JP2016526279A5 - - Google Patents
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- Publication number
- JP2016526279A5 JP2016526279A5 JP2016511757A JP2016511757A JP2016526279A5 JP 2016526279 A5 JP2016526279 A5 JP 2016526279A5 JP 2016511757 A JP2016511757 A JP 2016511757A JP 2016511757 A JP2016511757 A JP 2016511757A JP 2016526279 A5 JP2016526279 A5 JP 2016526279A5
- Authority
- JP
- Japan
- Prior art keywords
- liner
- ring
- liner assembly
- shaped
- channels
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002347 injection Methods 0.000 claims 8
- 239000007924 injection Substances 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 5
- 238000000034 method Methods 0.000 claims 4
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000010453 quartz Substances 0.000 claims 1
- 230000001105 regulatory effect Effects 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361817691P | 2013-04-30 | 2013-04-30 | |
| US61/817,691 | 2013-04-30 | ||
| PCT/US2014/034785 WO2014179093A1 (en) | 2013-04-30 | 2014-04-21 | Flow controlled liner having spatially distributed gas passages |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016526279A JP2016526279A (ja) | 2016-09-01 |
| JP2016526279A5 true JP2016526279A5 (enExample) | 2017-06-08 |
| JP6368773B2 JP6368773B2 (ja) | 2018-08-01 |
Family
ID=51789571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016511757A Active JP6368773B2 (ja) | 2013-04-30 | 2014-04-21 | 空間的に分散されたガス流路を有する流量制御ライナー |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US9553002B2 (enExample) |
| JP (1) | JP6368773B2 (enExample) |
| KR (2) | KR20160003831A (enExample) |
| CN (3) | CN111211074B (enExample) |
| TW (2) | TWI613318B (enExample) |
| WO (1) | WO2014179093A1 (enExample) |
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| KR20160003831A (ko) | 2013-04-30 | 2016-01-11 | 어플라이드 머티어리얼스, 인코포레이티드 | 공간적으로 분포된 가스 통로들을 갖는 유동 제어 라이너 |
| US11414759B2 (en) | 2013-11-29 | 2022-08-16 | Taiwan Semiconductor Manufacturing Co., Ltd | Mechanisms for supplying process gas into wafer process apparatus |
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| USD875053S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
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| JP6837911B2 (ja) * | 2017-05-17 | 2021-03-03 | 株式会社Screenホールディングス | 熱処理装置 |
| US11004722B2 (en) * | 2017-07-20 | 2021-05-11 | Applied Materials, Inc. | Lift pin assembly |
| KR102081704B1 (ko) * | 2018-02-05 | 2020-02-27 | 세메스 주식회사 | 기판 처리 장치 |
| CN214848503U (zh) | 2018-08-29 | 2021-11-23 | 应用材料公司 | 注入器设备、基板处理设备及在机器可读介质中实现的结构 |
| CN118841306A (zh) * | 2018-12-20 | 2024-10-25 | 应用材料公司 | 用于供应改良的气流至处理腔室的处理空间的方法和设备 |
| US11486038B2 (en) * | 2019-01-30 | 2022-11-01 | Applied Materials, Inc. | Asymmetric injection for better wafer uniformity |
| US10995419B2 (en) * | 2019-04-16 | 2021-05-04 | Applied Materials, Inc. | Methods and apparatus for gallium nitride deposition |
| CN113994023A (zh) * | 2019-05-15 | 2022-01-28 | 应用材料公司 | 减少腔室残留物的方法 |
| US11032945B2 (en) * | 2019-07-12 | 2021-06-08 | Applied Materials, Inc. | Heat shield assembly for an epitaxy chamber |
| US11952660B2 (en) * | 2019-07-29 | 2024-04-09 | Applied Materials, Inc. | Semiconductor processing chambers and methods for cleaning the same |
| JP7376693B2 (ja) | 2019-09-09 | 2023-11-08 | アプライド マテリアルズ インコーポレイテッド | 処理システムおよび反応体ガスを供給する方法 |
| KR20250163999A (ko) * | 2020-03-02 | 2025-11-21 | 램 리써치 코포레이션 | 프로세스 모듈들에 터보 펌프들을 부착하기 위한 어댑터 플레이트 (adapter plate) |
| CN119465090A (zh) | 2020-04-20 | 2025-02-18 | 应用材料公司 | 具有共用的气体输送和排气系统的多个热cvd腔室 |
| CN112002660B (zh) * | 2020-08-27 | 2024-01-19 | 南京国盛电子有限公司 | 一种半导体处理装置、处理方法及应用 |
| CN116368269A (zh) | 2020-10-13 | 2023-06-30 | 周星工程股份有限公司 | 基板处理设备 |
| US12188148B2 (en) * | 2020-12-22 | 2025-01-07 | Applied Materials, Inc. | Multi-layer EPI chamber body |
| CN112768384B (zh) * | 2021-01-26 | 2024-02-27 | 西安奕斯伟材料科技股份有限公司 | 预热环及晶圆外延生长设备 |
| US11781212B2 (en) | 2021-04-07 | 2023-10-10 | Applied Material, Inc. | Overlap susceptor and preheat ring |
| US12060651B2 (en) | 2021-05-11 | 2024-08-13 | Applied Materials, Inc. | Chamber architecture for epitaxial deposition and advanced epitaxial film applications |
| KR102811576B1 (ko) * | 2021-05-11 | 2025-05-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 에피택시 및 cvd 챔버용 가스 인젝터 |
| US12018372B2 (en) | 2021-05-11 | 2024-06-25 | Applied Materials, Inc. | Gas injector for epitaxy and CVD chamber |
| US12091749B2 (en) | 2021-05-11 | 2024-09-17 | Applied Materials, Inc. | Method for epitaxially depositing a material on a substrate by flowing a process gas across the substrate from an upper gas inlet to an upper gas outlet and flowing a purge gas from a lower gas inlet to a lower gas outlet |
| US12221696B2 (en) * | 2022-05-27 | 2025-02-11 | Applied Materials, Inc. | Process kits and related methods for processing chambers to facilitate deposition process adjustability |
| US20240112931A1 (en) * | 2022-10-03 | 2024-04-04 | Applied Materials, Inc. | Cassette structures and related methods for batch processing in epitaxial deposition operations |
| CN117904601A (zh) * | 2022-10-10 | 2024-04-19 | 中微半导体设备(上海)股份有限公司 | 一种衬底处理设备及方法 |
| US20240254627A1 (en) * | 2023-01-27 | 2024-08-01 | Applied Materials, Inc. | Injectors, liners, process kits, processing chambers, and related methods for gas flow in batch processing of semiconductor manufacturing |
| US20250191897A1 (en) * | 2023-12-07 | 2025-06-12 | Applied Materials, Inc. | Cross flow gas delivery for particle reduction |
| CN119297121B (zh) * | 2024-11-15 | 2025-04-18 | 深圳市新凯来工业机器有限公司 | 半导体工艺腔室和半导体工艺设备 |
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| KR101884003B1 (ko) * | 2011-03-22 | 2018-07-31 | 어플라이드 머티어리얼스, 인코포레이티드 | 화학 기상 증착 챔버를 위한 라이너 조립체 |
| US9499905B2 (en) * | 2011-07-22 | 2016-11-22 | Applied Materials, Inc. | Methods and apparatus for the deposition of materials on a substrate |
| KR20160003831A (ko) | 2013-04-30 | 2016-01-11 | 어플라이드 머티어리얼스, 인코포레이티드 | 공간적으로 분포된 가스 통로들을 갖는 유동 제어 라이너 |
-
2014
- 2014-04-21 KR KR1020157034124A patent/KR20160003831A/ko not_active Ceased
- 2014-04-21 CN CN202010034452.7A patent/CN111211074B/zh active Active
- 2014-04-21 JP JP2016511757A patent/JP6368773B2/ja active Active
- 2014-04-21 KR KR1020177015068A patent/KR102291460B1/ko active Active
- 2014-04-21 CN CN201480024290.1A patent/CN105164788B/zh active Active
- 2014-04-21 CN CN201710953411.6A patent/CN107833848B/zh active Active
- 2014-04-21 WO PCT/US2014/034785 patent/WO2014179093A1/en not_active Ceased
- 2014-04-23 TW TW103114721A patent/TWI613318B/zh active
- 2014-04-23 US US14/259,898 patent/US9553002B2/en active Active
- 2014-04-23 TW TW106118475A patent/TWI679299B/zh active
-
2017
- 2017-01-17 US US15/407,622 patent/US9842748B2/en active Active
- 2017-09-26 US US15/716,142 patent/US10170342B2/en active Active
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