JP2020530527A5 - - Google Patents
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- Publication number
- JP2020530527A5 JP2020530527A5 JP2020506157A JP2020506157A JP2020530527A5 JP 2020530527 A5 JP2020530527 A5 JP 2020530527A5 JP 2020506157 A JP2020506157 A JP 2020506157A JP 2020506157 A JP2020506157 A JP 2020506157A JP 2020530527 A5 JP2020530527 A5 JP 2020530527A5
- Authority
- JP
- Japan
- Prior art keywords
- surface region
- face plate
- emissivity
- holes
- density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007789 gas Substances 0.000 claims 16
- 239000000758 substrate Substances 0.000 claims 8
- 230000005855 radiation Effects 0.000 claims 7
- 238000000151 deposition Methods 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023130632A JP2023175682A (ja) | 2017-08-11 | 2023-08-10 | 熱化学気相堆積（ｃｖｄ）における均一性を改善するための装置及び方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762544507P | 2017-08-11 | 2017-08-11 | |
| US62/544,507 | 2017-08-11 | ||
| PCT/US2018/046344 WO2019033052A1 (en) | 2017-08-11 | 2018-08-10 | APPARATUS AND METHODS FOR IMPROVING CHEMICAL VAPOR PHASE (CVD) DEPOSITION UNIFORMITY |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023130632A Division JP2023175682A (ja) | 2017-08-11 | 2023-08-10 | 熱化学気相堆積（ｃｖｄ）における均一性を改善するための装置及び方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020530527A JP2020530527A (ja) | 2020-10-22 |
| JP2020530527A5 true JP2020530527A5 (enExample) | 2021-09-16 |
| JP7384784B2 JP7384784B2 (ja) | 2023-11-21 |
Family
ID=65271311
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020506157A Active JP7384784B2 (ja) | 2017-08-11 | 2018-08-10 | 熱化学気相堆積（ｃｖｄ）における均一性を改善するための装置及び方法 |
| JP2023130632A Pending JP2023175682A (ja) | 2017-08-11 | 2023-08-10 | 熱化学気相堆積（ｃｖｄ）における均一性を改善するための装置及び方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023130632A Pending JP2023175682A (ja) | 2017-08-11 | 2023-08-10 | 熱化学気相堆積（ｃｖｄ）における均一性を改善するための装置及び方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11939675B2 (enExample) |
| JP (2) | JP7384784B2 (enExample) |
| KR (1) | KR102697917B1 (enExample) |
| CN (1) | CN111066133B (enExample) |
| WO (1) | WO2019033052A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102560283B1 (ko) * | 2018-01-24 | 2023-07-26 | 삼성전자주식회사 | 샤워 헤드를 설계하고 제조하는 장치 및 방법 |
| JP2022535285A (ja) | 2019-06-07 | 2022-08-05 | アプライド マテリアルズ インコーポレイテッド | 湾曲面を有する面板 |
| CN114514602B (zh) * | 2019-09-27 | 2025-11-07 | 朗姆研究公司 | 用于影响衬底支撑件的温度分布轮廓的可调式和不可调式热屏 |
| US11600470B2 (en) * | 2019-12-27 | 2023-03-07 | Applied Materials, Inc. | Targeted heat control systems |
| US11810764B2 (en) * | 2020-04-23 | 2023-11-07 | Applied Materials, Inc. | Faceplate with edge flow control |
| TW202147492A (zh) * | 2020-06-03 | 2021-12-16 | 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 | 噴淋板、基板處理裝置、基板處理方法 |
| DE102020123546A1 (de) | 2020-09-09 | 2022-03-10 | Aixtron Se | CVD-Reaktor mit einer Kühlfläche mit bereichsweise vergrößerter Emissivität |
| US11946140B2 (en) | 2021-03-26 | 2024-04-02 | Applied Materials, Inc. | Hot showerhead |
| USD1071103S1 (en) * | 2022-04-11 | 2025-04-15 | Applied Materials, Inc. | Gas distribution plate |
| CN115125520B (zh) * | 2022-08-09 | 2023-11-24 | 季华恒一(佛山)半导体科技有限公司 | 一种匀气板及镀膜装置 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2610556C2 (de) * | 1976-03-12 | 1978-02-02 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum Verteilen strömender Medien über einen Strömungsquerschnitt |
| US5133284A (en) * | 1990-07-16 | 1992-07-28 | National Semiconductor Corp. | Gas-based backside protection during substrate processing |
| JP3824675B2 (ja) * | 1995-03-03 | 2006-09-20 | 有限会社デジタル・ウェーブ | 結晶製造装置 |
| US6301434B1 (en) * | 1998-03-23 | 2001-10-09 | Mattson Technology, Inc. | Apparatus and method for CVD and thermal processing of semiconductor substrates |
| JPH11279778A (ja) * | 1998-03-30 | 1999-10-12 | Seiko Epson Corp | エッチング装置及び半導体装置の製造方法 |
| US6245192B1 (en) * | 1999-06-30 | 2001-06-12 | Lam Research Corporation | Gas distribution apparatus for semiconductor processing |
| JP2002299240A (ja) * | 2001-03-28 | 2002-10-11 | Tadahiro Omi | プラズマ処理装置 |
| JP2007042951A (ja) * | 2005-08-04 | 2007-02-15 | Tokyo Electron Ltd | プラズマ処理装置 |
| TW200711029A (en) * | 2005-08-05 | 2007-03-16 | Tokyo Electron Ltd | Substrate processing apparatus and substrate stage used therein |
| US8142606B2 (en) | 2007-06-07 | 2012-03-27 | Applied Materials, Inc. | Apparatus for depositing a uniform silicon film and methods for manufacturing the same |
| US8291857B2 (en) * | 2008-07-03 | 2012-10-23 | Applied Materials, Inc. | Apparatuses and methods for atomic layer deposition |
| JP5487049B2 (ja) | 2010-08-19 | 2014-05-07 | 株式会社日本マイクロニクス | プローブカード |
| US8470614B2 (en) * | 2010-10-28 | 2013-06-25 | Texas Instruments Incorporated | PECVD showerhead configuration for CMP uniformity and improved stress |
| JP2012142329A (ja) * | 2010-12-28 | 2012-07-26 | Toshiba Corp | 処理装置 |
| KR101232200B1 (ko) * | 2010-12-28 | 2013-02-12 | 피에스케이 주식회사 | 배플, 기판 처리 장치 및 그 처리 방법 |
| JP5550602B2 (ja) | 2011-04-28 | 2014-07-16 | パナソニック株式会社 | 静電チャックおよびこれを備えるドライエッチング装置 |
| US9167625B2 (en) | 2011-11-23 | 2015-10-20 | Asm Ip Holding B.V. | Radiation shielding for a substrate holder |
| US20130164948A1 (en) * | 2011-12-22 | 2013-06-27 | Intermolecular, Inc. | Methods for improving wafer temperature uniformity |
| KR20130111029A (ko) * | 2012-03-30 | 2013-10-10 | 삼성전자주식회사 | 화학 기상 증착 장치용 서셉터 및 이를 구비하는 화학 기상 증착 장치 |
| US20130284092A1 (en) * | 2012-04-25 | 2013-10-31 | Applied Materials, Inc. | Faceplate having regions of differing emissivity |
| US9315899B2 (en) * | 2012-06-15 | 2016-04-19 | Novellus Systems, Inc. | Contoured showerhead for improved plasma shaping and control |
| KR102133373B1 (ko) * | 2012-08-23 | 2020-07-13 | 어플라이드 머티어리얼스, 인코포레이티드 | Uv 챔버들을 세정하기 위한 방법 및 하드웨어 |
| KR20150049180A (ko) * | 2013-10-29 | 2015-05-08 | 세메스 주식회사 | 기판 처리 장치 |
| JP5726281B1 (ja) * | 2013-12-27 | 2015-05-27 | 株式会社日立国際電気 | 基板処理装置及び半導体装置の製造方法 |
| SG10201901906YA (en) * | 2014-09-05 | 2019-04-29 | Applied Materials Inc | Atmospheric epitaxial deposition chamber |
| US9390910B2 (en) * | 2014-10-03 | 2016-07-12 | Applied Materials, Inc. | Gas flow profile modulated control of overlay in plasma CVD films |
| US10358722B2 (en) | 2015-12-14 | 2019-07-23 | Lam Research Corporation | Showerhead assembly |
| KR102528559B1 (ko) * | 2016-07-26 | 2023-05-04 | 삼성전자주식회사 | 대면적 기판 제조 장치 |
-
2018
- 2018-08-10 JP JP2020506157A patent/JP7384784B2/ja active Active
- 2018-08-10 US US16/636,659 patent/US11939675B2/en active Active
- 2018-08-10 KR KR1020207005044A patent/KR102697917B1/ko active Active
- 2018-08-10 CN CN201880056745.6A patent/CN111066133B/zh active Active
- 2018-08-10 WO PCT/US2018/046344 patent/WO2019033052A1/en not_active Ceased
-
2023
- 2023-08-10 JP JP2023130632A patent/JP2023175682A/ja active Pending