JP2020178060A - 半導体モジュール用外部端子 - Google Patents
半導体モジュール用外部端子 Download PDFInfo
- Publication number
- JP2020178060A JP2020178060A JP2019079866A JP2019079866A JP2020178060A JP 2020178060 A JP2020178060 A JP 2020178060A JP 2019079866 A JP2019079866 A JP 2019079866A JP 2019079866 A JP2019079866 A JP 2019079866A JP 2020178060 A JP2020178060 A JP 2020178060A
- Authority
- JP
- Japan
- Prior art keywords
- groove portion
- external terminal
- groove
- semiconductor module
- terminal body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10818—Flat leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
2−ケース
3−基板
4−外部端子
45−第1溝部
46−第2溝部
47−第3溝部
48−第4溝部
X−中心線
Claims (7)
- 半導体モジュール内に配置される基板に対し垂直に半田付けされる外部端子において、
半田付けされる底部と、
前記底部から垂直に折り曲げられた端子本体部と、を備え
前記端子本体部は、前記底部からの折り曲げ部の直上の左端部側に第1溝部、右端部側に第2溝部を有し、前記第1溝部と前記第2溝部は前記端子本体部を垂直方向に通過する中心線に対して非対称であることを特徴とする半導体モジュール用外部端子。 - 前記第1溝部と前記第2溝部は、それぞれの水平方向の長さが異なっている、請求項1記載の半導体モジュール用外部端子。
- 前記端子本体部は、前記第1溝部と前記第2溝部の上方の左端部側に第3溝部、右端部側に第4溝部を有し、前記第3溝部と前記第4溝部は前記中心線に対して非対称である、請求項1記載の半導体モジュール用外部端子。
- 前記第3溝部と前記第4溝部は、それぞれの水平方向の長さが異なっている、請求項3記載の半導体モジュール用外部端子。
- 前記第3溝部と前記第4溝部は、それぞれの垂直方向の位置が異なっている、請求項4記載の半導体モジュール用外部端子。
- 前記第1溝部と前記第3溝部は、それぞれの水平方向の長さが異なっている、請求項3〜請求項5のいずれかに記載の半導体モジュール用外部端子。
- 前記第2溝部と前記第4溝部は、それぞれの水平方向の長さが異なっている、請求項3〜請求項6のいずれかに記載の半導体モジュール用外部端子。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019079866A JP7244339B2 (ja) | 2019-04-19 | 2019-04-19 | 半導体モジュール用外部端子 |
CN201980095556.4A CN113711345B (zh) | 2019-04-19 | 2019-12-23 | 半导体模块用外部端子 |
US17/603,254 US11791244B2 (en) | 2019-04-19 | 2019-12-23 | Semiconductor-module external terminal |
PCT/JP2019/050285 WO2020213214A1 (ja) | 2019-04-19 | 2019-12-23 | 半導体モジュール用外部端子 |
EP19925105.9A EP3958300A4 (en) | 2019-04-19 | 2019-12-23 | EXTERNAL TERMINAL FOR SEMICONDUCTOR MODULE |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019079866A JP7244339B2 (ja) | 2019-04-19 | 2019-04-19 | 半導体モジュール用外部端子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020178060A true JP2020178060A (ja) | 2020-10-29 |
JP7244339B2 JP7244339B2 (ja) | 2023-03-22 |
Family
ID=72837238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019079866A Active JP7244339B2 (ja) | 2019-04-19 | 2019-04-19 | 半導体モジュール用外部端子 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11791244B2 (ja) |
EP (1) | EP3958300A4 (ja) |
JP (1) | JP7244339B2 (ja) |
CN (1) | CN113711345B (ja) |
WO (1) | WO2020213214A1 (ja) |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59110146A (ja) * | 1982-12-16 | 1984-06-26 | Toshiba Corp | パツケ−ジ形モジユ−ルの外部引出し端子 |
JP2720009B2 (ja) * | 1993-11-29 | 1998-02-25 | 株式会社三社電機製作所 | 電力用半導体モジュール |
JP2003115337A (ja) * | 2001-07-31 | 2003-04-18 | Rohm Co Ltd | 端子板、この端子板を備えた回路基板、およびこの端子板の接続方法 |
JP2007073782A (ja) * | 2005-09-08 | 2007-03-22 | Nippon Inter Electronics Corp | 大電力用半導体装置 |
JP2008205329A (ja) * | 2007-02-22 | 2008-09-04 | Nichia Chem Ind Ltd | 半導体装置 |
JP2013140862A (ja) * | 2011-12-29 | 2013-07-18 | Mitsubishi Electric Corp | パワー半導体装置 |
JP2013187437A (ja) * | 2012-03-09 | 2013-09-19 | Mitsubishi Electric Corp | 樹脂封止型パワーモジュール |
JP2015046416A (ja) * | 2013-08-27 | 2015-03-12 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
JP2015201505A (ja) * | 2014-04-07 | 2015-11-12 | 三菱電機株式会社 | 半導体装置 |
WO2017122471A1 (ja) * | 2016-01-15 | 2017-07-20 | 富士電機株式会社 | 半導体装置 |
JP2019009183A (ja) * | 2017-06-21 | 2019-01-17 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63164242U (ja) | 1987-04-14 | 1988-10-26 | ||
JP2650571B2 (ja) | 1992-07-03 | 1997-09-03 | 松下電器産業株式会社 | 回路モジュール |
JPH07221263A (ja) * | 1994-01-28 | 1995-08-18 | Hitachi Ltd | 半導体装置 |
JP2007165588A (ja) * | 2005-12-14 | 2007-06-28 | Omron Corp | パワーモジュール構造及びこれを用いたソリッドステートリレー |
JP4902558B2 (ja) * | 2007-01-31 | 2012-03-21 | 三洋電機株式会社 | 半導体モジュールの製造方法 |
US9620877B2 (en) * | 2014-06-17 | 2017-04-11 | Semiconductor Components Industries, Llc | Flexible press fit pins for semiconductor packages and related methods |
CN107078130B (zh) * | 2014-09-30 | 2019-07-23 | 株式会社三社电机制作所 | 半导体模块 |
-
2019
- 2019-04-19 JP JP2019079866A patent/JP7244339B2/ja active Active
- 2019-12-23 EP EP19925105.9A patent/EP3958300A4/en active Pending
- 2019-12-23 US US17/603,254 patent/US11791244B2/en active Active
- 2019-12-23 CN CN201980095556.4A patent/CN113711345B/zh active Active
- 2019-12-23 WO PCT/JP2019/050285 patent/WO2020213214A1/ja active Application Filing
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59110146A (ja) * | 1982-12-16 | 1984-06-26 | Toshiba Corp | パツケ−ジ形モジユ−ルの外部引出し端子 |
JP2720009B2 (ja) * | 1993-11-29 | 1998-02-25 | 株式会社三社電機製作所 | 電力用半導体モジュール |
JP2003115337A (ja) * | 2001-07-31 | 2003-04-18 | Rohm Co Ltd | 端子板、この端子板を備えた回路基板、およびこの端子板の接続方法 |
JP2007073782A (ja) * | 2005-09-08 | 2007-03-22 | Nippon Inter Electronics Corp | 大電力用半導体装置 |
JP2008205329A (ja) * | 2007-02-22 | 2008-09-04 | Nichia Chem Ind Ltd | 半導体装置 |
JP2013140862A (ja) * | 2011-12-29 | 2013-07-18 | Mitsubishi Electric Corp | パワー半導体装置 |
JP2013187437A (ja) * | 2012-03-09 | 2013-09-19 | Mitsubishi Electric Corp | 樹脂封止型パワーモジュール |
JP2015046416A (ja) * | 2013-08-27 | 2015-03-12 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
JP2015201505A (ja) * | 2014-04-07 | 2015-11-12 | 三菱電機株式会社 | 半導体装置 |
WO2017122471A1 (ja) * | 2016-01-15 | 2017-07-20 | 富士電機株式会社 | 半導体装置 |
JP2019009183A (ja) * | 2017-06-21 | 2019-01-17 | 三菱電機株式会社 | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JP7244339B2 (ja) | 2023-03-22 |
EP3958300A1 (en) | 2022-02-23 |
CN113711345B (zh) | 2024-04-26 |
US20220199495A1 (en) | 2022-06-23 |
US11791244B2 (en) | 2023-10-17 |
EP3958300A4 (en) | 2023-05-10 |
CN113711345A (zh) | 2021-11-26 |
WO2020213214A1 (ja) | 2020-10-22 |
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