JP7442446B2 - ラミネート積層基板における埋め込み垂直インダクタ - Google Patents

ラミネート積層基板における埋め込み垂直インダクタ Download PDF

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Publication number
JP7442446B2
JP7442446B2 JP2020531599A JP2020531599A JP7442446B2 JP 7442446 B2 JP7442446 B2 JP 7442446B2 JP 2020531599 A JP2020531599 A JP 2020531599A JP 2020531599 A JP2020531599 A JP 2020531599A JP 7442446 B2 JP7442446 B2 JP 7442446B2
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Prior art keywords
laminate substrate
vertical
traces
vertical columns
inductor structure
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JP2020531599A
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Japanese (ja)
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JP2021507508A5 (https=
JP2021507508A (ja
Inventor
ダニエル・デイク・キム
ボンフン・クー
ババク・ネジャティ
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クアルコム，インコーポレイテッド
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H01F27/363—Electric or magnetic shields or screens made of electrically conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/008—Electric or magnetic shielding of printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/04—Circuits

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2020531599A 2017-12-15 2018-12-10 ラミネート積層基板における埋め込み垂直インダクタ Active JP7442446B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762599397P 2017-12-15 2017-12-15
US62/599,397 2017-12-15
US16/210,594 US11817239B2 (en) 2017-12-15 2018-12-05 Embedded vertical inductor in laminate stacked substrates
US16/210,594 2018-12-05
PCT/US2018/064782 WO2019118366A1 (en) 2017-12-15 2018-12-10 Embedded vertical inductor in laminate stacked substrates

Publications (3)

Publication Number Publication Date
JP2021507508A JP2021507508A (ja) 2021-02-22
JP2021507508A5 JP2021507508A5 (https=) 2022-01-06
JP7442446B2 true JP7442446B2 (ja) 2024-03-04

Family

ID=66814602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020531599A Active JP7442446B2 (ja) 2017-12-15 2018-12-10 ラミネート積層基板における埋め込み垂直インダクタ

Country Status (8)

Country Link
US (1) US11817239B2 (https=)
EP (1) EP3724900A1 (https=)
JP (1) JP7442446B2 (https=)
KR (1) KR102722208B1 (https=)
CN (1) CN111448626A (https=)
SG (1) SG11202004020TA (https=)
TW (1) TWI837106B (https=)
WO (1) WO2019118366A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11546019B2 (en) 2018-12-10 2023-01-03 Skyworks Solutions, Inc. Apparatus for minimizing electromagnetic coupling between surface mount device inductors
US20200286660A1 (en) * 2019-03-04 2020-09-10 Intel Corporation On-package vertical inductors and transformers for compact 5g modules
US11728293B2 (en) * 2021-02-03 2023-08-15 Qualcomm Incorporated Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive component
US12592334B2 (en) * 2021-11-22 2026-03-31 Intel Corporation Stacked magnetic inductor and method
JP2023089544A (ja) * 2021-12-16 2023-06-28 キオクシア株式会社 半導体装置
US20240379650A1 (en) * 2022-04-27 2024-11-14 Beijing Boe Optoelectronics Technology Co., Ltd. Filter and manufacturing method therefor
CN116544008B (zh) * 2023-03-31 2026-03-17 泉州市三安集成电路有限公司 一种桥式电感结构及其制作方法和应用
WO2025020187A1 (zh) * 2023-07-27 2025-01-30 京东方科技集团股份有限公司 电感结构、滤波器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014024762A1 (ja) 2012-08-09 2014-02-13 株式会社村田製作所 アンテナ装置および無線通信装置
JP2014160751A (ja) 2013-02-20 2014-09-04 Ibiden Co Ltd プリント配線板
US20140353022A1 (en) 2013-05-30 2014-12-04 Ibiden Co., Ltd. Wiring board
JP2015026762A (ja) 2013-07-29 2015-02-05 イビデン株式会社 プリント配線板

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6501363B1 (en) * 1999-11-03 2002-12-31 Innosys, Inc. Vertical transformer
JP4341321B2 (ja) * 2003-07-18 2009-10-07 パナソニック株式会社 電子部品内蔵モジュール
US6931712B2 (en) 2004-01-14 2005-08-23 International Business Machines Corporation Method of forming a dielectric substrate having a multiturn inductor
US7733207B2 (en) 2007-05-31 2010-06-08 Electronics And Telecommunications Research Institute Vertically formed inductor and electronic device having the same
JP5407404B2 (ja) 2009-02-19 2014-02-05 ソニー株式会社 配線基板とその製造方法、チューナモジュール、及び電子機器
US8471358B2 (en) 2010-06-01 2013-06-25 Taiwan Semiconductor Manufacturing Company, Ltd. 3D inductor and transformer
US9406738B2 (en) * 2011-07-20 2016-08-02 Xilinx, Inc. Inductive structure formed using through silicon vias
US8952504B2 (en) 2013-02-08 2015-02-10 Qualcomm Incorporated Small form factor magnetic shield for magnetorestrictive random access memory (MRAM)
US9196406B2 (en) 2013-03-15 2015-11-24 Rf Micro Devices, Inc. High Q factor inductor structure
JP5585740B1 (ja) 2013-03-18 2014-09-10 株式会社村田製作所 積層型インダクタ素子および通信装置
US9806144B2 (en) 2013-11-13 2017-10-31 Qualcomm Incorporated Solenoid inductor in a substrate
US20150371764A1 (en) 2014-06-20 2015-12-24 International Business Machines Corporation Nested helical inductor
US9478348B2 (en) 2014-06-24 2016-10-25 Qualcomm Incorporated Vertical spiral inductor
US10796835B2 (en) 2015-08-24 2020-10-06 Qorvo Us, Inc. Stacked laminate inductors for high module volume utilization and performance-cost-size-processing-time tradeoff
CN106531410B (zh) 2015-09-15 2019-08-27 臻绚电子科技(上海)有限公司 线圈，电感元件及制备应用于电感元件的线圈的方法
US20170084379A1 (en) 2015-09-21 2017-03-23 Qorvo Us, Inc. Substrates with integrated three dimensional inductors with via columns

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014024762A1 (ja) 2012-08-09 2014-02-13 株式会社村田製作所 アンテナ装置および無線通信装置
JP2014160751A (ja) 2013-02-20 2014-09-04 Ibiden Co Ltd プリント配線板
US20140353022A1 (en) 2013-05-30 2014-12-04 Ibiden Co., Ltd. Wiring board
JP2014232837A (ja) 2013-05-30 2014-12-11 イビデン株式会社 配線板
JP2015026762A (ja) 2013-07-29 2015-02-05 イビデン株式会社 プリント配線板

Also Published As

Publication number Publication date
EP3724900A1 (en) 2020-10-21
US20190189327A1 (en) 2019-06-20
SG11202004020TA (en) 2020-07-29
US11817239B2 (en) 2023-11-14
TW201931394A (zh) 2019-08-01
WO2019118366A1 (en) 2019-06-20
JP2021507508A (ja) 2021-02-22
CN111448626A (zh) 2020-07-24
TWI837106B (zh) 2024-04-01
KR20200097717A (ko) 2020-08-19
KR102722208B1 (ko) 2024-10-24

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