JP2021197483A5 - - Google Patents

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Publication number
JP2021197483A5
JP2021197483A5 JP2020103997A JP2020103997A JP2021197483A5 JP 2021197483 A5 JP2021197483 A5 JP 2021197483A5 JP 2020103997 A JP2020103997 A JP 2020103997A JP 2020103997 A JP2020103997 A JP 2020103997A JP 2021197483 A5 JP2021197483 A5 JP 2021197483A5
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JP
Japan
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region
conductive type
main surface
base region
emitter
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JP2020103997A
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English (en)
Japanese (ja)
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JP2021197483A (ja
JP7354937B2 (ja
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Priority to JP2020103997A priority Critical patent/JP7354937B2/ja
Priority claimed from JP2020103997A external-priority patent/JP7354937B2/ja
Priority to PCT/JP2021/019669 priority patent/WO2021256182A1/ja
Priority to CN202180042364.4A priority patent/CN115699269A/zh
Publication of JP2021197483A publication Critical patent/JP2021197483A/ja
Publication of JP2021197483A5 publication Critical patent/JP2021197483A5/ja
Priority to US18/062,360 priority patent/US20230098207A1/en
Application granted granted Critical
Publication of JP7354937B2 publication Critical patent/JP7354937B2/ja
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JP2020103997A 2020-06-16 2020-06-16 半導体装置およびその製造方法 Active JP7354937B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020103997A JP7354937B2 (ja) 2020-06-16 2020-06-16 半導体装置およびその製造方法
PCT/JP2021/019669 WO2021256182A1 (ja) 2020-06-16 2021-05-24 半導体装置およびその製造方法
CN202180042364.4A CN115699269A (zh) 2020-06-16 2021-05-24 半导体装置及其制造方法
US18/062,360 US20230098207A1 (en) 2020-06-16 2022-12-06 Semiconductor device and manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020103997A JP7354937B2 (ja) 2020-06-16 2020-06-16 半導体装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2021197483A JP2021197483A (ja) 2021-12-27
JP2021197483A5 true JP2021197483A5 (enExample) 2022-06-10
JP7354937B2 JP7354937B2 (ja) 2023-10-03

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ID=79196068

Family Applications (1)

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JP2020103997A Active JP7354937B2 (ja) 2020-06-16 2020-06-16 半導体装置およびその製造方法

Country Status (4)

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US (1) US20230098207A1 (enExample)
JP (1) JP7354937B2 (enExample)
CN (1) CN115699269A (enExample)
WO (1) WO2021256182A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240145462A1 (en) * 2022-10-27 2024-05-02 Globalfoundries Singapore Pte. Ltd. Electrostatic discharge control devices
US12471385B2 (en) * 2022-12-08 2025-11-11 Globalfoundries Singapore Pte. Ltd. Electrostatic discharge protection devices with multiple-depth trench isolation
US12396236B1 (en) 2024-04-23 2025-08-19 Globalfoundries Singapore Pte. Ltd. High-voltage electrostatic discharge device
US12453156B1 (en) * 2024-04-23 2025-10-21 Globalfoundries Singapore Pte. Ltd. High-voltage electrostatic discharge device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61114574A (ja) * 1984-11-09 1986-06-02 Hitachi Ltd 半導体装置
EP0253724A1 (en) * 1986-07-16 1988-01-20 Fairchild Semiconductor Corporation A method of simultaneously fabricating bipolar and complementary field effect transistors using a minimal number of masks
JP2000183073A (ja) 1998-12-17 2000-06-30 Rohm Co Ltd バイポーラトランジスタを含む半導体装置
JP2003318188A (ja) 2002-04-24 2003-11-07 Denso Corp ラテラルpnpトランジスタおよびその製造方法
JP2004140235A (ja) 2002-10-18 2004-05-13 Toshiba Corp 半導体装置

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