JP2021130162A - 非接触搬送装置 - Google Patents
非接触搬送装置 Download PDFInfo
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- JP2021130162A JP2021130162A JP2020026447A JP2020026447A JP2021130162A JP 2021130162 A JP2021130162 A JP 2021130162A JP 2020026447 A JP2020026447 A JP 2020026447A JP 2020026447 A JP2020026447 A JP 2020026447A JP 2021130162 A JP2021130162 A JP 2021130162A
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- 239000012530 fluid Substances 0.000 claims abstract description 55
- 230000007246 mechanism Effects 0.000 claims description 20
- 230000032258 transport Effects 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- 239000013013 elastic material Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 description 22
- 230000000694 effects Effects 0.000 description 9
- 238000004891 communication Methods 0.000 description 7
- 238000001514 detection method Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 230000000740 bleeding effect Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
- B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0023—Gripper surfaces directly activated by a fluid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/917—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers control arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
Description
ワークに臨むワーク保持面を軸方向端部に有したボディと、
ボディの内部に形成されエア供給部から供給された圧力流体が流通する通路と、
ボディの内部に設けられ、通路の下流端と連通して径方向外側へと延在し、且つ、ボディの周方向に沿って複数設けられ通路内の圧力流体をワーク保持面へ向けて導出するノズルと、
ワーク保持面に対して軸方向に窪み、ノズルの径方向端部とワーク保持面とを繋ぐ凹部と、
を備え、
ノズルが、ボディの軸方向において少なくとも一部が断面円弧状となりワーク保持面側に向かって窪んで形成され、径方向外側へ向かって放射状に延在する。
14…ディフレクタ 16…ワーク保持面
18…ストッパ機構 20…孔部
22…第1ポート 24…第2ポート
36…凹部 48…第1湾曲面
50…第2湾曲面 66…フランジ部
84…ノズル溝 86…パッド部材
104、152…保持部 106…第1アタッチメント部材
110、156…カバー壁 112…円環部
114…架橋部 154…第2アタッチメント部材
158…ガイド壁 S1、S2…ワーク
Claims (9)
- 圧力流体の供給作用下にワークを吸引し、該ワークを非接触状態で保持搬送する非接触搬送装置において、
前記ワークに臨むワーク保持面を軸方向端部に有したボディと、
前記ボディの内部に形成されエア供給部から供給された前記圧力流体が流通する通路と、
前記ボディの内部に設けられ、前記通路の下流端と連通して径方向外側へと延在し、且つ、前記ボディの周方向に沿って複数設けられ前記通路内の圧力流体を前記ワーク保持面へ向けて導出するノズルと、
前記ワーク保持面に対して軸方向に窪み、前記ノズルの径方向端部と前記ワーク保持面とを繋ぐ凹部と、
を備え、
前記ノズルが、前記ボディの軸方向において少なくとも一部が断面円弧状となり前記ワーク保持面側に向かって窪んで形成され、径方向外側へ向かって放射状に延在する、非接触搬送装置。 - 請求項1記載の非接触搬送装置において、
前記ノズルは、前記ボディの中央に収納されるディフレクタに形成され、該ディフレクタの軸方向端部が前記凹部に臨むように設けられる、非接触搬送装置。 - 請求項1又は2記載の非接触搬送装置において、
前記ノズルは、前記凹部の内壁面に当接する部位に形成され、前記内壁面との間に前記圧力流体の流通する流路を構成する、非接触搬送装置。 - 請求項1〜3のいずれか1項に記載の非接触搬送装置において、
前記ワーク保持面には、前記ワークが吸引された際に接触可能なストッパ機構を備え、該ストッパ機構は、弾性材料から形成され前記ワーク保持面に対して一部が突出したパッド部材と、該パッド部材の内部に挿入され前記ボディに対して前記パッド部材を固定するピン部材とを備える、非接触搬送装置。 - 請求項4記載の非接触搬送装置において、
前記パッド部材は、前記ワーク保持面に対して離間する方向へスカート状に広がって前記ワークに接触可能なパッド部を有する、非接触搬送装置。 - 請求項2〜5のいずれか1項に記載の非接触搬送装置において、
前記ボディ、前記ディフレクタ及び前記パッド部材は、半導電性材料から形成される、非接触搬送装置。 - 請求項1〜6のいずれか1項に記載の非接触搬送装置において、
前記ボディには、前記ワーク保持面に臨み、且つ、該ワーク保持面に対して所定距離離間して複数の開口を有した保持部を備えたアタッチメント部材が着脱自在に設けられる、非接触搬送装置。 - 請求項1〜6のいずれか1項に記載の非接触搬送装置において、
前記ボディには、前記ワーク保持面側となり、該ワーク保持面に対して径方向外側で軸方向に延在する環状の保持部を備えたアタッチメント部材が着脱自在に設けられる、非接触搬送装置。 - 請求項2〜8のいずれか1項に記載の非接触搬送装置において、
前記ボディには、前記ワーク保持面とは反対側となる端部、又は、軸方向と略直交する側面部に開口したポートを有し、前記ポートが前記ディフレクタの内部を通じて前記凹部と連通している、非接触搬送装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020026447A JP7219426B2 (ja) | 2020-02-19 | 2020-02-19 | 非接触搬送装置 |
EP21155673.3A EP3869544A1 (en) | 2020-02-19 | 2021-02-08 | Non-contact transport device |
US17/169,601 US11541554B2 (en) | 2020-02-19 | 2021-02-08 | Non-contact transport device |
TW110105304A TW202144259A (zh) | 2020-02-19 | 2021-02-17 | 非接觸搬送裝置 |
CN202110189982.3A CN113277302A (zh) | 2020-02-19 | 2021-02-18 | 非接触输送装置 |
KR1020210022415A KR20210105843A (ko) | 2020-02-19 | 2021-02-19 | 비접촉 반송장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020026447A JP7219426B2 (ja) | 2020-02-19 | 2020-02-19 | 非接触搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021130162A true JP2021130162A (ja) | 2021-09-09 |
JP7219426B2 JP7219426B2 (ja) | 2023-02-08 |
Family
ID=74561712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2020026447A Active JP7219426B2 (ja) | 2020-02-19 | 2020-02-19 | 非接触搬送装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11541554B2 (ja) |
EP (1) | EP3869544A1 (ja) |
JP (1) | JP7219426B2 (ja) |
KR (1) | KR20210105843A (ja) |
CN (1) | CN113277302A (ja) |
TW (1) | TW202144259A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023056639A (ja) * | 2021-10-08 | 2023-04-20 | Smc株式会社 | リフト装置 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6351446U (ja) * | 1986-09-22 | 1988-04-07 | ||
JPH05136254A (ja) * | 1991-11-13 | 1993-06-01 | Hitachi Ltd | 静電吸着装置 |
JP2002319611A (ja) * | 2001-04-23 | 2002-10-31 | Sharp Corp | 板状体の取り出し装置 |
JP2004119784A (ja) * | 2002-09-27 | 2004-04-15 | Disco Abrasive Syst Ltd | 板状物の搬送装置 |
JP2005251948A (ja) * | 2004-03-03 | 2005-09-15 | Izumi Akiyama | 非接触保持装置および非接触保持搬送装置 |
JP2006346783A (ja) * | 2005-06-14 | 2006-12-28 | Myotoku Ltd | 非接触ハンド |
JP5110480B2 (ja) * | 2010-05-11 | 2012-12-26 | Smc株式会社 | 非接触搬送装置 |
JP2014227260A (ja) * | 2013-05-22 | 2014-12-08 | 株式会社ハーモテック | 搬送装置 |
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JPH0723445B2 (ja) | 1986-08-20 | 1995-03-15 | 東レ株式会社 | オキシメチレン共重合体組成物 |
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JP2003245885A (ja) * | 2002-02-25 | 2003-09-02 | Koganei Corp | 搬送装置 |
JP4342331B2 (ja) * | 2004-02-09 | 2009-10-14 | 株式会社コガネイ | 非接触搬送装置 |
JP4491340B2 (ja) * | 2004-12-28 | 2010-06-30 | 株式会社コガネイ | 搬送装置 |
JP5250864B2 (ja) * | 2008-03-26 | 2013-07-31 | Smc株式会社 | 搬送装置 |
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-
2020
- 2020-02-19 JP JP2020026447A patent/JP7219426B2/ja active Active
-
2021
- 2021-02-08 EP EP21155673.3A patent/EP3869544A1/en active Pending
- 2021-02-08 US US17/169,601 patent/US11541554B2/en active Active
- 2021-02-17 TW TW110105304A patent/TW202144259A/zh unknown
- 2021-02-18 CN CN202110189982.3A patent/CN113277302A/zh active Pending
- 2021-02-19 KR KR1020210022415A patent/KR20210105843A/ko unknown
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JPS6351446U (ja) * | 1986-09-22 | 1988-04-07 | ||
JPH05136254A (ja) * | 1991-11-13 | 1993-06-01 | Hitachi Ltd | 静電吸着装置 |
JP2002319611A (ja) * | 2001-04-23 | 2002-10-31 | Sharp Corp | 板状体の取り出し装置 |
JP2004119784A (ja) * | 2002-09-27 | 2004-04-15 | Disco Abrasive Syst Ltd | 板状物の搬送装置 |
JP2005251948A (ja) * | 2004-03-03 | 2005-09-15 | Izumi Akiyama | 非接触保持装置および非接触保持搬送装置 |
JP2006346783A (ja) * | 2005-06-14 | 2006-12-28 | Myotoku Ltd | 非接触ハンド |
JP5110480B2 (ja) * | 2010-05-11 | 2012-12-26 | Smc株式会社 | 非接触搬送装置 |
JP2014227260A (ja) * | 2013-05-22 | 2014-12-08 | 株式会社ハーモテック | 搬送装置 |
Also Published As
Publication number | Publication date |
---|---|
EP3869544A1 (en) | 2021-08-25 |
TW202144259A (zh) | 2021-12-01 |
CN113277302A (zh) | 2021-08-20 |
JP7219426B2 (ja) | 2023-02-08 |
KR20210105843A (ko) | 2021-08-27 |
US20210252720A1 (en) | 2021-08-19 |
US11541554B2 (en) | 2023-01-03 |
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