JP2019512566A - 金属−ポリオルガノシロキサン - Google Patents
金属−ポリオルガノシロキサン Download PDFInfo
- Publication number
- JP2019512566A JP2019512566A JP2018545927A JP2018545927A JP2019512566A JP 2019512566 A JP2019512566 A JP 2019512566A JP 2018545927 A JP2018545927 A JP 2018545927A JP 2018545927 A JP2018545927 A JP 2018545927A JP 2019512566 A JP2019512566 A JP 2019512566A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- polyorganosiloxane
- component
- curable
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 215
- 238000000034 method Methods 0.000 claims abstract description 56
- 239000000203 mixture Substances 0.000 claims description 481
- 239000002245 particle Substances 0.000 claims description 169
- 239000002131 composite material Substances 0.000 claims description 137
- 239000002923 metal particle Substances 0.000 claims description 119
- 229910052751 metal Inorganic materials 0.000 claims description 86
- 239000002184 metal Substances 0.000 claims description 85
- 239000000919 ceramic Substances 0.000 claims description 58
- 238000001723 curing Methods 0.000 claims description 58
- 239000003054 catalyst Substances 0.000 claims description 57
- 125000000743 hydrocarbylene group Chemical group 0.000 claims description 54
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 49
- 229910000077 silane Inorganic materials 0.000 claims description 41
- 125000004191 (C1-C6) alkoxy group Chemical group 0.000 claims description 38
- 150000003254 radicals Chemical class 0.000 claims description 38
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 36
- 238000006243 chemical reaction Methods 0.000 claims description 35
- 150000001875 compounds Chemical class 0.000 claims description 34
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 32
- 229910052782 aluminium Inorganic materials 0.000 claims description 31
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 31
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 claims description 30
- 125000000962 organic group Chemical group 0.000 claims description 27
- 238000010438 heat treatment Methods 0.000 claims description 26
- 229930195733 hydrocarbon Natural products 0.000 claims description 24
- 150000002430 hydrocarbons Chemical class 0.000 claims description 24
- 239000007787 solid Substances 0.000 claims description 23
- 238000002156 mixing Methods 0.000 claims description 22
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 21
- 239000003999 initiator Substances 0.000 claims description 20
- 239000004971 Cross linker Substances 0.000 claims description 19
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 19
- 229910052799 carbon Inorganic materials 0.000 claims description 18
- 239000003085 diluting agent Substances 0.000 claims description 18
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 17
- 229910052709 silver Inorganic materials 0.000 claims description 17
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 16
- 229910045601 alloy Inorganic materials 0.000 claims description 16
- 239000000956 alloy Substances 0.000 claims description 16
- 229910052697 platinum Inorganic materials 0.000 claims description 16
- 239000004215 Carbon black (E152) Substances 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 15
- 125000001931 aliphatic group Chemical group 0.000 claims description 15
- 239000011258 core-shell material Substances 0.000 claims description 15
- 239000004332 silver Substances 0.000 claims description 15
- 239000011135 tin Substances 0.000 claims description 15
- 229910052719 titanium Inorganic materials 0.000 claims description 15
- 239000010936 titanium Substances 0.000 claims description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 14
- 239000002318 adhesion promoter Substances 0.000 claims description 14
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 14
- 229910052718 tin Inorganic materials 0.000 claims description 14
- 229910052725 zinc Inorganic materials 0.000 claims description 14
- 239000011701 zinc Substances 0.000 claims description 14
- 239000004970 Chain extender Substances 0.000 claims description 13
- 229910052737 gold Inorganic materials 0.000 claims description 13
- 239000010931 gold Substances 0.000 claims description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 12
- 125000004432 carbon atom Chemical group C* 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 238000004132 cross linking Methods 0.000 claims description 12
- 239000003112 inhibitor Substances 0.000 claims description 12
- 125000005375 organosiloxane group Chemical group 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 11
- 239000000945 filler Substances 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 11
- 229910052742 iron Inorganic materials 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- 239000002253 acid Substances 0.000 claims description 10
- 239000000470 constituent Substances 0.000 claims description 10
- 238000005859 coupling reaction Methods 0.000 claims description 10
- 229910052736 halogen Inorganic materials 0.000 claims description 10
- 229910052739 hydrogen Inorganic materials 0.000 claims description 10
- 239000001257 hydrogen Substances 0.000 claims description 10
- 229910052763 palladium Inorganic materials 0.000 claims description 10
- 239000006254 rheological additive Substances 0.000 claims description 10
- 239000013008 thixotropic agent Substances 0.000 claims description 10
- 229910017052 cobalt Inorganic materials 0.000 claims description 9
- 239000010941 cobalt Substances 0.000 claims description 9
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 9
- 239000003086 colorant Substances 0.000 claims description 9
- 238000005260 corrosion Methods 0.000 claims description 9
- 230000007797 corrosion Effects 0.000 claims description 9
- 230000008878 coupling Effects 0.000 claims description 9
- 238000010168 coupling process Methods 0.000 claims description 9
- 239000004519 grease Substances 0.000 claims description 9
- 229910052738 indium Inorganic materials 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 9
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 8
- 229910008326 Si-Y Inorganic materials 0.000 claims description 8
- 229910006773 Si—Y Inorganic materials 0.000 claims description 8
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 8
- 150000002739 metals Chemical class 0.000 claims description 8
- 238000010998 test method Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 239000011787 zinc oxide Substances 0.000 claims description 8
- 125000000882 C2-C6 alkenyl group Chemical group 0.000 claims description 7
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 7
- 229910052797 bismuth Inorganic materials 0.000 claims description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 239000002470 thermal conductor Substances 0.000 claims description 7
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 claims description 6
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 claims description 6
- 239000000370 acceptor Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 6
- 239000003963 antioxidant agent Substances 0.000 claims description 6
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 6
- 238000009833 condensation Methods 0.000 claims description 6
- 230000005494 condensation Effects 0.000 claims description 6
- 239000002270 dispersing agent Substances 0.000 claims description 6
- 125000005843 halogen group Chemical group 0.000 claims description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims description 6
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims description 6
- 238000013006 addition curing Methods 0.000 claims description 5
- 229910052790 beryllium Inorganic materials 0.000 claims description 5
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 5
- 238000011282 treatment Methods 0.000 claims description 5
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 claims description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 238000006482 condensation reaction Methods 0.000 claims description 4
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 claims description 4
- 238000003878 thermal aging Methods 0.000 claims description 4
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 claims description 4
- 125000000041 C6-C10 aryl group Chemical group 0.000 claims description 3
- IGWIYXUTBNGZFJ-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd].[Pd].[Pd] IGWIYXUTBNGZFJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000007342 radical addition reaction Methods 0.000 claims description 3
- 125000003601 C2-C6 alkynyl group Chemical group 0.000 claims description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 claims description 2
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 239000001273 butane Substances 0.000 claims description 2
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical compound CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 claims description 2
- 238000009792 diffusion process Methods 0.000 claims description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims description 2
- 229940058172 ethylbenzene Drugs 0.000 claims description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 2
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 claims description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 2
- ZCYXXKJEDCHMGH-UHFFFAOYSA-N nonane Chemical compound CCCC[CH]CCCC ZCYXXKJEDCHMGH-UHFFFAOYSA-N 0.000 claims description 2
- BKIMMITUMNQMOS-UHFFFAOYSA-N normal nonane Natural products CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 claims description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 claims description 2
- 230000008520 organization Effects 0.000 claims description 2
- 239000001294 propane Substances 0.000 claims description 2
- 230000001052 transient effect Effects 0.000 claims description 2
- 230000020169 heat generation Effects 0.000 claims 1
- -1 silane compound Chemical class 0.000 description 67
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 27
- 229920000642 polymer Polymers 0.000 description 22
- 238000009472 formulation Methods 0.000 description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 17
- 230000006870 function Effects 0.000 description 17
- 125000001183 hydrocarbyl group Chemical group 0.000 description 15
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- 125000006526 (C1-C2) alkyl group Chemical group 0.000 description 7
- 238000005481 NMR spectroscopy Methods 0.000 description 7
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- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
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- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 3
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- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
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- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
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- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
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- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- YZCKVEUIGOORGS-NJFSPNSNSA-N Tritium Chemical compound [3H] YZCKVEUIGOORGS-NJFSPNSNSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- FRGQJYJPLLUXBJ-UHFFFAOYSA-N aluminum;bismuth Chemical compound [Al+3].[Bi+3] FRGQJYJPLLUXBJ-UHFFFAOYSA-N 0.000 description 2
- 125000000732 arylene group Chemical group 0.000 description 2
- 238000004630 atomic force microscopy Methods 0.000 description 2
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- 229910052794 bromium Inorganic materials 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
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- FTWUXYZHDFCGSV-UHFFFAOYSA-N n,n'-diphenyloxamide Chemical compound C=1C=CC=CC=1NC(=O)C(=O)NC1=CC=CC=C1 FTWUXYZHDFCGSV-UHFFFAOYSA-N 0.000 description 1
- LFNLGNPSGWYGGD-UHFFFAOYSA-N neptunium atom Chemical compound [Np] LFNLGNPSGWYGGD-UHFFFAOYSA-N 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 239000012454 non-polar solvent Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical class CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000000744 organoheteryl group Chemical group 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 150000001282 organosilanes Chemical class 0.000 description 1
- 125000001190 organyl group Chemical group 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000075 oxide glass Substances 0.000 description 1
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- XYJRXVWERLGGKC-UHFFFAOYSA-D pentacalcium;hydroxide;triphosphate Chemical compound [OH-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O XYJRXVWERLGGKC-UHFFFAOYSA-D 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 230000002186 photoactivation Effects 0.000 description 1
- 239000004038 photonic crystal Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 230000000485 pigmenting effect Effects 0.000 description 1
- OYEHPCDNVJXUIW-UHFFFAOYSA-N plutonium atom Chemical compound [Pu] OYEHPCDNVJXUIW-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005594 polymer fiber Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000009885 systemic effect Effects 0.000 description 1
- 229920006250 telechelic polymer Polymers 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 238000009757 thermoplastic moulding Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 239000012974 tin catalyst Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 238000004627 transmission electron microscopy Methods 0.000 description 1
- 125000004665 trialkylsilyl group Chemical group 0.000 description 1
- FOQJQXVUMYLJSU-UHFFFAOYSA-N triethoxy(1-triethoxysilylethyl)silane Chemical compound CCO[Si](OCC)(OCC)C(C)[Si](OCC)(OCC)OCC FOQJQXVUMYLJSU-UHFFFAOYSA-N 0.000 description 1
- IZRJPHXTEXTLHY-UHFFFAOYSA-N triethoxy(2-triethoxysilylethyl)silane Chemical compound CCO[Si](OCC)(OCC)CC[Si](OCC)(OCC)OCC IZRJPHXTEXTLHY-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- GNBPMOQUHWCSGK-UHFFFAOYSA-N trimethoxy(1-trimethoxysilyldecan-2-yl)silane Chemical compound CCCCCCCCC([Si](OC)(OC)OC)C[Si](OC)(OC)OC GNBPMOQUHWCSGK-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- ASEGJSMHCHEQSA-UHFFFAOYSA-N trimethoxy(undec-10-enyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCCCCC=C ASEGJSMHCHEQSA-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- WCAGGTLUGWSHOV-UHFFFAOYSA-N tris(tert-butylperoxy)-ethenylsilane Chemical compound CC(C)(C)OO[Si](OOC(C)(C)C)(OOC(C)(C)C)C=C WCAGGTLUGWSHOV-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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Abstract
Description
Claims (24)
- 縮合硬化性ポリオルガノシロキサンと金属粒子及びセラミック粒子以外の固体粒子とを含有しない金属−ポリオルガノシロキサン混合物であって、その他に構成要素(A)〜(C)、すなわち
(A)ケイ素結合したオルガノヘテリル基を含有しないポリオルガノシロキサンと、
(B)ヒドロカルビレン系多足性シランと、
(C)金属粒子と、を含む、金属−ポリオルガノシロキサン混合物。 - 前記構成要素(A)が、硬化性基を含有しない非硬化性ポリオルガノシロキサンであるか、または
前記構成要素(A)が、分子あたり平均少なくとも1つの不飽和脂肪族有機基を含有する付加硬化性ポリオルガノシロキサンであるか、または
前記構成要素(A)が、ラジカル硬化性ポリオルガノシロキサンもしくはヒドロシリル化硬化性ポリオルガノシロキサンである付加硬化性ポリオルガノシロキサンであるか、または
前記構成要素(A)が、熱ラジカル硬化性ポリオルガノシロキサンであるラジカル硬化性ポリオルガノシロキサンであるか、または
前記構成要素(A)が、ヒドロシリル化硬化性ポリオルガノシロキサンであるか、または
前記構成要素(A)が、式(I)、
[R1 3SiO1/2]m[R2 2SiO2/2]d[R3SiO3/2]t[SiO4/2]q[Z]z(I)
の少なくとも1つのポリオルガノシロキサンであり、
式中、下付き文字mは、0.0025〜0.05のモル分率であり、下付き文字dは、>0.90〜0.9975のモル分率であり、下付き文字tは、0.00〜0.05のモル分率であり、下付き文字qは、0.00〜0.05のモル分率であり、下付き文字zは、0.00〜0.05であり、m+d+t+q+zの合計=1であり、各R1は独立して、水素、(C1−C6)アルキル、(C2−C6)アルケニル、もしくは(C2−C6)アルキニルであり、各R2は独立して、水素、(C1−C6)アルキル、(C2−C6)アルケニル、もしくは(C6−C10)アリールであり、各R3は、存在する場合、独立して、水素、(C1−C6)アルキル、(C2−C6)アルケニル、もしくは(C6−C10)アリールであり、かつ各Zは、存在する場合、独立して、炭化水素ジイルであり、各ラジカルは、前記炭化水素ジイルの同じもしくは異なる炭素原子上にあり、かつ式(I)の前記ポリオルガノシロキサンの異なるケイ素原子へ結合している、請求項1に記載の金属−ポリオルガノシロキサン混合物。 - 構成要素(B)である前記ヒドロカルビレン系多足性シランが、式(II):X3Si−Y1−SiX3(II)のヒドロカルビレン系二足性シラン、または式(III)X3Si−Y2(SiX3)−SiX3(III)のヒドロカルビレン系三足性シランであり、式中、Y1は、(C2−C30)炭化水素ジイルであり、Y2は、(C2−C30)炭化水素トリイルであり、各Xは独立して、ハロゲン、(C1−C6)アルコキシ、(C2−C6)カルボキシ、及び(C2−C6)オキシモから選択される一価の脱離基であり、式(II)における各ケイ素原子は、Y1における同じまたは異なる炭素原子へ結合し、かつ式(III)におけるケイ素原子は独立して、Y2における同じまたは異なる炭素原子へ結合している、請求項1または2に記載の金属−ポリオルガノシロキサン混合物。
- 構成要素(B)である前記ヒドロカルビレン系多足性シランが、(i)〜(xviii)、すなわち
(i)式(II):X3Si−Y1−SiX3(II)の前記ヒドロカルビレン系二足性シラン、
(ii)式(III)X3Si−Y2(SiX3)−SiX3(III)の前記ヒドロカルビレン系三足性シラン、
(iii)1’,2’−ビス(トリ((C1−C6)アルコキシ)シリル)エチル−ベンゼン、
(iv)ビス(トリ((C1−C6)アルコキシ)シリル)(C1−C12)アルカン、
(v)ビス(トリ((C1−C6)アルコキシ)シリル)(C2−C12)アルカン、
(vi)1,2−ビス(トリ((C1−C6)アルコキシ)シリル)(C2−C12)アルカン、
(vii)1,2−ビス(トリ((C1−C6)アルコキシ)シリル)エタン、
(viii)1,2−ビス(トリ((C1−C6)アルコキシ)シリル)プロパン、
(ix)1,2−ビス(トリ((C1−C6)アルコキシ)シリル)ブタン、
(x)1,2−ビス(トリ((C1−C6)アルコキシ)シリル)ペンタン、
(xi)1,2−ビス(トリ((C1−C6)アルコキシ)シリル)ヘキサン、
(xii)1,2−ビス(トリ((C1−C6)アルコキシ)シリル)ヘプタン、
(xiii)1,2−ビス(トリ((C1−C6)アルコキシ)シリル)オクタン、
(xiv)1,2−ビス(トリ((C1−C6)アルコキシ)シリル)ノナン、
(xv)1,2−ビス(トリ((C1−C6)アルコキシ)シリル)デカン、
(xvi)1,2−ビス(トリ((C1−C6)アルコキシ)シリル)ウンデカン、
(xvii)1,2−ビス(トリ((C1−C6)アルコキシ)シリル)ドデカン、
(xviii)(vi)〜(xvii)のいずれか1つの1,3置換位置異性体、及び
(xix)各(C1−C6)アルコキシが独立して、メトキシまたはエトキシである、(i)〜(xviii)のうちのいずれか1つ
のうちのいずれか1つである、請求項1〜3のいずれか1項に記載の金属−ポリオルガノシロキサン混合物。 - 前記構成要素(C)である前記金属粒子が、アルミニウムであって、前記アルミニウムの粒子が1マイクロメートルよりも大きな平均粒径を有するアルミニウム;ベリリウム;ビスマス;コバルト;銅;金;インジウム;鉄;ニッケル;パラジウム;白金;銀;スズ;チタン;亜鉛;アルミニウム、ベリリウム、ビスマス、コバルト、銅、金、インジウム、鉄、ニッケル、パラジウム、白金、銀、スズ、チタン、及び亜鉛のうちのいずれか2つからなる合金、を含むか、もしくはこれらから本質的になるか、または前記構成要素(C)である前記金属粒子が、コア−シェル金属粒子を含むかもしくはこれから本質的になり、前記シェルが、アルミニウム、ベリリウム、ビスマス、コバルト、銅、金、インジウム、鉄、ニッケル、パラジウム、白金、銀、スズ、チタン、もしくは亜鉛を含むかもしくはこれらから本質的になり、かつ前記コアが、支持材料を含むかもしくはこれから本質的になる、請求項1〜4のいずれか1項に記載の金属−ポリオルガノシロキサン混合物。
- 構成要素(D)セラミック粒子をさらに含む、請求項1〜5のいずれか1項に記載の金属−ポリオルガノシロキサン混合物。
- 前記(D)セラミック粒子が、0.05マイクロメートル〜1マイクロメートルの平均粒径を有し、かつ/または前記セラミック粒子が、酸化亜鉛、アルミナ、もしくは酸化亜鉛及びアルミナの組み合わせを含むかもしくはこれらから本質的になる、請求項6に記載の金属−ポリオルガノシロキサン混合物。
- 任意の構成要素(E)〜(R)、すなわち(E)構成要素(A)の2個以上の分子間で架橋基を形成するために構成要素(A)と反応する架橋剤、(F)構成要素(E)の分子と構成要素(A)の2個以上の分子との間の架橋反応を触媒するために反応する硬化触媒、(G)構成要素(F)によって触媒される硬化を阻害するために摂氏23度(℃)で有効である触媒阻害剤、(H)接着促進剤、(I)レオロジー改質剤、(J)酸化防止剤、(K)チキソトロープ剤、(L)着色剤、(M)構成要素(B)と構成要素(C)との間の縮合反応を開始するのに有効であるカップリング開始剤、(N)溶剤、希釈剤、及び分散剤から選択されるビヒクル、(O)反応性希釈剤、(P)酸受容体、(Q)腐食抑制剤、(R)分子あたり平均少なくとも1つの不飽和脂肪族有機基を含有する付加硬化性ポリオルガノシロキサンである構成要素(A)の2つ以上の分子間のラジカル付加反応を開始するのに有効であるラジカル硬化開始剤、
(S)鎖延長剤、
(T)処理剤、ならびに
(U)反応性化合物
のうちの少なくとも1つをさらに含む、請求項1〜7のいずれか1項に記載の金属−ポリオルガノシロキサン混合物。 - 前記金属ポリオルガノシロキサン混合物が、その構成要素(A)〜構成要素(C)と何らかの任意の構成要素との量を特徴とし、前記構成要素(C)金属粒子の量が、前記金属−ポリオルガノシロキサン混合物の40〜95重量パーセントであり、構成要素(B)である前記ヒドロカルビレン系多足性シランの量が、前記金属−ポリオルガノシロキサン混合物の0.01〜2重量パーセントであり、かつ構成要素(A)の量と何らかの任意の構成要素(複数可)の量(複数可)との合計が、前記金属−ポリオルガノシロキサン混合物の3〜58重量パーセントであり、これらはすべて前記金属−ポリオルガノシロキサン混合物の合計100重量パーセントに基づいているか、または
前記金属−ポリオルガノシロキサン混合物が、構成要素(D)セラミック粒子をさらに含み、前記金属−ポリオルガノシロキサン混合物が、その構成要素(A)〜構成要素(D)と何らかの任意の構成要素との量を特徴とし、前記(C)の金属粒子の量が、前記金属−ポリオルガノシロキサン混合物の15〜90重量パーセントであり、前記(D)セラミック粒子の量が、前記金属−ポリオルガノシロキサン混合物の5〜25重量パーセントであり、(B)である前記ヒドロカルビレン系多足性シランの量が、前記金属−ポリオルガノシロキサン混合物の0.01〜2重量パーセントであり、構成要素(A)の量と構成要素(A)〜構成要素(D)以外の任意の構成要素(複数可)の量(複数可)との合計が、前記金属−ポリオルガノシロキサン混合物の3〜58重量パーセントであり、これらはすべて前記金属−ポリオルガノシロキサン混合物の合計100重量パーセントに基づいている、請求項1〜8のいずれか1項に記載の金属−ポリオルガノシロキサン混合物。 - 縮合硬化性ポリオルガノシロキサンと金属粒子及びセラミック粒子以外の固体粒子とを含有しない金属−ポリオルガノシロキサン混合物を製造する方法であって、前記金属−ポリオルガノシロキサン混合物が、その他に構成要素(A)〜構成要素(C)、すなわち(A)ケイ素結合したオルガノヘテリル基を含有しないポリオルガノシロキサンと、(B)ヒドロカルビレン系多足性シランと、(C)金属粒子とを含み、前記方法が、構成要素(A)、構成要素(B)、及び構成要素(C)を一緒に混合して、前記金属−ポリオルガノシロキサン混合物を製造することを含む、方法。
- 縮合硬化性ポリオルガノシロキサンと金属粒子及びセラミック粒子以外の固体粒子とを含有しない金属−ポリオルガノシロキサン組成物であって、その他に構成要素(A)及び構成要素(B’−C’)、すなわち(A)ケイ素結合したオルガノヘテリル基を含有しないポリオルガノシロキサンと、(B’−C’)ヒドロカルビレン系多足性シラノキシで官能化された金属粒子とを含む、金属−ポリオルガノシロキサン組成物。
- 前記構成要素(A)が、非硬化性ポリオルガノシロキサンであり、かつ前記金属−ポリオルガノシロキサン組成物が、非硬化性金属−ポリオルガノシロキサン組成物であり、
前記構成要素(A)が、付加硬化性ポリオルガノシロキサンであり、かつ前記金属−ポリオルガノシロキサン組成物が、付加硬化性金属−ポリオルガノシロキサン組成物であり、かつ/または
前記構成要素(B’−C’)が、前記構成要素(A)の中で分散している、請求項11に記載の金属−ポリオルガノシロキサン組成物。 - 縮合硬化性ポリオルガノシロキサンと金属粒子及びセラミック粒子以外の固体粒子とを含有しない金属−ポリオルガノシロキサン組成物を製造する方法であって、前記金属−オルガノシロキサン組成物が、その他に構成要素(A)及び構成要素(B’−C’)、すなわち(A)ケイ素結合したオルガノヘテリル基を含有しないポリオルガノシロキサンと、(B’−C’)ヒドロカルビレン系多足性シラノキシで官能化された金属粒子とを含み、前記方法が、前記構成要素(B)と前記構成要素(C)との間で縮合反応を生じさせて、前記金属−ポリオルガノシロキサン組成物を得ることができるように、処理条件下で請求項1〜9のいずれか1項に記載の金属−ポリオルガノシロキサン混合物であって、前記多足性シランは加水分解性基を有する、金属−ポリオルガノシロキサン混合物を、ケイ素結合したオルガノヘテリル基を含有しない前記ポリオルガノシロキサンの存在下でかつ前記ポリオルガノシロキサンを硬化させることなく、制御された量の水と接触させることを含み、前記制御された量の水が、前記多足性シランの加水分解性基の量に対する化学量論量よりも少ない、方法。
- 縮合架橋したポリオルガノシロキサンと金属粒子及びセラミック粒子以外の固体粒子とを含有しない硬化複合体であって、その他に付加硬化性ポリオルガノシロキサン中に分散したヒドロカルビレン系多足性シラノキシ官能性金属粒子を含む、硬化複合体。
- 縮合架橋したポリオルガノシロキサンと金属粒子及びセラミック粒子以外の固体粒子とを含有しない参照の硬化複合体と比較して、摂氏150度(℃)の温度での熱老化に対する高い安定性を特徴とし、前記参照の硬化複合体が、その他に、同じ付加硬化したポリオルガノシロキサン中に分散した非官能化金属粒子を含む、請求項14に記載の硬化複合体。
- 縮合架橋したポリオルガノシロキサンと金属粒子及びセラミック粒子以外の固体粒子とを含有しない硬化複合体を製造する方法であって、構成要素(A)との間の架橋を可能にして前記硬化複合体を得るために、硬化条件下で、請求項12に記載の金属−ポリオルガノシロキサン組成物を、構成要素(E)前記付加硬化性ポリオルガノシロキサンと反応する架橋剤、及び構成要素(E)硬化触媒と接触させることを含む、方法。
- 熱老化した材料を製造する方法であって、請求項12に記載の非硬化性金属−ポリオルガノシロキサン組成物または請求項14もしくは15に記載の硬化複合体を、100℃〜350℃の温度で少なくとも1日間加熱して、熱老化した材料を得ることを含み、前記熱老化した材料が、熱老化した非硬化性組成物または熱老化した複合体をそれぞれ含む、方法。
- 請求項17に記載の方法によって調製される、熱老化した材料。
- コンポーネント(1)、すなわち請求項1〜9のいずれか1項に記載の金属−ポリオルガノシロキサン混合物、請求項11もしくは12に記載の金属−ポリオルガノシロキサン組成物、または請求項14もしくは15に記載の硬化複合体、または請求項18に記載の熱老化した材料、を含む熱伝導体コンポーネントを備える、製造された物品。
- 前記金属−ポリオルガノシロキサン混合物、前記金属−ポリオルガノシロキサン組成物、硬化複合体、及び/または熱老化した材料が、摂氏22度(℃)の温度で測定された検査法ISO22007−2:2015(プラスチック−熱伝導率及び熱拡散係数の求め方−第2部:過渡的平面熱源(ホットディスク)法;国際標準化機構(Geneva,Switzerland)により公開)により測定された、>0.6W/m・Kの熱伝導率を特徴とする、請求項19に記載の製造された物品。
- 熱管理を必要とする電子デバイスであって、コンポーネント(1)〜コンポーネント(3)、すなわち、(1)請求項1〜9のいずれか1項に記載の金属−ポリオルガノシロキサン混合物、請求項11もしくは12に記載の金属−ポリオルガノシロキサン組成物、または請求項14もしくは15に記載の硬化複合体、または請求項18に記載の熱老化した材料を含む、熱伝導体コンポーネントと、(2)発熱性電子コンポーネントと、(3)放熱性コンポーネントとを含み、(1)前記熱伝導体コンポーネントが、(2)前記発熱性コンポーネントによって生じる熱の少なくとも一部が(2)前記発熱性コンポーネントから(1)前記熱伝導体コンポーネントを通じて(3)前記放熱性コンポーネントへと伝導されるような方法で、前記コンポーネント(2)と前記コンポーネント(3)との間に配備され、かつこれら2つと熱的に連通している、電子デバイス。
- (1)前記熱伝導体コンポーネントが、前記硬化複合体を含み、かつ/または(1)前記熱伝導体コンポーネントが、前記熱老化した材料を含み、かつ/または(3)前記放熱性コンポーネントが、吸熱源もしくはヒートスプレッダである、請求項21に記載の電子デバイス。
- 熱管理を必要とするデバイスにおける、請求項1〜9のいずれか1項に記載の金属−ポリオルガノシロキサン混合物、請求項11もしくは12に記載の金属−ポリオルガノシロキサン組成物、または請求項14もしくは15に記載の硬化複合体、または請求項18に記載の熱老化した材料を含む、(1)熱伝導体コンポーネントの使用。
- (1)前記熱伝導体コンポーネントが、前記デバイスにおいて、熱接着剤、熱ゲル、熱グリース、熱インターフェイス材料、または熱間隙充填剤として使用される、請求項21に記載の電子デバイスまたは請求項23に記載の使用。
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KR20180127391A (ko) | 2018-11-28 |
EP3433311B1 (en) | 2020-04-22 |
US20190100650A1 (en) | 2019-04-04 |
CN108779293A (zh) | 2018-11-09 |
JP7479120B2 (ja) | 2024-05-08 |
KR102384435B1 (ko) | 2022-04-12 |
TW201802185A (zh) | 2018-01-16 |
TWI738743B (zh) | 2021-09-11 |
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