JP2007243960A - カメラモジュール及びカメラモジュールの製造方法 - Google Patents
カメラモジュール及びカメラモジュールの製造方法 Download PDFInfo
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- JP2007243960A JP2007243960A JP2007062495A JP2007062495A JP2007243960A JP 2007243960 A JP2007243960 A JP 2007243960A JP 2007062495 A JP2007062495 A JP 2007062495A JP 2007062495 A JP2007062495 A JP 2007062495A JP 2007243960 A JP2007243960 A JP 2007243960A
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- housing
- circuit board
- printed circuit
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- image sensor
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000005516 engineering process Methods 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 42
- 229910000679 solder Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 230000008569 process Effects 0.000 claims description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910017944 Ag—Cu Inorganic materials 0.000 claims description 3
- 229910020888 Sn-Cu Inorganic materials 0.000 claims description 3
- 229910019204 Sn—Cu Inorganic materials 0.000 claims description 3
- 229910020830 Sn-Bi Inorganic materials 0.000 claims description 2
- 229910020994 Sn-Zn Inorganic materials 0.000 claims description 2
- 229910018728 Sn—Bi Inorganic materials 0.000 claims description 2
- 229910009069 Sn—Zn Inorganic materials 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 description 16
- 230000003287 optical effect Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 210000000653 nervous system Anatomy 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
【解決手段】カメラモジュール100は、イメージセンサ120を備えたプリント回路基板110にハウジング130を表面実装技術により実装できるようにする。また、カメラモジュール100の製造方法は、プリント回路基板110にイメージセンサ120及びハウジング130を実装し、ハウジング130の上部にレンズ部154及びフィルタ152を結合できるようにする。
【選択図】図2
Description
Claims (13)
- イメージセンサと、
前記イメージセンサが搭載されたプリント回路基板と、
表面実装技術(SMT)工程により前記プリント回路基板に実装されるハウジングと、
前記ハウジングに備えられたレンズ部と、を含むカメラモジュール。 - 前記イメージセンサは、プリント回路基板の上面又は背面に結合されている請求項1に記載のカメラモジュール。
- 前記プリント回路基板の上面及びハウジングの下端部には、互いに対応する実装部が形成されている請求項1に記載のカメラモジュール。
- 前記実装部は、円形状又は多角形形状に形成されている請求項3に記載のカメラモジュール。
- 前記実装部は、金属パッドに形成されている請求項3に記載のカメラモジュール。
- 前記金属パッドは、銅パッド又は銅に金若しくはニッケルでメッキされたパッドを含む請求項5に記載のカメラモジュール。
- 前記ハウジングの下端に設けられた実装部は、ハウジングの一側に平行な領域及び/又は前記平行な領域から延長された非平行な領域を具備しており、前記非平行な領域は少なくとも一つ以上の垂直な曲げ部である請求項3に記載のカメラモジュール。
- 前記表面実装技術(SMT)工程は、鉛、Sn−Cu系合金、Sn−Ag−Cu系合金、Sn−Bi系合金及びSn−Zn系合金のうちの一つのソルダーを利用する請求項1に記載のカメラモジュール。
- プリント回路基板にイメージセンサを搭載するステップと、
表面実装技術(SMT)工程により前記プリント回路基板にハウジングが固定されるステップと、
前記ハウジングの上部にレンズ及びフィルタを含むレンズ部を結合するステップと、を含むカメラモジュールの製造方法。 - 前記イメージセンサは、BGAタイプ、CSPタイプ、COBタイプのうちの何れか1つである請求項9に記載のカメラモジュールの製造方法。
- 前記ハウジングが固定されるステップは、
前記プリント回路基板の上面に設けられた第1実装部または前記ハウジングの下端に設けられた第2実装部のいずれかにソルダーを塗布するステップと、
お互いに対応するように形成された実装部を有する前記ハウジング及び前記プリント回路基板を整列するステップと、
前記プリント回路基板の上面に前記ハウジングを実装するステップと、
リフロー(REFLOW)工程に前記プリント回路基板上に実装されたハウジングを送るステップと、
を含む請求項9に記載のカメラモジュールの製造方法。 - 前記プリント回路基板の第1実装部及び前記ハウジングの第2実装部は、円形状又は多角形形状に形成される請求項11に記載のカメラモジュールの製造方法。
- 前記第2実装部は、前記ハウジングの射出成形時に形成される請求項11に記載のカメラモジュールの製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060022840A KR101294419B1 (ko) | 2006-03-10 | 2006-03-10 | 카메라 모듈 및 그 제조 방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007243960A true JP2007243960A (ja) | 2007-09-20 |
Family
ID=38479052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007062495A Pending JP2007243960A (ja) | 2006-03-10 | 2007-03-12 | カメラモジュール及びカメラモジュールの製造方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US7780365B2 (ja) |
JP (1) | JP2007243960A (ja) |
KR (1) | KR101294419B1 (ja) |
Cited By (3)
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EP2039921A1 (en) | 2007-09-20 | 2009-03-25 | Hitachi Ltd. | Control apparatus for cylinder injection internal combustion engine with high-pressure fuel pump |
JP2012114675A (ja) * | 2010-11-25 | 2012-06-14 | Ricoh Co Ltd | 撮像装置 |
KR101365328B1 (ko) | 2012-05-15 | 2014-02-20 | 삼성전기주식회사 | 카메라 모듈 및 카메라 모듈의 제조 방법 |
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JP4463793B2 (ja) * | 2006-10-10 | 2010-05-19 | 浜松ホトニクス株式会社 | 光検出装置 |
WO2008133946A1 (en) * | 2007-04-24 | 2008-11-06 | Flextronics Ap Llc | Auto focus/ zoom modules using wafer level optics |
CN101303444A (zh) * | 2007-05-11 | 2008-11-12 | 鸿富锦精密工业(深圳)有限公司 | 相机模组及其组装方法 |
CN101349792B (zh) * | 2007-07-18 | 2011-11-09 | 鸿富锦精密工业(深圳)有限公司 | 镜头座及其应用的镜头座组件 |
US7825985B2 (en) * | 2007-07-19 | 2010-11-02 | Flextronics Ap, Llc | Camera module back-focal length adjustment method and ultra compact components packaging |
KR100889353B1 (ko) * | 2007-12-06 | 2009-03-18 | 삼성전기주식회사 | 이미지센서와 이미지센서 모듈 및 이를 포함하는 카메라모듈 |
US9118825B2 (en) * | 2008-02-22 | 2015-08-25 | Nan Chang O-Film Optoelectronics Technology Ltd. | Attachment of wafer level optics |
JP2009253427A (ja) * | 2008-08-25 | 2009-10-29 | Cheng Uei Precision Industry Co Ltd | カメラモジュールとその製造方法 |
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2006
- 2006-03-10 KR KR1020060022840A patent/KR101294419B1/ko active IP Right Grant
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2007
- 2007-03-12 JP JP2007062495A patent/JP2007243960A/ja active Pending
- 2007-03-12 US US11/684,927 patent/US7780365B2/en active Active
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2010
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Cited By (3)
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EP2039921A1 (en) | 2007-09-20 | 2009-03-25 | Hitachi Ltd. | Control apparatus for cylinder injection internal combustion engine with high-pressure fuel pump |
JP2012114675A (ja) * | 2010-11-25 | 2012-06-14 | Ricoh Co Ltd | 撮像装置 |
KR101365328B1 (ko) | 2012-05-15 | 2014-02-20 | 삼성전기주식회사 | 카메라 모듈 및 카메라 모듈의 제조 방법 |
Also Published As
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US8714843B2 (en) | 2014-05-06 |
KR101294419B1 (ko) | 2013-08-08 |
US20070212061A1 (en) | 2007-09-13 |
US7780365B2 (en) | 2010-08-24 |
US20100278524A1 (en) | 2010-11-04 |
KR20070092545A (ko) | 2007-09-13 |
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