KR102722208B1 - 라미네이트 적층 기판들에 임베딩된 수직 인덕터 - Google Patents

라미네이트 적층 기판들에 임베딩된 수직 인덕터 Download PDF

Info

Publication number
KR102722208B1
KR102722208B1 KR1020207016813A KR20207016813A KR102722208B1 KR 102722208 B1 KR102722208 B1 KR 102722208B1 KR 1020207016813 A KR1020207016813 A KR 1020207016813A KR 20207016813 A KR20207016813 A KR 20207016813A KR 102722208 B1 KR102722208 B1 KR 102722208B1
Authority
KR
South Korea
Prior art keywords
laminate substrate
vertical
vertical columns
traces
inductor structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020207016813A
Other languages
English (en)
Korean (ko)
Other versions
KR20200097717A (ko
Inventor
다니엘 대익 김
본훈 구
바박 네자티
Original Assignee
퀄컴 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 퀄컴 인코포레이티드 filed Critical 퀄컴 인코포레이티드
Publication of KR20200097717A publication Critical patent/KR20200097717A/ko
Application granted granted Critical
Publication of KR102722208B1 publication Critical patent/KR102722208B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H01F27/363—Electric or magnetic shields or screens made of electrically conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/008—Electric or magnetic shielding of printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/04—Circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1020207016813A 2017-12-15 2018-12-10 라미네이트 적층 기판들에 임베딩된 수직 인덕터 Active KR102722208B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762599397P 2017-12-15 2017-12-15
US62/599,397 2017-12-15
US16/210,594 US11817239B2 (en) 2017-12-15 2018-12-05 Embedded vertical inductor in laminate stacked substrates
US16/210,594 2018-12-05
PCT/US2018/064782 WO2019118366A1 (en) 2017-12-15 2018-12-10 Embedded vertical inductor in laminate stacked substrates

Publications (2)

Publication Number Publication Date
KR20200097717A KR20200097717A (ko) 2020-08-19
KR102722208B1 true KR102722208B1 (ko) 2024-10-24

Family

ID=66814602

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207016813A Active KR102722208B1 (ko) 2017-12-15 2018-12-10 라미네이트 적층 기판들에 임베딩된 수직 인덕터

Country Status (8)

Country Link
US (1) US11817239B2 (https=)
EP (1) EP3724900A1 (https=)
JP (1) JP7442446B2 (https=)
KR (1) KR102722208B1 (https=)
CN (1) CN111448626A (https=)
SG (1) SG11202004020TA (https=)
TW (1) TWI837106B (https=)
WO (1) WO2019118366A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11546019B2 (en) 2018-12-10 2023-01-03 Skyworks Solutions, Inc. Apparatus for minimizing electromagnetic coupling between surface mount device inductors
US20200286660A1 (en) * 2019-03-04 2020-09-10 Intel Corporation On-package vertical inductors and transformers for compact 5g modules
US11728293B2 (en) * 2021-02-03 2023-08-15 Qualcomm Incorporated Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component
US12592334B2 (en) * 2021-11-22 2026-03-31 Intel Corporation Stacked magnetic inductor and method
JP2023089544A (ja) * 2021-12-16 2023-06-28 キオクシア株式会社 半導体装置
US20240379650A1 (en) * 2022-04-27 2024-11-14 Beijing Boe Optoelectronics Technology Co., Ltd. Filter and manufacturing method therefor
CN116544008B (zh) * 2023-03-31 2026-03-17 泉州市三安集成电路有限公司 一种桥式电感结构及其制作方法和应用
WO2025020187A1 (zh) * 2023-07-27 2025-01-30 京东方科技集团股份有限公司 电感结构、滤波器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050150106A1 (en) * 2004-01-14 2005-07-14 Long David C. Embedded inductor and method of making
US20100208439A1 (en) * 2009-02-19 2010-08-19 Sony Corporation Wiring board, method of manufacturing same, tuner module, and electronic device
US20170076853A1 (en) * 2015-09-15 2017-03-16 Xytech Electronic Technology (Shanghai) Co., Ltd. Coil, inductor device and method for manufacturing the coil
US20170084378A1 (en) * 2015-09-21 2017-03-23 Qorvo Us, Inc. Substrates with integrated three dimensional solenoid inductors

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6501363B1 (en) * 1999-11-03 2002-12-31 Innosys, Inc. Vertical transformer
JP4341321B2 (ja) * 2003-07-18 2009-10-07 パナソニック株式会社 電子部品内蔵モジュール
US7733207B2 (en) 2007-05-31 2010-06-08 Electronics And Telecommunications Research Institute Vertically formed inductor and electronic device having the same
US8471358B2 (en) 2010-06-01 2013-06-25 Taiwan Semiconductor Manufacturing Company, Ltd. 3D inductor and transformer
US9406738B2 (en) * 2011-07-20 2016-08-02 Xilinx, Inc. Inductive structure formed using through silicon vias
JP5761463B2 (ja) 2012-08-09 2015-08-12 株式会社村田製作所 アンテナ装置および無線通信装置
US8952504B2 (en) 2013-02-08 2015-02-10 Qualcomm Incorporated Small form factor magnetic shield for magnetorestrictive random access memory (MRAM)
JP2014160751A (ja) 2013-02-20 2014-09-04 Ibiden Co Ltd プリント配線板
US9196406B2 (en) 2013-03-15 2015-11-24 Rf Micro Devices, Inc. High Q factor inductor structure
JP5585740B1 (ja) 2013-03-18 2014-09-10 株式会社村田製作所 積層型インダクタ素子および通信装置
JP2014232837A (ja) 2013-05-30 2014-12-11 イビデン株式会社 配線板
JP2015026762A (ja) 2013-07-29 2015-02-05 イビデン株式会社 プリント配線板
US9806144B2 (en) 2013-11-13 2017-10-31 Qualcomm Incorporated Solenoid inductor in a substrate
US20150371764A1 (en) 2014-06-20 2015-12-24 International Business Machines Corporation Nested helical inductor
US9478348B2 (en) 2014-06-24 2016-10-25 Qualcomm Incorporated Vertical spiral inductor
US10796835B2 (en) 2015-08-24 2020-10-06 Qorvo Us, Inc. Stacked laminate inductors for high module volume utilization and performance-cost-size-processing-time tradeoff

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050150106A1 (en) * 2004-01-14 2005-07-14 Long David C. Embedded inductor and method of making
US20100208439A1 (en) * 2009-02-19 2010-08-19 Sony Corporation Wiring board, method of manufacturing same, tuner module, and electronic device
US20170076853A1 (en) * 2015-09-15 2017-03-16 Xytech Electronic Technology (Shanghai) Co., Ltd. Coil, inductor device and method for manufacturing the coil
US20170084378A1 (en) * 2015-09-21 2017-03-23 Qorvo Us, Inc. Substrates with integrated three dimensional solenoid inductors

Also Published As

Publication number Publication date
EP3724900A1 (en) 2020-10-21
US20190189327A1 (en) 2019-06-20
SG11202004020TA (en) 2020-07-29
US11817239B2 (en) 2023-11-14
TW201931394A (zh) 2019-08-01
WO2019118366A1 (en) 2019-06-20
JP2021507508A (ja) 2021-02-22
CN111448626A (zh) 2020-07-24
TWI837106B (zh) 2024-04-01
KR20200097717A (ko) 2020-08-19
JP7442446B2 (ja) 2024-03-04

Similar Documents

Publication Publication Date Title
KR102722208B1 (ko) 라미네이트 적층 기판들에 임베딩된 수직 인덕터
US9425761B2 (en) High pass filters and low pass filters using through glass via technology
US9954267B2 (en) Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter
US10256863B2 (en) Monolithic integration of antenna switch and diplexer
US9203373B2 (en) Diplexer design using through glass via technology
US10039188B2 (en) Two-stage power delivery architecture
US10292269B1 (en) Inductor with metal-insulator-metal (MIM) capacitor
WO2018034770A1 (en) Density-optimized module-level inductor ground structure
US10433425B1 (en) Three-dimensional high quality passive structure with conductive pillar technology
WO2022265729A1 (en) 3d inductor design using bundle substrate vias
US10693432B2 (en) Solenoid structure with conductive pillar technology
TW202236321A (zh) 具有離散的金屬－堆疊圖案的堆疊電感器
EP3756219A1 (en) Folded metal-oxide-metal capacitor overlapped by on-chip inductor/transformer
US10262786B2 (en) Stepped-width co-spiral inductor structure
TW202450064A (zh) 用於器件整合的帶有雙側柱的雙側再分佈層（ｒｄｌ）基板

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20200611

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20211122

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20231214

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20240922

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20241022

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20241022

End annual number: 3

Start annual number: 1

PG1601 Publication of registration