JP2012246482A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2012246482A5 JP2012246482A5 JP2012117445A JP2012117445A JP2012246482A5 JP 2012246482 A5 JP2012246482 A5 JP 2012246482A5 JP 2012117445 A JP2012117445 A JP 2012117445A JP 2012117445 A JP2012117445 A JP 2012117445A JP 2012246482 A5 JP2012246482 A5 JP 2012246482A5
- Authority
- JP
- Japan
- Prior art keywords
- polysiloxane
- formula
- weight
- group
- cyclic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- -1 polysiloxane Polymers 0.000 claims description 53
- 229920001296 polysiloxane Polymers 0.000 claims description 53
- 125000004122 cyclic group Chemical group 0.000 claims description 12
- 239000011342 resin composition Substances 0.000 claims description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- 239000012463 white pigment Substances 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 125000004429 atom Chemical group 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 4
- 239000011256 inorganic filler Substances 0.000 claims description 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims 4
- 230000005494 condensation Effects 0.000 claims 3
- 238000009833 condensation Methods 0.000 claims 3
- 125000005843 halogen group Chemical group 0.000 claims 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 3
- 125000000229 (C1-C4)alkoxy group Chemical group 0.000 claims 2
- 125000002947 alkylene group Chemical group 0.000 claims 2
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 claims 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 1
- 230000005693 optoelectronics Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100118318A TW201247782A (en) | 2011-05-25 | 2011-05-25 | White thermocurable siloxane resin composition |
| TW100118318 | 2011-05-25 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012246482A JP2012246482A (ja) | 2012-12-13 |
| JP2012246482A5 true JP2012246482A5 (enExample) | 2015-01-22 |
| JP5765581B2 JP5765581B2 (ja) | 2015-08-19 |
Family
ID=47195699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012117445A Expired - Fee Related JP5765581B2 (ja) | 2011-05-25 | 2012-05-23 | ポリシロキサン樹脂組成物 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8637603B2 (enExample) |
| JP (1) | JP5765581B2 (enExample) |
| CN (1) | CN102796380B (enExample) |
| TW (1) | TW201247782A (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5728960B2 (ja) * | 2011-01-17 | 2015-06-03 | 信越化学工業株式会社 | 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース |
| JP5728961B2 (ja) * | 2011-01-17 | 2015-06-03 | 信越化学工業株式会社 | 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース |
| JP6337336B2 (ja) * | 2013-03-26 | 2018-06-06 | Jnc株式会社 | アルコキシシリル基含有シルセスキオキサンおよびその組成物 |
| KR102631719B1 (ko) * | 2017-09-26 | 2024-01-31 | 주식회사 엘지에너지솔루션 | 리튬 망간계 산화물을 포함하는 고전압용 양극 활물질 및 이의 제조방법 |
| CN111909517B (zh) * | 2019-05-10 | 2022-03-01 | 中国科学院化学研究所 | 一种可环线交联的有机硅组合物及反应产物及制备方法和应用 |
| US20220274383A1 (en) * | 2019-07-31 | 2022-09-01 | Dow Global Technologies Llc | Multilayer films and articles comprising multilayer films |
| CN119842314B (zh) * | 2024-12-12 | 2025-09-16 | 广州信粤新材料科技有限公司 | 一种双组份高憎水prtv涂料及其制备方法 |
| CN119899586B (zh) * | 2024-12-12 | 2025-09-16 | 广州信粤新材料科技有限公司 | 一种耐老化有机硅绝缘防水涂料及其制备方法和应用 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8222363B2 (en) * | 2007-09-26 | 2012-07-17 | Dow Corning Corporation | Silicone organic elastomer gels from organopolysiloxane resins |
| JP4623322B2 (ja) * | 2007-12-26 | 2011-02-02 | 信越化学工業株式会社 | 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物並びに光半導体ケース及びその成形方法 |
| JP5218298B2 (ja) * | 2008-07-02 | 2013-06-26 | 信越化学工業株式会社 | 熱硬化性シリコーン樹脂−エポキシ樹脂組成物及び当該樹脂で成形したプレモールドパッケージ |
| JP2010106243A (ja) * | 2008-09-30 | 2010-05-13 | Shin-Etsu Chemical Co Ltd | 光半導体装置用シリコーン樹脂組成物 |
| JP5526823B2 (ja) * | 2009-02-24 | 2014-06-18 | 信越化学工業株式会社 | シリコーン樹脂で封止された光半導体装置 |
| JP2011032392A (ja) | 2009-08-03 | 2011-02-17 | Shin-Etsu Chemical Co Ltd | 光半導体装置用シリコーン樹脂組成物 |
| JP5545246B2 (ja) * | 2010-03-30 | 2014-07-09 | 信越化学工業株式会社 | 樹脂組成物及び発光半導体素子用リフレクター、及び発光半導体装置 |
-
2011
- 2011-05-25 TW TW100118318A patent/TW201247782A/zh not_active IP Right Cessation
-
2012
- 2012-05-22 US US13/477,515 patent/US8637603B2/en not_active Expired - Fee Related
- 2012-05-23 JP JP2012117445A patent/JP5765581B2/ja not_active Expired - Fee Related
- 2012-05-24 CN CN201210164324.XA patent/CN102796380B/zh not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2012246482A5 (enExample) | ||
| ES2619847T3 (es) | Uso de una composición de poliorganosiloxano curable como encapsulante para un módulo de célula solar | |
| EP2845880B1 (en) | Addition curable liquid silicone rubber composition and silicone rubber cured article | |
| JPWO2014017579A1 (ja) | シリコーンゴム系硬化性組成物 | |
| JP2009024114A5 (enExample) | ||
| JP2019524959A5 (enExample) | ||
| JP2012012434A5 (enExample) | ||
| JP2014088513A5 (enExample) | ||
| CN104212185B (zh) | 一种稳定不渗油型电子元器件用透明硅凝胶 | |
| DE602004005670D1 (de) | Wärmeleitfähige siliconzusammensetzung | |
| ATE541896T1 (de) | Silikonharzzusammensetzung für optische halbleiterbauelemente und optisches halbleiterbauelement | |
| JP2013067683A5 (enExample) | ||
| JPWO2005030874A1 (ja) | 熱伝導性シリコーン組成物 | |
| US7875695B2 (en) | Hydrophilic organopolysiloxane composition for use as dental impression material | |
| JP2016153184A5 (enExample) | ||
| JP2020533459A5 (enExample) | ||
| RU2013158135A (ru) | Силиконовая композиция для герметизации полупроводникового прибора | |
| JP6022501B2 (ja) | 超音波プローブ用組成物および超音波プローブ用シリコーン樹脂 | |
| JP2007191504A (ja) | 硬化性シリコーンゴム組成物及びその硬化物 | |
| JP2013227473A (ja) | シリコーンゴム系硬化性組成物 | |
| JP2013227474A (ja) | シリコーンゴム系硬化性組成物 | |
| JP4834032B2 (ja) | 硬化性組成物 | |
| JP2004331738A (ja) | 硬化性組成物 | |
| JP2000169714A (ja) | 硬化性シリコーン組成物 | |
| EP2966115B1 (en) | Temperature-resistant silicone resins |