IL264175B2 - Processing apparatus managing method and processing apparatus - Google Patents

Processing apparatus managing method and processing apparatus

Info

Publication number
IL264175B2
IL264175B2 IL264175A IL26417519A IL264175B2 IL 264175 B2 IL264175 B2 IL 264175B2 IL 264175 A IL264175 A IL 264175A IL 26417519 A IL26417519 A IL 26417519A IL 264175 B2 IL264175 B2 IL 264175B2
Authority
IL
Israel
Prior art keywords
processing apparatus
axis direction
chuck table
check
precision
Prior art date
Application number
IL264175A
Other languages
Hebrew (he)
Other versions
IL264175B1 (en
IL264175A (en
Inventor
Tanaka Kazunari
Original Assignee
Disco Corp
Tanaka Kazunari
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp, Tanaka Kazunari filed Critical Disco Corp
Publication of IL264175A publication Critical patent/IL264175A/en
Publication of IL264175B1 publication Critical patent/IL264175B1/en
Publication of IL264175B2 publication Critical patent/IL264175B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/4093—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by part programming, e.g. entry of geometrical information as taken from a technical drawing, combining this with machining and material information to obtain control information, named part programme, for the NC machine
    • G05B19/40937—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by part programming, e.g. entry of geometrical information as taken from a technical drawing, combining this with machining and material information to obtain control information, named part programme, for the NC machine concerning programming of machining or material parameters, pocket machining
    • G05B19/40938—Tool management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30—Computing systems specially adapted for manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Human Computer Interaction (AREA)
  • Automation & Control Theory (AREA)
  • Dicing (AREA)
  • General Factory Administration (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Multi-Process Working Machines And Systems (AREA)
  • Machine Tool Sensing Apparatuses (AREA)

Description

JP 7064887 B2 2022.5. (19) Japan Patent Office (JP) (12) Patent publication (B2) (11) Patent number Patent No. 7064887 (P7064887) (45) Publication date May 11, Reiwa 4 (2022.5.11) (24) Registration date April 27, Reiwa 4 (2022.4.17) (51) International Patent Classification G06Q 50/04 (2012.01) H01L 21/301 (2006.01) FI G06Q 50/04 H01L 21/78 A Number of claims: 6 (Number of pages: 8) (21) Application number Patent Application No. 2018-003121 (P2018-003121) (22) JP 7064887 B2 2022.5.
Filing date January 12, Heisei 30 (2018.1.12) (65) Publication number Patent Laid-Open No. 2019-124989 (P2019-124989A) (43) Publication date July 25, Reiwa 1 (2019.7.25) Date of examination request November 12, Reiwa 2 (2020.11.12) (73) Patent holder 0001340 Disco Corporation 13-11, Omori-Kita 2-cho-me, Ota-ku, Tokyo (74) Agent 1000751 Patent attorney Naozumi Ono (74) Agent 1001132 Patent attorney Sachiko Okunuki JP 7064887 B2 2022.5. (74) Agent 1002024 Patent attorney Goji Kazuno (74) Agent 1002026 Patent attorney Yoshifumi Kaneko (72) Inventor Kazunari Tanaka C/O DISCO CORPORATION 13-11, Omori-Kita 2-cho-me, Ota-ku, Tokyo Continued on the last page JP 7064887 B2 2022.5. (54) [TITLE OF THE INVENTION] PROCESSING APPARATUS MANAGING METHOD AND PROCESSING APPARATUS (57) [CLAIMS] [CLAIM 1] A method of managing a processing apparatus which includes a chuck table for holding a workpiece and an X- axis direction moving means for moving the chuck table in the X-axis direction, comprising: a display step of displaying a check sheet on which a plurality of check items are entered on a display unit; an input step of entering information on the check sheet according to the check items; a storing step of storing the information in a storage unit together with a date of the entering on the check sheet; and a diagnosing step of diagnosing a secular change in a precision of a constituent element of the processing apparatus stored in the storage unit, wherein the precision of the constituent element of the processing apparatus diagnosed in the diagnosing step includes a precision of pitching of the chuck table in a Z-axis direction at a time of movement of the chuck table JP 7064887 B2 2022.5. in the X-axis direction.
[CLAIM 2] The method of managing a processing apparatus according to claim 1, wherein the check items include information identifying an entry person in addition to whether precision of a constituent element constituting the processing apparatus is high or not, whether or not repair is necessary, and whether or not replacement is necessary.
[CLAIM 3] The method of managing a processing apparatus according to claim 1, wherein in the display step, the check sheet is displayed on the display unit on an appropriate date, and processing by the processing apparatus is enabled by filling out the check sheet.
[CLAIM 4] A processing apparatus comprising: a chuck table for holding a workpiece; an X-axis direction moving means for moving the chuck table in the X-axis direction; a display unit configured to display a check sheet on which check items are entered; input means entering information on the check sheet according to the check items; and JP 7064887 B2 2022.5. a storage unit configured to store the information together with a date of the entering on the check sheet, wherein the display unit displays a secular change in a precision of a constituent element of the processing apparatus stored in the storage unit and the precision of the constituent element of the processing apparatus displayed on the display unit includes a precision of pitching of the chuck table in a Z-axis direction at a time of movement of the chuck table in the X-axis direction.
[CLAIM 5] The processing apparatus according to claim 4, wherein the check items include information identifying an entry person in addition to whether precision of a constituent element constituting the processing apparatus is high or not, whether or not repair is necessary, and whether or not replacement is necessary.
[CLAIM 6] The processing apparatus according to claim 4, wherein the check sheet is displayed on the display unit on an appropriate date, and processing is enabled by filling out the check sheet.
[DETAILED DESCRIPTION OF THE INVENTION] [FIELD OF THE INVENTION] JP 7064887 B2 2022.5. id="p-1" id="p-1" id="p-1"
[0001] The present invention relates to a processing apparatus managing method and a processing apparatus that achieve an improvement in productivity.
[DESCRIPTION OF THE RELATED ART] id="p-2" id="p-2" id="p-2"
[0002] A wafer having a plurality of devices such as integrated circuits (ICs), large scale integrations (LSIs), or the like formed on a top surface thereof so as to be demarcated by a plurality of intersecting planned dividing lines is divided into individual device chips by a processing apparatus such as a dicing apparatus, a laser processing apparatus, or the like. Each of the divided device chips is used in an electric apparatus such as a mobile telephone, a personal computer, or the like. id="p-3" id="p-3" id="p-3"
[0003] A dicing apparatus is constituted mainly of: a chuck table that sucks and holds a wafer; an imaging unit that detects planned dividing lines of the wafer held on the chuck table; X-axis direction moving means moving the chuck table in an X-axis direction; a cutting unit that has a spindle having, as an axis thereof, a Y-axis direction orthogonal to the X-axis direction and has a cutting blade at an end of the spindle; Y-axis direction JP 7064887 B2 2022.5. moving means for moving the cutting unit in the Y-axis direction; cleaning means for cleaning an already cut wafer; a cassette mounting base mounted with a cassette that houses wafers before cutting and already cut wafers; and carrying-in/out means for taking out a wafer from the cassette and conveying the wafer to a temporary placement table, and housing an already cutting wafer positioned on the temporary placement table into the cassette. The dicing apparatus can automatically divide wafers into individual device chips (see Patent Document 1, for example). id="p-4" id="p-4" id="p-4"
[0004] In addition, a laser processing apparatus is configured in a substantially similar manner to the dicing apparatus.
The laser processing apparatus is constituted mainly of: a chuck table that sucks and holds a wafer; an imaging unit that detects planned dividing lines of the wafer held on the chuck table; X-axis direction moving means for moving the chuck table in an X-axis direction; a laser beam irradiating unit that irradiates the wafer held on the chuck table with a laser beam; Y-axis direction moving means for moving the chuck table and the laser beam irradiating unit relative to each other in a Y-axis direction; a cassette mounting base mounted with a cassette that houses wafers before laser processing and JP 7064887 B2 2022.5. already laser-processed wafers; and carrying-in/out means for taking out a wafer from the cassette and conveying the wafer to a temporary placement table, and housing an already laser-processed wafer positioned on the temporary placement table into the cassette. The laser processing apparatus can automatically divide wafers into individual devices (see Patent Document 2, for example). id="p-5" id="p-5" id="p-5"
[0005] The processing apparatus such as the dicing apparatus, the laser processing apparatus, or the like needs maintenance such as repair, replacement, or the like because constituent elements (parts) constituting the processing apparatus, the constituent elements being the chuck table, the X-axis direction moving means, the Y- axis direction moving means, and the like, are degraded with the passage of time. A worker periodically enters a test result on a check sheet on which a plurality of check items are entered, and chooses timing of the repair, replacement, or the like of the constituent elements.
[PRIOR ART DOCUMENT] [PATENT DOCUMENT] id="p-6" id="p-6" id="p-6"
[0006] [Patent Document 1] Japanese Patent Laid-Open No. Hei 7- 455 [Patent Document 2] Japanese Patent Laid-Open No. 2007- JP 7064887 B2 2022.5. 2011 [SUMMARY OF THE INVENTION] [PROBLEM TO BE SOLVED BY THE INVENTION] id="p-7" id="p-7" id="p-7"
[0007] However, the check sheet is formed of paper, and when a history of test results is desired to be viewed, a comparison of a plurality of check sheets in the past is performed by a worker. There is thus a problem of poor productivity. id="p-8" id="p-8" id="p-8"
[0008] Accordingly, it is an object of the present invention to provide a processing apparatus managing method and a processing apparatus that can enable easy reference to a history of test results, and achieve an improvement in productivity.
[MEANS FOR SOLVING THE PROBLEM] id="p-9" id="p-9" id="p-9"
[0009] In accordance with an aspect of the present invention, there is provided a method of managing a processing apparatus which includes a chuck table for holding a workpiece and an X-axis direction moving means for moving the chuck table in the X-axis direction, including: a display step of displaying a check sheet on which check items are entered on a display unit; an input step of entering information on the check sheet according to the JP 7064887 B2 2022.5. check items; a storing step of storing the information in a storage unit together with a date of the entering on the check sheet; and a diagnosing step of diagnosing a secular change in a precision of a constituent element of the processing apparatus stored in the storage unit, wherein the precision of the constituent element of the processing apparatus diagnosed in the diagnosing step includes a precision of pitching of the chuck table in a Z-axis direction at a time of movement of the chuck table in the X-axis direction. id="p-10" id="p-10" id="p-10"
[0010] Preferably, the check items include information identifying an entry person in addition to whether precision of a constituent element constituting the processing apparatus is high or not, whether or not repair is necessary, and whether or not replacement is necessary. Preferably, in the display step, the check sheet is displayed on the display unit on an appropriate date, and processing by the processing apparatus is enabled by filling out the check sheet. id="p-11" id="p-11" id="p-11"
[0011] In accordance with another aspect of the present invention, there is provided a processing apparatus including: a chuck table for holding a workpiece; an X- axis direction moving means for moving the chuck table in JP 7064887 B2 2022.5. the X-axis direction; a display unit configured to display a check sheet on which check items are entered; input means entering information on the check sheet according to the check items; and a storage unit configured to store the information together with a date of the entering on the check sheet, wherein the display unit displays a secular change in a precision of a constituent element of the processing apparatus stored in the storage unit and the precision of the constituent element of the processing apparatus displayed on the display unit includes a precision of pitching of the chuck table in a Z-axis direction at a time of movement of the chuck table in the X-axis direction. id="p-12" id="p-12" id="p-12"
[0012] Preferably, the check items include information identifying an entry person in addition to whether precision of a constituent element constituting the processing apparatus is high or not, whether or not repair is necessary, and whether or not replacement is necessary. Preferably, the check sheet is displayed on the display unit on an appropriate date, and processing is enabled by filling out the check sheet.
[EFFECT OF THE INVENTION] id="p-13" id="p-13" id="p-13"
[0013] According to one aspect of the present invention, there JP 7064887 B2 2022.5. is provided a method of managing a processing apparatus which includes a chuck table for holding a workpiece and an X-axis direction moving means for moving the chuck table in the X-axis direction, including: a display step of displaying a check sheet on which check items are entered on a display unit; an input step of entering information on the check sheet according to the check items; a storing step of storing the information in a storage unit together with a date of the entering on the check sheet; and a diagnosing step of diagnosing a secular change in a precision of a constituent element of the processing apparatus stored in the storage unit, wherein the precision of the constituent element of the processing apparatus diagnosed in the diagnosing step includes a precision of pitching of the chuck table in a Z-axis direction at a time of movement of the chuck table in the X-axis direction. Therefore, check sheets can be stored in the storage unit in time series. Hence, it is possible to refer to a history of test results easily, and achieve an improvement in productivity. id="p-14" id="p-14" id="p-14"
[0014] According to another aspect of the present invention, there is provided a processing apparatus including: a chuck table for holding a workpiece; an X-axis direction moving means for moving the chuck table in the X-axis JP 7064887 B2 2022.5. direction; a display unit configured to display a check sheet on which check items are entered; input means entering information on the check sheet according to the check items; and a storage unit configured to store the information together with a date of the entering on the check sheet, wherein the display unit displays a secular change in a precision of a constituent element of the processing apparatus stored in the storage unit and the precision of the constituent element of the processing apparatus displayed on the display unit includes a precision of pitching of the chuck table in a Z-axis direction at a time of movement of the chuck table in the X-axis direction. Therefore, check sheets can be stored in time series. Hence, it is possible to refer to a history of test results easily, and achieve an improvement in productivity.
[BRIEF DESCRIPTION OF THE DRAWINGS] id="p-15" id="p-15" id="p-15"
[0015] [FIG. 1] FIG. 1 is a perspective view of a dicing apparatus as an example of a processing apparatus.
[FIG. 2] FIG. 2 is a schematic diagram of a display unit depicted in FIG. 1.
[FIG. 3] FIG. 3 is a schematic diagram of a list of check sheets stored in a storage unit.
[FIG. 4] FIG. 4 is a schematic diagram of time series JP 7064887 B2 2022.5. information stored in the storage unit.
[MODE FOR CARRYING OUT THE INVENTION] id="p-16" id="p-16" id="p-16"
[0016] An embodiment of a method of managing a processing apparatus and the processing apparatus according to the present invention will hereinafter be described with reference to the drawings. id="p-17" id="p-17" id="p-17"
[0017] The processing apparatus according to the present invention will first be described. FIG. 1 depicts a cutting apparatus 2 as an example of the processing apparatus. The cutting apparatus 2 includes: a chuck table 4 that sucks and holds a workpiece; an imaging unit 6 that images the workpiece held on the chuck table 4 and detects a region to be cut; and a cutting unit 8 that cuts the workpiece held on the chuck table 4. The chuck table 4 is mounted on an apparatus housing 10 so as to be movable in an X-axis direction indicated by an arrow X in FIG. 1 and be rotatable. The chuck table 4 is moved in the X-axis direction by X-axis direction moving means (not depicted), and is rotated by a motor (not depicted).
A porous suction chuck 12 connected to suction means (not depicted) is disposed on an upper end part of the chuck table 4. The chuck table 4 sucks and holds the workpiece placed on an upper surface of the suction chuck 12 by JP 7064887 B2 2022.5. generating a suction force in the upper surface of the suction chuck 12 by suction means. FIG. 1 depicts a wafer 14 as an example of the workpiece. In the present embodiment, the wafer 14 is affixed to an adhesive tape 18 whose periphery is fixed to an annular frame 16. In addition, a plurality of clamps 20 for fixing the annular frame 16 are arranged on the periphery of the chuck table 4 at intervals in a circumferential direction. id="p-18" id="p-18" id="p-18"
[0018] As depicted in FIG. 1, the imaging unit 6 disposed above the chuck table 4 is formed of optical means such as a microscope, a charge-coupled device (CCD) camera, or the like. An image imaged by the imaging unit 6 is displayed on a monitor 22 mounted on an upper portion of the apparatus housing 10. id="p-19" id="p-19" id="p-19"
[0019] The cutting unit 8 includes: a spindle housing supported by the apparatus housing 10 so as to be movable in a Y-axis direction (direction indicated by an arrow Y in FIG. 1) orthogonal to the X-axis direction and be movable (capable of being raised and lowered) in a Z-axis direction (vertical direction indicated by an arrow Z in FIG. 1) orthogonal to the X-axis direction and the Y-axis direction; a spindle 26 supported by the spindle housing 24 so as to be rotatable with the Y-axis direction as an JP 7064887 B2 2022.5. axis thereof; a motor (not depicted) that rotates the spindle 26; and a cutting blade 28 fixed to an end of the spindle 26. The spindle housing 24 is moved in the Y-axis direction by Y-axis direction moving means (not depicted), and is raised and lowered in the Z-axis direction by raising and lowering means (not depicted). Incidentally, a plane defined by the X-axis direction and the Y-axis direction is substantially horizontal. id="p-20" id="p-20" id="p-20"
[0020] The apparatus housing 10 liftably supports a cassette mounting base 32 to be mounted with a cassette 30 that houses workpieces before cutting and already cut workpieces. The cassette mounting base 32 is raised and lowered by raising and lowering means (not depicted) included in the apparatus housing 10. A plurality of wafers 14 as workpieces supported by an annular frame via an adhesive tape 18 are housed in the cassette 30 in the present embodiment at intervals in the vertical direction. In addition, the cutting apparatus 2 includes: carrying-in/out means 36 for taking out a workpiece from the cassette 30 and carrying out the workpiece to a temporary placement table 34, and housing an already cut workpiece placed on the temporary placement table 34 into the cassette 30; first conveying means 38 for conveying, to the chuck table 4, the workpiece before cutting, the JP 7064887 B2 2022.5. workpiece having been carried out from the cassette 30 to the temporary placement table 34; cleaning means 40 for cleaning an already cut workpiece; second conveying means 42 for conveying the already cut workpiece from the chuck table 4 to the cleaning means 40; control means 44 for controlling operation of the cutting apparatus 2; and a keyboard 46 for inputting control data to the control means 44. The control means 44 constituted by a computer includes: a central processing unit (CPU) 48 that performs arithmetic processing according to a control program; a read-only memory (ROM) 50 that stores the control program and the like; and a readable and writable random access memory (RAM) 52 that stores an arithmetic result and the like. id="p-21" id="p-21" id="p-21"
[0021] In the cutting apparatus 2 according to the embodiment of the present invention, it is important to include at least: a display unit that displays a check sheet on which a plurality of check items are entered; input means for entering information on the check sheet according to the check items; and a storage unit that stores the information together with a date of entry on the check sheet. In the present embodiment, the display unit is formed by the above-described monitor 22, the input means is formed by the above-described keyboard 46, and the JP 7064887 B2 2022.5. storage unit is formed by the above-described random access memory 52. The monitor 22 as the display unit displays the date of entry on the check sheet and the information of the check sheet, the date of entry and the information being stored in the random access memory 52, and displays time series information of each check item.
Hence, the cutting apparatus 2 allows a history of test results to be referred to easily, so that an improvement in productivity can be achieved. Incidentally, while the display unit and the input means are provided separately from each other in the present embodiment, the display unit and the input means may be integrally formed by a touch panel. id="p-22" id="p-22" id="p-22"
[0022] The check items entered on the check sheet preferably include information identifying an entry person (for example, a name or an employee number) in addition to whether precision of constituent elements (parts) constituting the processing apparatus is high or not, whether or not repair is necessary, and whether or not replacement is necessary. As the precision of the constituent elements constituting the processing apparatus, yawing in the Y-axis direction and pitching in the Z-axis direction at a time of movement of the chuck table 4, the squareness of the spindle 26 to the X-axis JP 7064887 B2 2022.5. direction, pitching in the Z-axis direction at a time of movement of the spindle 26, and the like, for example, can be cited. In addition, an upper limit and a lower limit of a tolerable value of each check item are entered on the check sheet, and the check sheet is provided with an entry section for a measured value related to each check item, the description (adjustment or replacement) of processing performed at a time of a test, and the like.
Then, at a time of a test on the cutting apparatus 2, as depicted in FIG. 2, for example, a first part 22a of the monitor 22 displays the check sheet, a second part 22b of the monitor 22 displays an input section of control data for performing test operation of the cutting apparatus 2, and a third part 22c of the monitor 22 displays measured values measured at the time of the test operation. id="p-23" id="p-23" id="p-23"
[0023] The cutting apparatus 2 in the present embodiment stores an appropriate date (for example, a first operation day of each month) of display of the check sheet on the monitor 22 in the read-only memory 50 of the control means 44 in advance. When the cutting apparatus 2 is started on the appropriate date stored in the read-only memory 50, the control means 44 displays the check sheet on the first part 22a of the monitor 22, and processing by the cutting apparatus 2 is enabled by filling out the JP 7064887 B2 2022.5. check sheet. Hence, when the check sheet is displayed on the monitor 22, the processing by the cutting apparatus cannot be started unless the filling out of the check sheet is completed. Thus, omission of filling out the check sheet is prevented, and required processing precision of the cutting apparatus 2 is maintained without delays in timing of repair and replacement of the constituent elements. id="p-24" id="p-24" id="p-24"
[0024] A method of managing the processing apparatus according to the present invention will next be described. In the following, a method of managing the above-described cutting apparatus 2 will be described. The method of managing the cutting apparatus 2 includes a display step of displaying a check sheet on which a plurality of check items are entered on the display unit. As described above, in the cutting apparatus 2, when the cutting apparatus is started on an appropriate date stored in the read-only memory 50, the check sheet is displayed on the monitor 22, and the processing by the cutting apparatus 2 is enabled by filling out the check sheet. id="p-25" id="p-25" id="p-25"
[0025] After the display step, an input step is performed which enters information on the check sheet according to check items. In the input step, first, control data for the JP 7064887 B2 2022.5. test operation of the cutting apparatus 2 is input to the input section displayed on the second part 22b of the monitor 22 by using the keyboard 46. Next, the test operation of the cutting apparatus 2 is performed, and the precision of the constituent elements constituting the processing apparatus is measured according to each check item. Then, information such as each measured value measured in the test operation, whether the precision of the constituent elements of the processing apparatus is high or not, whether or not repair is necessary, whether or not replacement is necessary, the name of an entry person, and the like are entered on the check sheet according to the check items by using the keyboard 46. id="p-26" id="p-26" id="p-26"
[0026]

Claims (6)

264175/ Claims
1. A method of managing a processing apparatus which includes a chuck table for holding a workpiece and an X-axis direction moving means for moving the chuck table in the X-axis direction, comprising: a display step of displaying a check sheet on which a plurality of check items are entered on a display unit; an input step of entering information on the check sheet according to the check items; a storing step of storing the information in a storage unit together with a date of the entering on the check sheet; and a diagnosing step of diagnosing a secular change in a precision of a constituent element of the processing apparatus stored in the storage unit, wherein the precision of the constituent element of the processing apparatus diagnosed in the diagnosing step includes a precision of pitching of the chuck table in a Z-axis direction at a time of movement of the chuck table in the X-axis direction.
2. The method of managing a processing apparatus according to claim 1, wherein 264175/ the check items include information identifying an entry person in addition to whether precision of a constituent element constituting the processing apparatus is high or not, whether or not repair is necessary, and whether or not replacement is necessary.
3. The method of managing a processing apparatus according to claim 1, wherein in the display step, the check sheet is displayed on the display unit on an appropriate date, and processing by the processing apparatus is enabled by filling out the check sheet.
4. A processing apparatus comprising: a chuck table for holding a workpiece; an X-axis direction moving means for moving the chuck table in the X-axis direction; a display unit configured to display a check sheet on which check items are entered; input means entering information on the check sheet according to the check items; and a storage unit configured to store the information together with a date of the entering on the check sheet; wherein 264175/ the display unit displays a secular change in a precision of a constituent element of the processing apparatus stored in the storage unit and the precision of the constituent element of the processing apparatus displayed on the display unit includes a precision of pitching of the chuck table in a Z-axis direction at a time of movement of the chuck table in the X-axis direction.
5. The processing apparatus according to claim 4, wherein the check items include information identifying an entry person in addition to whether precision of a constituent element constituting the processing apparatus is high or not, whether or not repair is necessary, and whether or not replacement is necessary.
6. The processing apparatus according to claim 4, wherein the check sheet is displayed on the display unit on an appropriate date, and processing is enabled by filling out the check sheet. In the name of the applicant: 264175/ Reuben Berman, patent attorney
IL264175A 2018-01-12 2019-01-09 Processing apparatus managing method and processing apparatus IL264175B2 (en)

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Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3076179B2 (en) 1993-07-26 2000-08-14 株式会社ディスコ Dicing equipment
JP2002063240A (en) * 2000-06-06 2002-02-28 Mori Seiki Co Ltd Production management system
US20050216228A1 (en) * 2004-03-15 2005-09-29 Tokyo Electron Limited Method and system for correcting a fault in a semiconductor manufacturing system
JP4777783B2 (en) 2006-01-26 2011-09-21 株式会社ディスコ Laser processing equipment
JP5134216B2 (en) * 2006-06-23 2013-01-30 株式会社ディスコ Wafer processing result management method
JP2008100247A (en) * 2006-10-18 2008-05-01 Sintokogio Ltd Safety starting method of facility apparatus in production of casting article and automobile internal article, and facility apparatus using the method
JP5072691B2 (en) * 2008-04-04 2012-11-14 株式会社片岡製作所 Laser light output measuring method and output measuring device
JP2012043041A (en) * 2010-08-13 2012-03-01 Disco Abrasive Syst Ltd Remote control system
JP2014154633A (en) 2013-02-06 2014-08-25 Disco Abrasive Syst Ltd Processing device
US10275439B2 (en) * 2014-03-20 2019-04-30 Pfu Limited Information processing device, display method and control program
CN106461691A (en) * 2014-05-30 2017-02-22 株式会社日立高新技术 Automatic analysis device
US10139311B2 (en) * 2014-09-26 2018-11-27 Palo Alto Research Center Incorporated Computer-implemented method and system for machine tool damage assessment, prediction, and planning in manufacturing shop floor
KR102044617B1 (en) * 2015-03-31 2019-11-13 가부시키가이샤 코쿠사이 엘렉트릭 Substrate processing apparatus, manufacturing method and recording medium of semiconductor device
JP6482446B2 (en) * 2015-09-30 2019-03-13 株式会社牧野フライス製作所 Machine tool controller
JP6607639B2 (en) * 2015-12-24 2019-11-20 株式会社ディスコ Wafer processing method
JP6468237B2 (en) * 2016-04-25 2019-02-13 横河電機株式会社 Equipment maintenance device, equipment maintenance method, equipment maintenance program, and recording medium
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