CN104576325B - 一种制作碳化硅sbd器件的方法及其正面保护方法 - Google Patents
一种制作碳化硅sbd器件的方法及其正面保护方法 Download PDFInfo
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- CN104576325B CN104576325B CN201510041144.6A CN201510041144A CN104576325B CN 104576325 B CN104576325 B CN 104576325B CN 201510041144 A CN201510041144 A CN 201510041144A CN 104576325 B CN104576325 B CN 104576325B
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- sic wafer
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- 238000000034 method Methods 0.000 title claims abstract description 70
- 230000002633 protecting effect Effects 0.000 title claims abstract description 26
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 23
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 238000005530 etching Methods 0.000 claims abstract description 10
- 238000002161 passivation Methods 0.000 claims abstract description 8
- 238000004544 sputter deposition Methods 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 10
- 238000000137 annealing Methods 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 4
- 239000007792 gaseous phase Substances 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 208000027418 Wounds and injury Diseases 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 208000014674 injury Diseases 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- MEYZYGMYMLNUHJ-UHFFFAOYSA-N tunicamycin Natural products CC(C)CCCCCCCCCC=CC(=O)NC1C(O)C(O)C(CC(O)C2OC(C(O)C2O)N3C=CC(=O)NC3=O)OC1OC4OC(CO)C(O)C(O)C4NC(=O)C MEYZYGMYMLNUHJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
- H01L29/6606—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510041144.6A CN104576325B (zh) | 2015-01-27 | 2015-01-27 | 一种制作碳化硅sbd器件的方法及其正面保护方法 |
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CN201510041144.6A CN104576325B (zh) | 2015-01-27 | 2015-01-27 | 一种制作碳化硅sbd器件的方法及其正面保护方法 |
Publications (2)
Publication Number | Publication Date |
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CN104576325A CN104576325A (zh) | 2015-04-29 |
CN104576325B true CN104576325B (zh) | 2017-07-21 |
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CN201510041144.6A Active CN104576325B (zh) | 2015-01-27 | 2015-01-27 | 一种制作碳化硅sbd器件的方法及其正面保护方法 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107946215A (zh) * | 2017-11-23 | 2018-04-20 | 长江存储科技有限责任公司 | 晶圆翘曲状态调整方法 |
CN109830456A (zh) * | 2018-12-25 | 2019-05-31 | 厦门市三安集成电路有限公司 | 功率器件的背面金属加厚的方法和功率器件的制备方法 |
CN113555504B (zh) * | 2021-07-22 | 2023-10-03 | 长鑫存储技术有限公司 | 半导体结构及半导体结构的制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1938857A (zh) * | 2004-03-26 | 2007-03-28 | 财团法人电力中央研究所 | 肖特基结合型半导体装置的制造方法 |
CN101000936A (zh) * | 2006-12-23 | 2007-07-18 | 厦门大学 | δ掺杂4H-SiC PIN结构紫外光电探测器及其制备方法 |
Family Cites Families (1)
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DE102006011697B4 (de) * | 2006-03-14 | 2012-01-26 | Infineon Technologies Austria Ag | Integrierte Halbleiterbauelementeanordnung und Verfahren zu deren Herstellung |
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2015
- 2015-01-27 CN CN201510041144.6A patent/CN104576325B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1938857A (zh) * | 2004-03-26 | 2007-03-28 | 财团法人电力中央研究所 | 肖特基结合型半导体装置的制造方法 |
CN101000936A (zh) * | 2006-12-23 | 2007-07-18 | 厦门大学 | δ掺杂4H-SiC PIN结构紫外光电探测器及其制备方法 |
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Address after: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee after: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee before: ZHUZHOU CSR TIMES ELECTRIC Co.,Ltd. |
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Effective date of registration: 20201012 Address after: 412001 Room 309, floor 3, semiconductor third line office building, Tianxin hi tech park, Shifeng District, Zhuzhou City, Hunan Province Patentee after: Zhuzhou CRRC times Semiconductor Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee before: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. |
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