CN111479385B - 电子模块、电子装备、成像传感器模块、成像装置和显示装置 - Google Patents

电子模块、电子装备、成像传感器模块、成像装置和显示装置 Download PDF

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Publication number
CN111479385B
CN111479385B CN202010063596.5A CN202010063596A CN111479385B CN 111479385 B CN111479385 B CN 111479385B CN 202010063596 A CN202010063596 A CN 202010063596A CN 111479385 B CN111479385 B CN 111479385B
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CN
China
Prior art keywords
electrode
insulating layer
flexible wiring
substrate
electrodes
Prior art date
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CN202010063596.5A
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English (en)
Chinese (zh)
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CN111479385A (zh
Inventor
冈田有矢
野口幸嗣
长谷川光利
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Canon Inc
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Canon Inc
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Publication of CN111479385A publication Critical patent/CN111479385A/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Solid State Image Pick-Up Elements (AREA)
CN202010063596.5A 2019-01-23 2020-01-20 电子模块、电子装备、成像传感器模块、成像装置和显示装置 Active CN111479385B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019009363 2019-01-23
JP2019-009363 2019-01-23
JP2019227601A JP2020120106A (ja) 2019-01-23 2019-12-17 電子モジュール、電子機器、撮像センサモジュール、撮像装置及び表示装置
JP2019-227601 2019-12-17

Publications (2)

Publication Number Publication Date
CN111479385A CN111479385A (zh) 2020-07-31
CN111479385B true CN111479385B (zh) 2024-10-25

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Country Status (3)

Country Link
US (3) US11595557B2 (enExample)
JP (3) JP2020120106A (enExample)
CN (1) CN111479385B (enExample)

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US11895793B2 (en) 2020-04-09 2024-02-06 Canon Kabu Shiki Kaisha Image pickup unit and imaging apparatus
JP7679221B2 (ja) 2020-07-16 2025-05-19 キヤノン株式会社 中間接続部材の製造方法、中間接続部材、電子モジュールの製造方法、電子モジュール、及び電子機器
US11839019B2 (en) 2021-02-19 2023-12-05 Canon Kabushiki Kaisha Communication module and electronic device
CN113131291B (zh) * 2021-03-11 2023-05-12 东莞市晟合科技有限公司 一种搭载电子元器件的连接线及其制作方法
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US11595557B2 (en) 2023-02-28
JP2020120106A (ja) 2020-08-06
JP2024128127A (ja) 2024-09-20
CN111479385A (zh) 2020-07-31
JP2025183446A (ja) 2025-12-16
US20200236261A1 (en) 2020-07-23
US12160652B2 (en) 2024-12-03
US20250047966A1 (en) 2025-02-06
JP7753464B2 (ja) 2025-10-14
US20230188822A1 (en) 2023-06-15

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