JP2021027279A5 - - Google Patents

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Publication number
JP2021027279A5
JP2021027279A5 JP2019146311A JP2019146311A JP2021027279A5 JP 2021027279 A5 JP2021027279 A5 JP 2021027279A5 JP 2019146311 A JP2019146311 A JP 2019146311A JP 2019146311 A JP2019146311 A JP 2019146311A JP 2021027279 A5 JP2021027279 A5 JP 2021027279A5
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JP
Japan
Prior art keywords
defective product
insulating layer
product area
opening
wiring
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Application number
JP2019146311A
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English (en)
Japanese (ja)
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JP2021027279A (ja
JP7249907B2 (ja
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Priority to JP2019146311A priority Critical patent/JP7249907B2/ja
Priority claimed from JP2019146311A external-priority patent/JP7249907B2/ja
Priority to US16/983,202 priority patent/US11219128B2/en
Publication of JP2021027279A publication Critical patent/JP2021027279A/ja
Publication of JP2021027279A5 publication Critical patent/JP2021027279A5/ja
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Publication of JP7249907B2 publication Critical patent/JP7249907B2/ja
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JP2019146311A 2019-08-08 2019-08-08 配線基板の製造方法及び積層構造 Active JP7249907B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019146311A JP7249907B2 (ja) 2019-08-08 2019-08-08 配線基板の製造方法及び積層構造
US16/983,202 US11219128B2 (en) 2019-08-08 2020-08-03 Laminated structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019146311A JP7249907B2 (ja) 2019-08-08 2019-08-08 配線基板の製造方法及び積層構造

Publications (3)

Publication Number Publication Date
JP2021027279A JP2021027279A (ja) 2021-02-22
JP2021027279A5 true JP2021027279A5 (enExample) 2022-03-29
JP7249907B2 JP7249907B2 (ja) 2023-03-31

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ID=74499078

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JP2019146311A Active JP7249907B2 (ja) 2019-08-08 2019-08-08 配線基板の製造方法及び積層構造

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US (1) US11219128B2 (enExample)
JP (1) JP7249907B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102789024B1 (ko) * 2019-12-17 2025-04-01 삼성전기주식회사 전자부품 내장기판
KR102393573B1 (ko) * 2020-07-06 2022-05-03 (주)와이솔 표면 탄성파 웨이퍼 레벨 패키지 및 그 제작 방법
KR102734651B1 (ko) * 2020-09-17 2024-11-28 삼성디스플레이 주식회사 표시 패널의 제조방법
US12419149B2 (en) * 2021-03-05 2025-09-16 Seoul Semiconductor Co., Ltd. Circuit board having multiple solder resists and displaying apparatus having the same
CN115484754A (zh) * 2021-06-16 2022-12-16 宏启胜精密电子(秦皇岛)有限公司 具有内埋元件的线路板及其制作方法
CN114501856B (zh) * 2021-12-13 2024-07-12 深圳市华鼎星科技有限公司 多层导电线路及其制作方法及显示模组
KR20240136339A (ko) * 2022-01-13 2024-09-13 아지노모토 가부시키가이샤 회로 기판의 제조방법 및 이에 사용하는 수지 시트
JP7282945B1 (ja) * 2022-03-29 2023-05-29 株式会社日本製鋼所 制御装置、積層成形品製造システムおよび積層成形品の製造方法
JP2024085326A (ja) * 2022-12-14 2024-06-26 イビデン株式会社 プリント配線板

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1098368B1 (en) * 1999-04-16 2011-12-21 Panasonic Corporation Module component and method of manufacturing the same
JP2001291727A (ja) * 2000-04-10 2001-10-19 Matsushita Electric Ind Co Ltd ダイボンディング方法
US8704359B2 (en) * 2003-04-01 2014-04-22 Ge Embedded Electronics Oy Method for manufacturing an electronic module and an electronic module
EP1962569A1 (en) * 2005-12-16 2008-08-27 Ibiden Co., Ltd. Multilayer printed wiring plate, and method for fabricating the same
JP5444473B2 (ja) * 2010-10-01 2014-03-19 株式会社メイコー 部品内蔵基板及び部品内蔵基板の製造方法
US8745860B2 (en) * 2011-03-11 2014-06-10 Ibiden Co., Ltd. Method for manufacturing printed wiring board
JP2014096506A (ja) * 2012-11-09 2014-05-22 Renesas Electronics Corp 半導体装置及び半導体装置の製造方法
KR20150028031A (ko) * 2013-09-05 2015-03-13 삼성전기주식회사 인쇄회로기판
KR102222608B1 (ko) * 2014-08-01 2021-03-05 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR102295105B1 (ko) * 2014-12-29 2021-08-31 삼성전기주식회사 회로기판 및 회로기판 제조방법
KR102483612B1 (ko) * 2015-02-10 2023-01-02 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP2016149411A (ja) 2015-02-10 2016-08-18 イビデン株式会社 半導体素子内蔵配線板及びその製造方法
US10032651B2 (en) * 2015-02-12 2018-07-24 Taiwan Semiconductor Manufacturing Company, Ltd. Package structures and method of forming the same
KR102374256B1 (ko) * 2015-02-23 2022-03-15 삼성전기주식회사 회로기판 및 회로기판 제조방법
KR102411997B1 (ko) * 2015-04-08 2022-06-22 삼성전기주식회사 회로기판 및 회로기판 제조방법
JP2016219478A (ja) * 2015-05-15 2016-12-22 イビデン株式会社 配線基板及びその製造方法
TWI578416B (zh) * 2015-09-18 2017-04-11 旭德科技股份有限公司 封裝載板及其製作方法
KR102192569B1 (ko) * 2015-11-06 2020-12-17 삼성전자주식회사 전자 부품 패키지 및 그 제조방법
KR102216506B1 (ko) * 2015-11-10 2021-02-17 삼성전기주식회사 방열부재 및 이를 구비한 인쇄회로기판
JP7208011B2 (ja) * 2016-11-28 2023-01-18 三井金属鉱業株式会社 多層配線板の製造方法

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