MY205007A - Cleaning chemical composition for the removal of an amorphous passivation layer at the surface of crystalline materials - Google Patents
Cleaning chemical composition for the removal of an amorphous passivation layer at the surface of crystalline materialsInfo
- Publication number
- MY205007A MY205007A MYPI2019006445A MYPI2019006445A MY205007A MY 205007 A MY205007 A MY 205007A MY PI2019006445 A MYPI2019006445 A MY PI2019006445A MY PI2019006445 A MYPI2019006445 A MY PI2019006445A MY 205007 A MY205007 A MY 205007A
- Authority
- MY
- Malaysia
- Prior art keywords
- weight
- chemical composition
- passivation layer
- substrate
- cleaning chemical
- Prior art date
Links
- 239000000126 substance Substances 0.000 title abstract 8
- 238000004140 cleaning Methods 0.000 title abstract 5
- 238000002161 passivation Methods 0.000 title abstract 5
- 239000002178 crystalline material Substances 0.000 title 1
- 239000002253 acid Substances 0.000 abstract 5
- 239000000758 substrate Substances 0.000 abstract 5
- 238000005530 etching Methods 0.000 abstract 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 abstract 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N hydrofluoric acid Substances F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/042—Acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2079—Monocarboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/34—Organic compounds containing sulfur
- C11D3/3409—Alkyl -, alkenyl -, cycloalkyl - or terpene sulfates or sulfonates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/06—Silver salts
- G03F7/063—Additives or means to improve the lithographic properties; Processing solutions characterised by such additives; Treatment after development or transfer, e.g. finishing, washing; Correction or deletion fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Inorganic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1756215A FR3068509B1 (fr) | 2017-06-30 | 2017-06-30 | Composition chimique de nettoyage pour le retrait d'une couche de passivation amorphe a la surface de materiaux cristallins |
| PCT/FR2018/051607 WO2019002789A1 (fr) | 2017-06-30 | 2018-06-29 | Composition chimique de nettoyage pour le retrait d'une couche de passivation amorphe a la surface de matériaux cristallins |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY205007A true MY205007A (en) | 2024-09-27 |
Family
ID=60182676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2019006445A MY205007A (en) | 2017-06-30 | 2018-06-29 | Cleaning chemical composition for the removal of an amorphous passivation layer at the surface of crystalline materials |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11075073B2 (enExample) |
| EP (1) | EP3646371B1 (enExample) |
| JP (1) | JP7206269B2 (enExample) |
| KR (1) | KR102617800B1 (enExample) |
| CN (1) | CN110892511A (enExample) |
| FR (1) | FR3068509B1 (enExample) |
| MY (1) | MY205007A (enExample) |
| TW (1) | TWI776909B (enExample) |
| WO (1) | WO2019002789A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210317389A1 (en) * | 2020-04-14 | 2021-10-14 | William Quan | Chemical product for rapid removal of food burned on to the surfaces of cooktops |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6064437A (ja) * | 1983-09-20 | 1985-04-13 | Toshiba Corp | 鉛系パツシベ−シヨンガラスのエツチング液 |
| US6296714B1 (en) * | 1997-01-16 | 2001-10-02 | Mitsubishi Materials Silicon Corporation | Washing solution of semiconductor substrate and washing method using the same |
| WO2005045895A2 (en) * | 2003-10-28 | 2005-05-19 | Sachem, Inc. | Cleaning solutions and etchants and methods for using same |
| KR100660863B1 (ko) * | 2005-04-12 | 2006-12-26 | 삼성전자주식회사 | 세정액 및 이를 이용한 반도체 소자의 금속 패턴 형성 방법 |
| CN101356629B (zh) | 2005-11-09 | 2012-06-06 | 高级技术材料公司 | 用于将其上具有低k介电材料的半导体晶片再循环的组合物和方法 |
| JP4642001B2 (ja) * | 2006-10-24 | 2011-03-02 | 関東化学株式会社 | フォトレジスト残渣及びポリマー残渣除去液組成物 |
| US20100124713A1 (en) * | 2008-11-17 | 2010-05-20 | Xerox Corporation | Toners including carbon nanotubes dispersed in a polymer matrix |
| US8431516B2 (en) * | 2009-10-24 | 2013-04-30 | Wai Mun Lee | Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid |
| US9139800B2 (en) * | 2011-12-13 | 2015-09-22 | Ecolab Usa Inc. | Concentrated warewashing compositions and methods |
| US9058976B2 (en) * | 2012-11-06 | 2015-06-16 | International Business Machines Corporation | Cleaning composition and process for cleaning semiconductor devices and/or tooling during manufacturing thereof |
| JP2015005660A (ja) | 2013-06-21 | 2015-01-08 | 東京エレクトロン株式会社 | 酸化タンタル膜の除去方法および除去装置 |
| KR101700636B1 (ko) * | 2015-04-17 | 2017-01-31 | 재원산업 주식회사 | 접착제 제거용 조성물 및 이를 이용한 박형 웨이퍼의 제조방법 |
| GB2554635A (en) * | 2016-08-03 | 2018-04-11 | Northwick Park Institute For Medical Res Ltd | Bioreactors and methods for processing biological material |
| JP6970675B2 (ja) * | 2016-09-29 | 2021-11-24 | 富士フイルム株式会社 | 処理液および積層体の処理方法 |
-
2017
- 2017-06-30 FR FR1756215A patent/FR3068509B1/fr active Active
-
2018
- 2018-06-29 MY MYPI2019006445A patent/MY205007A/en unknown
- 2018-06-29 JP JP2020522793A patent/JP7206269B2/ja active Active
- 2018-06-29 US US16/616,089 patent/US11075073B2/en active Active
- 2018-06-29 CN CN201880043734.4A patent/CN110892511A/zh active Pending
- 2018-06-29 EP EP18749844.9A patent/EP3646371B1/fr active Active
- 2018-06-29 KR KR1020207002493A patent/KR102617800B1/ko active Active
- 2018-06-29 WO PCT/FR2018/051607 patent/WO2019002789A1/fr not_active Ceased
- 2018-06-29 TW TW107122599A patent/TWI776909B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| FR3068509A1 (fr) | 2019-01-04 |
| JP2020526046A (ja) | 2020-08-27 |
| KR20200026258A (ko) | 2020-03-10 |
| US20200335326A1 (en) | 2020-10-22 |
| EP3646371A1 (fr) | 2020-05-06 |
| EP3646371B1 (fr) | 2021-04-14 |
| US11075073B2 (en) | 2021-07-27 |
| TW201905240A (zh) | 2019-02-01 |
| CN110892511A (zh) | 2020-03-17 |
| TWI776909B (zh) | 2022-09-11 |
| FR3068509B1 (fr) | 2020-02-28 |
| KR102617800B1 (ko) | 2023-12-27 |
| WO2019002789A1 (fr) | 2019-01-03 |
| JP7206269B2 (ja) | 2023-01-17 |
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