymer (a1) can be improved. Examples of the monomer having a carboxyl group include (meth) acrylates having a carboxyl group such as 2- (meth) acryloyloxyethylphthalate and 2- (meth) acryloyloxypropylphthalate; (meth) acrylic acid, maleic acid, fumaric acid, itaconic acid, and the like. When an epoxy thermosetting component is used as the curable component (B) described later, the carboxyl group reacts with the epoxy group in the epoxy thermosetting component, and therefore the amount of the monomer having a carboxyl group is preferably small.

As the monomer constituting the acrylic polymer (a1), a monomer having an amino group may be used. Examples of such monomers include (meth) acrylates having an amino group such as monoethylamino (meth) acrylate.

As the monomer constituting the acrylic polymer (a1), other vinyl acetate, styrene, ethylene, α -olefin, and the like may be used.

The acrylic polymer (a1) may also be crosslinked. The crosslinking is carried out by adding a crosslinking agent to the composition for forming a resin film-forming layer, the crosslinkable functional group being reacted with the functional group of the crosslinking agent, the acrylic polymer (a1) before crosslinking having a crosslinkable functional group such as a hydroxyl group. By crosslinking the acrylic polymer (a1), the cohesive force of the resin film-forming layer can be adjusted.

Examples of the crosslinking agent include organic polyisocyanate compounds and organic polyimine compounds.

Examples of the organic polyisocyanate compound include an aromatic polyisocyanate compound, an aliphatic polyisocyanate compound, an alicyclic polyisocyanate compound, a trimer of the above organic polyisocyanate compound, and an isocyanate-terminated urethane prepolymer obtained by reacting the above organic polyisocyanate compound with a polyol compound.

Specific examples of the organic polyisocyanate compound include 2, 4-tolylene diisocyanate, 2, 6-tolylene diisocyanate, 1, 3-xylylene diisocyanate, 1, 4-xylylene diisocyanate, diphenylmethane-4, 4 '-diisocyanate, diphenylmethane-2, 4' -diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4, 4 '-diisocyanate, dicyclohexylmethane-2, 4' -diisocyanate, lysine diisocyanate, and the polyol adduct described above.

Specific examples of the organic polyimine compound include N, N ' -diphenylmethane-4, 4' -bis (1-aziridinecarboxamide), trimethylolpropane-tri- β -aziridinylpropionate, tetramethylolmethane-tri- β -aziridinylpropionate, and N, N ' -toluene-2, 4-bis (1-aziridinecarboxamide) triethylenemelamine.

The crosslinking agent is used in an amount of usually 0.01 to 20 parts by mass, preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass, based on 100 parts by mass of the acrylic polymer (A1) before crosslinking.

In the case where the content of the component constituting the resin film-forming layer is determined based on the content of the polymer component (a), when the polymer component (a) is a crosslinked acrylic polymer, the content as the reference is the content of the acrylic polymer before crosslinking.

(A2) Non-acrylic resins

Further, as the polymer component (a), one kind or two or more kinds of non-acrylic resins (a2) selected from polyesters, phenoxy resins (for convenience, for the sake of distinction from the curable polymer (AB) described later, it is limited to a material having no epoxy group), polycarbonates, polyethers, polyurethanes, polysiloxanes, rubber-based polymers, or components in which two or more kinds of the above are bonded may be used alone or in combination. The weight average molecular weight of the resin is preferably 20,000 to 100,000, and more preferably 20,000 to 80,000.

The glass transition temperature of the non-acrylic resin (A2) is preferably in the range of-30 to 150 ℃, and more preferably-20 to 120 ℃.

When the non-acrylic resin (a2) and the acrylic polymer (a1) are used together, the interlayer separation between the support sheet and the resin film-forming layer can be easily performed when the resin film-forming layer is transferred to a package, and the resin film-forming layer can further follow the transfer surface to suppress the occurrence of voids and the like.

When the non-acrylic resin (a2) and the acrylic polymer (a1) are used together, the content of the non-acrylic resin (a2) is usually 1:99 to 60:40, preferably 1:99 to 30:70, in terms of the mass ratio (a2: a1) of the non-acrylic resin (a2) to the acrylic polymer (a 1). When the content of the non-acrylic resin (a2) is within this range, the above-described effects can be obtained.

(B) Curable component

The curable component (B) is added mainly for the purpose of imparting curability to the resin film-forming layer. As the curable component (B), a thermosetting component (B1) or an energy ray curable component (B2) can be used. Further, a combination of both may be used. The thermosetting component (B1) is a compound containing at least a functional group that reacts by heating. The energy ray-curable component (B2) is a compound (B21) containing a functional group that reacts upon irradiation with an energy ray, and undergoes polymerization and curing upon irradiation with an energy ray such as an ultraviolet ray or an electron beam. The functional groups of these curable components react with each other to form a three-dimensional network structure, thereby achieving curing. Since the curable component (B) and the polymer component (a) are used in combination, the weight average molecular weight (Mw) is usually 10,000 or less, preferably 100 to 10,000, from the viewpoint of suppressing the viscosity of the coating composition for forming a resin film-forming layer and improving the workability.

(B1) Thermosetting composition

As the thermosetting component, for example, an epoxy thermosetting component is preferable.

The epoxy thermosetting component contains a compound (B11) having an epoxy group, and preferably a compound (B11) having an epoxy group and a thermosetting agent (B12) are used in combination.

(B11) Compound having epoxy group

As the compound (B11) having an epoxy group (hereinafter, this may be referred to as "epoxy compound (B11)"), conventionally known materials can be used. Specific examples thereof include polyfunctional epoxy resins, bisphenol a diglycidyl ether and hydrogenated products thereof, o-cresol novolac epoxy resins, dicyclopentadiene epoxy resins, biphenyl epoxy resins, bisphenol a epoxy resins, bisphenol F epoxy resins, phenylene skeleton epoxy resins, and epoxy compounds having a bifunctional or higher in the molecule. The above-mentioned compounds may be used singly or in combination of two or more.

When the epoxy compound (B11) is used, the epoxy compound (B11) is preferably contained in the resin film-forming layer in an amount of 1 to 1500 parts by mass, more preferably 3 to 1200 parts by mass, based on 100 parts by mass of the polymer component (a). When the content of the epoxy compound (B11) is small, the adhesiveness of the resin film-forming layer after curing tends to be lowered. When the content of the epoxy compound (B11) is large, the peeling force between the resin film-forming layer and the support sheet increases, and transfer failure of the resin film-forming layer may occur.

(B12) Thermal curing agent

The heat-curing agent (B12) functions as a curing agent for the epoxy compound (B11). Examples of a preferable thermosetting agent include a compound having 2 or more functional groups reactive with an epoxy group in 1 molecule. Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxyl group, and an acid anhydride. Among them, preferred are a phenolic hydroxyl group, an amino group, an acid anhydride, and the like, and more preferred are a phenolic hydroxyl group and an amino group.

Specific examples of the phenol curing agent include polyfunctional phenol resins, biphenol, novolak-type phenol resins, dicyclopentadiene-type phenol resins, Xylok-type phenol resins, and aralkyl-type phenol resins.

Specific examples of the amine-based curing agent include DICY (dicyandiamide).

The curing agent may be used alone or in combination of two or more.

The content of the thermosetting agent (B12) is preferably 0.1 to 500 parts by mass, more preferably 1 to 200 parts by mass, per 100 parts by mass of the epoxy compound (B11). When the content of the thermosetting agent is small, the adhesiveness after curing tends to be lowered.

(B13) Curing accelerator

The curing accelerator (B13) can also be used to adjust the speed of thermal curing of the resin film-forming layer. When an epoxy thermosetting component is used as the thermosetting component (B1), a curing accelerator (B13) is particularly preferably used.

Preferred examples of the curing accelerator include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris (dimethylaminomethyl) phenol; imidazoles such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4, 5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole; organic phosphines such as tributylphosphine, diphenylphosphine, and triphenylphosphine; tetraphenylboron salts such as tetraphenylboron tetraphenylphosphine and triphenylphosphine tetraphenylborate. The curing accelerator may be used singly or in combination of two or more.

The curing accelerator (B13) is preferably contained in an amount of 0.01 to 10 parts by mass, more preferably 0.1 to 1 part by mass, based on 100 parts by mass of the total amount of the epoxy compound (B11) and the thermosetting agent (B12). By containing the curing accelerator (B13) in an amount within the above range, excellent adhesion is obtained even when exposed to an environment of high temperature and high humidity, and high reliability is obtained even when exposed to severe flow (flow) conditions. By adding the curing accelerator (B13), the adhesiveness of the resin film-forming layer after curing can be improved. This effect is stronger as the content of the curing accelerator (B13) is larger.

(B2) Energy ray-curable component

By containing the energy ray-curable component in the resin film-forming layer, the resin film-forming layer can be cured without performing a heat curing step that requires a large amount of energy and a long time. This can reduce the manufacturing cost.

The energy ray-curable component may be a compound having a functional group that reacts by irradiation with an energy ray (B21) alone, or a compound having a functional group that reacts by irradiation with an energy ray (B21) and a photopolymerization initiator (B22) may be used in combination.

(B21) Compound having functional group that reacts by irradiation with energy ray

Examples of the compound (B21) having a functional group which reacts by irradiation with an energy ray (hereinafter, this may be referred to as "energy ray-reactive compound (B21)") include acrylate compounds such as trimethylolpropane triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1, 4-butanediol diacrylate and 1, 6-hexanediol diacrylate, and compounds having a relatively low molecular weight which are acrylate compounds having a polymerization structure such as oligoester acrylate, urethane acrylate oligomer, epoxy acrylate, polyether acrylate and itaconic acid oligomer. This compound has at least 1 polymerizable double bond in the molecule.

When the energy ray-reactive compound (B21) is used, the energy ray-reactive compound (B21) is contained in the resin film-forming layer preferably in an amount of 1 to 1500 parts by mass, more preferably 3 to 1200 parts by mass, based on 100 parts by mass of the polymer component (a).

(B22) Photopolymerization initiator

By using the energy ray-reactive compound (B21) in combination with the photopolymerization initiator (B22), the polymerization curing time can be shortened and the amount of light irradiation can be reduced.

Specific examples of such a photopolymerization initiator (B22) include benzophenone, acetophenone, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, benzoin dimethyl ketal, 2, 4-diethylthioxanthone, α -hydroxycyclohexyl phenyl ketone, benzyl diphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzil, diacetyl, 1, 2-diphenylmethane, 2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl ] acetone, 2,4, 6-trimethylbenzoyldiphenylphosphine oxide, and β -chloroanthraquinone. The photopolymerization initiator (B22) may be used alone or in combination of two or more.

The blending ratio of the photopolymerization initiator (B22) is preferably 0.1 to 10 parts by mass, more preferably 1 to 5 parts by mass, of the photopolymerization initiator (B22) per 100 parts by mass of the energy ray-reactive compound (B21).

If the blending ratio of the photopolymerization initiator (B22) is less than 0.1 parts by mass, satisfactory curability may not be obtained due to insufficient photopolymerization, and if it exceeds 10 parts by mass, a residue that does not contribute to photopolymerization may be generated, which may cause a problem.

(second Binder component)

By containing the curable polymer component (AB) in the second binder component, sheet-like retention and curability can be imparted to the resin film-forming layer.

(AB) curable Polymer component

The curable polymer component is a polymer having a functional group for curing. The curing functional group is a functional group that can react with each other to form a three-dimensional network structure, and examples thereof include a functional group that reacts by heating and a functional group that reacts by energy rays.

The curing functional group may be added to the middle of a unit that becomes a continuous structure of the skeleton of the curable polymer (AB), or may be added to the end of the skeleton of the curable polymer (AB). When the curing functional group is added to the middle of the unit which becomes the continuous structure of the skeleton of the curable polymer component (AB), the curing functional group may be added to a side chain or may be directly added to the main chain. The weight average molecular weight (Mw) of the curable polymer component (AB) is usually 20,000 or more in order to achieve the purpose of providing sheet-like retention to the resin film-forming layer.

Examples of the functional group that reacts by heating include an epoxy group. Examples of the curable polymer component (AB) having an epoxy group include a high molecular weight epoxy group-containing compound and an epoxy group-containing phenoxy resin. Examples of the epoxy group-containing compounds include those having a high molecular weight disclosed in Japanese patent laid-open No. 2001-261789.

The acrylic polymer may be the same as the acrylic polymer (a1), or may be a polymer (epoxy-containing acrylic polymer) obtained by polymerizing a monomer having an epoxy group as a monomer. Examples of the monomer having an epoxy group include (meth) acrylates having a glycidyl group such as glycidyl (meth) acrylate.

When an epoxy group-containing acrylic polymer is used, it is preferably the same as the acrylic polymer (a1) except for the epoxy group.

When the curable polymer component (AB) having an epoxy group is used, the heat-curing agent (B12), the curing accelerator (B13), and the like may be used together, as in the case of using an epoxy thermosetting component as the curable component (B).

Examples of the functional group that reacts with energy rays include a (meth) acryloyl group. As the curable polymer component (AB) having a functional group that reacts with energy rays, a polymer having a high molecular weight such as an acrylate compound having a polymerization structure such as polyether acrylate can be used.

Further, for example, a polymer prepared by reacting a base polymer having a functional group X such as a hydroxyl group in a side chain with a low molecular weight compound having a functional group Y (for example, an isocyanate group or the like when the functional group X is a hydroxyl group) reactive with the functional group X and a functional group reactive by irradiation with an energy ray may be used.

At this time, when the base polymer belongs to the above-mentioned acrylic polymer (a1), the preferred mode of the base polymer is the same as that of the acrylic polymer (a 1).

When the curable polymer component (AB) having a functional group which reacts with energy rays is used, the photopolymerization initiator (B22) may be used together with the curable polymer component (AB) as in the case of the energy ray-curable component (B2).

The second binder component may contain the above-mentioned polymer component (a) and curable component (B) and the like, together with the curable polymer component (AB).

The resin film-forming layer may contain the following components in addition to the binder component.

(C) Inorganic filler

The resin film-forming layer may also contain an inorganic filler (C). By blending the inorganic filler (C) into the resin film-forming layer, the thermal expansion coefficient of the cured resin film can be adjusted, and the thermal expansion coefficient of the cured resin film can be optimized for the package, whereby the reliability of the semiconductor device can be improved. In addition, the moisture absorption of the cured resin film can be reduced.

In addition, when the resin film obtained by curing the resin film-forming layer of the present invention functions as a protective film, the inorganic filler (C) is exposed at a portion thereof scraped off by a laser beam by laser marking (laser marking), and reflected light is diffused, so that the resin film exhibits a color close to white. Therefore, when the resin film-forming layer contains the colorant (D) described later, the contrast between the laser-marked portion and the other portion is poor, and the printed matter becomes clear.

Preferred examples of the inorganic filler include powders such as silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide, and boron nitride, beads obtained by spheroidizing the above powders, single crystal fibers, and glass fibers. Among them, silica fillers and alumina fillers are preferable. The material of the inorganic filler (C) may be used alone, or two or more kinds may be used in combination.

In order to more reliably obtain the above-described effects, the content of the inorganic filler (C) is preferably 1 to 80 parts by mass, more preferably 20 to 75 parts by mass, and particularly preferably 40 to 70 parts by mass, based on 100 parts by mass of all solid components constituting the resin film-forming layer.

(D) Coloring agent

The resin film forming layer may be transparent. Further, the resin film-forming layer may be colored by blending a colorant (D). When the resin film is engraved by a method such as laser marking, the resin film is doped with a coloring agent, whereby marks such as characters and symbols can be easily recognized. That is, in a package in which a resin film is formed, a product number or the like is usually printed on the surface of the resin film by laser marking (a method of scraping the surface of a protective film by laser and printing), and by adding a colorant (D) to the resin film, a difference in contrast between a portion of the resin film scraped by laser and a portion not scraped can be sufficiently obtained, thereby improving visibility.

As the colorant, organic or inorganic pigments and dyes can be used. Among them, a black pigment is preferable because it emits light from an electromagnetic wave or infrared ray shielding property. As the black pigment, carbon black, iron oxide, manganese dioxide, aniline black, activated carbon, and the like can be used, but the black pigment is not limited thereto. Carbon black is preferable from the viewpoint of improving the reliability of the semiconductor device. The colorant (D) may be used alone or in combination of two or more. In the case of inspecting a semiconductor device by infrared rays, a colorant having infrared ray transmittance may be used.

The amount of the colorant (D) is preferably 0.1 to 35 parts by mass, more preferably 0.5 to 25 parts by mass, and particularly preferably 1 to 15 parts by mass, based on 100 parts by mass of all solid components constituting the resin film-forming layer.

(E) Coupling agent

In order to improve the adhesion of the resin film-forming layer to the package, the adhesion and/or the cohesion of the resin film, a coupling agent (E) having a functional group reactive with an inorganic substance and a functional group reactive with an organic functional group may be used. Further, by using the coupling agent (E), the water resistance of the resin film obtained by curing the resin film-forming layer can be improved without impairing the heat resistance of the resin film. Examples of such a coupling agent include titanate-based coupling agents, aluminate-based coupling agents, and silane coupling agents. Among them, a silane coupling agent is preferable.

The silane coupling agent is preferably a silane coupling agent having a functional group reactive with an organic functional group, which is a group reactive with functional groups of the polymer component (a), the curable component (B), the curable polymer component (AB), and the like.

Examples of such silane coupling agents include gamma-glycidoxypropyltrimethoxysilane, gamma-glycidoxypropylmethyldiethoxysilane, beta- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, gamma- (methacryloxypropyl) trimethoxysilane, gamma-aminopropyltrimethoxysilane, N-6- (aminoethyl) -gamma-aminopropylmethyldiethoxysilane, N-phenyl-gamma-aminopropyltrimethoxysilane, gamma-ureidopropyltriethoxysilane, gamma-mercaptopropyltrimethoxysilane, gamma-mercaptopropylmethyldimethoxysilane, bis (3-triethoxysilylpropyl) tetrasulfane, gamma-glycidoxypropyl-trimethoxysilane, gamma-glycidoxypropyl-methyldimethoxysilane, gamma-glycidoxypropyl-dimethyltrimethoxysilane, gamma-glycidoxypropyl-ethyltrimethoxysilane, gamma-glycidoxypropyl-dimethyltrimethoxysilane, gamma, Methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, imidazolesilane and the like. The silane coupling agent may be used alone or in combination of two or more.

The silane coupling agent is contained in an amount of usually 0.1 to 20 parts by mass, preferably 0.2 to 10 parts by mass, and more preferably 0.3 to 5 parts by mass, based on 100 parts by mass of the total of the polymer component (a), the curable component (B), and the curable polymer component (AB). If the content of the silane coupling agent is less than 0.1 parts by mass, the above-described effects may not be obtained, and if it exceeds 20 parts by mass, degassing (out gas) may be caused.

(F) Universal additive

In addition to the above components, various additives may be blended in the resin film-forming layer as needed. Examples of the various additives include leveling agents, plasticizers, antistatic agents, antioxidants, ion trapping agents, gettering agents (gettergent), chain transfer agents, and release agents.

The resin film-forming layer can be obtained, for example, by using a composition (resin film-forming composition) obtained by mixing the above components in an appropriate ratio. The resin film-forming composition may be diluted with a solvent in advance, or may be added to a solvent during mixing. Further, the resin film-forming composition may be diluted with a solvent when used.

Examples of the solvent include ethyl acetate, methyl acetate, diethyl ether, dimethyl ether, acetone, methyl ethyl ketone, acetonitrile, hexane, cyclohexane, toluene, and heptane.

The resin film forming layer has initial adhesiveness and curability, and can be easily adhered by pressing on the chip package in an uncured state at normal temperature or under heating. Further, the resin film forming layer may be heated during pressing. And finally, a resin film having high impact resistance can be provided after curing, and the resin film has excellent adhesive strength and can maintain sufficient reliability even under severe high-temperature and high-humidity conditions. The resin film-forming layer may have a single-layer structure or a multi-layer structure.

The thickness of the resin film forming layer is preferably 1 to 100 μm, more preferably 2 to 90 μm, and particularly preferably 3 to 80 μm. When the thickness of the resin film-forming layer is in the above range, the resin film-forming layer can function as a highly reliable protective film or adhesive.

[ Ring frame holding Member ]

In the support sheet with a resin film forming layer of the second embodiment, the support sheet 21 is made of an adhesive sheet, and the adhesive layer 21B exposed on the outer periphery of the resin film forming layer 22 functions as a ring frame holding member.

In the first aspect, the annular frame holding member 13 is provided on the outer peripheral portion of the surface of the resin film formation layer, while in the third aspect, the annular frame holding member 33 is provided in a manner surrounding the resin film formation layer. As the ring-shaped frame holding member, an adhesive member composed of an adhesive agent layer alone, an adhesive member composed of a base material and an adhesive agent layer, or a double-sided adhesive member having a core material can be used.

The outer peripheral shape of the ring

frame holding members

13, 33 is substantially rectangular, and the inner peripheral portion has a rectangular hollow portion (inner opening). In shape, has a size that can be fixed to the ring frame. The internal opening is larger than the chipset package. In addition, the ring frame is usually a molded body of metal or plastic.

When the annular frame holding member is an adhesive member formed of an adhesive agent layer alone, the annular frame holding member is not particularly limited, and is preferably formed of, for example, an acrylic adhesive, a rubber adhesive, or a silicone adhesive. Among them, acrylic pressure-sensitive adhesives are preferable in view of removability from the ring frame. The above-mentioned adhesives may be used alone or in combination of two or more.

The thickness of the adhesive agent layer constituting the annular frame holding member is preferably 2 to 20 μm, more preferably 3 to 15 μm, and still more preferably 4 to 10 μm. When the thickness of the adhesive layer is less than 2 μm, sufficient adhesiveness may not be exhibited. When the thickness of the adhesive layer exceeds 20 μm, residues of the adhesive sometimes remain on the ring frame when it is peeled off from the ring frame, thereby contaminating the ring frame.

When an adhesive member composed of a base material and an adhesive layer is used as the ring-shaped frame holding member, the ring-shaped frame is attached to the adhesive layer constituting the adhesive member.

The adhesive agent for forming the adhesive agent layer may be the same as the adhesive agent for forming the adhesive agent layer in the adhesive member composed of the adhesive agent layer monomer. The thickness of the adhesive layer is also the same as described above.

The base material constituting the ring frame holding member is not particularly limited, and examples thereof include a polyethylene film, a polypropylene film, an ethylene-vinyl acetate copolymer film, an ethylene- (meth) acrylic acid copolymer film, an ethylene- (meth) acrylate copolymer film, a polyolefin film such as an ionomer resin film, a polyvinyl chloride film, a polyethylene terephthalate film, and the like. Among them, in view of expandability, a polyethylene film and a polyvinyl chloride film are preferable, and a polyvinyl chloride film is more preferable.

The thickness of the base material constituting the ring-shaped frame holding member is preferably 5 to 200 μm, more preferably 10 to 150 μm, and still more preferably 20 to 100 μm.

In the case where the double-sided adhesive member having the core material is used as the ring-shaped frame holding member, the double-sided adhesive member is composed of the core material, the laminating adhesive layer formed on one surface of the core material, and the fixing adhesive layer formed on the other surface of the core material. The laminating adhesive layer is an adhesive layer to be attached to the resin film forming layer side, and the fixing adhesive layer is an adhesive layer to be attached to the ring frame side.

The core material of the double-sided adhesive member may be the same as the base material of the adhesive member. Among them, polyolefin films and plasticized polyvinyl chloride films are preferable in view of expandability.

The thickness of the core material is usually 5 to 200 μm, preferably 10 to 150 μm, and more preferably 20 to 100 μm.

The adhesive layer for lamination and the adhesive layer for fixation of the double-sided adhesive member may be layers composed of the same adhesive or layers composed of different adhesives. The adhesive force between the fixing adhesive layer and the annular frame is selected appropriately so as to be smaller than the adhesive force between the resin film forming layer and the laminating adhesive layer. Examples of such adhesives include acrylic adhesives, rubber adhesives, and silicone adhesives. Among them, acrylic pressure-sensitive adhesives are preferable in view of removability from the ring frame. The adhesives forming the fixing adhesive layer may be used alone or in combination of two or more. The same applies to the laminating adhesive layer.

The thicknesses of the laminating adhesive layer and the fixing adhesive layer are the same as those of the adhesive layer of the adhesive member.

By providing the ring frame holding member, the support sheet with the resin film forming layer can be easily bonded to a jig such as a ring frame.

[ Long Release sheet ]

When the sheet for forming a resin film is used, the

long release sheets

14, 24, and 34 function as carrier films, and the release sheets exemplified above as support sheets can be used.

The surface tension of the surface of the long release sheet which is in contact with the resin film formation layer is preferably 40mN/m or less, more preferably 37mN/m or less, and particularly preferably 35mN/m or less. The lower limit is usually about 25 mN/m. However, when a release sheet is used as the support sheet, the long release sheet is preferably of a light release type.

Specific examples of the long release sheet, the release agent, the release treatment method, and the like are the same as those of the release sheet described above as an example of the support sheet.

The thickness of the long release sheet is not particularly limited, but is preferably 30 μm or more, and more preferably 50 to 200 μm. If the release film is less than 30 μm, a winding mark may be generated in the resin film formation layer when the resin film formation sheet is wound in a roll shape.

The use of such a long laminated sheet roll will be briefly described with reference to fig. 6A and 6B, taking as an example the long laminated sheet of the first embodiment in the first aspect.

First, the long laminated sheet 2 is unwound from the roll 1, the support sheet 10 with the resin film forming layer is peeled from the long peeling sheet 14 while being bent at a large angle by the peeling plate 40, and the support sheet 10 with the resin film forming layer is attached to the chip group package 44. At the same time, the ring frame 45 is fixed to the ring frame holding member 13. The remaining sheets (the release sheet 14 and the auxiliary sheet 15) are wound up by

guide rollers

42 and 43 and collected as a waste tape 46. In fig. 6A, the auxiliary piece 15 is omitted. Next, dicing is performed so that the resin film formation layer 12 and the chip package 44 are completely cut, and the support sheet 11 is not cut at all. After the dicing, the divided packages are peeled from the support sheet 11 together with the resin film forming layer 12, and a package to which the resin film forming layer has been transferred is obtained. When the resin film-forming layer is used as the protective film, the resin film-forming layer may be cured to produce the protective film before the dicing is performed, or may be cured after the dicing is performed. In the case of using the resin film-forming layer as the adhesive layer, the package is attached to a predetermined adherend via the resin film-forming layer, and the resin film-forming layer is cured as necessary.

Such a process can be carried out according to the method described in international patent publication No. WO2015/146254, which relates to a semiconductor wafer, and forms a protective film or a transfer adhesive layer on a chip.

According to the roll of the long laminated sheet of the present invention, when the support sheet with the resin film forming layer is peeled from the long release sheet, the occurrence of the tunnel phenomenon can be prevented even if the roll is bent at a large angle.

Description of the reference numerals

1. 3, 5: coiling; 2. 4, 6: a strip laminate; 10: a support sheet having a resin film forming layer according to a first aspect of the first embodiment; 11: a support sheet; 12: a resin film forming layer; 13: an annular frame retaining member; 14: a strip peel sheet; 15: an auxiliary sheet; 20: a support sheet having a resin film forming layer according to a second embodiment of the first embodiment; 21: a support sheet; 21A: a substrate; 21B: an adhesive layer; 22: a resin film forming layer; 23: an annular frame retaining member; 24: a strip peel sheet; 25: an auxiliary sheet; 30: a support sheet having a resin film forming layer according to a third aspect of the first aspect; 31: a support sheet; 32: a resin film forming layer; 33: an annular frame retaining member; 34: a strip peel sheet; 35: an auxiliary sheet; 40: stripping the plate; 41. 42, 43: a guide roller; 44: packaging a chip set; 45: an annular frame; 46: the tape is discarded.

Claims

1. A long laminated sheet of a support sheet with a resin film forming layer, comprising a support sheet with a resin film forming layer and a long release sheet,

2. A long laminated sheet of a support sheet with a resin film forming layer, comprising a support sheet with a resin film forming layer and a long release sheet,

the stripping processing surface of the stripping sheet is exposed at the two ends of the stripping processing surface of the stripping sheet in the short side direction,

3. A long laminated sheet of a support sheet with a resin film forming layer, comprising a support sheet with a resin film forming layer and a long release sheet,

both ends in the short-side direction of the support sheet with the resin film forming layer are positioned on the same line as both ends in the short-side direction of the release sheet.

4. A roll material obtained by winding the long laminated sheet according to any one of claims 1 to 3 into a roll shape.