JP2021174924A5 - - Google Patents

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Publication number
JP2021174924A5
JP2021174924A5 JP2020079269A JP2020079269A JP2021174924A5 JP 2021174924 A5 JP2021174924 A5 JP 2021174924A5 JP 2020079269 A JP2020079269 A JP 2020079269A JP 2020079269 A JP2020079269 A JP 2020079269A JP 2021174924 A5 JP2021174924 A5 JP 2021174924A5
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JP
Japan
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layer
region
conductivity type
semiconductor substrate
base layer
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JP2020079269A
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English (en)
Japanese (ja)
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JP2021174924A (ja
JP7435214B2 (ja
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Priority claimed from JP2020079269A external-priority patent/JP7435214B2/ja
Priority to JP2020079269A priority Critical patent/JP7435214B2/ja
Application filed filed Critical
Priority to CN202180030791.0A priority patent/CN115485857A/zh
Priority to PCT/JP2021/016486 priority patent/WO2021220965A1/ja
Publication of JP2021174924A publication Critical patent/JP2021174924A/ja
Priority to US17/972,945 priority patent/US12363997B2/en
Publication of JP2021174924A5 publication Critical patent/JP2021174924A5/ja
Publication of JP7435214B2 publication Critical patent/JP7435214B2/ja
Application granted granted Critical
Priority to US19/231,815 priority patent/US20250301773A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2020079269A 2020-04-28 2020-04-28 半導体装置 Active JP7435214B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020079269A JP7435214B2 (ja) 2020-04-28 2020-04-28 半導体装置
CN202180030791.0A CN115485857A (zh) 2020-04-28 2021-04-23 半导体装置
PCT/JP2021/016486 WO2021220965A1 (ja) 2020-04-28 2021-04-23 半導体装置
US17/972,945 US12363997B2 (en) 2020-04-28 2022-10-25 Semiconductor device
US19/231,815 US20250301773A1 (en) 2020-04-28 2025-06-09 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020079269A JP7435214B2 (ja) 2020-04-28 2020-04-28 半導体装置

Publications (3)

Publication Number Publication Date
JP2021174924A JP2021174924A (ja) 2021-11-01
JP2021174924A5 true JP2021174924A5 (enExample) 2022-11-07
JP7435214B2 JP7435214B2 (ja) 2024-02-21

Family

ID=78278327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020079269A Active JP7435214B2 (ja) 2020-04-28 2020-04-28 半導体装置

Country Status (4)

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US (2) US12363997B2 (enExample)
JP (1) JP7435214B2 (enExample)
CN (1) CN115485857A (enExample)
WO (1) WO2021220965A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7729175B2 (ja) 2021-10-26 2025-08-26 住友ゴム工業株式会社 タイヤ
JP7692875B2 (ja) * 2022-05-16 2025-06-16 三菱電機株式会社 パワー半導体装置およびパワー半導体装置の製造方法
JP2024080317A (ja) * 2022-12-02 2024-06-13 株式会社デンソー 半導体装置とその製造方法
JP2024154236A (ja) * 2023-04-18 2024-10-30 株式会社デンソー 半導体装置とその製造方法
JP2024162687A (ja) * 2023-05-11 2024-11-21 株式会社デンソー 半導体装置とその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4109009B2 (ja) * 2002-04-09 2008-06-25 株式会社東芝 半導体素子及びその製造方法
JP4746927B2 (ja) * 2005-07-01 2011-08-10 新電元工業株式会社 半導体装置の製造方法
JP5937413B2 (ja) 2011-06-15 2016-06-22 株式会社デンソー 半導体装置
JP6158123B2 (ja) * 2014-03-14 2017-07-05 株式会社東芝 半導体装置
JP2016086136A (ja) * 2014-10-29 2016-05-19 トヨタ自動車株式会社 半導体装置の製造方法
CN117936538A (zh) * 2018-03-15 2024-04-26 富士电机株式会社 半导体装置
JP7024626B2 (ja) 2018-06-27 2022-02-24 三菱電機株式会社 半導体装置、半導体装置の製造方法

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