JP2020526046A5 - - Google Patents
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- Publication number
- JP2020526046A5 JP2020526046A5 JP2020522793A JP2020522793A JP2020526046A5 JP 2020526046 A5 JP2020526046 A5 JP 2020526046A5 JP 2020522793 A JP2020522793 A JP 2020522793A JP 2020522793 A JP2020522793 A JP 2020522793A JP 2020526046 A5 JP2020526046 A5 JP 2020526046A5
- Authority
- JP
- Japan
- Prior art keywords
- weight
- chemical composition
- acid
- passivation layer
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000126 substance Substances 0.000 claims 15
- 239000000463 material Substances 0.000 claims 10
- 238000000034 method Methods 0.000 claims 9
- 239000002253 acid Substances 0.000 claims 7
- 238000002161 passivation Methods 0.000 claims 7
- 238000004140 cleaning Methods 0.000 claims 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims 4
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims 4
- 238000005530 etching Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims 3
- 230000001590 oxidative effect Effects 0.000 claims 3
- 229940098779 methanesulfonic acid Drugs 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052729 chemical element Inorganic materials 0.000 claims 1
- 239000000470 constituent Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910052735 hafnium Inorganic materials 0.000 claims 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N hydrofluoric acid Substances F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims 1
- 230000003993 interaction Effects 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 238000001020 plasma etching Methods 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1756215 | 2017-06-30 | ||
| FR1756215A FR3068509B1 (fr) | 2017-06-30 | 2017-06-30 | Composition chimique de nettoyage pour le retrait d'une couche de passivation amorphe a la surface de materiaux cristallins |
| PCT/FR2018/051607 WO2019002789A1 (fr) | 2017-06-30 | 2018-06-29 | Composition chimique de nettoyage pour le retrait d'une couche de passivation amorphe a la surface de matériaux cristallins |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020526046A JP2020526046A (ja) | 2020-08-27 |
| JP2020526046A5 true JP2020526046A5 (enExample) | 2021-08-12 |
| JP7206269B2 JP7206269B2 (ja) | 2023-01-17 |
Family
ID=60182676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020522793A Active JP7206269B2 (ja) | 2017-06-30 | 2018-06-29 | 結晶材料の表面における非晶質パッシベーション層を除去するための洗浄化学組成物 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11075073B2 (enExample) |
| EP (1) | EP3646371B1 (enExample) |
| JP (1) | JP7206269B2 (enExample) |
| KR (1) | KR102617800B1 (enExample) |
| CN (1) | CN110892511A (enExample) |
| FR (1) | FR3068509B1 (enExample) |
| MY (1) | MY205007A (enExample) |
| TW (1) | TWI776909B (enExample) |
| WO (1) | WO2019002789A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210317389A1 (en) * | 2020-04-14 | 2021-10-14 | William Quan | Chemical product for rapid removal of food burned on to the surfaces of cooktops |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6064437A (ja) * | 1983-09-20 | 1985-04-13 | Toshiba Corp | 鉛系パツシベ−シヨンガラスのエツチング液 |
| US6296714B1 (en) * | 1997-01-16 | 2001-10-02 | Mitsubishi Materials Silicon Corporation | Washing solution of semiconductor substrate and washing method using the same |
| WO2005045895A2 (en) * | 2003-10-28 | 2005-05-19 | Sachem, Inc. | Cleaning solutions and etchants and methods for using same |
| KR100660863B1 (ko) * | 2005-04-12 | 2006-12-26 | 삼성전자주식회사 | 세정액 및 이를 이용한 반도체 소자의 금속 패턴 형성 방법 |
| US7960328B2 (en) * | 2005-11-09 | 2011-06-14 | Advanced Technology Materials, Inc. | Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon |
| JP4642001B2 (ja) * | 2006-10-24 | 2011-03-02 | 関東化学株式会社 | フォトレジスト残渣及びポリマー残渣除去液組成物 |
| US20100124713A1 (en) * | 2008-11-17 | 2010-05-20 | Xerox Corporation | Toners including carbon nanotubes dispersed in a polymer matrix |
| US8431516B2 (en) * | 2009-10-24 | 2013-04-30 | Wai Mun Lee | Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid |
| JP6014163B2 (ja) * | 2011-12-13 | 2016-10-25 | エコラボ ユーエスエー インコーポレイティド | 濃縮物品洗浄組成物及び方法 |
| US9058976B2 (en) * | 2012-11-06 | 2015-06-16 | International Business Machines Corporation | Cleaning composition and process for cleaning semiconductor devices and/or tooling during manufacturing thereof |
| JP2015005660A (ja) | 2013-06-21 | 2015-01-08 | 東京エレクトロン株式会社 | 酸化タンタル膜の除去方法および除去装置 |
| KR101700636B1 (ko) * | 2015-04-17 | 2017-01-31 | 재원산업 주식회사 | 접착제 제거용 조성물 및 이를 이용한 박형 웨이퍼의 제조방법 |
| GB2554635A (en) * | 2016-08-03 | 2018-04-11 | Northwick Park Institute For Medical Res Ltd | Bioreactors and methods for processing biological material |
| JP6970675B2 (ja) * | 2016-09-29 | 2021-11-24 | 富士フイルム株式会社 | 処理液および積層体の処理方法 |
-
2017
- 2017-06-30 FR FR1756215A patent/FR3068509B1/fr active Active
-
2018
- 2018-06-29 KR KR1020207002493A patent/KR102617800B1/ko active Active
- 2018-06-29 CN CN201880043734.4A patent/CN110892511A/zh active Pending
- 2018-06-29 EP EP18749844.9A patent/EP3646371B1/fr active Active
- 2018-06-29 US US16/616,089 patent/US11075073B2/en active Active
- 2018-06-29 MY MYPI2019006445A patent/MY205007A/en unknown
- 2018-06-29 TW TW107122599A patent/TWI776909B/zh active
- 2018-06-29 JP JP2020522793A patent/JP7206269B2/ja active Active
- 2018-06-29 WO PCT/FR2018/051607 patent/WO2019002789A1/fr not_active Ceased
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