JP2019524959A5 - - Google Patents
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- JP2019524959A5 JP2019524959A5 JP2019507191A JP2019507191A JP2019524959A5 JP 2019524959 A5 JP2019524959 A5 JP 2019524959A5 JP 2019507191 A JP2019507191 A JP 2019507191A JP 2019507191 A JP2019507191 A JP 2019507191A JP 2019524959 A5 JP2019524959 A5 JP 2019524959A5
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- JP
- Japan
- Prior art keywords
- component
- sio
- group
- composition according
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920001296 polysiloxane Polymers 0.000 claims description 19
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 5
- 125000003342 alkenyl group Chemical group 0.000 claims 8
- 125000003118 aryl group Chemical group 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 4
- 229910004298 SiO 2 Inorganic materials 0.000 claims 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 3
- -1 siloxane unit Chemical group 0.000 claims 3
- 229910004283 SiO 4 Inorganic materials 0.000 claims 2
- 125000004400 (C1-C12) alkyl group Chemical group 0.000 claims 1
- 125000006710 (C2-C12) alkenyl group Chemical group 0.000 claims 1
- 125000006736 (C6-C20) aryl group Chemical group 0.000 claims 1
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000003710 aryl alkyl group Chemical group 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 239000007809 chemical reaction catalyst Substances 0.000 claims 1
- 239000003431 cross linking reagent Substances 0.000 claims 1
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 150000002430 hydrocarbons Chemical group 0.000 claims 1
- 238000006459 hydrosilylation reaction Methods 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 238000001542 size-exclusion chromatography Methods 0.000 claims 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2016/069244 WO2018028792A1 (en) | 2016-08-12 | 2016-08-12 | Curable organopolysiloxane composition, encapsulant and semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019524959A JP2019524959A (ja) | 2019-09-05 |
| JP2019524959A5 true JP2019524959A5 (enExample) | 2020-08-13 |
Family
ID=56682127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019507191A Pending JP2019524959A (ja) | 2016-08-12 | 2016-08-12 | 硬化性有機ポリシロキサン組成物、封止剤、および半導体デバイス |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11028266B2 (enExample) |
| EP (1) | EP3497160B1 (enExample) |
| JP (1) | JP2019524959A (enExample) |
| KR (1) | KR102165826B1 (enExample) |
| CN (1) | CN109563312B (enExample) |
| TW (1) | TWI654257B (enExample) |
| WO (1) | WO2018028792A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020043312A1 (en) * | 2018-08-31 | 2020-03-05 | Wacker Chemie Ag | Thermosetting silicone resin composition for reflector of led, reflector of led and semiconductor device using the same |
| WO2020043313A1 (en) * | 2018-08-31 | 2020-03-05 | Wacker Chemie Ag | Curable organopolysiloxane composition, encapsulant and semiconductor device |
| US12215226B2 (en) | 2018-10-30 | 2025-02-04 | Dow Toray Co., Ltd. | Curable reactive silicone composition, cured product thereof and uses of composition and cured product |
| JP7513365B2 (ja) | 2018-12-27 | 2024-07-09 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、その硬化物、およびその製造方法 |
| WO2020138409A1 (ja) | 2018-12-27 | 2020-07-02 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、その硬化物、およびその製造方法 |
| US12172357B2 (en) | 2018-12-27 | 2024-12-24 | Dow Toray Co., Ltd. | Method for producing curable silicone sheet having hot melt properties |
| WO2020203304A1 (ja) * | 2019-03-29 | 2020-10-08 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、その硬化物、およびその製造方法 |
| EP3950844A4 (en) | 2019-03-29 | 2022-12-21 | Dow Toray Co., Ltd. | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF AND METHOD OF MAKING THEREOF |
| WO2020203305A1 (ja) | 2019-03-29 | 2020-10-08 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、その硬化物、およびその製造方法 |
| JP2021107550A (ja) | 2019-12-27 | 2021-07-29 | ダウ・東レ株式会社 | 硬化性ホットメルトシリコーン組成物、その硬化物、及び前記組成物又は硬化物を含む積層体 |
| US20240166877A1 (en) | 2021-03-08 | 2024-05-23 | Dupont Toray Specialty Materials Kabushiki Kaisha | Curable silicone composition, encapsulant, and optical semiconductor device |
| JP2025520574A (ja) * | 2022-06-29 | 2025-07-03 | ダウ・東レ株式会社 | Ｕｖ硬化性オルガノポリシロキサン組成物及びその用途 |
| KR20240013993A (ko) * | 2022-07-22 | 2024-01-31 | 삼성디스플레이 주식회사 | 표시 장치 |
| WO2025039213A1 (en) | 2023-08-23 | 2025-02-27 | Dupont Toray Specialty Materials Kabushiki Kaisha | Process for manufacturing silicone encapsulants |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10062181A1 (de) * | 2000-12-14 | 2002-07-04 | Wacker Chemie Gmbh | Härtbare Organopolysiloxanmassen |
| JP4409160B2 (ja) | 2002-10-28 | 2010-02-03 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| JP4908736B2 (ja) | 2003-10-01 | 2012-04-04 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| CN101389695B (zh) | 2006-02-24 | 2012-07-04 | 陶氏康宁公司 | 用硅氧烷包封的发光器件和用于制备该硅氧烷的可固化的硅氧烷组合物 |
| DE102006016753A1 (de) * | 2006-04-10 | 2007-10-11 | Wacker Chemie Ag | Vernetzbare Massen auf der Basis von Organosiliciumverbindungen |
| DE102006031107A1 (de) * | 2006-07-05 | 2008-01-10 | Wacker Chemie Ag | Härtbare Organopolysiloxanmassen |
| JP5972512B2 (ja) * | 2008-06-18 | 2016-08-17 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物及び半導体装置 |
| TWI435914B (zh) * | 2010-12-31 | 2014-05-01 | Eternal Chemical Co Ltd | 可固化之有機聚矽氧烷組合物及其製法 |
| JP5505436B2 (ja) | 2011-04-21 | 2014-05-28 | Ｊｓｒ株式会社 | 硬化性組成物、硬化物、光半導体装置およびポリシロキサン |
| JP5846208B2 (ja) * | 2011-09-01 | 2016-01-20 | 東亞合成株式会社 | 耐熱衝撃性硬化物及びその製造方法 |
| JP5893874B2 (ja) | 2011-09-02 | 2016-03-23 | 信越化学工業株式会社 | 光半導体装置 |
| JP5912600B2 (ja) | 2011-09-16 | 2016-04-27 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| JP5545601B2 (ja) * | 2011-11-07 | 2014-07-09 | 信越化学工業株式会社 | 蛍光体高充填波長変換シート、それを用いた発光半導体装置の製造方法、及び該発光半導体装置 |
| JP2013159670A (ja) * | 2012-02-02 | 2013-08-19 | Dow Corning Toray Co Ltd | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| JP2013159671A (ja) | 2012-02-02 | 2013-08-19 | Dow Corning Toray Co Ltd | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| KR101545111B1 (ko) | 2012-05-25 | 2015-08-17 | 주식회사 다이셀 | 경화성 수지 조성물 및 그의 경화물, 밀봉제, 및 광반도체 장치 |
| US9346954B2 (en) | 2012-09-14 | 2016-05-24 | The Yokohama Rubber Co., Ltd. | Curable resin composition |
| KR20160049539A (ko) * | 2013-08-30 | 2016-05-09 | 다우 코닝 도레이 캄파니 리미티드 | 1액형 경화성 실리콘 조성물 및 광반도체 장치 |
| TWI653295B (zh) | 2014-02-04 | 2019-03-11 | 日商道康寧東麗股份有限公司 | 硬化性聚矽氧組合物、其硬化物及光半導體裝置 |
-
2016
- 2016-08-12 CN CN201680088199.5A patent/CN109563312B/zh active Active
- 2016-08-12 KR KR1020197003795A patent/KR102165826B1/ko active Active
- 2016-08-12 WO PCT/EP2016/069244 patent/WO2018028792A1/en not_active Ceased
- 2016-08-12 JP JP2019507191A patent/JP2019524959A/ja active Pending
- 2016-08-12 EP EP16750454.7A patent/EP3497160B1/en active Active
- 2016-08-12 US US16/322,415 patent/US11028266B2/en active Active
-
2017
- 2017-07-24 TW TW106124790A patent/TWI654257B/zh active
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