JP2020504451A5 - - Google Patents
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- Publication number
- JP2020504451A5 JP2020504451A5 JP2019536063A JP2019536063A JP2020504451A5 JP 2020504451 A5 JP2020504451 A5 JP 2020504451A5 JP 2019536063 A JP2019536063 A JP 2019536063A JP 2019536063 A JP2019536063 A JP 2019536063A JP 2020504451 A5 JP2020504451 A5 JP 2020504451A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- packaged semiconductor
- polymer
- particles
- packaged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 48
- 229920000642 polymer Polymers 0.000 claims 19
- 229910000679 solder Inorganic materials 0.000 claims 18
- 239000002245 particle Substances 0.000 claims 17
- 239000004593 Epoxy Substances 0.000 claims 5
- 239000004642 Polyimide Substances 0.000 claims 5
- 229920000728 polyester Polymers 0.000 claims 5
- 229920001721 polyimide Polymers 0.000 claims 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 4
- 239000013528 metallic particle Substances 0.000 claims 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 238000000465 moulding Methods 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052763 palladium Inorganic materials 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 claims 2
- 239000011135 tin Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000002923 metal particle Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662440950P | 2016-12-30 | 2016-12-30 | |
| US62/440,950 | 2016-12-30 | ||
| US15/842,608 | 2017-12-14 | ||
| US15/842,608 US10186478B2 (en) | 2016-12-30 | 2017-12-14 | Packaged semiconductor device with a particle roughened surface |
| PCT/US2017/068761 WO2018126038A1 (en) | 2016-12-30 | 2017-12-28 | Packaged semiconductor device with a particle roughened surface |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020504451A JP2020504451A (ja) | 2020-02-06 |
| JP2020504451A5 true JP2020504451A5 (https=) | 2021-02-12 |
| JP7206198B2 JP7206198B2 (ja) | 2023-01-17 |
Family
ID=62710747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019536063A Active JP7206198B2 (ja) | 2016-12-30 | 2017-12-28 | 表面が粗化された粒子を有するパッケージングされた半導体デバイス |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US10186478B2 (https=) |
| JP (1) | JP7206198B2 (https=) |
| CN (1) | CN109863594B (https=) |
| WO (1) | WO2018126038A1 (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10186478B2 (en) * | 2016-12-30 | 2019-01-22 | Texas Instruments Incorporated | Packaged semiconductor device with a particle roughened surface |
| US12237249B2 (en) * | 2018-10-30 | 2025-02-25 | Texas Instruments Incorporated | Substrates with solder barriers on leads |
| JP7353794B2 (ja) | 2019-05-13 | 2023-10-02 | ローム株式会社 | 半導体装置、その製造方法、及びモジュール |
| US11264314B2 (en) | 2019-09-27 | 2022-03-01 | International Business Machines Corporation | Interconnection with side connection to substrate |
| US11004819B2 (en) * | 2019-09-27 | 2021-05-11 | International Business Machines Corporation | Prevention of bridging between solder joints |
| WO2021065907A1 (ja) * | 2019-10-03 | 2021-04-08 | ローム株式会社 | 半導体装置、電子部品および電子部品の製造方法 |
| JP7408885B2 (ja) * | 2020-01-30 | 2024-01-09 | 長華科技股▲ふん▼有限公司 | リードフレーム |
| US11235404B2 (en) * | 2020-03-21 | 2022-02-01 | International Business Machines Corporation | Personalized copper block for selective solder removal |
| JP7607438B2 (ja) * | 2020-11-13 | 2024-12-27 | ローム株式会社 | 半導体装置 |
| US11735529B2 (en) | 2021-05-21 | 2023-08-22 | International Business Machines Corporation | Side pad anchored by next adjacent via |
| CN116995054B (zh) * | 2023-07-13 | 2025-04-01 | 日月新半导体(昆山)有限公司 | 集成电路封装产品以及集成电路封装方法 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06204362A (ja) * | 1993-01-05 | 1994-07-22 | Nec Corp | 半導体装置 |
| JP2953424B2 (ja) * | 1997-03-31 | 1999-09-27 | 日本電気株式会社 | フェイスダウンボンディング用リードフレーム |
| JPH11289040A (ja) * | 1998-02-09 | 1999-10-19 | Shinko Electric Ind Co Ltd | リードフレーム及びこれを用いた半導体装置 |
| SG87769A1 (en) | 1998-09-29 | 2002-04-16 | Texas Instr Singapore Pte Ltd | Direct attachment of semiconductor chip to organic substrate |
| JP4351327B2 (ja) | 1999-05-20 | 2009-10-28 | 大日本印刷株式会社 | リードフレーム部材とそれを用いた樹脂封止型半導体装置およびリードフレーム部材の製造方法 |
| KR100583494B1 (ko) * | 2000-03-25 | 2006-05-24 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지 |
| JP2002170838A (ja) * | 2000-11-30 | 2002-06-14 | Shinkawa Ltd | 半導体装置およびその製造方法 |
| DE10148120B4 (de) * | 2001-09-28 | 2007-02-01 | Infineon Technologies Ag | Elektronische Bauteile mit Halbleiterchips und ein Systemträger mit Bauteilpositionen sowie Verfahren zur Herstellung eines Systemträgers |
| US7645640B2 (en) * | 2004-11-15 | 2010-01-12 | Stats Chippac Ltd. | Integrated circuit package system with leadframe substrate |
| US8067823B2 (en) * | 2004-11-15 | 2011-11-29 | Stats Chippac, Ltd. | Chip scale package having flip chip interconnect on die paddle |
| US7443015B2 (en) * | 2005-05-05 | 2008-10-28 | Stats Chippac Ltd. | Integrated circuit package system with downset lead |
| US7382059B2 (en) * | 2005-11-18 | 2008-06-03 | Semiconductor Components Industries, L.L.C. | Semiconductor package structure and method of manufacture |
| JP5247626B2 (ja) * | 2008-08-22 | 2013-07-24 | 住友化学株式会社 | リードフレーム、樹脂パッケージ、半導体装置及び樹脂パッケージの製造方法 |
| JP2010135723A (ja) | 2008-10-29 | 2010-06-17 | Panasonic Corp | 半導体装置 |
| JP5156658B2 (ja) | 2009-01-30 | 2013-03-06 | 株式会社日立製作所 | Ｌｓｉ用電子部材 |
| US8044495B2 (en) * | 2009-06-22 | 2011-10-25 | Texas Instruments Incorporated | Metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds |
| RU2438845C1 (ru) | 2010-07-01 | 2012-01-10 | Открытое акционерное общество "Авангард" | Припойная паста |
| CN103563099A (zh) | 2011-06-01 | 2014-02-05 | 皇家飞利浦有限公司 | 键合到支撑衬底的发光器件 |
| CN102339809B (zh) * | 2011-11-04 | 2013-11-06 | 北京工业大学 | 一种多圈引脚排列四边扁平无引脚封装及制造方法 |
| JP5842109B2 (ja) | 2012-02-23 | 2016-01-13 | パナソニックＩｐマネジメント株式会社 | 樹脂封止型半導体装置及びその製造方法 |
| US9040346B2 (en) * | 2012-05-03 | 2015-05-26 | Infineon Technologies Ag | Semiconductor package and methods of formation thereof |
| TWI460837B (zh) | 2012-06-19 | 2014-11-11 | 頎邦科技股份有限公司 | 半導體封裝結構及其導線架 |
| CN104425287A (zh) | 2013-08-19 | 2015-03-18 | 讯芯电子科技（中山）有限公司 | 封装结构及制造方法 |
| US20160068387A1 (en) * | 2014-09-09 | 2016-03-10 | Texas Instruments Incorporated | Semiconductor cavity package using photosensitive resin |
| US9502337B2 (en) | 2014-10-31 | 2016-11-22 | Nantong Fujitsu Microelectronics Co., Ltd. | Flip-chip on leadframe semiconductor packaging structure and fabrication method thereof |
| US10008472B2 (en) * | 2015-06-29 | 2018-06-26 | Stmicroelectronics, Inc. | Method for making semiconductor device with sidewall recess and related devices |
| US10186478B2 (en) * | 2016-12-30 | 2019-01-22 | Texas Instruments Incorporated | Packaged semiconductor device with a particle roughened surface |
-
2017
- 2017-12-14 US US15/842,608 patent/US10186478B2/en active Active
- 2017-12-28 JP JP2019536063A patent/JP7206198B2/ja active Active
- 2017-12-28 CN CN201780065757.0A patent/CN109863594B/zh active Active
- 2017-12-28 WO PCT/US2017/068761 patent/WO2018126038A1/en not_active Ceased
-
2019
- 2019-01-18 US US16/252,412 patent/US10475729B2/en active Active
- 2019-11-12 US US16/681,221 patent/US11062982B2/en active Active
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