JP2020102544A - 半導体装置とその製造方法 - Google Patents
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Abstract
Description
12:半導体素子
14:封止体
20、120:絶縁回路基板
22、122:絶縁基板
24、26、124、126、224:導体膜
25、27、125、127:ろう材
30:信号端子
32:第1電力端子
34:第2電力端子
40:接合層
Claims (13)
- 絶縁体で構成された基板と、
前記基板上の一部に設けられた第1導体膜と、
前記第1導体膜上に配置された半導体素子と、
前記第1導体膜から離れた位置で、前記基板上に接合層を介して接合された外部接続端子と、
を備え、
前記半導体素子は、主電極と信号電極とを有するパワー半導体素子であり、
前記主電極は、前記第1導体膜と電気的に接続されており、前記信号電極は、前記外部接続端子と電気的に接続されている、
半導体装置。 - 前記半導体素子の一部は、前記外部接続端子上に位置しており、前記信号電極が前記外部接続端子に接合されている、請求項1に記載の半導体装置。
- 前記外部接続端子は、前記信号電極と対向する部分が、前記信号電極に向けて突出している、請求項2に記載の半導体装置。
- 前記外部接続端子の側面が前記基板と成す角度は、前記第1導体膜の側面が前記基板と成す角度よりも大きい、請求項1から3のいずれか一項に記載の半導体装置。
- 前記第1導体膜の厚みは、前記外部接続端子の厚みよりも大きい、請求項1から4のいずれか一項に記載の半導体装置。
- 前記外部接続端子は、前記接合層に接する第1区間と、前記第1区間から前記基板の外部へ延びるとともに、前記第1区間よりも厚みの小さい第2区間とを有する、請求項1から5のいずれか一項に記載の半導体装置。
- 前記半導体素子は、IGBT(Insulated Gate Bipolar Transistor)構造を含むパワー半導体素子であり、
前記主電極は、前記IGBT構造のエミッタ又はコレクタに接続されており、
前記信号電極は、前記IGBT構造のゲートに接続されている、請求項1から6のいずれか一項に記載の半導体装置。 - 前記半導体素子は、MOSFET(Metal-Oxide-Semiconductor Field-Effect Transistor)構造を含むパワー半導体素子であり、
前記主電極は、前記MOSFETのソース又はドレインに接続されており、
前記信号電極は、前記MOSFETのゲートに接続されている、請求項1から6のいずれか一項に記載の半導体装置。 - 前記基板は、セラミック基板である、請求項1から8のいずれか一項に記載の半導体装置。
- 前記第1導体膜は、ろう材を介して前記基板上に接合されている、請求項1から9のいずれか一項に記載の半導体装置。
- 前記基板の前記第1導体膜とは反対側に設けられた第2導体膜をさらに備える、請求項1から10のいずれか一項に記載の半導体装置。
- 半導体装置の製造方法であって、
絶縁体で構成された基板上の導体膜を部分的にエッチングして、前記基板上の一部を覆う第1導体膜を形成する工程と、
前記第1導体膜から離れた位置で、前記基板上に接合層を介して外部接続端子を接合する工程と、
前記第1導体膜上に、主電極と信号電極とを有するパワー半導体素子を、前記主電極が前記第1導体膜に対向するように配置する工程と、
前記パワー半導体素子の前記主電極を、前記第1導体膜に接合する工程と、
前記パワー半導体素子の前記信号電極を、前記基板上に接合された前記外部接続端子へ電気的に接続する工程と、
を備える製造方法。 - 前記配置する工程では、前記信号電極が前記外部接続端子に対向するように、前記パワー半導体素子の一部を前記外部接続端子上に配置し、
前記電気的に接続する工程では、前記接合する工程と並行して、前記信号電極を前記外部接続端子へ接合する、請求項12に記載の製造方法。
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JP2018239956A JP7176397B2 (ja) | 2018-12-21 | 2018-12-21 | 半導体装置とその製造方法 |
US16/693,478 US11201099B2 (en) | 2018-12-21 | 2019-11-25 | Semiconductor device and method of manufacturing the same |
CN201911319896.9A CN111354710B (zh) | 2018-12-21 | 2019-12-19 | 半导体装置及其制造方法 |
DE102019135373.4A DE102019135373A1 (de) | 2018-12-21 | 2019-12-20 | Halbleitervorrichtung und Verfahren zum Herstellen derselben |
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JP2016174165A (ja) * | 2011-12-20 | 2016-09-29 | 株式会社東芝 | 半導体装置 |
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JPH1056131A (ja) * | 1996-08-12 | 1998-02-24 | Denso Corp | 半導体装置 |
JP2016174165A (ja) * | 2011-12-20 | 2016-09-29 | 株式会社東芝 | 半導体装置 |
JP2013183022A (ja) * | 2012-03-01 | 2013-09-12 | Toyota Industries Corp | 半導体装置および半導体装置の製造方法 |
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DE102019135373A1 (de) | 2020-06-25 |
CN111354710B (zh) | 2023-08-04 |
CN111354710A (zh) | 2020-06-30 |
US11201099B2 (en) | 2021-12-14 |
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