JP7206269B2 - 結晶材料の表面における非晶質パッシベーション層を除去するための洗浄化学組成物 - Google Patents

結晶材料の表面における非晶質パッシベーション層を除去するための洗浄化学組成物 Download PDF

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Publication number
JP7206269B2
JP7206269B2 JP2020522793A JP2020522793A JP7206269B2 JP 7206269 B2 JP7206269 B2 JP 7206269B2 JP 2020522793 A JP2020522793 A JP 2020522793A JP 2020522793 A JP2020522793 A JP 2020522793A JP 7206269 B2 JP7206269 B2 JP 7206269B2
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substrate
chemical composition
layer
weight
acid
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Japanese (ja)
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JP2020526046A5 (enExample
JP2020526046A (ja
Inventor
クリスチャン・ピッツェッティ
マリーヌ・オドワン
ジェローム・ダヴィオ
ニコラ・ピアロ
フィリップ・ヴェルナン
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Technic France
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Technic France
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/042—Acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2075—Carboxylic acids-salts thereof
    • C11D3/2079—Monocarboxylic acids-salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/34—Organic compounds containing sulfur
    • C11D3/3409—Alkyl -, alkenyl -, cycloalkyl - or terpene sulfates or sulfonates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/06—Silver salts
    • G03F7/063—Additives or means to improve the lithographic properties; Processing solutions characterised by such additives; Treatment after development or transfer, e.g. finishing, washing; Correction or deletion fluids
    • H10P70/234—
    • H10P70/273—
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Detergent Compositions (AREA)
JP2020522793A 2017-06-30 2018-06-29 結晶材料の表面における非晶質パッシベーション層を除去するための洗浄化学組成物 Active JP7206269B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1756215A FR3068509B1 (fr) 2017-06-30 2017-06-30 Composition chimique de nettoyage pour le retrait d'une couche de passivation amorphe a la surface de materiaux cristallins
FR1756215 2017-06-30
PCT/FR2018/051607 WO2019002789A1 (fr) 2017-06-30 2018-06-29 Composition chimique de nettoyage pour le retrait d'une couche de passivation amorphe a la surface de matériaux cristallins

Publications (3)

Publication Number Publication Date
JP2020526046A JP2020526046A (ja) 2020-08-27
JP2020526046A5 JP2020526046A5 (enExample) 2021-08-12
JP7206269B2 true JP7206269B2 (ja) 2023-01-17

Family

ID=60182676

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020522793A Active JP7206269B2 (ja) 2017-06-30 2018-06-29 結晶材料の表面における非晶質パッシベーション層を除去するための洗浄化学組成物

Country Status (9)

Country Link
US (1) US11075073B2 (enExample)
EP (1) EP3646371B1 (enExample)
JP (1) JP7206269B2 (enExample)
KR (1) KR102617800B1 (enExample)
CN (1) CN110892511A (enExample)
FR (1) FR3068509B1 (enExample)
MY (1) MY205007A (enExample)
TW (1) TWI776909B (enExample)
WO (1) WO2019002789A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210317389A1 (en) * 2020-04-14 2021-10-14 William Quan Chemical product for rapid removal of food burned on to the surfaces of cooktops

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008107494A (ja) 2006-10-24 2008-05-08 Kanto Chem Co Inc フォトレジスト残渣及びポリマー残渣除去液組成物
JP2009515055A (ja) 2005-11-09 2009-04-09 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド 低ｋ誘電体材料をその上に有する半導体ウェハをリサイクルするための組成物および方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6064437A (ja) * 1983-09-20 1985-04-13 Toshiba Corp 鉛系パツシベ−シヨンガラスのエツチング液
US6296714B1 (en) * 1997-01-16 2001-10-02 Mitsubishi Materials Silicon Corporation Washing solution of semiconductor substrate and washing method using the same
US7192910B2 (en) * 2003-10-28 2007-03-20 Sachem, Inc. Cleaning solutions and etchants and methods for using same
KR100660863B1 (ko) * 2005-04-12 2006-12-26 삼성전자주식회사 세정액 및 이를 이용한 반도체 소자의 금속 패턴 형성 방법
US20100124713A1 (en) * 2008-11-17 2010-05-20 Xerox Corporation Toners including carbon nanotubes dispersed in a polymer matrix
US8431516B2 (en) * 2009-10-24 2013-04-30 Wai Mun Lee Composition and method for cleaning semiconductor substrates comprising an alkyl diphosphonic acid
EP2791301B1 (en) * 2011-12-13 2017-10-04 Ecolab USA Inc. Concentrated warewashing compositions and methods
US9058976B2 (en) * 2012-11-06 2015-06-16 International Business Machines Corporation Cleaning composition and process for cleaning semiconductor devices and/or tooling during manufacturing thereof
JP2015005660A (ja) 2013-06-21 2015-01-08 東京エレクトロン株式会社 酸化タンタル膜の除去方法および除去装置
KR101700636B1 (ko) * 2015-04-17 2017-01-31 재원산업 주식회사 접착제 제거용 조성물 및 이를 이용한 박형 웨이퍼의 제조방법
GB2554635A (en) * 2016-08-03 2018-04-11 Northwick Park Institute For Medical Res Ltd Bioreactors and methods for processing biological material
JP6970675B2 (ja) * 2016-09-29 2021-11-24 富士フイルム株式会社 処理液および積層体の処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009515055A (ja) 2005-11-09 2009-04-09 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド 低ｋ誘電体材料をその上に有する半導体ウェハをリサイクルするための組成物および方法
JP2008107494A (ja) 2006-10-24 2008-05-08 Kanto Chem Co Inc フォトレジスト残渣及びポリマー残渣除去液組成物

Also Published As

Publication number Publication date
FR3068509B1 (fr) 2020-02-28
US11075073B2 (en) 2021-07-27
JP2020526046A (ja) 2020-08-27
US20200335326A1 (en) 2020-10-22
KR102617800B1 (ko) 2023-12-27
WO2019002789A1 (fr) 2019-01-03
TWI776909B (zh) 2022-09-11
KR20200026258A (ko) 2020-03-10
MY205007A (en) 2024-09-27
TW201905240A (zh) 2019-02-01
CN110892511A (zh) 2020-03-17
EP3646371B1 (fr) 2021-04-14
EP3646371A1 (fr) 2020-05-06
FR3068509A1 (fr) 2019-01-04

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