JP2019524615A5 - - Google Patents

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JP2019524615A5
JP2019524615A5 JP2018567717A JP2018567717A JP2019524615A5 JP 2019524615 A5 JP2019524615 A5 JP 2019524615A5 JP 2018567717 A JP2018567717 A JP 2018567717A JP 2018567717 A JP2018567717 A JP 2018567717A JP 2019524615 A5 JP2019524615 A5 JP 2019524615A5
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layer
bonding layer
ceramic substrate
depositing
bonding
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JP2018567717A
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JP6719600B2 (ja
JP2019524615A (ja
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Priority claimed from PCT/US2017/037213 external-priority patent/WO2017222873A1/en
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JP2018567717A 2016-06-24 2017-06-13 多結晶セラミック基板およびその製造方法 Active JP6719600B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662354623P 2016-06-24 2016-06-24
US62/354,623 2016-06-24
PCT/US2017/037213 WO2017222873A1 (en) 2016-06-24 2017-06-13 Polycrystalline ceramic substrate and method of manufacture

Related Child Applications (1)

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JP2020103432A Division JP7169321B2 (ja) 2016-06-24 2020-06-16 多結晶セラミック基板

Publications (3)

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JP2019524615A JP2019524615A (ja) 2019-09-05
JP2019524615A5 true JP2019524615A5 (https=) 2019-11-28
JP6719600B2 JP6719600B2 (ja) 2020-07-08

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JP2018567717A Active JP6719600B2 (ja) 2016-06-24 2017-06-13 多結晶セラミック基板およびその製造方法
JP2020103432A Active JP7169321B2 (ja) 2016-06-24 2020-06-16 多結晶セラミック基板
JP2022173496A Active JP7611208B2 (ja) 2016-06-24 2022-10-28 電力およびｒｆ用途用の設計された基板構造
JP2024134987A Active JP7802126B2 (ja) 2016-06-24 2024-08-13 電力およびｒｆ用途用の設計された基板構造

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JP2020103432A Active JP7169321B2 (ja) 2016-06-24 2020-06-16 多結晶セラミック基板
JP2022173496A Active JP7611208B2 (ja) 2016-06-24 2022-10-28 電力およびｒｆ用途用の設計された基板構造
JP2024134987A Active JP7802126B2 (ja) 2016-06-24 2024-08-13 電力およびｒｆ用途用の設計された基板構造

Country Status (8)

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US (6) US10134589B2 (https=)
EP (2) EP3475975B1 (https=)
JP (4) JP6719600B2 (https=)
KR (4) KR102391997B1 (https=)
CN (2) CN109716508B (https=)
SG (1) SG11201811295TA (https=)
TW (5) TWI823763B (https=)
WO (1) WO2017222873A1 (https=)

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