JP5982585B2 - ガラス貫通ビア技術を使用するダイプレクサ構成 - Google Patents
ガラス貫通ビア技術を使用するダイプレクサ構成 Download PDFInfo
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- JP5982585B2 JP5982585B2 JP2015552851A JP2015552851A JP5982585B2 JP 5982585 B2 JP5982585 B2 JP 5982585B2 JP 2015552851 A JP2015552851 A JP 2015552851A JP 2015552851 A JP2015552851 A JP 2015552851A JP 5982585 B2 JP5982585 B2 JP 5982585B2
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- 239000011521 glass Substances 0.000 title claims description 20
- 238000005516 engineering process Methods 0.000 title description 6
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- 239000003990 capacitor Substances 0.000 claims description 124
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- 238000010168 coupling process Methods 0.000 claims description 24
- 238000005859 coupling reaction Methods 0.000 claims description 24
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- 239000003570 air Substances 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
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- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
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- H03H7/17—Structural details of sub-circuits of frequency selective networks
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- H03H7/1766—Parallel LC in series path
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- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
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- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
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- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
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Description
本出願は、2013年1月11日に出願された「DIPLEXER DESIGN USING THROUGH GLASS VIA TECHNOLOGY」という名称の米国仮特許出願第61/751,539号に対する利益を米国特許法第119条(e)の下に主張するものであり、この仮特許出願の全体は参照により本明細書に明示的に組み込まれる。
102 電力増幅器
104 デュプレクサ/フィルタ
106 無線周波数(RF)スイッチモジュール
108 パッシブコンバイナ
110 受信機
112 チューナ回路
112A 第1のチューナ回路
112B 第2のチューナ回路
114 ダイプレクサ
115 接地端子
116 キャパシタ
118 インダクタ
120 アンテナ
200 ダイプレクサ構成
202 ハイパスフィルタ整合ブロック
204 第1の入力ポート、第1の入力パッド
206 第1のインダクタ
210 第1のキャパシタ
212 第2のキャパシタ
214 第3のキャパシタ
216 接地端子、接地端子パッド
218 アンテナポート、アンテナパッド
220 ローパスフィルタ整合ブロック
222 第2の入力ポート、第2の入力パッド
224 第2のインダクタ
226 第3のインダクタ
228 第4のインダクタ
230 第4のキャパシタ
240 ダイプレクサ構成
242 半導体基板
300 グラフ
302 ハイパスフィルタ曲線
304 ローパスフィルタ曲線
400 ダイプレクサ構成
402 ハイパスフィルタ整合ブロック
404 ローパス入力ポート、ローパス入力パッド
406 第1のインダクタ
408 第2のインダクタ
410 第1のキャパシタ
412 第2のキャパシタ
414 第3のキャパシタ
416 接地端子、接地端子パッド
418 アンテナポート、アンテナパッド
420 バンドパスフィルタ整合ブロック
422 バンドパス入力ポート、バンドパス入力パッド
424 第3のインダクタ
426 第4のインダクタ
430 第4のキャパシタ
432 第5のキャパシタ
434 第6のキャパシタ
436 第7のキャパシタ
438 第8のキャパシタ
440 ダイプレクサ構成
442 半導体基板
450 ダイプレクサ構成
454 ローパス入力パッド
456 第1のインダクタ
458 第2のインダクタ
460 第1のキャパシタ
462 第2のキャパシタ
464 第3のキャパシタ
466 接地端子パッド
468 アンテナパッド
472 バンドパス入力パッド
474 第3のインダクタ
476 第4のインダクタ
480 第4のキャパシタ
482 第5のキャパシタ
484 第6のキャパシタ
486 第7のキャパシタ
488 第8のキャパシタ
492 半導体基板
500 グラフ
502 曲線
504 曲線
720、730、750 遠隔ユニット
725A、725B、725C ICデバイス
740 基地局
780 順方向リンク信号
790 逆方向リンク信号
800 設計用ワークステーション
802 ディスプレイ
803 駆動装置
804 記憶媒体
810 回路
812 半導体構成要素
Claims (12)
- 複数の基板貫通ビアを有する基板と、
前記複数の基板貫通ビアに結合された前記基板の第1の外面上の第1の複数のトレースと、
前記第1の外面の反対側の前記基板の第2の外面上の第2の複数のトレースであって、前記第2の複数のトレースは、前記複数の基板貫通ビアの反対の端に結合され、前記複数の基板貫通ビアならびに前記第1および第2の複数のトレースが3Dインダクタとして動作する第2の複数のトレースと、
前記基板の前記第1の外面によって直接支持され、前記3Dインダクタに直接結合された階層金属絶縁体金属キャパシタ構造と、
を備えるダイプレクサ。 - 前記階層金属絶縁体金属キャパシタ構造は前記基板の一方の側のみによって支持される、請求項1に記載のダイプレクサ。
- 前記基板は、ガラス、空気、水晶、サファイア、または高抵抗シリコンを含む、請求項1に記載のダイプレクサ。
- 前記階層金属絶縁体金属キャパシタ構造は両側に導電層を備え、前記導電層の厚さが約200nm〜5μmである、請求項1に記載のダイプレクサ。
- 前記ダイプレクサは、周波数が5.5GHzのときにリジェクションが30dBを超える、請求項1に記載のダイプレクサ。
- 携帯電話、セットトップボックス、音楽プレーヤ、ビデオプレーヤ、エンターテインメントユニット、ナビゲーションデバイス、コンピュータ、ハンドヘルドパーソナル通信システム(PCS)ユニット、ポータブルデータユニット、および/または固定ロケーションデータユニットに統合される、請求項1に記載のダイプレクサ。
- ダイプレクサを作製する方法であって、
基板内に複数の基板貫通ビアを形成するステップと、
前記基板の第1の外面上に第1の複数のトレースを堆積させるステップと、
前記基板の第2の外面上に第2の複数のトレースを堆積させるステップと、
前記複数の基板貫通ビアの第1の側に前記第1の複数のトレースを結合するステップと、
前記複数の基板貫通ビアの第2の側に前記第2の複数のトレースを結合して蛇行状3Dインダクタを形成するステップと、
階層金属絶縁体金属キャパシタ構造を前記基板の前記第1の外面に直接形成するステップとを含む方法。 - 前記ダイプレクサを、携帯電話、セットトップボックス、音楽プレーヤ、ビデオプレーヤ、エンターテインメントユニット、ナビゲーションデバイス、コンピュータ、ハンドヘルドパーソナル通信システム(PCS)ユニット、ポータブルデータユニット、および/または固定位置データユニットに統合するステップをさらに含む、請求項7に記載の方法。
- 複数の基板貫通ビアを有する基板と、
前記基板の第1の外面上に前記複数の基板貫通ビアを結合するための第1の複数の手段と、
前記第1の外面の反対側の前記基板の第2の外面上に前記複数の基板貫通ビアの反対の端を結合するための第2の複数の手段であって、前記複数の基板貫通ビア、前記第1の複数の手段、および前記第2の複数の手段が、3Dインダクタとして動作する第2の手段と、
前記基板の前記第1の外面によって直接支持され、前記3Dインダクタに直接結合された、電荷を貯留するための手段とを備えるダイプレクサ。 - 携帯電話、セットトップボックス、音楽プレーヤ、ビデオプレーヤ、エンターテインメントユニット、ナビゲーションデバイス、コンピュータ、ハンドヘルドパーソナル通信システム(PCS)ユニット、ポータブルデータユニット、および/または固定ロケーションデータユニットに統合される、請求項9に記載のダイプレクサ。
- ダイプレクサを作製する方法であって、
基板内に複数の基板貫通ビアを形成するステップと、
前記基板の第1の外面上に第1の複数のトレースを堆積させるステップと、
前記基板の第2の外面上に第2の複数のトレースを堆積させるステップと、
前記複数の基板貫通ビアの第1の側に前記第1の複数のトレースを結合するステップと、
前記複数の基板貫通ビアの第2の側に前記第2の複数のトレースを結合して蛇行状3Dインダクタを形成するステップと、
階層金属絶縁体金属キャパシタ構造を前記基板の前記第1の外面に直接形成するステップとを含む方法。 - 前記ダイプレクサを、携帯電話、セットトップボックス、音楽プレーヤ、ビデオプレーヤ、エンターテインメントユニット、ナビゲーションデバイス、コンピュータ、ハンドヘルドパーソナル通信システム(PCS)ユニット、ポータブルデータユニット、および/または固定位置データユニットに統合するステップをさらに含む、請求項11に記載の方法。
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US13/798,733 | 2013-03-13 | ||
US13/798,733 US9203373B2 (en) | 2013-01-11 | 2013-03-13 | Diplexer design using through glass via technology |
PCT/US2014/011223 WO2014110480A2 (en) | 2013-01-11 | 2014-01-13 | Diplexer design using through glass via technology |
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2013
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KR20150107779A (ko) | 2015-09-23 |
US9203373B2 (en) | 2015-12-01 |
JP2016508356A (ja) | 2016-03-17 |
WO2014110480A3 (en) | 2014-09-04 |
EP2944027A2 (en) | 2015-11-18 |
KR101702399B1 (ko) | 2017-02-03 |
US20140197902A1 (en) | 2014-07-17 |
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