JP2019524959A5 - - Google Patents
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- JP2019524959A5 JP2019524959A5 JP2019507191A JP2019507191A JP2019524959A5 JP 2019524959 A5 JP2019524959 A5 JP 2019524959A5 JP 2019507191 A JP2019507191 A JP 2019507191A JP 2019507191 A JP2019507191 A JP 2019507191A JP 2019524959 A5 JP2019524959 A5 JP 2019524959A5
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- JP
- Japan
- Prior art keywords
- component
- sio
- group
- composition according
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920001296 polysiloxane Polymers 0.000 claims description 19
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 5
- 125000003342 alkenyl group Chemical group 0.000 claims 8
- 125000003118 aryl group Chemical group 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 4
- 229910004298 SiO 2 Inorganic materials 0.000 claims 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 3
- -1 siloxane unit Chemical group 0.000 claims 3
- 229910004283 SiO 4 Inorganic materials 0.000 claims 2
- 125000004400 (C1-C12) alkyl group Chemical group 0.000 claims 1
- 125000006710 (C2-C12) alkenyl group Chemical group 0.000 claims 1
- 125000006736 (C6-C20) aryl group Chemical group 0.000 claims 1
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000003710 aryl alkyl group Chemical group 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 239000007809 chemical reaction catalyst Substances 0.000 claims 1
- 239000003431 cross linking reagent Substances 0.000 claims 1
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 150000002430 hydrocarbons Chemical group 0.000 claims 1
- 238000006459 hydrosilylation reaction Methods 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 238000001542 size-exclusion chromatography Methods 0.000 claims 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2016/069244 WO2018028792A1 (en) | 2016-08-12 | 2016-08-12 | Curable organopolysiloxane composition, encapsulant and semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019524959A JP2019524959A (ja) | 2019-09-05 |
| JP2019524959A5 true JP2019524959A5 (enExample) | 2020-08-13 |
Family
ID=56682127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019507191A Pending JP2019524959A (ja) | 2016-08-12 | 2016-08-12 | 硬化性有機ポリシロキサン組成物、封止剤、および半導体デバイス |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11028266B2 (enExample) |
| EP (1) | EP3497160B1 (enExample) |
| JP (1) | JP2019524959A (enExample) |
| KR (1) | KR102165826B1 (enExample) |
| CN (1) | CN109563312B (enExample) |
| TW (1) | TWI654257B (enExample) |
| WO (1) | WO2018028792A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020043313A1 (en) * | 2018-08-31 | 2020-03-05 | Wacker Chemie Ag | Curable organopolysiloxane composition, encapsulant and semiconductor device |
| WO2020043312A1 (en) * | 2018-08-31 | 2020-03-05 | Wacker Chemie Ag | Thermosetting silicone resin composition for reflector of led, reflector of led and semiconductor device using the same |
| KR102873949B1 (ko) | 2018-10-30 | 2025-10-22 | 다우 도레이 캄파니 리미티드 | 경화 반응성 실리콘 조성물 및 그 경화물 및 이들의 용도 |
| US12173202B2 (en) | 2018-12-27 | 2024-12-24 | Dow Toray Co., Ltd. | Curable silicone composition, cured product thereof, and method for producing same |
| US12172357B2 (en) | 2018-12-27 | 2024-12-24 | Dow Toray Co., Ltd. | Method for producing curable silicone sheet having hot melt properties |
| CN113330071B (zh) | 2018-12-27 | 2023-01-03 | 陶氏东丽株式会社 | 固化性有机硅组合物、其固化物及其制造方法 |
| US12384941B2 (en) | 2019-03-29 | 2025-08-12 | Dow Toray Co., Ltd. | Curable silicone composition, cured product of same, and method for manufacturing same |
| JP7560442B2 (ja) | 2019-03-29 | 2024-10-02 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、その硬化物、およびその製造方法 |
| EP3950844A4 (en) | 2019-03-29 | 2022-12-21 | Dow Toray Co., Ltd. | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF AND METHOD OF MAKING THEREOF |
| EP4083140A4 (en) | 2019-12-27 | 2024-01-10 | Dow Toray Co., Ltd. | Curable hot-melt silicone composition, cured material thereof, and laminate containing curable hot-melt silicone composition or cured material thereof |
| CN116940637A (zh) | 2021-03-08 | 2023-10-24 | 杜邦东丽特殊材料株式会社 | 可固化硅酮组合物、封装剂以及光学半导体装置 |
| CN119317683A (zh) * | 2022-06-29 | 2025-01-14 | 陶氏东丽株式会社 | 可uv固化的有机聚硅氧烷组合物及其应用 |
| KR20240013993A (ko) * | 2022-07-22 | 2024-01-31 | 삼성디스플레이 주식회사 | 표시 장치 |
| WO2025039213A1 (en) | 2023-08-23 | 2025-02-27 | Dupont Toray Specialty Materials Kabushiki Kaisha | Process for manufacturing silicone encapsulants |
| JP2025182422A (ja) | 2024-06-03 | 2025-12-15 | デュポン・東レ・スペシャルティ・マテリアル株式会社 | 硬化性シリコーン組成物、封止材、及び光半導体装置 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10062181A1 (de) * | 2000-12-14 | 2002-07-04 | Wacker Chemie Gmbh | Härtbare Organopolysiloxanmassen |
| JP4409160B2 (ja) | 2002-10-28 | 2010-02-03 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| JP4908736B2 (ja) | 2003-10-01 | 2012-04-04 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| US8258502B2 (en) | 2006-02-24 | 2012-09-04 | Dow Corning Corporation | Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones |
| DE102006016753A1 (de) * | 2006-04-10 | 2007-10-11 | Wacker Chemie Ag | Vernetzbare Massen auf der Basis von Organosiliciumverbindungen |
| DE102006031107A1 (de) * | 2006-07-05 | 2008-01-10 | Wacker Chemie Ag | Härtbare Organopolysiloxanmassen |
| JP5972512B2 (ja) * | 2008-06-18 | 2016-08-17 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物及び半導体装置 |
| TWI435914B (zh) * | 2010-12-31 | 2014-05-01 | Eternal Chemical Co Ltd | 可固化之有機聚矽氧烷組合物及其製法 |
| JP5505436B2 (ja) | 2011-04-21 | 2014-05-28 | Ｊｓｒ株式会社 | 硬化性組成物、硬化物、光半導体装置およびポリシロキサン |
| WO2013031798A1 (ja) * | 2011-09-01 | 2013-03-07 | 東亞合成株式会社 | 耐熱衝撃性硬化物及びその製造方法 |
| JP5893874B2 (ja) | 2011-09-02 | 2016-03-23 | 信越化学工業株式会社 | 光半導体装置 |
| JP5912600B2 (ja) * | 2011-09-16 | 2016-04-27 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| JP5545601B2 (ja) * | 2011-11-07 | 2014-07-09 | 信越化学工業株式会社 | 蛍光体高充填波長変換シート、それを用いた発光半導体装置の製造方法、及び該発光半導体装置 |
| JP2013159670A (ja) | 2012-02-02 | 2013-08-19 | Dow Corning Toray Co Ltd | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| JP2013159671A (ja) | 2012-02-02 | 2013-08-19 | Dow Corning Toray Co Ltd | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| KR101545111B1 (ko) | 2012-05-25 | 2015-08-17 | 주식회사 다이셀 | 경화성 수지 조성물 및 그의 경화물, 밀봉제, 및 광반도체 장치 |
| EP2896658A4 (en) * | 2012-09-14 | 2015-09-02 | Yokohama Rubber Co Ltd | HARDENABLE RESIN COMPOSITION |
| WO2015030259A1 (en) * | 2013-08-30 | 2015-03-05 | Dow Corning Toray Co., Ltd | One-part curable silicone composition and optical semiconductor device |
| TWI653295B (zh) | 2014-02-04 | 2019-03-11 | 日商道康寧東麗股份有限公司 | 硬化性聚矽氧組合物、其硬化物及光半導體裝置 |
-
2016
- 2016-08-12 JP JP2019507191A patent/JP2019524959A/ja active Pending
- 2016-08-12 US US16/322,415 patent/US11028266B2/en active Active
- 2016-08-12 EP EP16750454.7A patent/EP3497160B1/en active Active
- 2016-08-12 CN CN201680088199.5A patent/CN109563312B/zh active Active
- 2016-08-12 WO PCT/EP2016/069244 patent/WO2018028792A1/en not_active Ceased
- 2016-08-12 KR KR1020197003795A patent/KR102165826B1/ko active Active
-
2017
- 2017-07-24 TW TW106124790A patent/TWI654257B/zh active
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