JP2020526934A5 - - Google Patents

Download PDF

Info

Publication number
JP2020526934A5
JP2020526934A5 JP2020501522A JP2020501522A JP2020526934A5 JP 2020526934 A5 JP2020526934 A5 JP 2020526934A5 JP 2020501522 A JP2020501522 A JP 2020501522A JP 2020501522 A JP2020501522 A JP 2020501522A JP 2020526934 A5 JP2020526934 A5 JP 2020526934A5
Authority
JP
Japan
Prior art keywords
alignment
lead
mark
cof
label
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020501522A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020526934A (ja
JP7058319B2 (ja
Filing date
Publication date
Priority claimed from CN201810283325.3A external-priority patent/CN108493183B/zh
Application filed filed Critical
Publication of JP2020526934A publication Critical patent/JP2020526934A/ja
Publication of JP2020526934A5 publication Critical patent/JP2020526934A5/ja
Application granted granted Critical
Publication of JP7058319B2 publication Critical patent/JP7058319B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2020501522A 2018-04-02 2018-08-28 アレイ基板、ｃｏｆ、表示装置及び位置合わせ方法 Active JP7058319B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201810283325.3 2018-04-02
CN201810283325.3A CN108493183B (zh) 2018-04-02 2018-04-02 一种阵列基板、覆晶薄膜及其对位方法及显示装置
PCT/CN2018/102687 WO2019192137A1 (zh) 2018-04-02 2018-08-28 阵列基板、覆晶薄膜、显示装置及对位方法

Publications (3)

Publication Number Publication Date
JP2020526934A JP2020526934A (ja) 2020-08-31
JP2020526934A5 true JP2020526934A5 (https=) 2020-10-08
JP7058319B2 JP7058319B2 (ja) 2022-04-21

Family

ID=63318062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020501522A Active JP7058319B2 (ja) 2018-04-02 2018-08-28 アレイ基板、ｃｏｆ、表示装置及び位置合わせ方法

Country Status (7)

Country Link
US (1) US10964644B2 (https=)
EP (1) EP3640980A4 (https=)
JP (1) JP7058319B2 (https=)
KR (1) KR20200008655A (https=)
CN (1) CN108493183B (https=)
TW (1) TWI659513B (https=)
WO (1) WO2019192137A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110097823B (zh) * 2019-04-09 2021-02-02 深圳市华星光电半导体显示技术有限公司 显示面板及显示模组
KR102796654B1 (ko) * 2019-09-02 2025-04-16 삼성디스플레이 주식회사 표시 장치
CN110707136B (zh) * 2019-10-28 2025-01-21 京东方科技集团股份有限公司 一种覆晶薄膜绑定结构、显示模组及终端设备
CN110930866B (zh) * 2019-11-26 2021-07-06 Tcl华星光电技术有限公司 覆晶薄膜及显示装置
CN111081151A (zh) * 2020-01-08 2020-04-28 深圳市华星光电半导体显示技术有限公司 显示面板
KR102812775B1 (ko) 2020-10-06 2025-05-26 삼성디스플레이 주식회사 표시 장치 및 가요성 인쇄 회로 기판의 정렬 방법
CN114696129B (zh) * 2020-12-28 2026-03-20 超聚变数字技术股份有限公司 显示模组及电子设备
USD1000400S1 (en) * 2021-04-16 2023-10-03 Creeled, Inc. Light emitting diode package
US20240298403A1 (en) * 2021-05-13 2024-09-05 Hefei Boe Display Technology Co., Ltd. Circuit board, chip on film, display apparatus and bonding method
KR102802969B1 (ko) * 2022-10-24 2025-05-08 세메스 주식회사 반도체 기판 장치와, 반도체 처리 방법 및 반도체 처리 장치
US12494440B2 (en) * 2023-05-31 2025-12-09 Infineon Technologies Ag Power semiconductor module and method of increasing pin alignment accuracy for power semiconductor modules

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274670A (ja) * 1998-03-19 1999-10-08 Kyocera Corp 積層基板
JP4651886B2 (ja) * 2001-09-14 2011-03-16 東北パイオニア株式会社 電子機器及び電子機器の製造方法
JP4214357B2 (ja) * 2002-02-28 2009-01-28 セイコーエプソン株式会社 電子デバイスの製造方法
JP3544970B2 (ja) * 2002-09-30 2004-07-21 沖電気工業株式会社 Ｃｏｆテープキャリア、半導体素子、半導体装置
JP2006119321A (ja) * 2004-10-21 2006-05-11 Kofu Casio Co Ltd 電気回路間の導通接続構造
JP2006245514A (ja) * 2005-03-07 2006-09-14 Hitachi Media Electoronics Co Ltd フレキシブル基板同士の接続方法
CN100461984C (zh) * 2005-09-30 2009-02-11 友达光电股份有限公司 电路组装结构
TWI292936B (en) * 2006-03-24 2008-01-21 Chipmos Technologies Inc Inner lead bonding tape and tape carrier package utilizing the tape
TW200822303A (en) * 2006-11-07 2008-05-16 Chipmos Technologies Inc Substrate for chip on film packages
CN100545890C (zh) * 2007-03-22 2009-09-30 中华映管股份有限公司 显示面板、显示面板的引脚接合及检测方法
TWI343090B (en) * 2007-05-18 2011-06-01 Au Optronics Corp System and method for alignment
CN101060112B (zh) * 2007-06-11 2010-10-06 友达光电股份有限公司 基板对位系统及其对位方法
JP2012013719A (ja) * 2010-06-29 2012-01-19 Funai Electric Co Ltd Ｃｏｆアライメントマーク
US8994898B2 (en) * 2012-10-18 2015-03-31 Shenzhen China Star Optoelectronics Technology Co., Ltd COF base tape and manufacturing method thereof and liquid crystal display module comprising same
CN102890348B (zh) 2012-10-18 2016-03-30 深圳市华星光电技术有限公司 一种cof基带及其制造方法、液晶显示模组
CN203365865U (zh) * 2013-07-04 2013-12-25 京东方科技集团股份有限公司 一种阵列基板、覆晶薄膜和显示装置
CN106299092A (zh) 2015-06-02 2017-01-04 上海和辉光电有限公司 具有封装对位功能的amoled面板及封装方法
CN105551378A (zh) * 2016-02-04 2016-05-04 京东方科技集团股份有限公司 一种覆晶薄膜、柔性显示面板及显示装置
CN105513499B (zh) * 2016-02-04 2018-03-30 京东方科技集团股份有限公司 一种柔性显示面板、显示装置及其绑定方法
CN106783664B (zh) * 2017-01-03 2020-04-21 京东方科技集团股份有限公司 一种显示模组、绑定检测方法及绑定系统

Similar Documents

Publication Publication Date Title
JP2020526934A5 (https=)
US10290622B2 (en) Method for expanding spacings in light-emitting element array
WO2018166192A1 (zh) 显示设备及其柔性电路板
EP3343274A3 (en) Display device, multi-screen display device using the same and method for manufacturing the same
CN102956180B (zh) 显示装置
JP6634651B2 (ja) 差動信号線の配線方法、及びｐｃｂ基板
KR20160069571A (ko) 곡면 표시 장치 및 그 제조방법
EP3343273A3 (en) Display device and multi-screen display device using the same
JP6858774B2 (ja) フレキシブルエレクトロニクス機器及びそのための製造方法
EP3276595A3 (en) Display device with crack-sensing line
CN107658234A (zh) 显示面板及显示装置
EP4525470A3 (en) Device for fixing camera module circuit board, and camera module
JP2017083759A5 (https=)
EP2722887A3 (en) Oganic light emitting display device and testing method thereof
TWI589885B (zh) 用於偵測壓縮品質之電阻量測設備及使用其之量測方法
EP3640980A4 (en) MATRIX SUBSTRATE, CHIP ON FILM, DISPLAY AND ALIGNMENT PROCESS
US20150310823A1 (en) Driving Circuit, Display Device and Method for Implementing Equal Resistance of a Plurality of Transmission Lines
JP2016173541A5 (https=)
KR102239843B1 (ko) 표시 장치
CN104730720A (zh) 阵列基板、显示面板及显示装置
CN105974638A (zh) 一种显示基板及显示装置
JP2014107383A5 (https=)
CN104326209B (zh) 一种调节治具和显示基板传送装置
WO2016102454A3 (de) Verfahren und vorrichtung zur herstellung eines sandwichbauteils
CN104181714B (zh) Goa布局方法、阵列基板和显示装置