JP2021114621A - 個片化方法 - Google Patents
個片化方法 Download PDFInfo
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- JP2021114621A JP2021114621A JP2021068886A JP2021068886A JP2021114621A JP 2021114621 A JP2021114621 A JP 2021114621A JP 2021068886 A JP2021068886 A JP 2021068886A JP 2021068886 A JP2021068886 A JP 2021068886A JP 2021114621 A JP2021114621 A JP 2021114621A
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- 238000000034 method Methods 0.000 title claims abstract description 87
- 239000004065 semiconductor Substances 0.000 claims abstract description 279
- 229910052751 metal Inorganic materials 0.000 claims abstract description 200
- 239000002184 metal Substances 0.000 claims abstract description 200
- 238000004140 cleaning Methods 0.000 claims abstract description 48
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 39
- 230000001678 irradiating effect Effects 0.000 claims abstract description 13
- 238000003860 storage Methods 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 278
- 239000011241 protective layer Substances 0.000 claims description 70
- 238000013467 fragmentation Methods 0.000 claims description 12
- 238000006062 fragmentation reaction Methods 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 49
- 238000005520 cutting process Methods 0.000 abstract description 18
- 239000000463 material Substances 0.000 abstract description 5
- 230000001681 protective effect Effects 0.000 abstract 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 169
- 238000005755 formation reaction Methods 0.000 description 48
- 239000012535 impurity Substances 0.000 description 27
- 239000000758 substrate Substances 0.000 description 24
- 210000000746 body region Anatomy 0.000 description 10
- 239000000047 product Substances 0.000 description 8
- 238000002474 experimental method Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- YNGJHXAVDDIVMV-UHFFFAOYSA-N 1-methoxypropan-2-ol 2-methoxypropan-1-ol Chemical compound COC(CO)C.COCC(C)O YNGJHXAVDDIVMV-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005108 dry cleaning Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823487—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of vertical transistor structures, i.e. with channel vertical to the substrate surface
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02076—Cleaning after the substrates have been singulated
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
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- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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Abstract
Description
発明者らは、金属層を構成する金属を含む形成物の付着を抑制した半導体装置を提供すべく、鋭意、実験、検討を重ねた。
[1−1.半導体装置の構造]
以下、実施の形態1に係る半導体装置の構造について説明する。実施の形態1に係る半導体装置は、2つの縦型MOS(Metal Oxide Semiconductor)トランジスタが形成された、フェイスダウン実装が可能なチップサイズパッケージ(Chip Size Package:CSP)型の半導体デバイスである。上記2つの縦型MOSトランジスタは、パワートランジスタであり、いわゆる、トレンチMOS型FET(Field Effect Transistor)である。
上記半導体装置1は、複数の半導体素子構造が形成されたウェーハを個片化することで形成される。
半導体装置1は、第1の個片化方法により、ウェーハ100から個片化される。このため、上述したように、半導体装置1は、半導体層40の平面視における半導体層40の外縁から5μm以上内側の、任意の10μm×10μmの領域で、前記金属層を構成する金属を含む形成物の面積占有率は、5%以下となる。
以下、実施の形態1に係る半導体装置1から、その構成の一部が変更された実施の形態2に係る半導体装置について説明する。
上述したように、実施の形態1に係る半導体装置1は、ウェーハ100を第1の個片化方法により個片化されることで製造される。これに対して、実施の形態2に係る半導体装置は、ウェーハ100を、第1の個片化方法からその一部の工程が変更された第2の個片化方法により個片化されることで製造される。これにより、第2の個片化方法により個片化された実施の形態2に係る半導体装置と、半導体装置1とは、半導体基板32と、低濃度不純物層33と、酸化膜34との形状が異なる。このため、実施の形態2において半導体基板32を半導体基板32Aと称し、低濃度不純物層33を低濃度不純物層33Aと称し、酸化膜34を酸化膜34Aと称する。また、これに伴い、半導体層40を半導体層40Aと称し、ウェーハ100をウェーハ100Aと称する。また、実施の形態2に係る半導体装置を半導体装置1Aと称する。
以下、半導体装置1Aをウェーハ100Aから個片化する第2の個片化方法について説明する。
半導体装置1Aは、第2の個片化方法により、ウェーハ100Aから個片化される。このため、上述したように、半導体装置1Aは、半導体層40Aの平面視における半導体層40Aの外縁から13μm以上内側の、任意の10μm×10μmの領域で、前記金属層を構成する金属を含む形成物の面積占有率は、5%以下となる。
以上、本開示の一態様に係る半導体装置および個片化方法について、実施の形態1および実施の形態2に基づいて説明したが、本開示は、これら実施の形態に限定されるものではない。本開示の趣旨を逸脱しない限り、当業者が思いつく各種変形をこれら実施の形態に施したものや、異なる実施の形態における構成要素を組み合わせて構築される形態も、本開示の1つまたは複数の態様の範囲内に含まれてもよい。
10 トランジスタ(第1の縦型MOSトランジスタ)
11 第1のソース電極
12、13、22、23 部分
14 第1のソース領域
15 第1のゲート導体
16 第1のゲート絶縁膜
18 第1のボディ領域
20 トランジスタ(第2の縦型MOSトランジスタ)
21 第2のソース電極
24 第2のソース領域
25 第2のゲート導体
26 第2のゲート絶縁膜
28 第2のボディ領域
30 金属層
30A 第1の金属層
30B 第2の金属層
32、32A 半導体基板
33、33A 低濃度不純物層
34、34A 酸化膜
35 保護層
40、40A 半導体層
50 表面保持膜
51、51A 水溶性保護層
52 ダイシングテープ
62、62A、62B、63、63A、63B、64、65、66、67、72、72A、72B、73、73A、73B、74、75、76、77 デブリ(金属層を構成する金属からなる形成物)
90 中央線
90C 境界
91 一方の長辺
92 他方の長辺
93 一方の短辺
94 他方の短辺
100、100A ウェーハ
111、111a、111b、111c、111d、111e、111f 第1のソースパッド
119 第1のゲートパッド
121、121a、121b、121c、121d、121e、121f 第2のソースパッド
129 第2のゲートパッド
A1 第1の領域
A2 第2の領域
Claims (9)
- 上面に複数の半導体素子構造が形成されたウェーハを個片化する個片化方法であって、
前記ウェーハの上面に表面保持膜を形成する第1の工程と、
前記ウェーハの下面を薄化加工する第2の工程と、
前記ウェーハの上面から前記表面保持膜を除去する第3の工程と、
薄化加工された前記ウェーハの下面に厚さ10μm以上の金属層を形成する第4の工程と、
前記金属層の下面にダイシングテープを貼り付ける第5の工程と、
前記ウェーハの上面に、前記ウェーハの表面の親水性を高める処理を施す第6の工程と、
前記ウェーハの表面に、水溶性保護層を形成する第7の工程と、
前記ウェーハの上面の所定の領域に、レーザ光を照射して前記金属層を切断する第8の工程と、
前記ウェーハの表面から、洗浄用水を用いて前記水溶性保護層を除去する第9の工程と、を順に含み、
前記第6の工程の終了から前記第7の工程の開始までの期間に、さらに、前記ウェーハを、前記ウェーハの表面における親水性が失われない保管環境で保管する保管工程を含む
個片化方法。 - 前記第6の工程の終了から前記第7の工程の開始までの期間、前記ウェーハを、立方フィート当たり0.5μmのパーティクルが5000個以下の環境で保管する
請求項1に記載の個片化方法。 - 前記第6の工程の終了から240時間未満に前記第7の工程を開始する
請求項1に記載の個片化方法。 - 前記第7の工程の開始時点において、比抵抗13.2MΩ〜17.0MΩの純水1.77mm3を前記ウェーハの表面に静置して形成される水滴と、前記ウェーハの表面との接触角度は、60度未満である
請求項1から請求項3のいずれか1項に記載の個片化方法。 - 前記第9の工程は、
第1の水圧の前記洗浄用水を用いる第1の洗浄工程と、
第2の水圧の前記洗浄用水を用いる第2の洗浄工程と、を順に含み、
前記第1の水圧は、50bar以上であり、前記第2の水圧より高く、
前記第1の洗浄工程の期間は、40秒以上100秒以下である
請求項1から請求項3のいずれか1項に記載の個片化方法。 - 前記第1の洗浄工程では、前記ウェーハを第1の回転速度で回転させ、
前記第2の洗浄工程では、前記ウェーハを前記第1の回転速度以下の第2の回転速度で回転させ、
前記第9の工程は、更に、前記第1の洗浄工程と前記第2の洗浄工程との間に、前記ウェーハを前記第1の回転速度よりも速い第3の回転速度で回転させる乾燥工程を含む
請求項5に記載の個片化方法。 - 更に、前記第5の工程の終了から前記第6の工程の開始までの期間に、前記ウェーハの上面における、前記複数の半導体素子構造間の領域に溝を形成する第10の工程を含む
請求項1に記載の個片化方法。 - 前記ウェーハの平面視において、
前記所定の領域は、前記溝の内部の領域に含まれ、
前記所定の領域と前記溝の縁との最短距離は、14μm以上である
請求項7に記載の個片化方法。 - 前記親水性を高める処理は、前記ウェーハの表面に対して行うプラズマ洗浄である
請求項1から請求項3のいずれか1項に記載の個片化方法。
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