JP2019124989A - 加工装置の管理方法および加工装置 - Google Patents
加工装置の管理方法および加工装置 Download PDFInfo
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- JP2019124989A JP2019124989A JP2018003121A JP2018003121A JP2019124989A JP 2019124989 A JP2019124989 A JP 2019124989A JP 2018003121 A JP2018003121 A JP 2018003121A JP 2018003121 A JP2018003121 A JP 2018003121A JP 2019124989 A JP2019124989 A JP 2019124989A
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000007726 management method Methods 0.000 claims abstract description 8
- 238000003745 diagnosis Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 20
- 238000007689 inspection Methods 0.000 description 13
- 238000003384 imaging method Methods 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 210000000707 wrist Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/4093—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by part programming, e.g. entry of geometrical information as taken from a technical drawing, combining this with machining and material information to obtain control information, named part programme, for the NC machine
- G05B19/40937—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by part programming, e.g. entry of geometrical information as taken from a technical drawing, combining this with machining and material information to obtain control information, named part programme, for the NC machine concerning programming of machining or material parameters, pocket machining
- G05B19/40938—Tool management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Human Computer Interaction (AREA)
- Automation & Control Theory (AREA)
- Dicing (AREA)
- General Factory Administration (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Multi-Process Working Machines And Systems (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
22:モニタ(表示手段)
46:キーボード(入力手段)
52:ランダムアクセスメモリ(記憶手段)
Claims (7)
- 加工装置の管理方法であって、
チェック項目が記載されたチェックシートを表示手段に表示する表示工程と、
チェック項目に従ってチェックシートに情報を記入する入力工程と、
チェックシートに記入した年月日と共に情報を記憶手段に記憶させる記憶工程と、
から少なくとも構成される加工装置の管理方法。 - チェック項目には、加工装置を構成する構成要素の精度の良否、修理の要否、交換の要否、に加え記入者を特定する情報が含まれる請求項1記載の加工装置の管理方法。
- 該表示工程において、適宜の年月日にチェックシートは該表示手段に表示され、チェックシートの記入をもって加工装置による加工が可能になる請求項1記載の加工装置の管理方法。
- 該記憶手段に記憶された過去の情報を分析して加工装置を診断する診断工程が含まれる請求項1記載の加工装置の管理方法。
- 加工装置であって、
チェック項目が記載されたチェックシートを表示する表示手段と、
チェック項目に従ってチェックシートに情報を記入するための入力手段と、
チェックシートに記入した年月日と共に情報を記憶する記憶手段と、
を少なくとも備えた加工装置。 - チェック項目には、加工装置を構成する構成要素の精度の良否、修理の要否、交換の要否、に加え記入者を特定する情報が含まれる請求項5記載の加工装置。
- 適宜の年月日にチェックシートは該表示手段に表示され、チェックシートの記入をもって加工が可能になる請求項5記載の加工装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018003121A JP7064887B2 (ja) | 2018-01-12 | 2018-01-12 | 加工装置の管理方法および加工装置 |
CN201910011007.6A CN110026884B (zh) | 2018-01-12 | 2019-01-07 | 加工装置的管理方法和加工装置 |
IL264175A IL264175B2 (en) | 2018-01-12 | 2019-01-09 | A method for managing a processing facility and a processing facility |
KR1020190003151A KR102592786B1 (ko) | 2018-01-12 | 2019-01-10 | 가공 장치의 관리 방법 및 가공 장치 |
TW108101142A TWI805677B (zh) | 2018-01-12 | 2019-01-11 | 加工裝置之管理方法及加工裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018003121A JP7064887B2 (ja) | 2018-01-12 | 2018-01-12 | 加工装置の管理方法および加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019124989A true JP2019124989A (ja) | 2019-07-25 |
JP7064887B2 JP7064887B2 (ja) | 2022-05-11 |
Family
ID=66768910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018003121A Active JP7064887B2 (ja) | 2018-01-12 | 2018-01-12 | 加工装置の管理方法および加工装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7064887B2 (ja) |
KR (1) | KR102592786B1 (ja) |
CN (1) | CN110026884B (ja) |
IL (1) | IL264175B2 (ja) |
TW (1) | TWI805677B (ja) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002063240A (ja) * | 2000-06-06 | 2002-02-28 | Mori Seiki Co Ltd | 生産管理システム |
JP2008100247A (ja) * | 2006-10-18 | 2008-05-01 | Sintokogio Ltd | 鋳造品の生産や自動車内装品の生産における設備装置の安全起動方法および該方法を用いる設備装置 |
JP2009248120A (ja) * | 2008-04-04 | 2009-10-29 | Kataoka Seisakusho:Kk | レーザ光の出力計測方法、出力計測装置 |
CN102375447A (zh) * | 2010-08-13 | 2012-03-14 | 株式会社迪思科 | 远程操作系统 |
WO2015182256A1 (ja) * | 2014-05-30 | 2015-12-03 | 株式会社日立ハイテクノロジーズ | 自動分析装置 |
US20160091393A1 (en) * | 2014-09-26 | 2016-03-31 | Palo Alto Research Center Incorporated | Computer-Implemented Method And System For Machine Tool Damage Assessment, Prediction, And Planning In Manufacturing Shop Floor |
JP2017068630A (ja) * | 2015-09-30 | 2017-04-06 | 株式会社牧野フライス製作所 | 工作機械の制御装置 |
JP2017216333A (ja) * | 2016-05-31 | 2017-12-07 | 株式会社ディスコ | 加工装置及び加工方法 |
Family Cites Families (9)
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JP3076179B2 (ja) | 1993-07-26 | 2000-08-14 | 株式会社ディスコ | ダイシング装置 |
US20050216228A1 (en) * | 2004-03-15 | 2005-09-29 | Tokyo Electron Limited | Method and system for correcting a fault in a semiconductor manufacturing system |
JP4777783B2 (ja) | 2006-01-26 | 2011-09-21 | 株式会社ディスコ | レーザー加工装置 |
JP5134216B2 (ja) * | 2006-06-23 | 2013-01-30 | 株式会社ディスコ | ウエーハの加工結果管理方法 |
JP2014154633A (ja) * | 2013-02-06 | 2014-08-25 | Disco Abrasive Syst Ltd | 加工装置 |
WO2015141006A1 (ja) * | 2014-03-20 | 2015-09-24 | 株式会社Pfu | 情報処理装置、表示方法及び制御プログラム |
WO2016157402A1 (ja) * | 2015-03-31 | 2016-10-06 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法及び記録媒体 |
JP6607639B2 (ja) * | 2015-12-24 | 2019-11-20 | 株式会社ディスコ | ウェーハの加工方法 |
JP6468237B2 (ja) * | 2016-04-25 | 2019-02-13 | 横河電機株式会社 | 機器保全装置、機器保全方法、機器保全プログラム及び記録媒体 |
-
2018
- 2018-01-12 JP JP2018003121A patent/JP7064887B2/ja active Active
-
2019
- 2019-01-07 CN CN201910011007.6A patent/CN110026884B/zh active Active
- 2019-01-09 IL IL264175A patent/IL264175B2/en unknown
- 2019-01-10 KR KR1020190003151A patent/KR102592786B1/ko active IP Right Grant
- 2019-01-11 TW TW108101142A patent/TWI805677B/zh active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002063240A (ja) * | 2000-06-06 | 2002-02-28 | Mori Seiki Co Ltd | 生産管理システム |
JP2008100247A (ja) * | 2006-10-18 | 2008-05-01 | Sintokogio Ltd | 鋳造品の生産や自動車内装品の生産における設備装置の安全起動方法および該方法を用いる設備装置 |
JP2009248120A (ja) * | 2008-04-04 | 2009-10-29 | Kataoka Seisakusho:Kk | レーザ光の出力計測方法、出力計測装置 |
CN102375447A (zh) * | 2010-08-13 | 2012-03-14 | 株式会社迪思科 | 远程操作系统 |
WO2015182256A1 (ja) * | 2014-05-30 | 2015-12-03 | 株式会社日立ハイテクノロジーズ | 自動分析装置 |
US20160091393A1 (en) * | 2014-09-26 | 2016-03-31 | Palo Alto Research Center Incorporated | Computer-Implemented Method And System For Machine Tool Damage Assessment, Prediction, And Planning In Manufacturing Shop Floor |
JP2017068630A (ja) * | 2015-09-30 | 2017-04-06 | 株式会社牧野フライス製作所 | 工作機械の制御装置 |
JP2017216333A (ja) * | 2016-05-31 | 2017-12-07 | 株式会社ディスコ | 加工装置及び加工方法 |
Also Published As
Publication number | Publication date |
---|---|
KR102592786B1 (ko) | 2023-10-20 |
TW201931279A (zh) | 2019-08-01 |
TWI805677B (zh) | 2023-06-21 |
KR20190086388A (ko) | 2019-07-22 |
IL264175B2 (en) | 2024-01-01 |
CN110026884A (zh) | 2019-07-19 |
CN110026884B (zh) | 2022-06-24 |
JP7064887B2 (ja) | 2022-05-11 |
IL264175B1 (en) | 2023-09-01 |
IL264175A (en) | 2019-05-30 |
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