JP2020120106A - 電子モジュール、電子機器、撮像センサモジュール、撮像装置及び表示装置 - Google Patents

電子モジュール、電子機器、撮像センサモジュール、撮像装置及び表示装置 Download PDF

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Publication number
JP2020120106A
JP2020120106A JP2019227601A JP2019227601A JP2020120106A JP 2020120106 A JP2020120106 A JP 2020120106A JP 2019227601 A JP2019227601 A JP 2019227601A JP 2019227601 A JP2019227601 A JP 2019227601A JP 2020120106 A JP2020120106 A JP 2020120106A
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JP
Japan
Prior art keywords
electrode
electronic module
flexible wiring
flexible
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019227601A
Other languages
English (en)
Japanese (ja)
Inventor
有矢 岡田
Yuya Okada
有矢 岡田
幸嗣 野口
Yukitsugu Noguchi
幸嗣 野口
長谷川　光利
Mitsutoshi Hasegawa
光利 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2019227601A priority Critical patent/JP2020120106A/ja
Priority to US16/741,913 priority patent/US11595557B2/en
Priority to CN202010063596.5A priority patent/CN111479385B/zh
Publication of JP2020120106A publication Critical patent/JP2020120106A/ja
Priority to US18/159,097 priority patent/US12160652B2/en
Priority to JP2024113375A priority patent/JP7753464B2/ja
Priority to US18/927,517 priority patent/US20250047966A1/en
Priority to JP2025165247A priority patent/JP2025183446A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2019227601A 2019-01-23 2019-12-17 電子モジュール、電子機器、撮像センサモジュール、撮像装置及び表示装置 Pending JP2020120106A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2019227601A JP2020120106A (ja) 2019-01-23 2019-12-17 電子モジュール、電子機器、撮像センサモジュール、撮像装置及び表示装置
US16/741,913 US11595557B2 (en) 2019-01-23 2020-01-14 Electronic module, electronic equipment, imaging sensor module, imaging apparatus, and display apparatus
CN202010063596.5A CN111479385B (zh) 2019-01-23 2020-01-20 电子模块、电子装备、成像传感器模块、成像装置和显示装置
US18/159,097 US12160652B2 (en) 2019-01-23 2023-01-25 Electronic module, electronic equipment, imaging sensor module, imaging apparatus, and display apparatus
JP2024113375A JP7753464B2 (ja) 2019-01-23 2024-07-16 電子モジュール、電子機器、撮像センサモジュール、撮像装置及び表示装置
US18/927,517 US20250047966A1 (en) 2019-01-23 2024-10-25 Electronic module, electronic equipment, imaging sensor module, imaging apparatus, and display apparatus
JP2025165247A JP2025183446A (ja) 2019-01-23 2025-10-01 電子モジュール、電子機器、撮像センサモジュール、撮像装置及び表示装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019009363 2019-01-23
JP2019009363 2019-01-23
JP2019227601A JP2020120106A (ja) 2019-01-23 2019-12-17 電子モジュール、電子機器、撮像センサモジュール、撮像装置及び表示装置

Related Child Applications (1)

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JP2024113375A Division JP7753464B2 (ja) 2019-01-23 2024-07-16 電子モジュール、電子機器、撮像センサモジュール、撮像装置及び表示装置

Publications (1)

Publication Number Publication Date
JP2020120106A true JP2020120106A (ja) 2020-08-06

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ID=71608780

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2019227601A Pending JP2020120106A (ja) 2019-01-23 2019-12-17 電子モジュール、電子機器、撮像センサモジュール、撮像装置及び表示装置
JP2024113375A Active JP7753464B2 (ja) 2019-01-23 2024-07-16 電子モジュール、電子機器、撮像センサモジュール、撮像装置及び表示装置
JP2025165247A Pending JP2025183446A (ja) 2019-01-23 2025-10-01 電子モジュール、電子機器、撮像センサモジュール、撮像装置及び表示装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2024113375A Active JP7753464B2 (ja) 2019-01-23 2024-07-16 電子モジュール、電子機器、撮像センサモジュール、撮像装置及び表示装置
JP2025165247A Pending JP2025183446A (ja) 2019-01-23 2025-10-01 電子モジュール、電子機器、撮像センサモジュール、撮像装置及び表示装置

Country Status (3)

Country Link
US (3) US11595557B2 (enExample)
JP (3) JP2020120106A (enExample)
CN (1) CN111479385B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023111743A (ja) * 2022-01-31 2023-08-10 富士電機株式会社 配線基板、電力変換装置
US12418975B2 (en) 2023-01-27 2025-09-16 Canon Kabushiki Kaisha Electronic module, imaging unit and equipment

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020120106A (ja) * 2019-01-23 2020-08-06 キヤノン株式会社 電子モジュール、電子機器、撮像センサモジュール、撮像装置及び表示装置
US11895793B2 (en) 2020-04-09 2024-02-06 Canon Kabu Shiki Kaisha Image pickup unit and imaging apparatus
JP7679221B2 (ja) 2020-07-16 2025-05-19 キヤノン株式会社 中間接続部材の製造方法、中間接続部材、電子モジュールの製造方法、電子モジュール、及び電子機器
US11839019B2 (en) 2021-02-19 2023-12-05 Canon Kabushiki Kaisha Communication module and electronic device
CN113131291B (zh) * 2021-03-11 2023-05-12 东莞市晟合科技有限公司 一种搭载电子元器件的连接线及其制作方法
JP7709298B2 (ja) 2021-04-26 2025-07-16 キヤノン株式会社 フレキシブル配線板、モジュール、及び電子機器
JP2023102815A (ja) 2022-01-13 2023-07-26 キヤノン株式会社 電子モジュール、中間接続部材及び電子機器

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JP2018112911A (ja) * 2017-01-12 2018-07-19 株式会社ぐるなび 情報処理装置、情報処理方法及びプログラム

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JPH07122834A (ja) * 1993-10-22 1995-05-12 Minolta Co Ltd プリント配線基板の接続構造
JPH11273678A (ja) * 1998-03-23 1999-10-08 Sumitomo Metal Mining Co Ltd 非水系電解質二次電池用正極活物質およびその製造方法ならびに該正極活物質を用いた非水系電解質二次電池
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023111743A (ja) * 2022-01-31 2023-08-10 富士電機株式会社 配線基板、電力変換装置
US12418975B2 (en) 2023-01-27 2025-09-16 Canon Kabushiki Kaisha Electronic module, imaging unit and equipment

Also Published As

Publication number Publication date
US20230188822A1 (en) 2023-06-15
US20200236261A1 (en) 2020-07-23
US20250047966A1 (en) 2025-02-06
JP7753464B2 (ja) 2025-10-14
US12160652B2 (en) 2024-12-03
CN111479385B (zh) 2024-10-25
JP2024128127A (ja) 2024-09-20
CN111479385A (zh) 2020-07-31
JP2025183446A (ja) 2025-12-16
US11595557B2 (en) 2023-02-28

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