TWI805677B - Processing device management method and processing device - Google Patents

Processing device management method and processing device Download PDF

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TWI805677B
TWI805677B TW108101142A TW108101142A TWI805677B TW I805677 B TWI805677 B TW I805677B TW 108101142 A TW108101142 A TW 108101142A TW 108101142 A TW108101142 A TW 108101142A TW I805677 B TWI805677 B TW I805677B
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processing device
axis direction
checklist
accuracy
memory
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TW201931279A (en
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田中万平
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/4093—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by part programming, e.g. entry of geometrical information as taken from a technical drawing, combining this with machining and material information to obtain control information, named part programme, for the NC machine
    • G05B19/40937—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by part programming, e.g. entry of geometrical information as taken from a technical drawing, combining this with machining and material information to obtain control information, named part programme, for the NC machine concerning programming of machining or material parameters, pocket machining
    • G05B19/40938—Tool management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
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    • H01L21/67271—Sorting devices
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/67282—Marking devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

[課題] 提供一種能夠容易地參照檢查結果之履歷並謀求生產性之提昇的加工裝置之管理方法及加工裝置。 [解決手段] 加工裝置之管理方法，其特徵為，係包含有：顯示工程，係將被記載有複數之檢查項目的檢查表，顯示於顯示單元處；和輸入工程，係依循於檢查項目而將資訊記入至檢查表中；和記憶工程，係與記入至檢查表中之年、月、日一同地而將資訊記憶在記憶單元中。[Problem] To provide a processing device management method and a processing device that can easily refer to a history of inspection results and improve productivity. [Solution] A method for managing a processing device is characterized by including: displaying a process for displaying a check sheet in which a plurality of inspection items are recorded on a display unit; and inputting a process for following the inspection items Entering information into the checklist; and memory engineering, is to memorize the information in the memory unit together with the year, month and day entered into the checklist.

Description

加工裝置之管理方法及加工裝置Processing device management method and processing device

本發明，係有關於能夠謀求生產性之提昇的加工裝置之管理方法及加工裝置。 The present invention relates to a method of managing a processing device and a processing device capable of improving productivity.

於表面上被形成有使IC、LSI等之複數之元件被相互交叉之複數之分割預定線來作了區劃並形成於表面上的晶圓，係藉由切削裝置、雷射加工裝置等之加工裝置而被分割成各個的元件晶片，被作了分割的各元件晶片係被利用於行動電話、個人電腦等之電子機器中。 Wafers formed on the surface of which a plurality of components such as ICs and LSIs are divided by a plurality of dividing lines that intersect each other are processed by a cutting device, a laser processing device, etc. Devices are divided into individual component chips, and the divided component chips are used in electronic equipment such as mobile phones and personal computers.

切割裝置，係概略由將晶圓作吸引保持之吸盤台、和檢測出被保持於吸盤台上的晶圓之分割預定線之攝像單元、和使吸盤台在X軸方向上移動之X軸方向移動手段、和具備有以與X軸方向相正交之Y軸方向作為軸心的轉軸並於轉軸之前端處具備有切削刃之切削單元、和使切削單元在Y軸方向上移動之Y軸方向移動手段、和對於完成切削之晶圓進行洗淨之洗淨手段、和被載置有收容切削前之晶圓以及完成切削之晶圓的卡匣之卡匣載置台、以及從卡匣而將晶圓拉出並一直搬送至暫時放置台處並且將被定位在暫時放置台處之完成切削之晶圓收容於卡匣中之 搬入搬出手段，而構成之，並能夠將晶圓自動性地分割成各個的元件晶片(例如，參考專利文獻1)。 The dicing device is roughly composed of a chuck table that attracts and holds the wafer, an imaging unit that detects the planned dividing line of the wafer held on the chuck table, and an X-axis direction that moves the chuck table in the X-axis direction. A moving means, a cutting unit having a cutting edge at the front end of a rotating shaft centered on a Y-axis direction perpendicular to the X-axis direction, and a Y-axis for moving the cutting unit in the Y-axis direction Direction moving means, and cleaning means for cleaning wafers that have been cut, and a cassette loading table on which cassettes for storing wafers before cutting and wafers that have been cut are placed, and from the cassettes The wafer is pulled out and transported to the temporary placement table and the cut wafers positioned at the temporary placement table are stored in the cassette It is constituted by loading and unloading means, and can automatically divide the wafer into individual element wafers (for example, refer to Patent Document 1).

又，雷射加工裝置，亦係與切割裝置略相同地而被構成，雷射加工裝置，係概略由將晶圓作吸引保持之吸盤台、和檢測出被保持於吸盤台上的晶圓之分割預定線之攝像單元、和使吸盤台在X軸方向上移動之X軸方向移動手段、和對於被保持於吸盤台上之晶圓照射雷射光線之雷射光線照射單元、和使吸盤台與雷射光線照射單元相對性地在Y軸方向上移動之Y軸方向移動手段、和被載置有收容雷射加工前之晶圓以及完成雷射加工之晶圓的卡匣之卡匣載置台、以及從卡匣而將晶圓拉出並一直搬送至暫時放置台處並且將被定位在暫時放置台處之完成雷射加工之晶圓收容於卡匣中之搬入搬出手段，而構成之，並能夠將晶圓自動性地分割成各個的元件(例如，參考專利文獻2)。 In addition, the laser processing device is also configured in the same manner as the cutting device. The laser processing device is roughly composed of a chuck table that attracts and holds the wafer, and detects the wafer held on the chuck table. An imaging unit for dividing a planned line, an X-axis direction moving means for moving the chuck table in the X-axis direction, a laser light irradiation unit for irradiating laser light to a wafer held on the chuck table, and the chuck table The Y-axis direction moving means that moves in the Y-axis direction opposite to the laser beam irradiation unit, and the cassette loaded with cassettes that accommodate wafers before laser processing and wafers that have been laser processed The loading and unloading means that pull out the wafer from the cassette and transport it to the temporary storage table and store the laser-processed wafer positioned at the temporary storage table in the cassette. , and the wafer can be automatically divided into individual elements (for example, refer to Patent Document 2).

而，切削裝置、雷射加工裝置等之加工裝置，由於伴隨著時間的經過，吸盤台、X軸方向移動手段、Y軸方向移動手段等之構成加工裝置之構成要素(零件)係會劣化，因此係需要進行修理或交換等之維修，作業者係定期性地將檢查結果記入至被記載有複數之檢查項目的檢查表中，並估計構成要素之修理交換等的時機。 However, for processing devices such as cutting devices and laser processing devices, the components (parts) constituting the processing devices, such as the chuck table, the X-axis direction moving means, and the Y-axis direction moving means, etc., will deteriorate over time. Therefore, maintenance such as repair or exchange is required, and the operator periodically records the inspection results in an inspection sheet in which a plurality of inspection items are recorded, and estimates the timing of repair, exchange, etc. of the components.

[先前技術文獻] [Prior Art Literature] [專利文獻] [Patent Document]

[專利文獻1]日本特開平7-45556號公報 [Patent Document 1] Japanese Patent Application Laid-Open No. 7-45556

[專利文獻2]日本特開2007-201178號公報 [Patent Document 2] Japanese Unexamined Patent Publication No. 2007-201178

但是，檢查表係由紙所構成，在想要觀看檢查結果之履歷的情況時，係由作業者來進行過去之複數之檢查表的比較，而有著生產性為差的問題。 However, the inspection sheet is made of paper, and when it is desired to view the history of the inspection results, the operator has to compare the past plural inspection sheets, and there is a problem that the productivity is poor.

故而，本發明之目的，係在於提供一種能夠容易地參照檢查結果之履歷並謀求生產性之提昇的加工裝置之管理方法及加工裝置。 Therefore, an object of the present invention is to provide a processing device management method and a processing device that can easily refer to the history of inspection results and improve productivity.

若依據本發明之其中一個側面，則係提供一種加工裝置之管理方法，該加工裝置，係具備有保持被加工物之吸盤台、和使該吸盤台在X軸方向上移動之X軸方向移動手段，該加工裝置之管理方法，其特徵為，係至少由下述工程所構成：顯示工程，係將被記載有檢查項目的檢查表，顯示於顯示手段處；和輸入工程，係依循於檢查項目而將資訊記入至檢查表中；和記憶工程，係與對檢查表進行記入之年、月、日一同地而將資訊記憶在記憶手段中；和診斷工程，係對於被記憶在該記憶手段中之加工裝置之構成要素的精確度之歷時變化進行診斷，於在該診斷工程中而進行診斷的加工裝置之構成要素之精確度中，係 包含有在使該吸盤台於X軸方向上作了移動時之該吸盤台之對於Z軸方向的縱搖之精確度。 According to one aspect of the present invention, there is provided a management method of a processing device, the processing device is provided with a suction table for holding a workpiece, and an X-axis direction movement for moving the suction table in the X-axis direction. The means, the management method of the processing device, is characterized in that it is composed of at least the following processes: a display process, which is to display a checklist on which inspection items are recorded at the display means; and an input process, which is based on the inspection Items are entered into the checklist; and memory engineering is used to memorize information in the memory means along with the year, month, and day when the checklist is entered; and diagnostic engineering is to memorize information in the memory means Diagnosing the time-varying changes in the accuracy of the constituent elements of the processing device in the diagnosis process, in the accuracy of the constituent elements of the processing device diagnosed in the diagnostic project, is It includes the accuracy of the pitching of the suction cup table with respect to the Z-axis direction when the suction cup table is moved in the X-axis direction.

較理想，在檢查項目中，係除了構成加工裝置之構成要素的精確度之是否良好、是否需要修理、是否需要交換之外，亦包含有對於記入者作特定之資訊。較理想，在該顯示工程中，於適宜之年、月、日，檢查表係被顯示於該顯示單元處，在進行了對於檢查表之記入之後，係成為能夠進行由加工裝置所致之加工。 Preferably, in the inspection items, in addition to whether the accuracy of the components constituting the processing device is good, whether it needs to be repaired, or whether it needs to be replaced, it also includes specific information for the entry. Preferably, in the display process, the checklist is displayed on the display unit on an appropriate year, month, and day, and after the entry of the checklist is performed, it becomes possible to perform processing by the processing device. .

若依據本發明之另外一個側面，則係提供一種加工裝置，其特徵為，係至少具備有：吸盤台，係保持被加工物；和X軸方向移動手段，係使該吸盤台於X軸方向上移動；和顯示手段，係將被記載有檢查項目的檢查表作顯示；和輸入手段，係用以依循於檢查項目而將資訊記入至檢查表中；和記憶手段，係與對檢查表進行記入之年、月、日一同地而將資訊作記憶，該顯示手段，係將被記憶在該記憶手段中之加工裝置之構成要素的精確度之歷時變化作顯示，於該顯示手段所顯示的加工裝置之構成要素之精確度中，係包含有在使該吸盤台於X軸方向上作了移動時之該吸盤台之對於Z軸方向的縱搖之精確度。 According to another aspect of the present invention, a processing device is provided, which is characterized in that it has at least: a sucker table for holding the workpiece; and an X-axis direction moving means for moving the sucker table in the X-axis direction and display means for displaying the checklist with the check items recorded; and input means for recording information into the checklist in accordance with the check items; and memory means for performing the checklist on the checklist The recorded year, month, and day are recorded together and the information is memorized. The display means displays the change over time of the accuracy of the constituent elements of the processing device memorized in the memory means. The accuracy of the components of the processing device includes the pitch accuracy of the chuck table with respect to the Z-axis direction when the chuck table is moved in the X-axis direction.

較理想，在檢查項目中，係除了構成加工裝置之構成要素的精確度是否良好、是否需要修理、是否需要交換之外，亦包含有對於記入者作特定之資訊。較理想，於適宜之年、月、日，檢查表係被顯示於該顯示單元處，在進行了對於檢查表之記入之後，係成為能夠進行加 工。 Preferably, in the inspection items, in addition to whether the accuracy of the components constituting the processing device is good, whether it needs to be repaired, or whether it needs to be replaced, it also includes specific information for the entry. Ideally, the checklist is displayed on the display unit at the appropriate year, month, and day, and after the checklist is entered, it becomes possible to add work.

若依據本發明之其中一個側面，則由於所提供之加工裝置之管理方法，該加工裝置，係具備有保持被加工物之吸盤台、和使該吸盤台在X軸方向上移動之X軸方向移動手段，該加工裝置之管理方法，係至少由下述工程所構成：顯示工程，係將被記載有檢查項目的檢查表，顯示於顯示手段處；和輸入工程，係依循於檢查項目而將資訊記入至檢查表中；和記憶工程，係與對檢查表進行記入之年、月、日一同地而將資訊記憶在記憶手段中；和診斷工程，係對於被記憶在該記憶手段中之加工裝置之構成要素的精確度之歷時變化進行診斷，於在該診斷工程中而進行診斷的加工裝置之構成要素之精確度中，係包含有在使該吸盤台於X軸方向上作了移動時之該吸盤台之對於Z軸方向的縱搖之精確度，因此，係能夠以時間序列來將檢查表記憶於記憶手段中，故而，係可容易地參照檢查結果之履歷，而能夠謀求生產性之提昇。 According to one of the aspects of the present invention, due to the management method of the processing device provided, the processing device is equipped with a suction table for holding the workpiece and an X-axis direction for moving the suction table in the X-axis direction. The moving means, the management method of the processing device, is composed of at least the following processes: a display process, which is to display a checklist on which inspection items are recorded on the display means; and an input process, which is to follow the inspection items and display entry of information into the checklist; and memory engineering, which is the memorization of information in the memory means together with the year, month, and day when the checklist is entered; and diagnostic engineering, which is the processing of the information memorized in the memory means Diagnosing the time-dependent changes in the accuracy of the components of the device, the accuracy of the components of the processing device that is diagnosed in the diagnostic process includes when the chuck table is moved in the X-axis direction The accuracy of the pitching of the chuck table with respect to the Z-axis direction, therefore, the inspection table can be memorized in the memory means in time series, so the history of inspection results can be easily referred to, and productivity can be achieved of promotion.

若依據本發明之另外一個側面，則由於所提供之加工裝置，係至少具備有：吸盤台，係保持被加工物；和X軸方向移動手段，係使該吸盤台於X軸方向上移動；和顯示手段，係將被記載有檢查項目的檢查表作顯示；和輸入手段，係用以依循於檢查項目而將資訊記入至檢查表中；和記憶手段，係與對檢查表進行記入之年、 月、日一同地而將資訊作記憶，該顯示手段，係將被記憶在該記憶手段中之加工裝置之構成要素的精確度之歷時變化作顯示，於該顯示手段所顯示的加工裝置之構成要素之精確度中，係包含有在使該吸盤台於X軸方向上作了移動時之該吸盤台之對於Z軸方向的縱搖之精確度，因此，係能夠以時間序列來記憶檢查表。故而，係可容易地參照檢查結果之履歷，而能夠謀求生產性之提昇。 According to another aspect of the present invention, the processing device provided at least has: a sucker table, which holds the workpiece; and a moving means in the X-axis direction, which makes the sucker table move in the X-axis direction; and display means for displaying the checklist on which the check items are recorded; and input means for recording information into the checklist in accordance with the check items; and memory means for recording the year of the checklist , The month and day are used together to memorize the information. The display means is to display the chronological change of the accuracy of the constituent elements of the processing device memorized in the memory means. The composition of the processing device displayed on the display means The accuracy of the elements includes the pitch accuracy of the chuck table with respect to the Z-axis direction when the chuck table is moved in the X-axis direction, so it is possible to memorize the checklist in time series . Therefore, the history of inspection results can be easily referred to, and productivity can be improved.

2:切削裝置 2: Cutting device

4:吸盤台 4: Suction cup table

6:攝像單元 6: Camera unit

8:切削單元 8: Cutting unit

10:裝置殼體 10: Device housing

12:吸附吸盤 12: Adsorption suction cup

14:晶圓 14:Wafer

16:環狀框架 16: ring frame

18:黏著膠帶 18: Adhesive tape

20:夾鉗 20: Clamp

22:螢幕(顯示單元) 22: Screen (display unit)

22a:第1部分 22a: Part 1

22b:第2部分 22b: Part 2

22c:第3部分 22c: Part 3

24:轉軸殼體 24: Shaft housing

26:轉軸 26: Shaft

28:切削刃 28: cutting edge

30:卡匣 30: Cassette

32:卡匣載置台 32: Cassette loading table

34:暫時放置台 34:Temporary placement table

36:搬入搬出手段 36: Moving in and out means

38:第1搬送手段 38: 1st transport means

40:洗淨手段 40: means of cleaning

42:第2搬送手段 42: Second conveying means

44:控制手段 44: means of control

46:鍵盤(輸入手段) 46: keyboard (input means)

48:中央處理裝置 48: Central processing unit

50:唯讀記憶體 50: ROM

52:隨機存取記憶體(記憶單元) 52: Random access memory (memory unit)

[圖1]係為作為加工裝置之其中一例的切割裝置之立體圖。 [ Fig. 1 ] is a perspective view of a cutting device as an example of a processing device.

[圖2]係為圖1中所示之顯示單元的示意圖。 [ Fig. 2 ] is a schematic diagram of the display unit shown in Fig. 1 .

[圖3]係為被記憶在記憶單元中之檢查表之清單的示意圖。 [ Fig. 3 ] is a schematic diagram of a list of a look-up table memorized in a memory unit.

[圖4]係為被記憶在記憶單元中之時間序列資訊的示意圖。 [FIG. 4] is a schematic diagram of the time series information stored in the memory unit.

以下，參考圖面，針對本發明之加工裝置之管理方法以及加工裝置之實施形態作說明。 Hereinafter, referring to the drawings, the management method of the processing device and the embodiment of the processing device according to the present invention will be described.

首先，針對本發明之加工裝置作說明。在圖1中，係展示有作為加工裝置之其中一例的切削裝置2。切削裝置2，係具備有將被加工物作吸引保持之吸盤台4、和 對於被保持在吸盤台4上的被加工物進行攝像並檢測出應切削之區域之攝像單元6、以及對於被保持在吸盤台4上的被加工物進行切削之切削單元8。吸盤台4，係能夠在圖1中以箭頭X所標示的X軸方向上而自由移動並且能夠自由旋轉地而被裝著於裝置殼體10處，並成為藉由X軸方向移動手段(未圖示)而在X軸方向上移動並且藉由馬達(未圖示)而旋轉。在吸盤台4之上端部分處，係被配置有被與吸引手段(未圖示)作了連接的多孔質之吸附吸盤12，在吸盤台4處，係藉由以吸引手段來在吸附吸盤12之上面產生吸引力，而將被載置在吸附吸盤12之上面的被加工物作吸引保持。在圖1中，作為被加工物之其中一例，係展示有晶圓14，在本實施形態中，晶圓14，係被貼附在使週緣被固定於環狀框架16處的黏著膠帶18上。又，在吸盤台4之週緣處，係在周方向上空出有間隔地而被配置有用以將環狀框架16作固定之複數之夾鉗20。 First, the processing device of the present invention will be described. In FIG. 1 , a cutting device 2 as one example of a processing device is shown. The cutting device 2 is equipped with a suction table 4 for attracting and holding the workpiece, and An imaging unit 6 for imaging the workpiece held on the chuck table 4 to detect a region to be cut, and a cutting unit 8 for cutting the workpiece held on the chuck table 4 . The suction cup table 4 is able to move freely in the X-axis direction indicated by the arrow X in FIG. shown) to move in the X-axis direction and rotated by a motor (not shown). At the upper end part of the suction cup table 4, a porous adsorption suction cup 12 connected with a suction means (not shown) is arranged, and at the suction cup table 4, the adsorption suction cup 12 is attached to the suction cup by means of suction. Attractive force is generated on the upper surface, and the workpiece placed on the suction pad 12 is sucked and held. In FIG. 1, a wafer 14 is shown as an example of a workpiece. In this embodiment, the wafer 14 is attached to an adhesive tape 18 that fixes the peripheral edge to the ring frame 16. . In addition, a plurality of clamps 20 for fixing the annular frame 16 are arranged at intervals in the circumferential direction at the peripheral edge of the suction cup table 4 .

如同圖1中所示一般，被配置在吸盤台4之上方處的攝像單元6，係由顯微鏡和CCD攝像機等之光學手段所構成。藉由攝像單元6所攝像的畫像，係被顯示在被搭載於裝置殼體10之上部的螢幕22處。 As shown in FIG. 1, the imaging unit 6 arranged above the chuck table 4 is composed of optical means such as a microscope and a CCD camera. The image captured by the imaging unit 6 is displayed on the screen 22 mounted on the upper part of the device case 10 .

切削單元8，係包含有被能夠在與X軸方向相正交之Y軸方向(在圖1中以箭頭Y所示之方向)上自由移動並且能夠在與X軸方向以及Y軸方向相正交之Z軸方向(在圖1中以箭頭Z所示之上下方向)上自由移動(自由升降)地而支持於裝置殼體10處之轉軸殼體24、和能夠以Y軸方向作 為軸心而自由旋轉地來被支持於轉軸殼體24處之轉軸26、和使轉軸26旋轉之馬達(未圖示)、以及被固定在轉軸26之前端處的切削刃28。轉軸殼體24，係成為藉由Y軸方向移動手段(未圖示)而在Y軸方向上移動並且藉由升降手段(未圖示)而在Z軸方向上被作升降。另外，X軸方向以及Y軸方向所規定的平面，係為實質上水平。 The cutting unit 8 includes a machine that can move freely in the Y-axis direction (the direction shown by arrow Y in FIG. 1 ) that is perpendicular to the X-axis direction and can move in a direction that is perpendicular to the X-axis direction and the Y-axis direction. In turn, freely move (up and down) in the Z-axis direction (in the up-and-down direction shown by arrow Z in FIG. A shaft 26 rotatably supported by a shaft housing 24 as an axis, a motor (not shown) that rotates the shaft 26 , and a cutting edge 28 fixed at the front end of the shaft 26 . The rotating shaft housing 24 is moved in the Y-axis direction by a Y-axis direction moving means (not shown), and is raised and lowered in the Z-axis direction by a lifting means (not shown). In addition, the plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.

在裝置殼體10處，被載置有收容切削前之被加工物以及完成切削之被加工物的卡匣30之卡匣載置台32，係被可自由升降地作支持。此卡匣載置台32，係成為藉由被內藏於裝置殼體10中之升降手段(未圖示)而被作升降。在本實施形態之卡匣30中，經由黏著膠帶18而被支持於環狀框架16處的作為被加工物之晶圓14，係於上下方向空出有間隔地而被作複數枚之收容。又，切削裝置2，係具備有從卡匣30而將被加工物拉出並一直搬出至暫時放置台34處並且將被定位在暫時放置台34處之完成切削之被加工物收容於卡匣30中之搬入搬出手段36、和將從卡匣30而被搬出至暫時放置台34處的切削前之被加工物搬送至吸盤台4處之第1搬送手段38、和對於完成切削之被加工物進行洗淨之洗淨手段40、和將完成切削之被加工物從吸盤台4而搬送至洗淨手段40處之第2搬送手段42、和對於切削裝置2之動作作控制之控制手段44、以及用以對於控制手段44輸入控制資料之鍵盤46。由電腦所構成之控制手段44，係包含有依循於控制程式而進行演算處理之中央處理裝置(CPU)48、和儲存控制程式等之唯讀記憶體(ROM)50、和 儲存演算結果等之可讀寫之隨機存取記憶體(RAM)52。 At the device case 10, the cassette mounting table 32 on which the cassettes 30 for accommodating the workpiece before cutting and the workpiece after cutting are placed is supported in a freely ascending and descending manner. The cassette mounting table 32 is raised and lowered by a lifting means (not shown) built in the device casing 10 . In the cassette 30 of this embodiment, the wafers 14 to be processed, which are supported by the ring frame 16 via the adhesive tape 18, are accommodated in plural at intervals in the vertical direction. In addition, the cutting device 2 is equipped with a mechanism for pulling out the processed object from the cassette 30 and carrying it out to the temporary storage table 34, and storing the processed object positioned at the temporary storage table 34 in the cassette. The loading and unloading means 36 in 30, and the first transport means 38 for transporting the workpiece before cutting from the cassette 30 to the temporary storage table 34 to the suction table 4, and the processed workpiece after cutting The cleaning means 40 for cleaning the objects, the second conveying means 42 for transferring the processed objects from the suction table 4 to the cleaning means 40 after cutting, and the control means 44 for controlling the movement of the cutting device 2 , and a keyboard 46 for inputting control data to the control means 44 . The control means 44 constituted by a computer includes a central processing unit (CPU) 48 that performs calculation processing according to the control program, and a read-only memory (ROM) 50 that stores the control program, etc., and A readable and writable random access memory (RAM) 52 for storing calculation results and the like.

在本發明實施形態之切削裝置2中，其重要之處在於，係至少具備有：顯示單元，係將被記載有複數之檢查項目的檢查表作顯示；和輸入手段，係用以依循於檢查項目而將資訊記入至檢查表中；和記憶單元，係與對檢查表進行記入之年、月、日一同地而將資訊作記憶。在本實施形態中，顯示單元係由上述螢幕22所構成，輸入手段係由上述鍵盤46所構成，記憶單元係由上述隨機存取記憶體52所構成。在作為顯示單元之螢幕22處，係被顯示有隨機存取記憶體52所記憶了的檢查表之記入年月日以及檢查表之資訊，並且，係成為顯示有各檢查項目之每一者的時間序列資訊。故而，在切削裝置2處，係可容易地參照檢查結果之履歷，而能夠謀求生產性之提昇。另外，在本實施形態中，雖係將顯示單元和輸入手段個別獨立設置，但是，顯示單元以及輸入手段係亦可由觸控面板來一體性地構成。 In the cutting device 2 of the embodiment of the present invention, it is important to have at least: a display unit for displaying a checklist in which a plurality of check items are recorded; and an input means for following the check Items are entered into the checklist; and memory units are used to memorize the information along with the year, month, and day when the checklist is entered. In this embodiment, the display unit is composed of the above-mentioned screen 22 , the input means is composed of the above-mentioned keyboard 46 , and the memory unit is composed of the above-mentioned random access memory 52 . At the screen 22 as the display unit, the entry date of the checklist memorized by the random access memory 52 and the information of the checklist are displayed, and each of the checklists is displayed. time series information. Therefore, in the cutting device 2, the history of inspection results can be easily referred to, and productivity can be improved. In addition, in the present embodiment, although the display unit and the input means are independently provided, the display unit and the input means may be integrally constituted by a touch panel.

在被記載於檢查表中之檢查項目中，較理想，係除了構成加工裝置之構成要素(零件)的精確度是否良好、是否需要修理、是否需要交換之外，亦包含有對於記入者作特定之資訊(例如姓名或員工編號)。作為構成加工裝置之構成要素之精確度，例如，係可列舉出在使吸盤台4作了移動時的對於Y軸方向之偏搖(yawing)或對於Z軸方向之縱搖(pitching)、轉軸26與X軸方向之間之直角度、在使轉軸26作了移動時的朝向Z軸方向之縱搖等。又，在 檢查表中，係記載有各檢查項目之容許值的上限以及下限，並且，係設置有關連於各檢查項目之測定值和在檢查時所實施了的處理內容(調整、交換)等之記入欄。而，在切削裝置2之檢查時，例如係如同圖2中所示一般，成為在螢幕22之第1部分22a處係被顯示有檢查表，在螢幕22之第2部分22b處係被顯示有用以進行切削裝置2之檢查稼動的控制資料之輸入欄，在螢幕22之第3部分22c處係被顯示有在檢查稼動時所測定的測定值。 Among the inspection items recorded in the inspection sheet, it is preferable to include specific information for the entry in addition to whether the accuracy of the components (parts) constituting the processing device is good, whether it needs to be repaired, or whether it needs to be replaced. information (such as name or employee number). As the accuracy of the constituent elements constituting the processing device, for example, when the chuck table 4 is moved, the yaw (yawing) with respect to the Y-axis direction or the pitch (pitching) with respect to the Z-axis direction, the rotation axis The perpendicular angle between 26 and the X-axis direction, the pitch toward the Z-axis direction when the rotating shaft 26 is moved, and the like. again In the inspection sheet, the upper limit and lower limit of the allowable value of each inspection item are recorded, and the measurement value related to each inspection item and the processing content (adjustment, exchange) implemented during the inspection are provided. . And, when checking the cutting device 2, for example, as shown in FIG. In the input column for the control data of the inspection operation of the cutting device 2, the measured value measured during the inspection operation is displayed on the third part 22c of the screen 22.

在本實施形態中之切削裝置2，係在控制手段44之唯讀記憶體50中預先被記憶有將檢查表顯示在螢幕22處之適宜之年月日(例如每個月的第1個稼動日)，若是在被記憶於唯讀記憶體50中之適宜之年月日而切削裝置2被啟動，則藉由控制手段44，檢查表係被顯示在螢幕22之第1部分22a處，並構成為在進行了檢查表之記入之後，成為能夠進行由切削裝置2所致之加工。故而，若是檢查表被顯示在螢幕22處，則只要尚未結束檢查表之記入，便無法開始由切削裝置2所致之加工，因此，係防止忘記記入檢查表的情形，而成為並不會有構成要素之修理、交換之時機有所延遲的情況，並成為維持有切削裝置2之所需的加工精確度。 In the cutting device 2 in the present embodiment, the appropriate year, month and day for displaying the checklist on the screen 22 is stored in advance in the read-only memory 50 of the control means 44 (for example, the first operation of each month) day), if the cutting device 2 is activated at the appropriate date stored in the read-only memory 50, the checklist is displayed on the first part 22a of the screen 22 by the control means 44, and It is configured so that the machining by the cutting device 2 can be performed after entry of the check table is performed. Therefore, if the checklist is displayed on the screen 22, as long as the entry of the checklist has not been completed, the processing caused by the cutting device 2 cannot be started. If the timing of repair and replacement of the components is delayed, the machining accuracy required by the cutting device 2 is maintained.

接著，針對本發明之加工裝置之管理方法作說明，但是，於此，係針對上述切削裝置2之管理方法作說明。切削裝置2之管理方法，係包含有：顯示工程，係將被記載有複數之檢查項目的檢查表，顯示於顯示單元 處。如同上述一般，在切削裝置2處，若是在被記憶於唯讀記憶體50中之適宜之年月日而切削裝置2被啟動，則檢查表係被顯示在螢幕22處，並構成為在進行了檢查表之記入之後，成為能夠進行由切削裝置2所致之加工。 Next, the management method of the machining device of the present invention will be described, but here, the management method of the above-mentioned cutting device 2 will be described. The management method of the cutting device 2 includes: displaying a process, displaying a check sheet in which a plurality of check items are recorded on a display unit place. As mentioned above, at the cutting device 2, if the cutting device 2 is activated at the appropriate date stored in the read-only memory 50, the checklist is displayed on the screen 22 and is configured to be After entering the checklist, machining by the cutting device 2 becomes possible.

在顯示工程之後，係實施依循於檢查項目來將資訊記入至檢查表中之輸入工程。在輸入工程中，首先，係將用以進行切削裝置2之檢查稼動的控制資料，使用鍵盤46來輸入至被顯示於螢幕22之第2部分22b處的輸入欄中。接著，進行切削裝置2之檢查稼動，並依循於各檢查項目來對於構成加工裝置之構成要素的精確度進行測定。之後，使用鍵盤46，來在檢查表中，記入在檢查稼動中所測定出的各測定值、加工裝置之構成要素的精確度之是否良好、是否需要修理、是否需要交換、以及記入者之姓名等的資訊。 After displaying the project, an input project is performed to record information into the checklist according to the check item. In the input process, first, the control data for the inspection operation of the cutting device 2 is input into the input column displayed on the second part 22b of the screen 22 using the keyboard 46 . Next, the inspection operation of the cutting device 2 is performed, and the accuracy of the components constituting the processing device is measured according to each inspection item. Afterwards, use the keyboard 46 to enter in the inspection table, each measurement value measured during the inspection operation, whether the accuracy of the components of the processing device is good, whether it needs to be repaired, whether it needs to be replaced, and the name of the person who entered it and other information.

在輸入工程之後，係實施使記憶單元與在輸入工程中所記入至檢查表中的年、月、日一同地而將資訊作記憶之記憶工程。在本實施形態中，檢查表之記入年月日以及檢查表之資訊，係被記憶在控制手段44之隨機存取記憶體52中。又，被記憶在隨機存取記憶體52中之檢查表之資訊，係例如如同圖3中所示一般，使記載有號碼和對檢查表作了記入年、月、日以及記入者的清單被顯示於螢幕22處，若是適宜之號碼的檢查表被選擇，則所選擇的檢查表之資訊係成為被顯示在螢幕22處。如此這般，在本實施形態中，由於係能夠以時間序列而將檢查表記憶在隨機 存取記憶體52中，因此，係可容易地參照檢查結果之履歷，而能夠謀求生產性之提昇。 After the input process, the memory unit is implemented to memorize the information together with the year, month, and day recorded in the checklist in the input process. In this embodiment, the entry date of the checklist and the information of the checklist are memorized in the random access memory 52 of the control means 44 . Also, the information of the checklist memorized in the random access memory 52 is, for example, as shown in FIG. Displayed on the screen 22, if the checklist with the appropriate number is selected, the information of the selected checklist becomes displayed on the screen 22. In this way, in this embodiment, since the checklist can be memorized in a random Since the memory 52 is accessed, the history of inspection results can be easily referred to, and productivity can be improved.

又，在本發明之加工裝置之管理方法中，係亦可包含有對於被記憶在記憶單元中之過去之資訊進行分析並對加工裝置進行診斷之診斷工程。在診斷工程中，係將加工裝置之構成要素的歷時變化(例如如同圖4中所示一般之吸盤台4之偏搖的歷時變化)顯示於螢幕22處。藉由此，來對於加工裝置之構成要素的精確度之歷時變化進行診斷，而能夠對於構成要素之修理、交換等的時機作估計，並且亦能夠利用於構成要素之改良等之中。 In addition, the processing device management method of the present invention may also include a diagnostic process of analyzing past information stored in the memory unit and diagnosing the processing device. In the diagnosis process, the temporal changes of the components of the processing device (for example, the temporal changes of the yaw of the chuck table 4 as shown in FIG. 4 ) are displayed on the screen 22 . By doing so, it is possible to diagnose the change over time in the accuracy of the components of the processing apparatus, to estimate the timing of repairs, replacements, etc. of the components, and to use it in the improvement of the components.

另外，在本實施形態中，作為加工裝置，雖係列舉出切削裝置2為例來作了說明，但是，作為能夠適用本發明之加工裝置，係亦可採用雷射加工裝置或研削裝置。又，係亦可在切削裝置2處連接印表機，並構成為將記憶在隨機存取記憶體52中之檢查表之資訊作印刷。 In addition, in this embodiment, although the cutting device 2 was taken as an example as a processing device, a laser processing device or a grinding device may be used as a processing device to which the present invention can be applied. Also, a printer can be connected to the cutting device 2, and it can be configured to print the information of the checklist stored in the random access memory 52.

2‧‧‧切削裝置 2‧‧‧Cutting device

4‧‧‧吸盤台 4‧‧‧Suction cup table

6‧‧‧攝像單元 6‧‧‧camera unit

8‧‧‧切削單元 8‧‧‧Cutting unit

10‧‧‧裝置殼體 10‧‧‧Device housing

12‧‧‧吸附吸盤 12‧‧‧Adsorption Suction Cup

14‧‧‧晶圓 14‧‧‧Wafer

16‧‧‧環狀框架 16‧‧‧Ring frame

18‧‧‧黏著膠帶 18‧‧‧adhesive tape

20‧‧‧夾鉗 20‧‧‧Clamp

22‧‧‧螢幕(顯示單元) 22‧‧‧Screen (display unit)

24‧‧‧轉軸殼體 24‧‧‧Rotating shaft housing

26‧‧‧轉軸 26‧‧‧Spindle

28‧‧‧切削刃 28‧‧‧Cutting edge

30‧‧‧卡匣 30‧‧‧cassette

32‧‧‧卡匣載置台 32‧‧‧cassette holder

34‧‧‧暫時放置台 34‧‧‧Temporary placement table

36‧‧‧搬入搬出手段 36‧‧‧Means of moving in and out

38‧‧‧第1搬送手段 38‧‧‧The first means of transport

40‧‧‧洗淨手段 40‧‧‧Cleaning means

42‧‧‧第2搬送手段 42‧‧‧Second means of transportation

44‧‧‧控制手段 44‧‧‧Control means

46‧‧‧鍵盤(輸入手段) 46‧‧‧Keyboard (input means)

48‧‧‧中央處理裝置 48‧‧‧central processing unit

50‧‧‧唯讀記憶體 50‧‧‧ROM

52‧‧‧隨機存取記憶體(記憶單元) 52‧‧‧random access memory (memory unit)

Claims (6)

一種加工裝置之管理方法，該加工裝置，係具備有保持被加工物之吸盤台、和使該吸盤台在X軸方向上移動之X軸方向移動手段，該加工裝置之管理方法，其特徵為，係至少由下述工程所構成：顯示工程，係將被記載有複數之檢查項目的檢查表，顯示於顯示手段處；和輸入工程，係依循於檢查項目而將資訊記入至檢查表中；和記憶工程，係與對檢查表進行記入之年、月、日一同地而將資訊記憶在記憶手段中；和診斷工程，係對於被記憶在該記憶手段中之加工裝置之構成要素的精確度之歷時變化進行診斷，於在該診斷工程中而進行診斷的加工裝置之構成要素之精確度中，係包含有在使該吸盤台於X軸方向上作了移動時之該吸盤台之對於Z軸方向的縱搖之精確度。 A method of managing a processing device, the processing device is provided with a suction table holding a workpiece, and an X-axis direction moving means for moving the suction table in the X-axis direction, the processing device management method is characterized in that , is composed of at least the following processes: a display process, which is to display a checklist with a plurality of check items recorded on the display means; and an input process, which is to record information into the checklist according to the check items; and memory engineering, which is the memorization of information in the memory means together with the year, month, and day when the checklist is entered; and diagnostic engineering, which is the accuracy of the constituent elements of the processing device memorized in the memory means The accuracy of the constituent elements of the processing device that is diagnosed in the diagnostic process includes the relative Z of the chuck table when the chuck table is moved in the X-axis direction. Axial pitch accuracy. 如申請專利範圍第1項所記載之加工裝置之管理方法，其中，在檢查項目中，係除了構成加工裝置之構成要素的精確度是否良好、是否需要修理、是否需要交換之外，亦包含有對於記入者作特定之資訊。 The management method of processing equipment as described in item 1 of the scope of the patent application, wherein, in the inspection items, in addition to whether the accuracy of the components constituting the processing equipment is good, whether it needs to be repaired, or whether it needs to be replaced, it also includes Specific information for the entry. 如申請專利範圍第1項所記載之加工裝置之管理方法，其中，在該顯示工程中，於適宜之年、月、日，檢查表係被顯示於該顯示手段處，在進行了對於檢查表之記入之後，係成為能夠進行由加工裝置所致之加工。 The management method of processing equipment as described in item 1 of the scope of the patent application, wherein, in the display process, the checklist is displayed on the display means on the appropriate year, month, and day, and the checklist is performed After entry, it becomes possible to perform processing by processing equipment. 一種加工裝置，其特徵為，係至少具備有：吸盤台，係保持被加工物；和X軸方向移動手段，係使該吸盤台於X軸方向上移動；和顯示手段，係將被記載有檢查項目的檢查表作顯示；和輸入手段，係用以依循於檢查項目而將資訊記入至檢查表中；和記憶手段，係與對檢查表進行記入之年、月、日一同地而將資訊作記憶，該顯示手段，係將被記憶在該記憶手段中之加工裝置之構成要素的精確度之歷時變化作顯示，於該顯示手段所顯示的加工裝置之構成要素之精確度中，係包含有在使該吸盤台於X軸方向上作了移動時之該吸盤台之對於Z軸方向的縱搖之精確度。 A processing device, characterized in that it comprises at least: a suction cup table for holding a workpiece; and X-axis direction moving means for moving the suction cup table in the X-axis direction; and a display means, which will be described in A check list of check items is displayed; and an input means is used to record information into the check list in accordance with the check items; and a memory means is to record the information together with the year, month and day when the check list is recorded For memory, the display means displays the temporal change of the accuracy of the constituent elements of the processing device memorized in the memory means, and the accuracy of the constituent elements of the processing device displayed by the display means includes There is an accuracy of pitching of the chuck table with respect to the Z-axis direction when the chuck table is moved in the X-axis direction. 如申請專利範圍第4項所記載之加工裝置，其中，在檢查項目中，係除了構成加工裝置之構成要素的精 確度是否良好、是否需要修理、是否需要交換之外，亦包含有對於記入者作特定之資訊。 As for the processing device described in item 4 of the scope of the patent application, among the inspection items, the fineness of the constituent elements constituting the processing device is excluded. In addition to whether the accuracy is good, whether it needs to be repaired, or whether it needs to be replaced, it also contains specific information for the recorder. 如申請專利範圍第4項所記載之加工裝置，其中，於適宜之年、月、日，檢查表係被顯示於該顯示手段處，在進行了對於檢查表之記入之後，係成為能夠進行加工。 The processing device described in claim 4 of the scope of the patent application, wherein a check list is displayed on the display means on an appropriate year, month, and day, and after the check list is entered, processing becomes possible .
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