TWI837106B - 立式電感器結構、其製造方法以及射頻前端模組 - Google Patents
立式電感器結構、其製造方法以及射頻前端模組 Download PDFInfo
- Publication number
- TWI837106B TWI837106B TW107144500A TW107144500A TWI837106B TW I837106 B TWI837106 B TW I837106B TW 107144500 A TW107144500 A TW 107144500A TW 107144500 A TW107144500 A TW 107144500A TW I837106 B TWI837106 B TW I837106B
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- Taiwan
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Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims abstract description 270
- 239000002184 metal Substances 0.000 claims description 40
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 238000000465 moulding Methods 0.000 claims description 24
- 238000004891 communication Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 20
- 230000008878 coupling Effects 0.000 claims description 17
- 238000010168 coupling process Methods 0.000 claims description 17
- 238000005859 coupling reaction Methods 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 238000010561 standard procedure Methods 0.000 claims description 7
- 239000002861 polymer material Substances 0.000 claims description 3
- 238000003491 array Methods 0.000 claims 3
- 239000010410 layer Substances 0.000 description 162
- 238000013461 design Methods 0.000 description 25
- 238000003860 storage Methods 0.000 description 20
- 239000003990 capacitor Substances 0.000 description 11
- 239000002356 single layer Substances 0.000 description 11
- 239000004020 conductor Substances 0.000 description 10
- 230000006870 function Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000002776 aggregation Effects 0.000 description 7
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- 239000004065 semiconductor Substances 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 4
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- 229910000679 solder Inorganic materials 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 3
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- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
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- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
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- 230000007774 longterm Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/36—Electric or magnetic shields or screens
- H01F27/363—Electric or magnetic shields or screens made of electrically conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/008—Electric or magnetic shielding of printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/36—Electric or magnetic shields or screens
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/04—Circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Coils Or Transformers For Communication (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762599397P | 2017-12-15 | 2017-12-15 | |
| US62/599,397 | 2017-12-15 | ||
| US16/210,594 US11817239B2 (en) | 2017-12-15 | 2018-12-05 | Embedded vertical inductor in laminate stacked substrates |
| US16/210,594 | 2018-12-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201931394A TW201931394A (zh) | 2019-08-01 |
| TWI837106B true TWI837106B (zh) | 2024-04-01 |
Family
ID=66814602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107144500A TWI837106B (zh) | 2017-12-15 | 2018-12-11 | 立式電感器結構、其製造方法以及射頻前端模組 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11817239B2 (https=) |
| EP (1) | EP3724900A1 (https=) |
| JP (1) | JP7442446B2 (https=) |
| KR (1) | KR102722208B1 (https=) |
| CN (1) | CN111448626A (https=) |
| SG (1) | SG11202004020TA (https=) |
| TW (1) | TWI837106B (https=) |
| WO (1) | WO2019118366A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11546019B2 (en) | 2018-12-10 | 2023-01-03 | Skyworks Solutions, Inc. | Apparatus for minimizing electromagnetic coupling between surface mount device inductors |
| US20200286660A1 (en) * | 2019-03-04 | 2020-09-10 | Intel Corporation | On-package vertical inductors and transformers for compact 5g modules |
| US11728293B2 (en) * | 2021-02-03 | 2023-08-15 | Qualcomm Incorporated | Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component |
| US12592334B2 (en) * | 2021-11-22 | 2026-03-31 | Intel Corporation | Stacked magnetic inductor and method |
| JP2023089544A (ja) * | 2021-12-16 | 2023-06-28 | キオクシア株式会社 | 半導体装置 |
| US20240379650A1 (en) * | 2022-04-27 | 2024-11-14 | Beijing Boe Optoelectronics Technology Co., Ltd. | Filter and manufacturing method therefor |
| CN116544008B (zh) * | 2023-03-31 | 2026-03-17 | 泉州市三安集成电路有限公司 | 一种桥式电感结构及其制作方法和应用 |
| WO2025020187A1 (zh) * | 2023-07-27 | 2025-01-30 | 京东方科技集团股份有限公司 | 电感结构、滤波器 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130020675A1 (en) * | 2011-07-20 | 2013-01-24 | Xilinx, Inc. | Inductive structure formed using through silicon vias |
| TW201440090A (zh) * | 2013-03-18 | 2014-10-16 | Murata Manufacturing Co | 積層型電感器元件及其製造方法以及通訊裝置 |
| US20150371751A1 (en) * | 2014-06-24 | 2015-12-24 | Qualcomm Incorporated | Vertical spiral inductor |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6501363B1 (en) * | 1999-11-03 | 2002-12-31 | Innosys, Inc. | Vertical transformer |
| JP4341321B2 (ja) * | 2003-07-18 | 2009-10-07 | パナソニック株式会社 | 電子部品内蔵モジュール |
| US6931712B2 (en) | 2004-01-14 | 2005-08-23 | International Business Machines Corporation | Method of forming a dielectric substrate having a multiturn inductor |
| US7733207B2 (en) | 2007-05-31 | 2010-06-08 | Electronics And Telecommunications Research Institute | Vertically formed inductor and electronic device having the same |
| JP5407404B2 (ja) | 2009-02-19 | 2014-02-05 | ソニー株式会社 | 配線基板とその製造方法、チューナモジュール、及び電子機器 |
| US8471358B2 (en) | 2010-06-01 | 2013-06-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | 3D inductor and transformer |
| JP5761463B2 (ja) | 2012-08-09 | 2015-08-12 | 株式会社村田製作所 | アンテナ装置および無線通信装置 |
| US8952504B2 (en) | 2013-02-08 | 2015-02-10 | Qualcomm Incorporated | Small form factor magnetic shield for magnetorestrictive random access memory (MRAM) |
| JP2014160751A (ja) | 2013-02-20 | 2014-09-04 | Ibiden Co Ltd | プリント配線板 |
| US9196406B2 (en) | 2013-03-15 | 2015-11-24 | Rf Micro Devices, Inc. | High Q factor inductor structure |
| JP2014232837A (ja) | 2013-05-30 | 2014-12-11 | イビデン株式会社 | 配線板 |
| JP2015026762A (ja) | 2013-07-29 | 2015-02-05 | イビデン株式会社 | プリント配線板 |
| US9806144B2 (en) | 2013-11-13 | 2017-10-31 | Qualcomm Incorporated | Solenoid inductor in a substrate |
| US20150371764A1 (en) | 2014-06-20 | 2015-12-24 | International Business Machines Corporation | Nested helical inductor |
| US10796835B2 (en) | 2015-08-24 | 2020-10-06 | Qorvo Us, Inc. | Stacked laminate inductors for high module volume utilization and performance-cost-size-processing-time tradeoff |
| CN106531410B (zh) | 2015-09-15 | 2019-08-27 | 臻绚电子科技(上海)有限公司 | 线圈，电感元件及制备应用于电感元件的线圈的方法 |
| US20170084379A1 (en) | 2015-09-21 | 2017-03-23 | Qorvo Us, Inc. | Substrates with integrated three dimensional inductors with via columns |
-
2018
- 2018-12-05 US US16/210,594 patent/US11817239B2/en active Active
- 2018-12-10 KR KR1020207016813A patent/KR102722208B1/ko active Active
- 2018-12-10 SG SG11202004020TA patent/SG11202004020TA/en unknown
- 2018-12-10 JP JP2020531599A patent/JP7442446B2/ja active Active
- 2018-12-10 CN CN201880080174.XA patent/CN111448626A/zh active Pending
- 2018-12-10 WO PCT/US2018/064782 patent/WO2019118366A1/en not_active Ceased
- 2018-12-10 EP EP18829662.8A patent/EP3724900A1/en active Pending
- 2018-12-11 TW TW107144500A patent/TWI837106B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130020675A1 (en) * | 2011-07-20 | 2013-01-24 | Xilinx, Inc. | Inductive structure formed using through silicon vias |
| TW201440090A (zh) * | 2013-03-18 | 2014-10-16 | Murata Manufacturing Co | 積層型電感器元件及其製造方法以及通訊裝置 |
| US20150371751A1 (en) * | 2014-06-24 | 2015-12-24 | Qualcomm Incorporated | Vertical spiral inductor |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3724900A1 (en) | 2020-10-21 |
| US20190189327A1 (en) | 2019-06-20 |
| SG11202004020TA (en) | 2020-07-29 |
| US11817239B2 (en) | 2023-11-14 |
| TW201931394A (zh) | 2019-08-01 |
| WO2019118366A1 (en) | 2019-06-20 |
| JP2021507508A (ja) | 2021-02-22 |
| CN111448626A (zh) | 2020-07-24 |
| KR20200097717A (ko) | 2020-08-19 |
| JP7442446B2 (ja) | 2024-03-04 |
| KR102722208B1 (ko) | 2024-10-24 |
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