CN110268504A - 用于封装有机发光二极管的方法和设备 - Google Patents
用于封装有机发光二极管的方法和设备 Download PDFInfo
- Publication number
- CN110268504A CN110268504A CN201780068134.9A CN201780068134A CN110268504A CN 110268504 A CN110268504 A CN 110268504A CN 201780068134 A CN201780068134 A CN 201780068134A CN 110268504 A CN110268504 A CN 110268504A
- Authority
- CN
- China
- Prior art keywords
- layer
- mask
- inorganic
- substrate
- buffer layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
- H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662418175P | 2016-11-06 | 2016-11-06 | |
| US62/418,175 | 2016-11-06 | ||
| PCT/US2017/060037 WO2018085715A2 (en) | 2016-11-06 | 2017-11-03 | Method and apparatus for encapsulation of an organic light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110268504A true CN110268504A (zh) | 2019-09-20 |
Family
ID=62064075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780068134.9A Pending CN110268504A (zh) | 2016-11-06 | 2017-11-03 | 用于封装有机发光二极管的方法和设备 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10333104B2 (https=) |
| JP (3) | JP2019534538A (https=) |
| KR (1) | KR102454027B1 (https=) |
| CN (1) | CN110268504A (https=) |
| WO (1) | WO2018085715A2 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210013034A (ko) * | 2018-05-18 | 2021-02-03 | 니폰 제온 가부시키가이샤 | 인쇄용 수지 용액 및 디바이스 구조체의 제조 방법 |
| KR102801661B1 (ko) * | 2019-04-09 | 2025-04-30 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
| WO2020251696A1 (en) * | 2019-06-10 | 2020-12-17 | Applied Materials, Inc. | Processing system for forming layers |
| WO2020250748A1 (ja) | 2019-06-14 | 2020-12-17 | 日本ゼオン株式会社 | 印刷用樹脂溶液 |
| EP3965185A1 (en) * | 2020-09-02 | 2022-03-09 | Evonik Operations GmbH | High performance silicon-based materials for lithium ion battery anodes |
| KR102876890B1 (ko) * | 2021-04-23 | 2025-10-28 | 주성엔지니어링(주) | 반도체 패키징 장치 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1700815A (zh) * | 2004-04-30 | 2005-11-23 | 东芝松下显示技术有限公司 | 显示装置 |
| CN103348502A (zh) * | 2011-02-08 | 2013-10-09 | 应用材料公司 | 有机发光二极管的混合式封装方法 |
| CN103855185A (zh) * | 2012-12-06 | 2014-06-11 | 三星显示有限公司 | 有机发光显示装置及其制造方法 |
| CN105009319A (zh) * | 2013-03-04 | 2015-10-28 | 应用材料公司 | 用于oled薄膜封装的含氟等离子体聚合的hmdso |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000328229A (ja) * | 1999-05-19 | 2000-11-28 | Canon Inc | 真空蒸着装置 |
| JP4096353B2 (ja) * | 2002-05-09 | 2008-06-04 | ソニー株式会社 | 有機電界発光表示素子の製造装置および製造方法 |
| JP4954434B2 (ja) * | 2002-05-17 | 2012-06-13 | 株式会社半導体エネルギー研究所 | 製造装置 |
| JP2004095330A (ja) * | 2002-08-30 | 2004-03-25 | Tohoku Pioneer Corp | 電子部品を覆う保護膜の形成方法および保護膜を備えた電子機器 |
| JP2004351832A (ja) * | 2003-05-30 | 2004-12-16 | Toppan Printing Co Ltd | 透明ガスバリア積層フィルム |
| JP2005034831A (ja) * | 2003-07-01 | 2005-02-10 | Sumitomo Heavy Ind Ltd | バリア多層膜及びその製造方法 |
| JP2005044613A (ja) * | 2003-07-28 | 2005-02-17 | Seiko Epson Corp | 発光装置の製造方法および発光装置 |
| JP2005353398A (ja) * | 2004-06-10 | 2005-12-22 | Toshiba Matsushita Display Technology Co Ltd | 表示素子、光学デバイス、及び光学デバイスの製造方法 |
| US8405193B2 (en) * | 2004-04-02 | 2013-03-26 | General Electric Company | Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages |
| JP2006339049A (ja) * | 2005-06-02 | 2006-12-14 | Tokki Corp | 封止膜形成装置 |
| JP4801382B2 (ja) * | 2005-06-15 | 2011-10-26 | 東北パイオニア株式会社 | 自発光パネル及びその製造方法 |
| JP2007273274A (ja) * | 2006-03-31 | 2007-10-18 | Canon Inc | 有機el素子及びその製造方法 |
| US7968146B2 (en) * | 2006-11-01 | 2011-06-28 | The Trustees Of Princeton University | Hybrid layers for use in coatings on electronic devices or other articles |
| US20080102223A1 (en) * | 2006-11-01 | 2008-05-01 | Sigurd Wagner | Hybrid layers for use in coatings on electronic devices or other articles |
| US8241713B2 (en) * | 2007-02-21 | 2012-08-14 | 3M Innovative Properties Company | Moisture barrier coatings for organic light emitting diode devices |
| US20100167002A1 (en) * | 2008-12-30 | 2010-07-01 | Vitex Systems, Inc. | Method for encapsulating environmentally sensitive devices |
| JP2010160906A (ja) * | 2009-01-06 | 2010-07-22 | Seiko Epson Corp | 有機エレクトロルミネッセンス装置、有機エレクトロルミネッセンス装置の製造方法、および電子機器 |
| DE102009019623A1 (de) * | 2009-04-30 | 2010-12-02 | Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg | Scheibenanordnung |
| KR20110101771A (ko) * | 2010-03-09 | 2011-09-16 | 삼성모바일디스플레이주식회사 | 유기 발광 표시장치 |
| JP2012216452A (ja) * | 2011-04-01 | 2012-11-08 | Hitachi High-Technologies Corp | 光半導体装置およびその製造方法 |
| TWI542727B (zh) * | 2011-06-17 | 2016-07-21 | 應用材料股份有限公司 | 處理腔室 |
| JP5803822B2 (ja) * | 2012-06-18 | 2015-11-04 | 株式会社デンソー | 積層膜の製造方法および製造装置 |
| JP5928197B2 (ja) * | 2012-06-29 | 2016-06-01 | 富士通株式会社 | ストレージシステム管理プログラム及びストレージシステム管理装置 |
| US9449809B2 (en) * | 2012-07-20 | 2016-09-20 | Applied Materials, Inc. | Interface adhesion improvement method |
| US9397318B2 (en) * | 2012-09-04 | 2016-07-19 | Applied Materials, Inc. | Method for hybrid encapsulation of an organic light emitting diode |
| KR101780019B1 (ko) * | 2013-03-11 | 2017-09-19 | 어플라이드 머티어리얼스, 인코포레이티드 | Oled 애플리케이션들을 위한 pecvd hmdso 막의 플라즈마 경화 |
| US9502686B2 (en) * | 2014-07-03 | 2016-11-22 | Applied Materials, Inc. | Fluorine-containing polymerized HMDSO applications for OLED thin film encapsulation |
| WO2016147639A1 (ja) * | 2015-03-17 | 2016-09-22 | シャープ株式会社 | 有機el表示装置およびその製造方法 |
| US20170117503A1 (en) * | 2015-10-22 | 2017-04-27 | Universal Display Corporation | Buffer layer for organic light emitting devices and method of making the same |
| KR102485707B1 (ko) * | 2016-01-29 | 2023-01-09 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| KR102478472B1 (ko) * | 2016-03-02 | 2022-12-19 | 삼성디스플레이 주식회사 | 표시 장치의 제조 방법 |
-
2017
- 2017-11-03 JP JP2019523015A patent/JP2019534538A/ja active Pending
- 2017-11-03 US US15/803,558 patent/US10333104B2/en active Active
- 2017-11-03 CN CN201780068134.9A patent/CN110268504A/zh active Pending
- 2017-11-03 WO PCT/US2017/060037 patent/WO2018085715A2/en not_active Ceased
- 2017-11-03 KR KR1020197015971A patent/KR102454027B1/ko active Active
-
2021
- 2021-08-25 JP JP2021137341A patent/JP7209058B2/ja active Active
-
2022
- 2022-08-08 JP JP2022126204A patent/JP2022145802A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1700815A (zh) * | 2004-04-30 | 2005-11-23 | 东芝松下显示技术有限公司 | 显示装置 |
| CN103348502A (zh) * | 2011-02-08 | 2013-10-09 | 应用材料公司 | 有机发光二极管的混合式封装方法 |
| CN103855185A (zh) * | 2012-12-06 | 2014-06-11 | 三星显示有限公司 | 有机发光显示装置及其制造方法 |
| CN105009319A (zh) * | 2013-03-04 | 2015-10-28 | 应用材料公司 | 用于oled薄膜封装的含氟等离子体聚合的hmdso |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102454027B1 (ko) | 2022-10-14 |
| US10333104B2 (en) | 2019-06-25 |
| WO2018085715A2 (en) | 2018-05-11 |
| KR20190098961A (ko) | 2019-08-23 |
| JP2021182563A (ja) | 2021-11-25 |
| JP7209058B2 (ja) | 2023-01-19 |
| WO2018085715A3 (en) | 2019-06-13 |
| JP2022145802A (ja) | 2022-10-04 |
| US20180130975A1 (en) | 2018-05-10 |
| JP2019534538A (ja) | 2019-11-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20211220 Address after: Israel Masao City Applicant after: ORBOTECH Ltd. Address before: California, USA Applicant before: Orbotech LT Solar, LLC |
|
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190920 |