CN111448626A - 层压堆叠基板中的嵌入式垂直电感器 - Google Patents

层压堆叠基板中的嵌入式垂直电感器 Download PDF

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Publication number
CN111448626A
CN111448626A CN201880080174.XA CN201880080174A CN111448626A CN 111448626 A CN111448626 A CN 111448626A CN 201880080174 A CN201880080174 A CN 201880080174A CN 111448626 A CN111448626 A CN 111448626A
Authority
CN
China
Prior art keywords
laminate substrate
vertical
vertical columns
traces
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880080174.XA
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English (en)
Chinese (zh)
Inventor
D·D·金姆
B·具
B·内亚蒂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of CN111448626A publication Critical patent/CN111448626A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H01F27/363—Electric or magnetic shields or screens made of electrically conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/008—Electric or magnetic shielding of printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/04—Circuits

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Semiconductor Integrated Circuits (AREA)
CN201880080174.XA 2017-12-15 2018-12-10 层压堆叠基板中的嵌入式垂直电感器 Pending CN111448626A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762599397P 2017-12-15 2017-12-15
US62/599,397 2017-12-15
US16/210,594 US11817239B2 (en) 2017-12-15 2018-12-05 Embedded vertical inductor in laminate stacked substrates
US16/210,594 2018-12-05
PCT/US2018/064782 WO2019118366A1 (en) 2017-12-15 2018-12-10 Embedded vertical inductor in laminate stacked substrates

Publications (1)

Publication Number Publication Date
CN111448626A true CN111448626A (zh) 2020-07-24

Family

ID=66814602

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880080174.XA Pending CN111448626A (zh) 2017-12-15 2018-12-10 层压堆叠基板中的嵌入式垂直电感器

Country Status (8)

Country Link
US (1) US11817239B2 (https=)
EP (1) EP3724900A1 (https=)
JP (1) JP7442446B2 (https=)
KR (1) KR102722208B1 (https=)
CN (1) CN111448626A (https=)
SG (1) SG11202004020TA (https=)
TW (1) TWI837106B (https=)
WO (1) WO2019118366A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023206156A1 (zh) * 2022-04-27 2023-11-02 京东方科技集团股份有限公司 滤波器及其制作方法、电子设备
WO2025020187A1 (zh) * 2023-07-27 2025-01-30 京东方科技集团股份有限公司 电感结构、滤波器

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11546019B2 (en) 2018-12-10 2023-01-03 Skyworks Solutions, Inc. Apparatus for minimizing electromagnetic coupling between surface mount device inductors
US20200286660A1 (en) * 2019-03-04 2020-09-10 Intel Corporation On-package vertical inductors and transformers for compact 5g modules
US11728293B2 (en) * 2021-02-03 2023-08-15 Qualcomm Incorporated Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component
US12592334B2 (en) * 2021-11-22 2026-03-31 Intel Corporation Stacked magnetic inductor and method
JP2023089544A (ja) * 2021-12-16 2023-06-28 キオクシア株式会社 半導体装置
CN116544008B (zh) * 2023-03-31 2026-03-17 泉州市三安集成电路有限公司 一种桥式电感结构及其制作方法和应用

Citations (8)

* Cited by examiner, † Cited by third party
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US20050150106A1 (en) * 2004-01-14 2005-07-14 Long David C. Embedded inductor and method of making
US20100208439A1 (en) * 2009-02-19 2010-08-19 Sony Corporation Wiring board, method of manufacturing same, tuner module, and electronic device
CN102270532A (zh) * 2010-06-01 2011-12-07 台湾积体电路制造股份有限公司 3d电感器和变压器
US20150130021A1 (en) * 2013-11-13 2015-05-14 Qualcomm Incorporated Solonoid inductor in a substrate
CN104969346A (zh) * 2013-02-08 2015-10-07 高通股份有限公司 用于磁致伸缩式随机存取存储器(mram)的小形状因子磁屏蔽
US20150371751A1 (en) * 2014-06-24 2015-12-24 Qualcomm Incorporated Vertical spiral inductor
US20150371764A1 (en) * 2014-06-20 2015-12-24 International Business Machines Corporation Nested helical inductor
US20170076853A1 (en) * 2015-09-15 2017-03-16 Xytech Electronic Technology (Shanghai) Co., Ltd. Coil, inductor device and method for manufacturing the coil

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US6501363B1 (en) * 1999-11-03 2002-12-31 Innosys, Inc. Vertical transformer
JP4341321B2 (ja) * 2003-07-18 2009-10-07 パナソニック株式会社 電子部品内蔵モジュール
US7733207B2 (en) 2007-05-31 2010-06-08 Electronics And Telecommunications Research Institute Vertically formed inductor and electronic device having the same
US9406738B2 (en) * 2011-07-20 2016-08-02 Xilinx, Inc. Inductive structure formed using through silicon vias
JP5761463B2 (ja) 2012-08-09 2015-08-12 株式会社村田製作所 アンテナ装置および無線通信装置
JP2014160751A (ja) 2013-02-20 2014-09-04 Ibiden Co Ltd プリント配線板
US9196406B2 (en) 2013-03-15 2015-11-24 Rf Micro Devices, Inc. High Q factor inductor structure
JP5585740B1 (ja) 2013-03-18 2014-09-10 株式会社村田製作所 積層型インダクタ素子および通信装置
JP2014232837A (ja) 2013-05-30 2014-12-11 イビデン株式会社 配線板
JP2015026762A (ja) 2013-07-29 2015-02-05 イビデン株式会社 プリント配線板
US10796835B2 (en) 2015-08-24 2020-10-06 Qorvo Us, Inc. Stacked laminate inductors for high module volume utilization and performance-cost-size-processing-time tradeoff
US20170084379A1 (en) 2015-09-21 2017-03-23 Qorvo Us, Inc. Substrates with integrated three dimensional inductors with via columns

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050150106A1 (en) * 2004-01-14 2005-07-14 Long David C. Embedded inductor and method of making
US20100208439A1 (en) * 2009-02-19 2010-08-19 Sony Corporation Wiring board, method of manufacturing same, tuner module, and electronic device
CN102270532A (zh) * 2010-06-01 2011-12-07 台湾积体电路制造股份有限公司 3d电感器和变压器
CN104969346A (zh) * 2013-02-08 2015-10-07 高通股份有限公司 用于磁致伸缩式随机存取存储器(mram)的小形状因子磁屏蔽
US20150130021A1 (en) * 2013-11-13 2015-05-14 Qualcomm Incorporated Solonoid inductor in a substrate
US20150371764A1 (en) * 2014-06-20 2015-12-24 International Business Machines Corporation Nested helical inductor
US20150371751A1 (en) * 2014-06-24 2015-12-24 Qualcomm Incorporated Vertical spiral inductor
US20170076853A1 (en) * 2015-09-15 2017-03-16 Xytech Electronic Technology (Shanghai) Co., Ltd. Coil, inductor device and method for manufacturing the coil

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023206156A1 (zh) * 2022-04-27 2023-11-02 京东方科技集团股份有限公司 滤波器及其制作方法、电子设备
WO2025020187A1 (zh) * 2023-07-27 2025-01-30 京东方科技集团股份有限公司 电感结构、滤波器

Also Published As

Publication number Publication date
EP3724900A1 (en) 2020-10-21
US20190189327A1 (en) 2019-06-20
SG11202004020TA (en) 2020-07-29
US11817239B2 (en) 2023-11-14
TW201931394A (zh) 2019-08-01
WO2019118366A1 (en) 2019-06-20
JP2021507508A (ja) 2021-02-22
TWI837106B (zh) 2024-04-01
KR20200097717A (ko) 2020-08-19
JP7442446B2 (ja) 2024-03-04
KR102722208B1 (ko) 2024-10-24

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Application publication date: 20200724

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