JP2019534538A - 有機発光ダイオードの封止方法及び装置 - Google Patents

有機発光ダイオードの封止方法及び装置 Download PDF

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Publication number
JP2019534538A
JP2019534538A JP2019523015A JP2019523015A JP2019534538A JP 2019534538 A JP2019534538 A JP 2019534538A JP 2019523015 A JP2019523015 A JP 2019523015A JP 2019523015 A JP2019523015 A JP 2019523015A JP 2019534538 A JP2019534538 A JP 2019534538A
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Prior art keywords
layer
mask
inorganic
substrate
forming
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Pending
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JP2019523015A
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Japanese (ja)
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JP2019534538A5 (https=
Inventor
エス． ロォー，カム
エス． ロォー，カム
エル． スティーブンズ，クレイグ
エル． スティーブンズ，クレイグ
外島　正人
正人 外島
Original Assignee
オルボテック エルティ ソラー，エルエルシー
オルボテック エルティ ソラー，エルエルシー
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Application filed by オルボテック エルティ ソラー，エルエルシー, オルボテック エルティ ソラー，エルエルシー filed Critical オルボテック エルティ ソラー，エルエルシー
Publication of JP2019534538A publication Critical patent/JP2019534538A/ja
Publication of JP2019534538A5 publication Critical patent/JP2019534538A5/ja
Priority to JP2021137341A priority Critical patent/JP7209058B2/ja
Priority to JP2022126204A priority patent/JP2022145802A/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
JP2019523015A 2016-11-06 2017-11-03 有機発光ダイオードの封止方法及び装置 Pending JP2019534538A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021137341A JP7209058B2 (ja) 2016-11-06 2021-08-25 有機発光ダイオードの封止方法
JP2022126204A JP2022145802A (ja) 2016-11-06 2022-08-08 有機発光ダイオードの封止方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662418175P 2016-11-06 2016-11-06
US62/418,175 2016-11-06
PCT/US2017/060037 WO2018085715A2 (en) 2016-11-06 2017-11-03 Method and apparatus for encapsulation of an organic light emitting diode

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021137341A Division JP7209058B2 (ja) 2016-11-06 2021-08-25 有機発光ダイオードの封止方法

Publications (2)

Publication Number Publication Date
JP2019534538A true JP2019534538A (ja) 2019-11-28
JP2019534538A5 JP2019534538A5 (https=) 2021-01-14

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ID=62064075

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JP2019523015A Pending JP2019534538A (ja) 2016-11-06 2017-11-03 有機発光ダイオードの封止方法及び装置
JP2021137341A Active JP7209058B2 (ja) 2016-11-06 2021-08-25 有機発光ダイオードの封止方法
JP2022126204A Pending JP2022145802A (ja) 2016-11-06 2022-08-08 有機発光ダイオードの封止方法

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JP2021137341A Active JP7209058B2 (ja) 2016-11-06 2021-08-25 有機発光ダイオードの封止方法
JP2022126204A Pending JP2022145802A (ja) 2016-11-06 2022-08-08 有機発光ダイオードの封止方法

Country Status (5)

Country Link
US (1) US10333104B2 (https=)
JP (3) JP2019534538A (https=)
KR (1) KR102454027B1 (https=)
CN (1) CN110268504A (https=)
WO (1) WO2018085715A2 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2019220896A1 (ja) * 2018-05-18 2021-07-01 日本ゼオン株式会社 印刷用樹脂溶液及びデバイス構造体の製造方法
JP2023539364A (ja) * 2020-09-02 2023-09-13 エボニック オペレーションズ ゲーエムベーハー リチウムイオン電池アノード用の高性能シリコン系材料
JP2024515953A (ja) * 2021-04-23 2024-04-11 ジュスン エンジニアリング カンパニー リミテッド 半導体パッケージング装置
US12359078B2 (en) 2019-06-14 2025-07-15 Zeon Corporation Resin solution for printing

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102801661B1 (ko) * 2019-04-09 2025-04-30 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
WO2020251696A1 (en) * 2019-06-10 2020-12-17 Applied Materials, Inc. Processing system for forming layers

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000328229A (ja) * 1999-05-19 2000-11-28 Canon Inc 真空蒸着装置
JP2003332052A (ja) * 2002-05-09 2003-11-21 Sony Corp 有機電界発光表示素子の製造装置および製造方法
JP2004095330A (ja) * 2002-08-30 2004-03-25 Tohoku Pioneer Corp 電子部品を覆う保護膜の形成方法および保護膜を備えた電子機器
JP2004351832A (ja) * 2003-05-30 2004-12-16 Toppan Printing Co Ltd 透明ガスバリア積層フィルム
JP2006339049A (ja) * 2005-06-02 2006-12-14 Tokki Corp 封止膜形成装置
JP2006351307A (ja) * 2005-06-15 2006-12-28 Tohoku Pioneer Corp 自発光パネル及びその製造方法
JP2007273274A (ja) * 2006-03-31 2007-10-18 Canon Inc 有機ｅｌ素子及びその製造方法
JP2010508640A (ja) * 2006-11-01 2010-03-18 ザ、トラスティーズ オブ プリンストン ユニバーシティ 電子デバイス又は他の部品上のコーティングに使用するハイブリッド層
JP2010160906A (ja) * 2009-01-06 2010-07-22 Seiko Epson Corp 有機エレクトロルミネッセンス装置、有機エレクトロルミネッセンス装置の製造方法、および電子機器
US20120199872A1 (en) * 2011-02-08 2012-08-09 Applied Materials, Inc. Method for hybrid encapsulation of an organic light emitting diode
JP2014003135A (ja) * 2012-06-18 2014-01-09 Denso Corp 積層膜の製造方法および製造装置
US20140065739A1 (en) * 2012-09-04 2014-03-06 Jrjyan Jerry Chen Method for hybrid encapsulation of an organic light emitting diode
JP2014520371A (ja) * 2011-06-17 2014-08-21 アプライド マテリアルズ インコーポレイテッド Ｏｌｅｄ封止用のマスク管理システム及び方法
US20140246655A1 (en) * 2013-03-04 2014-09-04 Applied Materials, Inc. Fluorine-containing plasma polymerized hmdso for oled thin film encapsulation
US20140256070A1 (en) * 2013-03-11 2014-09-11 Applied Materials, Inc. Plasma curing of pecvd hmdso film for oled applications
US20160005998A1 (en) * 2014-07-03 2016-01-07 Applied Materials, Inc. Afluorine-containing polymerized hmdso applications for oled thin film encapsulation

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4954434B2 (ja) * 2002-05-17 2012-06-13 株式会社半導体エネルギー研究所 製造装置
JP2005034831A (ja) * 2003-07-01 2005-02-10 Sumitomo Heavy Ind Ltd バリア多層膜及びその製造方法
JP2005044613A (ja) * 2003-07-28 2005-02-17 Seiko Epson Corp 発光装置の製造方法および発光装置
JP2005353398A (ja) * 2004-06-10 2005-12-22 Toshiba Matsushita Display Technology Co Ltd 表示素子、光学デバイス、及び光学デバイスの製造方法
US8405193B2 (en) * 2004-04-02 2013-03-26 General Electric Company Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
JP2005317476A (ja) * 2004-04-30 2005-11-10 Toshiba Matsushita Display Technology Co Ltd 表示装置
US7968146B2 (en) * 2006-11-01 2011-06-28 The Trustees Of Princeton University Hybrid layers for use in coatings on electronic devices or other articles
US8241713B2 (en) * 2007-02-21 2012-08-14 3M Innovative Properties Company Moisture barrier coatings for organic light emitting diode devices
US20100167002A1 (en) * 2008-12-30 2010-07-01 Vitex Systems, Inc. Method for encapsulating environmentally sensitive devices
DE102009019623A1 (de) * 2009-04-30 2010-12-02 Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg Scheibenanordnung
KR20110101771A (ko) * 2010-03-09 2011-09-16 삼성모바일디스플레이주식회사 유기 발광 표시장치
JP2012216452A (ja) * 2011-04-01 2012-11-08 Hitachi High-Technologies Corp 光半導体装置およびその製造方法
JP5928197B2 (ja) * 2012-06-29 2016-06-01 富士通株式会社 ストレージシステム管理プログラム及びストレージシステム管理装置
US9449809B2 (en) * 2012-07-20 2016-09-20 Applied Materials, Inc. Interface adhesion improvement method
KR101473310B1 (ko) * 2012-12-06 2014-12-16 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조방법
WO2016147639A1 (ja) * 2015-03-17 2016-09-22 シャープ株式会社 有機ｅｌ表示装置およびその製造方法
US20170117503A1 (en) * 2015-10-22 2017-04-27 Universal Display Corporation Buffer layer for organic light emitting devices and method of making the same
KR102485707B1 (ko) * 2016-01-29 2023-01-09 삼성디스플레이 주식회사 유기 발광 표시 장치
KR102478472B1 (ko) * 2016-03-02 2022-12-19 삼성디스플레이 주식회사 표시 장치의 제조 방법

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000328229A (ja) * 1999-05-19 2000-11-28 Canon Inc 真空蒸着装置
JP2003332052A (ja) * 2002-05-09 2003-11-21 Sony Corp 有機電界発光表示素子の製造装置および製造方法
JP2004095330A (ja) * 2002-08-30 2004-03-25 Tohoku Pioneer Corp 電子部品を覆う保護膜の形成方法および保護膜を備えた電子機器
JP2004351832A (ja) * 2003-05-30 2004-12-16 Toppan Printing Co Ltd 透明ガスバリア積層フィルム
JP2006339049A (ja) * 2005-06-02 2006-12-14 Tokki Corp 封止膜形成装置
JP2006351307A (ja) * 2005-06-15 2006-12-28 Tohoku Pioneer Corp 自発光パネル及びその製造方法
JP2007273274A (ja) * 2006-03-31 2007-10-18 Canon Inc 有機ｅｌ素子及びその製造方法
JP2010508640A (ja) * 2006-11-01 2010-03-18 ザ、トラスティーズ オブ プリンストン ユニバーシティ 電子デバイス又は他の部品上のコーティングに使用するハイブリッド層
JP2010160906A (ja) * 2009-01-06 2010-07-22 Seiko Epson Corp 有機エレクトロルミネッセンス装置、有機エレクトロルミネッセンス装置の製造方法、および電子機器
US20120199872A1 (en) * 2011-02-08 2012-08-09 Applied Materials, Inc. Method for hybrid encapsulation of an organic light emitting diode
JP2014520371A (ja) * 2011-06-17 2014-08-21 アプライド マテリアルズ インコーポレイテッド Ｏｌｅｄ封止用のマスク管理システム及び方法
JP2014003135A (ja) * 2012-06-18 2014-01-09 Denso Corp 積層膜の製造方法および製造装置
US20140065739A1 (en) * 2012-09-04 2014-03-06 Jrjyan Jerry Chen Method for hybrid encapsulation of an organic light emitting diode
US20140246655A1 (en) * 2013-03-04 2014-09-04 Applied Materials, Inc. Fluorine-containing plasma polymerized hmdso for oled thin film encapsulation
JP2016517134A (ja) * 2013-03-04 2016-06-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Ｏｌｅｄ薄膜カプセル化のためのフッ素含有プラズマ重合ｈｍｄｓｏ
US20140256070A1 (en) * 2013-03-11 2014-09-11 Applied Materials, Inc. Plasma curing of pecvd hmdso film for oled applications
US20160005998A1 (en) * 2014-07-03 2016-01-07 Applied Materials, Inc. Afluorine-containing polymerized hmdso applications for oled thin film encapsulation

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2019220896A1 (ja) * 2018-05-18 2021-07-01 日本ゼオン株式会社 印刷用樹脂溶液及びデバイス構造体の製造方法
US12359078B2 (en) 2019-06-14 2025-07-15 Zeon Corporation Resin solution for printing
JP2023539364A (ja) * 2020-09-02 2023-09-13 エボニック オペレーションズ ゲーエムベーハー リチウムイオン電池アノード用の高性能シリコン系材料
JP7780509B2 (ja) 2020-09-02 2025-12-04 エボニック オペレーションズ ゲーエムベーハー リチウムイオン電池アノード用の高性能シリコン系材料
JP2024515953A (ja) * 2021-04-23 2024-04-11 ジュスン エンジニアリング カンパニー リミテッド 半導体パッケージング装置
JP7842122B2 (ja) 2021-04-23 2026-04-07 ジュスン エンジニアリング カンパニー リミテッド 半導体パッケージング装置

Also Published As

Publication number Publication date
KR102454027B1 (ko) 2022-10-14
US10333104B2 (en) 2019-06-25
WO2018085715A2 (en) 2018-05-11
KR20190098961A (ko) 2019-08-23
JP2021182563A (ja) 2021-11-25
JP7209058B2 (ja) 2023-01-19
WO2018085715A3 (en) 2019-06-13
CN110268504A (zh) 2019-09-20
JP2022145802A (ja) 2022-10-04
US20180130975A1 (en) 2018-05-10

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