CN110026884A - 加工装置的管理方法和加工装置 - Google Patents

加工装置的管理方法和加工装置 Download PDF

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CN110026884A
CN110026884A CN201910011007.6A CN201910011007A CN110026884A CN 110026884 A CN110026884 A CN 110026884A CN 201910011007 A CN201910011007 A CN 201910011007A CN 110026884 A CN110026884 A CN 110026884A
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田中万平
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories
    • B24B37/345Feeding, loading or unloading work specially adapted to lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06Dust extraction equipment on grinding or polishing machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064Devices for the automatic drive or the program control of the machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/18Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/4093Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by part programming, e.g. entry of geometrical information as taken from a technical drawing, combining this with machining and material information to obtain control information, named part programme, for the NC machine
    • G05B19/40937Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by part programming, e.g. entry of geometrical information as taken from a technical drawing, combining this with machining and material information to obtain control information, named part programme, for the NC machine concerning programming of machining or material parameters, pocket machining
    • G05B19/40938Tool management
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Abstract

提供加工装置的管理方法和加工装置,能够容易地参照检查结果的履历,从而能够实现生产率的提高。加工装置的管理方法包含如下的工序:显示工序,在显示单元上显示记载有多个查核项目的查核表;输入工序,按照查核项目在查核表中填入信息;以及存储工序,将信息与填入至查核表的年月日一起存储于存储单元。

Description

加工装置的管理方法和加工装置
技术领域
本发明涉及加工装置的管理方法和加工装置,能够实现生产率的提高。
背景技术
由交叉的多条分割预定线划分而在正面上形成有IC、LSI等多个器件的晶片通过切割装置、激光加工装置等加工装置分割成各个器件芯片,分割得到的各器件芯片被用于移动电话、个人计算机等电子设备。
切割装置大致包含:卡盘工作台,其对晶片进行吸引保持;拍摄单元,其对卡盘工作台所保持的晶片的分割预定线进行检测;X轴方向移动单元,其使卡盘工作台在X轴方向上移动;切削单元,其具有以与X轴方向垂直的Y轴方向为轴心的主轴,在主轴的前端具有切削刀具;Y轴方向移动单元,其使切削单元在Y轴方向上移动;清洗单元,其对切削完成的晶片进行清洗;盒载置台,其载置有对切削前的晶片和切削完成的晶片进行收纳的盒;以及搬入搬出单元,其将晶片从盒中拉出并搬送至暂放工作台,并且将定位于暂放工作台的切削完成的晶片收纳于盒中,该切割装置能够自动地将晶片分割成各个器件芯片(例如,参照专利文献1)。
另外,激光加工装置也与切割装置几乎同样地构成,激光加工装置大致包含:卡盘工作台,其对晶片进行吸引保持;拍摄单元,其对卡盘工作台所保持的晶片的分割预定线进行检测;X轴方向移动单元,其使卡盘工作台在X轴方向上移动;激光光线照射单元,其对卡盘工作台所保持的晶片照射激光光线;Y轴方向移动单元,其使卡盘工作台与激光光线照射单元在Y轴方向上相对地移动;盒载置台,其载置有对激光加工前的晶片和激光加工完成的晶片进行收纳的盒;以及搬入搬出单元,其将晶片从盒中拉出并搬送至暂放工作台,并且将定位于暂放工作台的激光加工完成的晶片收纳于盒中,该激光加工装置能够自动地将晶片分割成各个器件(例如,参照专利文献2)。
并且,切割装置、激光加工装置等加工装置中,随着时间经过,卡盘工作台、X轴方向移动单元、Y轴方向移动单元等构成加工装置的构成要素(部件)发生劣化,因此需要进行修理或更换等维护,由作业者定期地在记载有多个查核项目的查核表中填入检查结果而对构成要素的修理、更换等的时刻进行规划。
专利文献1:日本特开平7-45556号公报
专利文献2:日本特开2007-201178号公报
但是,查核表由纸构成而存在如下的问题:在希望看到检查结果的履历的情况下,作业者要进行过去的多个查核表的比较,生产率较差。
发明内容
由此,本发明的目的在于提供加工装置的管理方法和加工装置,能够容易地参照检查结果的履历,从而能够实现生产率的提高。
根据本发明的一个方式,提供加工装置的管理方法,其中,该加工装置的管理方法具有如下的工序:显示工序,在显示单元上显示记载有多个查核项目的查核表;输入工序,按照查核项目在查核表中填入信息;以及存储工序,将信息与填入至查核表的年月日一起存储于存储单元。
优选在查核项目中包含有构成加工装置的构成要素的精度的优劣、是否需要修理、是否需要更换的信息,此外还包含有对填入者进行确定的信息。优选在该显示工序中,在适当的年月日将查核表显示在该显示单元上,从而能够根据查核表的填入而进行加工装置的加工。优选加工装置的管理方法包含如下的诊断工序:对该存储单元所存储的过去的信息进行分析而对加工装置进行诊断。
根据本发明的另一方式,提供加工装置,其中,该加工装置具有:显示单元,其显示记载有查核项目的查核表;输入单元,其用于按照查核项目在查核表中填入信息;以及存储单元,其将信息与填入至查核表的年月日一起进行存储。
优选在查核项目中包含构成加工装置的构成要素的精度的优劣、是否需要修理、是否需要更换的信息,此外还包含有对填入者进行确定的信息。优选在适当的年月日将查核表显示在该显示单元上,从而能够根据查核表的填入而进行加工。
根据本发明的一个方式,能够容易地参照检查结果的履历,从而能够实现生产率的提高。
根据本发明的另一方式,能够按照时间序列对查核表进行存储。因此,能够容易地参照检查结果的履历,从而能够实现生产率的提高。
附图说明
图1是作为加工装置的一例的切割装置的立体图。
图2是图1所示的显示单元的示意图。
图3是存储单元所存储的查核表的列表的示意图。
图4是存储单元所存储的时间序列信息的示意图。
标号说明
2:切削装置;22:监视器(显示单元);46:键盘(输入单元);52:随机存取存储器(存储单元)。
具体实施方式
以下,参照附图对本发明的加工装置的管理方法和加工装置的实施方式进行说明。
首先,对本发明的加工装置进行说明。在图1中示出作为加工装置的一例的切削装置2。切削装置2具有:卡盘工作台4,其对被加工物进行吸引保持;拍摄单元6,其对卡盘工作台4所保持的被加工物进行拍摄而检测到要进行切削的区域;以及切削单元8,其对卡盘工作台4所保持的被加工物进行切削。卡盘工作台4在图1中箭头X所示的X轴方向上移动自如且旋转自如地安装于装置壳体10上,通过X轴方向移动单元(未图示)在X轴方向上移动,并且通过电动机(未图示)进行旋转。在卡盘工作台4的上端部分配置有与吸引单元(未图示)连接的多孔质的吸附卡盘12,在卡盘工作台4中,利用吸引单元在吸附卡盘12的上表面上生成吸引力,从而对载置于吸附卡盘12的上表面的被加工物进行吸引保持。在图1中作为被加工物的一例示出了晶片14,在本实施方式中,将晶片14粘贴在周缘固定于环状框架16的粘接带18上。另外,在卡盘工作台4的周缘,沿周向隔开间隔地配置有多个夹具20,该多个夹具20用于对环状框架16进行固定。
如图1所示,配置在卡盘工作台4的上方的拍摄单元6由显微镜或CCD相机等光学单元构成。将利用拍摄单元6拍摄得到的图像显示在搭载于装置壳体10的上部的监视器22上。
切削单元8包含:主轴壳体24,其在与X轴方向垂直的Y轴方向(图1中箭头Y所示的方向)上移动自如且在与X轴方向和Y轴方向垂直的Z轴方向(图1中箭头Z所示的上下方向)上移动自如(升降自如)地支承于装置壳体10;主轴26,其以Y轴方向为轴心旋转自如地支承于主轴壳体24;电动机(未图示),其使主轴26旋转;以及切削刀具28,其固定于主轴26的前端。主轴壳体24通过Y轴方向移动单元(未图示)在Y轴方向上移动,并且通过升降单元(未图示)在Z轴方向上升降。另外,由X轴方向和Y轴方向所限定的平面实质上是水平的。
在装置壳体10上升降自如地支承有盒载置台32,该盒载置台32载置有对切削前的被加工物和切削完成的被加工物进行收纳的盒30。该盒载置台32通过内置于装置壳体10的升降单元(未图示)进行升降。在本实施方式的盒30中,沿上下方向隔开间隔地收纳有多张作为被加工物的晶片14,该晶片14借助粘接带18而支承于环状框架16。另外,切削装置2具有:搬入搬出单元36,其将被加工物从盒30中拉出并搬出至暂放工作台34,并且将定位于暂放工作台34的切削完成的被加工物收纳于盒30中;第一搬送单元38,其将从盒30中搬出至暂放工作台34的切削前的被加工物搬送至卡盘工作台4;清洗单元40,其对切削完成的被加工物进行清洗;第二搬送单元42,其将切削完成的被加工物从卡盘工作台4搬送至清洗单元40;控制单元44,其对切削装置2的动作进行控制;以及键盘46,其用于对控制单元44输入控制数据。由计算机构成的控制单元44包含:按照控制程序进行运算处理的中央处理装置(CPU)48;对控制程序等进行保存的只读存储器(ROM)50;以及对运算结果等进行保存的能够读写的随机存取存储器(RAM)52。
在本发明实施方式的切削装置2中,重要的是至少具有:显示单元,其显示记载有多个查核项目的查核表;输入单元,其用于按照查核项目在查核表中填入信息;以及存储单元,其将信息与填入至查核表的年月日一起进行存储。在本实施方式中,显示单元由上述监视器22构成,输入单元由上述键盘46构成,存储单元由上述随机存取存储器52构成。在作为显示单元的监视器22上显示随机存取存储器52所存储的查核表的填入年月日和查核表的信息,并且显示每个查核项目的时间序列信息。因此,在切削装置2中,能够容易地参照检查结果的履历,能够实现生产率的提高。另外,在本实施方式中,显示单元和输入单元分开设置,但也可以由触摸面板一体地构成显示单元和输入单元。
优选在查核表所记载的查核项目中包含有构成加工装置的构成要素(部件)的精度的优劣、是否需要修理、是否需要更换的信息,此外还包含有对填入者进行确定的信息(例如姓名、职员号)。作为构成加工装置的构成要素的精度,例如可以举出:使卡盘工作台4移动时的向Y轴方向的横摆(yawing)或向Z轴方向的俯仰(pitching);主轴26与X轴方向的垂直度;以及使主轴26移动时的向Z轴方向的俯仰等。另外,在查核表中记载有各查核项目的允许值的上限和下限,并且设置有与各查核项目相关的测量值以及检查时所实施的处理内容(调整、更换)等的填入栏。并且,在切削装置2的检查时,例如如图2所示,在监视器22的第一部分22a显示查核表,在监视器22的第二部分22b显示用于进行切削装置2的检查运转的控制数据的输入栏,在监视器22的第三部分22c显示在进行检查运转时所测量出的测量值。
本实施方式中的切削装置2构成为:将适合在监视器22上显示查核表的年月日(例如每月的月初运行日)预先存储于控制单元44的只读存储器50中,当在只读存储器50所存储的适当的年月日启动切削装置2时,通过控制单元44将查核表显示在监视器22的第一部分22a,从而能够根据查核表的填入而进行切削装置2的加工。因此,如果当在监视器22上显示查核表时不完成查核表的填入,则无法开始切削装置2的加工,因此能够防止忘记填入查核表,从而能够不延迟构成要素的修理、更换的时刻而维持切削装置2所需的加工精度。
接着,对本发明的加工装置的管理方法进行说明,这里对上述切削装置2的管理方法进行说明。切削装置2的管理方法包含显示工序,在显示单元上显示记载有多个查核项目的查核表。如上所述,在切削装置2中构成为:当在只读存储器50所存储的适当的年月日启动切削装置2时,在监视器22上显示查核表,从而能够根据查核表的填入而进行切削装置2的加工。
在显示工序之后,实施输入工序,按照查核项目在查核表中填入信息。在输入工序中,首先使用键盘46将用于切削装置2的检查运转的控制数据输入至监视器22的第二部分22b中所显示的输入栏。接着,进行切削装置2的检查运转,按照各查核项目对构成加工装置的构成要素的精度进行测量。并且,使用键盘46按照查核项目将在检查运转中测量出的各测量值、加工装置的构成要素的精度的优劣、是否需要修理、是否需要更换以及填入者的姓名等信息填入至查核表中。
在输入工序之后,实施存储工序,将信息与在输入工序中填入至查核表的年月日一起存储于存储单元。在本实施方式中,将查核表的填入年月日和查核表的信息存储于控制单元44的随机存取存储器52中。另外,随机存取存储器52所存储的查核表的信息例如如图3所示,在监视器22上显示记载有编号、填入至查核表的年月日以及填入者的列表,当选择适当的编号的查核表时,在监视器22上显示所选择的查核表的信息。这样,在本实施方式中,能够按照时间序列将查核表存储于随机存取存储器52,因此能够容易地参照检查结果的履历,从而能够实现生产率的提高。
另外,在本发明的加工装置的管理方法中可以包含如下的诊断工序:对存储单元所存储的过去的信息进行分析而对加工装置进行诊断。在诊断工序中,在监视器22上显示加工装置的构成要素的精度的经时变化(例如如图4所示,卡盘工作台4的横摆的经时变化)。由此,能够对加工装置的构成要素的精度的经时变化进行诊断而对构成要素的修理、更换等的时刻进行规划,并且也能够利用于构成要素的改良等。
另外,在本实施方式中,作为加工装置,列举切削装置2为例进行了说明,但作为能够应用本发明的加工装置可以是激光加工装置或研磨装置。另外,也可以在切削装置2上连接打印机,打印出随机存取存储器52所存储的查核表的信息。

Claims (7)

1.一种加工装置的管理方法,其中,
该加工装置的管理方法具有如下的工序:
显示工序,在显示单元上显示记载有多个查核项目的查核表;
输入工序,按照查核项目在查核表中填入信息;以及
存储工序,将信息与填入至查核表的年月日一起存储于存储单元。
2.根据权利要求1所述的加工装置的管理方法,其中,
在查核项目中包含有构成加工装置的构成要素的精度的优劣、是否需要修理、是否需要更换的信息,此外还包含有对填入者进行确定的信息。
3.根据权利要求1所述的加工装置的管理方法,其中,
在该显示工序中,在适当的年月日将查核表显示在该显示单元上,从而能够根据查核表的填入而进行加工装置的加工。
4.根据权利要求1所述的加工装置的管理方法,其中,
该加工装置的管理方法包含如下的诊断工序:对该存储单元所存储的过去的信息进行分析而对加工装置进行诊断。
5.一种加工装置,其中,
该加工装置具有:
显示单元,其显示记载有查核项目的查核表;
输入单元,其用于按照查核项目在查核表中填入信息;以及
存储单元,其将信息与填入至查核表的年月日一起进行存储。
6.根据权利要求5所述的加工装置,其中,
在查核项目中包含有构成加工装置的构成要素的精度的优劣、是否需要修理、是否需要更换的信息,此外还包含有对填入者进行确定的信息。
7.根据权利要求5所述的加工装置,其中,
在适当的年月日将查核表显示在该显示单元上,从而能够根据查核表的填入而进行加工。
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