JP2018533673A5 - - Google Patents
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- Publication number
- JP2018533673A5 JP2018533673A5 JP2018521365A JP2018521365A JP2018533673A5 JP 2018533673 A5 JP2018533673 A5 JP 2018533673A5 JP 2018521365 A JP2018521365 A JP 2018521365A JP 2018521365 A JP2018521365 A JP 2018521365A JP 2018533673 A5 JP2018533673 A5 JP 2018533673A5
- Authority
- JP
- Japan
- Prior art keywords
- apertures
- extending
- collimator
- aspect ratio
- hexagonal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002093 peripheral effect Effects 0.000 claims 8
- 230000007704 transition Effects 0.000 claims 6
- 238000005477 sputtering target Methods 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 2
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022031654A JP7504938B2 (ja) | 2015-10-27 | 2022-03-02 | Pvdスパッタチャンバ向けのバイアス可能なフラックスオプティマイザ/コリメータ |
| JP2024095005A JP2024127896A (ja) | 2015-10-27 | 2024-06-12 | Pvdスパッタチャンバ向けのバイアス可能なフラックスオプティマイザ/コリメータ |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562246967P | 2015-10-27 | 2015-10-27 | |
| US62/246,967 | 2015-10-27 | ||
| PCT/US2016/053970 WO2017074633A1 (en) | 2015-10-27 | 2016-09-27 | Biasable flux optimizer/collimator for pvd sputter chamber |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022031654A Division JP7504938B2 (ja) | 2015-10-27 | 2022-03-02 | Pvdスパッタチャンバ向けのバイアス可能なフラックスオプティマイザ/コリメータ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018533673A JP2018533673A (ja) | 2018-11-15 |
| JP2018533673A5 true JP2018533673A5 (enExample) | 2019-11-07 |
| JP7034912B2 JP7034912B2 (ja) | 2022-03-14 |
Family
ID=58562020
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018521365A Active JP7034912B2 (ja) | 2015-10-27 | 2016-09-27 | Pvdスパッタチャンバ向けのバイアス可能なフラックスオプティマイザ/コリメータ |
| JP2022031654A Active JP7504938B2 (ja) | 2015-10-27 | 2022-03-02 | Pvdスパッタチャンバ向けのバイアス可能なフラックスオプティマイザ/コリメータ |
| JP2024095005A Pending JP2024127896A (ja) | 2015-10-27 | 2024-06-12 | Pvdスパッタチャンバ向けのバイアス可能なフラックスオプティマイザ/コリメータ |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022031654A Active JP7504938B2 (ja) | 2015-10-27 | 2022-03-02 | Pvdスパッタチャンバ向けのバイアス可能なフラックスオプティマイザ/コリメータ |
| JP2024095005A Pending JP2024127896A (ja) | 2015-10-27 | 2024-06-12 | Pvdスパッタチャンバ向けのバイアス可能なフラックスオプティマイザ/コリメータ |
Country Status (8)
| Country | Link |
|---|---|
| US (4) | US9960024B2 (enExample) |
| EP (3) | EP3920210B1 (enExample) |
| JP (3) | JP7034912B2 (enExample) |
| KR (2) | KR20240127488A (enExample) |
| CN (6) | CN110438464A (enExample) |
| SG (2) | SG10202003396PA (enExample) |
| TW (5) | TWI669752B (enExample) |
| WO (1) | WO2017074633A1 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240127488A (ko) * | 2015-10-27 | 2024-08-22 | 어플라이드 머티어리얼스, 인코포레이티드 | Pvd 스퍼터 챔버를 위한 바이어스가능 플럭스 최적화기/콜리메이터 |
| CN109390222B (zh) * | 2017-08-08 | 2021-01-05 | 宁波江丰电子材料股份有限公司 | 准直器检具及其使用方法 |
| USD858468S1 (en) * | 2018-03-16 | 2019-09-03 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
| USD859333S1 (en) | 2018-03-16 | 2019-09-10 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
| US20190353919A1 (en) * | 2018-05-21 | 2019-11-21 | Applied Materials, Inc. | Multi-zone collimator for selective pvd |
| WO2020088415A1 (zh) * | 2018-10-31 | 2020-05-07 | 北京北方华创微电子装备有限公司 | 反应腔室及半导体加工设备 |
| CN109300764A (zh) * | 2018-10-31 | 2019-02-01 | 北京北方华创微电子装备有限公司 | 反应腔室及半导体加工设备 |
| USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD998575S1 (en) | 2020-04-07 | 2023-09-12 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
| CN112011776B (zh) * | 2020-08-28 | 2022-10-21 | 北京北方华创微电子装备有限公司 | 半导体工艺设备及其工艺腔室 |
| US11851751B2 (en) * | 2021-07-23 | 2023-12-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Deposition system and method |
| USD1009816S1 (en) | 2021-08-29 | 2024-01-02 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
| USD997111S1 (en) | 2021-12-15 | 2023-08-29 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
| USD1038901S1 (en) | 2022-01-12 | 2024-08-13 | Applied Materials, Inc. | Collimator for a physical vapor deposition chamber |
| USD1026054S1 (en) | 2022-04-22 | 2024-05-07 | Applied Materials, Inc. | Collimator for a physical vapor deposition (PVD) chamber |
| CN115449762A (zh) * | 2022-08-22 | 2022-12-09 | 无锡尚积半导体科技有限公司 | 一种用于磁控溅射设备的准直器及磁控溅射设备 |
| USD1025935S1 (en) * | 2022-11-03 | 2024-05-07 | Applied Materials, Inc. | Collimator for a physical vapor deposition (PVD) chamber |
| USD1024149S1 (en) * | 2022-12-16 | 2024-04-23 | Applied Materials, Inc. | Collimator for a physical vapor deposition (PVD) chamber |
| USD1026839S1 (en) * | 2022-12-16 | 2024-05-14 | Applied Materials, Inc. | Collimator for a physical vapor deposition (PVD) chamber |
| USD1025936S1 (en) * | 2022-12-16 | 2024-05-07 | Applied Materials, Inc. | Collimator for a physical vapor deposition (PVD) chamber |
| CN119020736A (zh) * | 2023-05-24 | 2024-11-26 | 北京北方华创微电子装备有限公司 | 物理气相沉积设备的准直装置及物理气相沉积设备 |
| US20250146119A1 (en) * | 2023-11-07 | 2025-05-08 | Applied Materials, Inc. | Dual collimator physical vapor depositions processing chamber |
| WO2025181241A1 (en) * | 2024-02-28 | 2025-09-04 | Université De Namur | A method for manufacturing coated articles |
| USD1103950S1 (en) * | 2024-03-21 | 2025-12-02 | Applied Materials, Inc. | Process chamber collimator |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5223108A (en) * | 1991-12-30 | 1993-06-29 | Materials Research Corporation | Extended lifetime collimator |
| JPH06295903A (ja) * | 1993-02-09 | 1994-10-21 | Matsushita Electron Corp | スパッタリング装置 |
| US5362372A (en) | 1993-06-11 | 1994-11-08 | Applied Materials, Inc. | Self cleaning collimator |
| US5380414A (en) | 1993-06-11 | 1995-01-10 | Applied Materials, Inc. | Shield and collimator pasting deposition chamber with a wafer support periodically used as an acceptor |
| US5415753A (en) | 1993-07-22 | 1995-05-16 | Materials Research Corporation | Stationary aperture plate for reactive sputter deposition |
| US5431799A (en) | 1993-10-29 | 1995-07-11 | Applied Materials, Inc. | Collimation hardware with RF bias rings to enhance sputter and/or substrate cavity ion generation efficiency |
| KR970009828B1 (en) | 1994-02-23 | 1997-06-18 | Sansung Electronics Co Ltd | Fabrication method of collimator |
| EP0703598A1 (en) * | 1994-09-26 | 1996-03-27 | Applied Materials, Inc. | Electrode between sputtering target and workpiece |
| JPH08260139A (ja) * | 1995-03-23 | 1996-10-08 | Sony Corp | 成膜用コリメータ、成膜装置及び電子装置の製造方法 |
| KR970017999A (ko) * | 1995-09-29 | 1997-04-30 | 김광호 | 개선된 구조의 콜리메이터를 갖는 스퍼터링장치 |
| US5650052A (en) * | 1995-10-04 | 1997-07-22 | Edelstein; Sergio | Variable cell size collimator |
| KR970017999U (ko) | 1995-10-23 | 1997-05-23 | 전자동세탁기 | |
| US5658442A (en) | 1996-03-07 | 1997-08-19 | Applied Materials, Inc. | Target and dark space shield for a physical vapor deposition system |
| US6482301B1 (en) | 1998-06-04 | 2002-11-19 | Seagate Technology, Inc. | Target shields for improved magnetic properties of a recording medium |
| US6362097B1 (en) | 1998-07-14 | 2002-03-26 | Applied Komatsu Technlology, Inc. | Collimated sputtering of semiconductor and other films |
| US6149776A (en) | 1998-11-12 | 2000-11-21 | Applied Materials, Inc. | Copper sputtering target |
| US20030015421A1 (en) | 2001-07-20 | 2003-01-23 | Applied Materials, Inc. | Collimated sputtering of cobalt |
| US20030029715A1 (en) | 2001-07-25 | 2003-02-13 | Applied Materials, Inc. | An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems |
| JP2005504885A (ja) | 2001-07-25 | 2005-02-17 | アプライド マテリアルズ インコーポレイテッド | 新規なスパッタ堆積方法を使用したバリア形成 |
| US7048837B2 (en) | 2002-09-13 | 2006-05-23 | Applied Materials, Inc. | End point detection for sputtering and resputtering |
| JPWO2004047160A1 (ja) | 2002-11-20 | 2006-03-23 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
| JP2007273490A (ja) * | 2004-03-30 | 2007-10-18 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
| EP1710324B1 (en) * | 2005-04-08 | 2008-12-03 | STMicroelectronics S.r.l. | PVD process and chamber for the pulsed deposition of a chalcogenide material layer of a phase change memory device |
| US7355192B2 (en) * | 2006-03-30 | 2008-04-08 | Intel Corporation | Adjustable suspension assembly for a collimating lattice |
| US9062379B2 (en) | 2008-04-16 | 2015-06-23 | Applied Materials, Inc. | Wafer processing deposition shielding components |
| KR101571558B1 (ko) | 2008-04-16 | 2015-11-24 | 어플라이드 머티어리얼스, 인코포레이티드 | 웨이퍼 프로세싱 증착 차폐 컴포넌트들 |
| US9316413B2 (en) | 2008-06-11 | 2016-04-19 | Honeywell International Inc. | Selectable efficiency versus comfort for modulating furnace |
| KR20200093084A (ko) | 2008-06-17 | 2020-08-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 균일한 증착을 위한 장치 및 방법 |
| US20090308739A1 (en) * | 2008-06-17 | 2009-12-17 | Applied Materials, Inc. | Wafer processing deposition shielding components |
| KR101929971B1 (ko) * | 2009-04-24 | 2018-12-18 | 어플라이드 머티어리얼스, 인코포레이티드 | 웨이퍼 프로세싱 증착 차폐 부품 |
| WO2013136384A1 (ja) * | 2012-03-14 | 2013-09-19 | キヤノンアネルバ株式会社 | 締結部材および真空装置 |
| US9831074B2 (en) | 2013-10-24 | 2017-11-28 | Applied Materials, Inc. | Bipolar collimator utilized in a physical vapor deposition chamber |
| US9543126B2 (en) | 2014-11-26 | 2017-01-10 | Applied Materials, Inc. | Collimator for use in substrate processing chambers |
| KR20240127488A (ko) * | 2015-10-27 | 2024-08-22 | 어플라이드 머티어리얼스, 인코포레이티드 | Pvd 스퍼터 챔버를 위한 바이어스가능 플럭스 최적화기/콜리메이터 |
-
2016
- 2016-09-27 KR KR1020247026805A patent/KR20240127488A/ko active Pending
- 2016-09-27 EP EP21188409.3A patent/EP3920210B1/en active Active
- 2016-09-27 JP JP2018521365A patent/JP7034912B2/ja active Active
- 2016-09-27 US US15/277,674 patent/US9960024B2/en active Active
- 2016-09-27 SG SG10202003396PA patent/SG10202003396PA/en unknown
- 2016-09-27 EP EP23175161.1A patent/EP4235744A3/en active Pending
- 2016-09-27 KR KR1020187014899A patent/KR102695398B1/ko active Active
- 2016-09-27 SG SG11201802667PA patent/SG11201802667PA/en unknown
- 2016-09-27 EP EP16860473.4A patent/EP3369108B1/en active Active
- 2016-09-27 WO PCT/US2016/053970 patent/WO2017074633A1/en not_active Ceased
- 2016-10-27 CN CN201910698016.7A patent/CN110438464A/zh active Pending
- 2016-10-27 TW TW105134741A patent/TWI669752B/zh active
- 2016-10-27 CN CN202410177120.2A patent/CN118127471A/zh active Pending
- 2016-10-27 CN CN201610958470.8A patent/CN106987815A/zh active Pending
- 2016-10-27 CN CN201621180242.4U patent/CN206418192U/zh active Active
- 2016-10-27 TW TW113110460A patent/TW202501569A/zh unknown
- 2016-10-27 TW TW108124712A patent/TWI702636B/zh active
- 2016-10-27 CN CN202010731212.2A patent/CN112030123A/zh active Pending
- 2016-10-27 TW TW109124539A patent/TWI761889B/zh active
- 2016-10-27 TW TW111114403A patent/TWI839710B/zh active
- 2016-10-27 CN CN202410177114.7A patent/CN118127470A/zh active Pending
-
2018
- 2018-03-29 US US15/940,398 patent/US10347474B2/en active Active
-
2019
- 2019-05-30 US US16/426,964 patent/US10727033B2/en active Active
-
2020
- 2020-06-24 US US16/910,151 patent/US11309169B2/en active Active
-
2022
- 2022-03-02 JP JP2022031654A patent/JP7504938B2/ja active Active
-
2024
- 2024-06-12 JP JP2024095005A patent/JP2024127896A/ja active Pending
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