KR102454027B1 - 유기 발광 다이오드의 캡슐화를 위한 방법 및 장치 - Google Patents

유기 발광 다이오드의 캡슐화를 위한 방법 및 장치 Download PDF

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KR102454027B1
KR102454027B1 KR1020197015971A KR20197015971A KR102454027B1 KR 102454027 B1 KR102454027 B1 KR 102454027B1 KR 1020197015971 A KR1020197015971 A KR 1020197015971A KR 20197015971 A KR20197015971 A KR 20197015971A KR 102454027 B1 KR102454027 B1 KR 102454027B1
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layer
forming
inorganic
mask
substrate
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KR20190098961A (ko
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캄 에스 라우
크레이그 엘 스티븐스
마사토 도시마
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케이엘에이 코포레이션
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H01L51/5253—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • H01L51/0034—
    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
KR1020197015971A 2016-11-06 2017-11-03 유기 발광 다이오드의 캡슐화를 위한 방법 및 장치 Active KR102454027B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662418175P 2016-11-06 2016-11-06
US62/418,175 2016-11-06
PCT/US2017/060037 WO2018085715A2 (en) 2016-11-06 2017-11-03 Method and apparatus for encapsulation of an organic light emitting diode

Publications (2)

Publication Number Publication Date
KR20190098961A KR20190098961A (ko) 2019-08-23
KR102454027B1 true KR102454027B1 (ko) 2022-10-14

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KR1020197015971A Active KR102454027B1 (ko) 2016-11-06 2017-11-03 유기 발광 다이오드의 캡슐화를 위한 방법 및 장치

Country Status (5)

Country Link
US (1) US10333104B2 (https=)
JP (3) JP2019534538A (https=)
KR (1) KR102454027B1 (https=)
CN (1) CN110268504A (https=)
WO (1) WO2018085715A2 (https=)

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KR20210013034A (ko) * 2018-05-18 2021-02-03 니폰 제온 가부시키가이샤 인쇄용 수지 용액 및 디바이스 구조체의 제조 방법
KR102801661B1 (ko) * 2019-04-09 2025-04-30 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
WO2020251696A1 (en) * 2019-06-10 2020-12-17 Applied Materials, Inc. Processing system for forming layers
WO2020250748A1 (ja) 2019-06-14 2020-12-17 日本ゼオン株式会社 印刷用樹脂溶液
EP3965185A1 (en) * 2020-09-02 2022-03-09 Evonik Operations GmbH High performance silicon-based materials for lithium ion battery anodes
KR102876890B1 (ko) * 2021-04-23 2025-10-28 주성엔지니어링(주) 반도체 패키징 장치

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US20140024180A1 (en) * 2012-07-20 2014-01-23 Applied Materials, Inc. Interface adhesion improvement method
US20160005998A1 (en) * 2014-07-03 2016-01-07 Applied Materials, Inc. Afluorine-containing polymerized hmdso applications for oled thin film encapsulation

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JP4954434B2 (ja) * 2002-05-17 2012-06-13 株式会社半導体エネルギー研究所 製造装置
JP2004095330A (ja) * 2002-08-30 2004-03-25 Tohoku Pioneer Corp 電子部品を覆う保護膜の形成方法および保護膜を備えた電子機器
JP2004351832A (ja) * 2003-05-30 2004-12-16 Toppan Printing Co Ltd 透明ガスバリア積層フィルム
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JP2005353398A (ja) * 2004-06-10 2005-12-22 Toshiba Matsushita Display Technology Co Ltd 表示素子、光学デバイス、及び光学デバイスの製造方法
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JP2005317476A (ja) * 2004-04-30 2005-11-10 Toshiba Matsushita Display Technology Co Ltd 表示装置
JP2006339049A (ja) * 2005-06-02 2006-12-14 Tokki Corp 封止膜形成装置
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US20120027984A1 (en) * 2006-11-01 2012-02-02 Sigurd Wagner Hybrid layers for use in coatings on electronic devices or other articles
US20110267816A1 (en) * 2009-04-30 2011-11-03 Marco Mueller Pane assembly
US20140024180A1 (en) * 2012-07-20 2014-01-23 Applied Materials, Inc. Interface adhesion improvement method
US20160005998A1 (en) * 2014-07-03 2016-01-07 Applied Materials, Inc. Afluorine-containing polymerized hmdso applications for oled thin film encapsulation

Also Published As

Publication number Publication date
US10333104B2 (en) 2019-06-25
WO2018085715A2 (en) 2018-05-11
KR20190098961A (ko) 2019-08-23
JP2021182563A (ja) 2021-11-25
JP7209058B2 (ja) 2023-01-19
WO2018085715A3 (en) 2019-06-13
CN110268504A (zh) 2019-09-20
JP2022145802A (ja) 2022-10-04
US20180130975A1 (en) 2018-05-10
JP2019534538A (ja) 2019-11-28

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