SG11202004020TA - Embedded vertical inductor in laminate stacked substrates - Google Patents

Embedded vertical inductor in laminate stacked substrates

Info

Publication number
SG11202004020TA
SG11202004020TA SG11202004020TA SG11202004020TA SG11202004020TA SG 11202004020T A SG11202004020T A SG 11202004020TA SG 11202004020T A SG11202004020T A SG 11202004020TA SG 11202004020T A SG11202004020T A SG 11202004020TA SG 11202004020T A SG11202004020T A SG 11202004020TA
Authority
SG
Singapore
Prior art keywords
stacked substrates
embedded vertical
vertical inductor
laminate stacked
laminate
Prior art date
Application number
SG11202004020TA
Other languages
English (en)
Inventor
Daniel Daeik Kim
Bonhoon Koo
Babak Nejati
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of SG11202004020TA publication Critical patent/SG11202004020TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H01F27/363—Electric or magnetic shields or screens made of electrically conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/008—Electric or magnetic shielding of printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/04—Circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Semiconductor Integrated Circuits (AREA)
SG11202004020TA 2017-12-15 2018-12-10 Embedded vertical inductor in laminate stacked substrates SG11202004020TA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762599397P 2017-12-15 2017-12-15
US16/210,594 US11817239B2 (en) 2017-12-15 2018-12-05 Embedded vertical inductor in laminate stacked substrates
PCT/US2018/064782 WO2019118366A1 (en) 2017-12-15 2018-12-10 Embedded vertical inductor in laminate stacked substrates

Publications (1)

Publication Number Publication Date
SG11202004020TA true SG11202004020TA (en) 2020-07-29

Family

ID=66814602

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202004020TA SG11202004020TA (en) 2017-12-15 2018-12-10 Embedded vertical inductor in laminate stacked substrates

Country Status (8)

Country Link
US (1) US11817239B2 (https=)
EP (1) EP3724900A1 (https=)
JP (1) JP7442446B2 (https=)
KR (1) KR102722208B1 (https=)
CN (1) CN111448626A (https=)
SG (1) SG11202004020TA (https=)
TW (1) TWI837106B (https=)
WO (1) WO2019118366A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11546019B2 (en) 2018-12-10 2023-01-03 Skyworks Solutions, Inc. Apparatus for minimizing electromagnetic coupling between surface mount device inductors
US20200286660A1 (en) * 2019-03-04 2020-09-10 Intel Corporation On-package vertical inductors and transformers for compact 5g modules
US11728293B2 (en) * 2021-02-03 2023-08-15 Qualcomm Incorporated Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component
US12592334B2 (en) * 2021-11-22 2026-03-31 Intel Corporation Stacked magnetic inductor and method
JP2023089544A (ja) * 2021-12-16 2023-06-28 キオクシア株式会社 半導体装置
US20240379650A1 (en) * 2022-04-27 2024-11-14 Beijing Boe Optoelectronics Technology Co., Ltd. Filter and manufacturing method therefor
CN116544008B (zh) * 2023-03-31 2026-03-17 泉州市三安集成电路有限公司 一种桥式电感结构及其制作方法和应用
WO2025020187A1 (zh) * 2023-07-27 2025-01-30 京东方科技集团股份有限公司 电感结构、滤波器

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6501363B1 (en) * 1999-11-03 2002-12-31 Innosys, Inc. Vertical transformer
JP4341321B2 (ja) * 2003-07-18 2009-10-07 パナソニック株式会社 電子部品内蔵モジュール
US6931712B2 (en) 2004-01-14 2005-08-23 International Business Machines Corporation Method of forming a dielectric substrate having a multiturn inductor
US7733207B2 (en) 2007-05-31 2010-06-08 Electronics And Telecommunications Research Institute Vertically formed inductor and electronic device having the same
JP5407404B2 (ja) 2009-02-19 2014-02-05 ソニー株式会社 配線基板とその製造方法、チューナモジュール、及び電子機器
US8471358B2 (en) 2010-06-01 2013-06-25 Taiwan Semiconductor Manufacturing Company, Ltd. 3D inductor and transformer
US9406738B2 (en) * 2011-07-20 2016-08-02 Xilinx, Inc. Inductive structure formed using through silicon vias
JP5761463B2 (ja) 2012-08-09 2015-08-12 株式会社村田製作所 アンテナ装置および無線通信装置
US8952504B2 (en) 2013-02-08 2015-02-10 Qualcomm Incorporated Small form factor magnetic shield for magnetorestrictive random access memory (MRAM)
JP2014160751A (ja) 2013-02-20 2014-09-04 Ibiden Co Ltd プリント配線板
US9196406B2 (en) 2013-03-15 2015-11-24 Rf Micro Devices, Inc. High Q factor inductor structure
JP5585740B1 (ja) 2013-03-18 2014-09-10 株式会社村田製作所 積層型インダクタ素子および通信装置
JP2014232837A (ja) 2013-05-30 2014-12-11 イビデン株式会社 配線板
JP2015026762A (ja) 2013-07-29 2015-02-05 イビデン株式会社 プリント配線板
US9806144B2 (en) 2013-11-13 2017-10-31 Qualcomm Incorporated Solenoid inductor in a substrate
US20150371764A1 (en) 2014-06-20 2015-12-24 International Business Machines Corporation Nested helical inductor
US9478348B2 (en) 2014-06-24 2016-10-25 Qualcomm Incorporated Vertical spiral inductor
US10796835B2 (en) 2015-08-24 2020-10-06 Qorvo Us, Inc. Stacked laminate inductors for high module volume utilization and performance-cost-size-processing-time tradeoff
CN106531410B (zh) 2015-09-15 2019-08-27 臻绚电子科技(上海)有限公司 线圈，电感元件及制备应用于电感元件的线圈的方法
US20170084379A1 (en) 2015-09-21 2017-03-23 Qorvo Us, Inc. Substrates with integrated three dimensional inductors with via columns

Also Published As

Publication number Publication date
EP3724900A1 (en) 2020-10-21
US20190189327A1 (en) 2019-06-20
US11817239B2 (en) 2023-11-14
TW201931394A (zh) 2019-08-01
WO2019118366A1 (en) 2019-06-20
JP2021507508A (ja) 2021-02-22
CN111448626A (zh) 2020-07-24
TWI837106B (zh) 2024-04-01
KR20200097717A (ko) 2020-08-19
JP7442446B2 (ja) 2024-03-04
KR102722208B1 (ko) 2024-10-24

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