WO2016157402A1 - 基板処理装置、半導体装置の製造方法及び記録媒体 - Google Patents
基板処理装置、半導体装置の製造方法及び記録媒体 Download PDFInfo
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- WO2016157402A1 WO2016157402A1 PCT/JP2015/060097 JP2015060097W WO2016157402A1 WO 2016157402 A1 WO2016157402 A1 WO 2016157402A1 JP 2015060097 W JP2015060097 W JP 2015060097W WO 2016157402 A1 WO2016157402 A1 WO 2016157402A1
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Images
Classifications
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- G—PHYSICS
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- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4183—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
- G05B23/0283—Predictive maintenance, e.g. involving the monitoring of a system and, based on the monitoring results, taking decisions on the maintenance schedule of the monitored system; Estimating remaining useful life [RUL]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
Definitions
- This relates to maintenance part management of a semiconductor manufacturing apparatus which is a kind of substrate processing apparatus for processing a substrate.
- part life, maintenance cycle, etc. are determined for each part.
- device manufacturers customers who use semiconductor manufacturing equipment
- clean parts that are managed by cumulative film thickness, such as quartz parts and exhaust pipes, and replace parts as needed.
- overhaul (O / H) and adjustment (calibration) for preventive maintenance are performed based on the elapsed time.
- parts (maintenance parts) other than some parts such as quartz parts as described above are generally replaced only when they are out of order (when there is some trouble). This is because the usage status of parts cannot be accurately grasped.
- the timing at which this part fails is when the device is in operation (manufacturing a product), it will cause a lot-out.
- the diameter of a silicon wafer increases, the integration of semiconductor devices increases, and the 3D structure increases, the amount of damage in the case of lot-out increases, and measures for more stable operation of the apparatus are necessary.
- An object of the present invention is to provide a configuration capable of grasping the usage status of components constituting a substrate processing apparatus.
- monitoring item information for displaying a monitoring item for monitoring a maintenance part selected as a monitoring target, setting information for setting a threshold value for the maintenance part, monitoring data for the maintenance part, and Monitoring item list information that holds the monitoring information including the number of resets that initialized the maintenance component, and component management information that holds the monitoring information for each unit configured with the maintenance component according to the monitoring item, , And an operation unit that transfers the monitoring data from the device data collected from the unit to the data collection controller, the data collection controller including the component management information and the monitoring In the operation unit, the monitoring data included in at least one of the item list information has reached the threshold value.
- the operation unit transmits an instruction to initialize the monitoring data to the data collection controller after completion of maintenance in the unit in which the monitoring data that has reached the threshold is generated, and the data collection controller A configuration is provided that initializes the monitoring data of the component management information to count up the number of resets, and initializes the monitoring data of the monitoring item list information according to the content of the maintenance.
- the present invention it is possible to grasp the maintenance time of parts constituting the substrate processing apparatus and provide stable operation of the substrate processing apparatus.
- FIG. 1 It is a perspective view which shows the substrate processing apparatus used suitably for one Embodiment of this invention. It is a sectional side view which shows the substrate processing apparatus used suitably for one Embodiment of this invention. It is sectional drawing which shows the controller structure (vertical semiconductor manufacturing apparatus) used suitably for one Embodiment of this invention. It is a figure which shows the structure of the main controller (operation part) used suitably for one Embodiment of this invention. It is a figure for showing the definition of the maintenance parts used suitably for the substrate processing apparatus of the present invention. It is a figure explaining the processing flow of the maintenance component management function used suitably for the board
- FIG. 1 It is a perspective view which shows the substrate processing apparatus used suitably for one Embodiment of this invention. It is a sectional side view which shows the substrate processing apparatus used suitably for one Embodiment of this invention. It is sectional drawing which shows the controller structure (vertical semiconductor manufacturing apparatus) used suitably for one Embodiment of
- the substrate processing apparatus 1 includes a housing 2, and a front maintenance port 4 serving as an opening provided for maintenance can be opened at a lower portion of the front wall 3 of the housing 2. Opened and closed by the maintenance door 5.
- a pod loading / unloading port 6 is opened on the front wall 3 of the housing 2 so as to communicate with the inside and outside of the housing 2, and the pod loading / unloading port 6 is a front shutter (loading / unloading opening / closing mechanism) 7.
- a load port (substrate transfer container delivery table) 8 is installed in front of the front side of the pod loading / unloading port 6, and the load port 8 is configured to align the placed pod 9. Has been.
- the pod 9 is a hermetically sealed substrate transfer container, and is loaded into the load port 8 by an in-process transfer device (not shown) and unloaded from the load port 8.
- a rotary pod shelf (substrate transfer container storage shelf) 11 is installed at an upper portion of the housing 2 at a substantially central portion in the front-rear direction.
- the rotary pod shelf 11 includes a plurality of pods 9. It is configured to store.
- the rotary pod shelf 11 is a vertically-supported support column 12 that is intermittently rotated, and a plurality of shelf plates (substrate transfer container placement) that are radially supported by the support column 12 at the upper, middle, and lower positions.
- the shelf 13 is configured to store the pod 9 in a state where a plurality of the pods 9 are mounted.
- a pod opener (substrate transfer container lid opening / closing mechanism) 14 is provided below the rotary pod shelf 11.
- the pod opener 14 can mount the pod 9 and can open and close the lid of the pod 9. It has a configuration.
- a pod transfer mechanism (container transfer mechanism) 15 is installed between the load port 8 and the rotary pod shelf 11 and the pod opener 14, and the pod transfer mechanism 15 holds the pod 9.
- the pod 9 can be moved between the load port 8, the rotary pod shelf 11, and the pod opener 14.
- a sub-housing 16 is provided over the rear end of the lower portion of the housing 2 at a substantially central portion in the front-rear direction.
- a pair of wafer loading / unloading ports (substrate loading / unloading ports) 19 for loading / unloading wafers (substrates) 18 into / from the sub-casing 16 are arranged on the front wall 17 of the sub-casing 16 vertically and vertically.
- the pod openers 14 are provided to the upper and lower wafer loading / unloading ports 19, 19, respectively.
- the pod opener 14 includes a mounting table 21 on which the pod 9 is mounted and an opening / closing mechanism 22 that opens and closes the lid of the pod 9.
- the pod opener 14 is configured to open and close the wafer doorway of the pod 9 by opening and closing the lid of the pod 9 mounted on the mounting table 21 by the opening and closing mechanism 22.
- the sub casing 16 constitutes a transfer chamber 23 that is airtight from a space (pod transport space) in which the pod transport mechanism 15 and the rotary pod shelf 11 are disposed.
- a wafer transfer mechanism (substrate transfer mechanism) 24 is installed in the front region of the transfer chamber 23, and the wafer transfer mechanism 24 has a required number of wafers 18 (five in the drawing).
- a wafer mounting plate 25 is provided, and the wafer mounting plate 25 can move in the horizontal direction, rotate in the horizontal direction, and move up and down.
- the wafer transfer mechanism 24 is configured to load and unload the wafer 18 with respect to a boat (substrate holder) 26.
- a standby unit 27 that accommodates and waits for the boat 26 is configured, and a vertical processing furnace 28 is provided above the standby unit 27.
- the processing furnace 28 has a processing chamber 29 formed therein, the lower end portion of the processing chamber 29 is a furnace port portion, and the furnace port portion is opened and closed by a furnace port shutter (furnace port opening / closing mechanism) 31. It has become.
- a boat elevator (substrate holder lifting mechanism) 32 for raising and lowering the boat 26 is installed between the right end of the casing 2 and the right end of the standby section 27 of the sub casing 16.
- a seal cap 34 serving as a lid is horizontally attached to an arm 33 connected to a lifting platform of the boat elevator 32.
- the seal cap 34 supports the boat 26 vertically, and the boat 26 is treated as described above.
- the furnace port portion can be hermetically closed while being charged in the chamber 29.
- the boat 26 is configured to hold a plurality of (for example, about 50 to 125) wafers 18 in a horizontal posture with the wafers 18 aligned in the center.
- a clean unit 35 is disposed at a position opposite to the boat elevator 32 side, and the clean unit 35 includes a supply fan and a dust filter so as to supply a clean atmosphere or clean air 36 which is an inert gas. ing. Between the wafer transfer mechanism 24 and the clean unit 35, a notch alignment device (not shown) is installed as a substrate alignment device for aligning the circumferential position of the wafer 18.
- the clean air 36 blown out from the clean unit 35 is circulated through a notch aligner (not shown), the wafer transfer mechanism 24, and the boat 26, and is then sucked in by a duct (not shown), 2 is exhausted to the outside or is blown into the transfer chamber 23 by the clean unit 35.
- the pod loading / unloading port 6 When the pod 9 is supplied to the load port 8, the pod loading / unloading port 6 is opened by the front shutter 7.
- the pod 9 on the load port 8 is loaded into the housing 2 by the pod transfer device 15 through the pod loading / unloading port 6 and placed on the designated shelf plate 13 of the rotary pod rack 11. Is done.
- the pod 9 is temporarily stored in the rotary pod shelf 11, and is then transferred from the shelf plate 13 to one of the pod openers 14 by the pod transfer device 15 and transferred to the mounting table 21. Alternatively, it is transferred directly from the load port 8 to the mounting table 21.
- the wafer loading / unloading port 19 is closed by the opening / closing mechanism 22, and the clean air 36 is circulated and filled in the transfer chamber 23.
- the oxygen concentration is set to 20 ppm or less, which is much lower than the oxygen concentration inside the housing 2 (atmosphere). ing.
- the opening side end surface of the pod 9 placed on the mounting table 21 is pressed against the opening edge of the wafer loading / unloading port 19 in the front wall 17 of the sub casing 16 and the lid is opened and closed. It is removed by the mechanism 22 and the wafer entrance is opened.
- the wafer 18 is taken out from the pod 9 by the wafer transfer mechanism 24 and transferred to a notch aligning device (not shown). After aligning 18, the wafer transfer mechanism 24 loads the wafer 18 into the standby section 27 located behind the transfer chamber 23 and charges (charges) the boat 26.
- the wafer transfer mechanism 24 that has transferred the wafer 18 to the boat 26 returns to the pod 9 and loads the next wafer 18 into the boat 26.
- the other (lower or upper) pod opener 14 has the rotary pod shelf. 11 and another pod 9 is transferred and transferred by the pod transfer device 15, and the opening operation of the pod 9 by the other pod opener 14 is simultaneously performed.
- the furnace port portion of the processing furnace 28 closed by the furnace port shutter 31 is opened by the furnace port shutter 31. Subsequently, the boat 26 is raised by the boat elevator 32 and loaded into the processing chamber 29.
- the furnace port After loading, the furnace port is hermetically closed by the seal cap 34.
- the processing chamber 29 has a purge process (pre-purge process) in which it is replaced with an inert gas.
- the process chamber 29 is evacuated by a gas evacuation mechanism (not shown) so as to have a desired pressure (degree of vacuum).
- the processing chamber 29 is heated to a predetermined temperature by a heater driving unit (not shown) so as to have a desired temperature distribution.
- a process gas controlled to a predetermined flow rate is supplied by a gas supply mechanism (not shown), and the process gas is in contact with the surface of the wafer 18 in the process of flowing through the process chamber 29. Predetermined processing is performed on the top. Further, the processed gas after the reaction is exhausted from the processing chamber 29 by the gas exhaust mechanism.
- an inert gas is supplied from an inert gas supply source (not shown) by the gas supply mechanism, the processing chamber 29 is replaced with an inert gas, and the processing chamber The pressure of 29 is returned to normal pressure (after purge process). Then, the boat 26 is lowered by the boat elevator 32 through the seal cap 34.
- the wafer 18 and the pod 9 are paid out to the outside of the casing 2 in the reverse order of the above description. Unprocessed wafers 18 are further loaded into the boat 26, and batch processing of the wafers 18 is repeated.
- the processing furnace 28, a pod transport mechanism 15 which is a mechanism for transporting at least a substrate, a transport mechanism including a wafer transfer mechanism 24, a boat elevator 32, etc., a gas supply mechanism for supplying a processing gas or the like to the processing furnace 28, the processing A gas exhaust mechanism for exhausting the inside of the furnace 28, a heater driving unit for heating the processing furnace 28 to a predetermined temperature, and the processing furnace 28, the transport mechanism, the gas supply mechanism, the gas exhaust mechanism, and the heater driving unit, respectively.
- the control system 240 to control is demonstrated with reference to FIG. 3, FIG.
- a main controller 201 a transport system controller 211 as a transport control unit, a process system controller 212 as a processing control unit, a management device, and a data collection controller 215 as a data monitoring unit, I have. Since the main controller 201 is electrically connected to the transport system controller 211 and the process system controller 212 via a LAN (Local Area Network) such as 100BASE-T, for example, transmission / reception of each device data, downloading and uploading of each file, etc. Is possible.
- LAN Local Area Network
- the main controller 201 is provided with a port as a mounting portion into which a USB memory or the like as a recording medium as an external storage device is inserted or removed. An OS corresponding to this port is installed in the main controller 201.
- the main controller 201 is connected to an external host computer (not shown) via a communication network, for example. For this reason, even if the substrate processing apparatus 1 is installed in a clean room, the host computer can be placed in an office or the like outside the clean room.
- the management apparatus is connected to the substrate processing apparatus 1 via a LAN line and has a function of collecting apparatus data from the operation unit 201.
- the data collection controller 215 is connected to the operation unit 201 via a LAN line, and has a function of collecting monitoring data of maintenance parts set in advance among the device data from the operation unit 201.
- the monitoring data is data for monitoring maintenance information of each component constituting the substrate processing apparatus 1.
- the types of maintenance parts to be monitored are defined in advance as three as shown in FIG.
- the data collection controller 215 receives a communication unit that transmits and receives various data to and from the operation unit 201, and apparatus data transmitted from the substrate processing apparatus via the communication unit, and includes the apparatus data.
- the message analysis unit that allocates request messages and notification messages to each unit according to the content of the message and the data received from the communication unit, updates the monitoring data for monitoring data, and updates the device data for device data
- An apparatus data control unit that processes the monitoring data into screen display data and updates the screen display data, and a screen display unit that displays various data on the screen. This functional configuration is an example, and the screen display unit may not be provided.
- the operation unit 201 and a terminal connected for screen reference may be substituted.
- the data collection controller 215 has a database function for collecting device data, and can be graphed in time series using the accumulated monitoring data or device data as shown in FIG.
- the function of processing device data to create monitoring data includes a main controller 201 as an operation unit, a transfer system controller 211 as a transfer control unit, a process system controller 212 as a processing control unit, and a data monitoring unit.
- the data collection controller 215 may be incorporated in any controller.
- the operation unit 201 has only wafer processing (substrate processing) and a higher-level reporting function, but is not limited to such a form.
- the data (monitoring data) related to the maintenance parts of the data collection controller 215 may be collected and managed in the main controller 201.
- each unit shown in FIG. 10 described later may be integrated into the main controller (operation unit) 201.
- the transfer system controller 211 mainly includes a rotary pod shelf 11, a boat elevator 32, a pod transfer device (substrate container transfer device) 15, a wafer transfer mechanism (substrate transfer mechanism) 24, a boat 26, and a rotation mechanism (not shown).
- the transfer system controller 211 includes a rotary pod shelf 11, a boat elevator 32, a pod transfer device (substrate container transfer device) 15, a wafer transfer mechanism (substrate transfer mechanism) 24, a boat 26, and a rotation mechanism (not shown).
- the transfer system controller 211 controls the transfer operations of the boat elevator 32, the pod transfer device (substrate container transfer device) 15, and the wafer transfer mechanism (substrate transfer mechanism) 24 via the motion controller 216, respectively. It is configured.
- the process system controller 212 includes a temperature controller 212a, a pressure controller 212b, a gas flow rate controller 212c, and a sequencer 212d. These temperature controller 212a, pressure controller 212b, gas flow rate controller 212c, and sequencer 212d constitute a sub-controller and are electrically connected to the process system controller 212, so that each data is transmitted and received, each file is downloaded and uploaded, etc. Is possible.
- the process system controller 212 and the sub-controller are illustrated as separate bodies, but may be integrated.
- a heating mechanism 212A mainly composed of a heater, a temperature sensor, and the like is connected to the temperature controller 212a.
- the temperature controller 212 a is configured to adjust the temperature in the processing furnace 28 by controlling the temperature of the heater of the processing furnace 28.
- the temperature controller 212a is configured to perform switching (on / off) control of the thyristor and control power supplied to the heater wire.
- a gas exhaust mechanism 212B mainly composed of a pressure sensor, an APC valve as a pressure valve, and a vacuum pump is connected to the pressure controller 212b.
- the pressure controller 212b switches the opening of the APC valve and the vacuum pump (on / off) so that the pressure in the processing chamber 29 becomes a desired pressure at a desired timing based on the pressure value detected by the pressure sensor. Is configured to control.
- the gas flow rate controller 212c is configured by an MFC (Mass Flow Controller).
- the sequencer 212d is configured to control the supply and stop of gas from the processing gas supply pipe and the purge gas supply pipe by opening and closing the valve 212D. Further, the process system controller 212 controls the gas flow rate controller 212c (MFC) and the sequencer 212d (valve 212D) so that the flow rate of the gas supplied into the processing chamber 29 becomes a desired flow rate at a desired timing. It is configured.
- the main controller 201, the transport system controller 211, and the process system controller 212 according to the embodiment of the present invention can be realized using a normal computer system, not a dedicated system.
- each controller that executes a predetermined process is configured by installing the program from a recording medium (flexible disk, CD-ROM, USB, or the like) that stores the program for executing the above-described process in a general-purpose computer. can do.
- And means for supplying these programs is arbitrary.
- it may be supplied via a communication line, a communication network, a communication system, or the like.
- the program may be posted on a bulletin board of a communication network, and the program may be provided by being superimposed on a carrier wave via the network.
- a predetermined process can be executed by starting the program thus provided and executing it in the same manner as other application programs under the control of the OS.
- the operation unit 201 includes a CPU (Central Processing Unit) 224 as a processing unit, a memory (RAM, ROM, etc.) 226 as a temporary storage unit, a hard disk (HDD) 222 as a storage unit, a transmission / reception module 228 as a communication unit, a display
- the display device 218 as a unit and a computer having a clock function (not shown) are configured.
- the hard disk 222 includes recipe files such as recipes in which processing conditions and processing procedures are defined, control program files for executing these recipe files, parameter files for setting processing conditions and processing procedures, and errors.
- various screen files including an input screen for inputting process parameters, various icon files, and the like (all not shown) are stored.
- a parts management program (FIG. 6) for managing maintenance parts of the semiconductor manufacturing apparatus is stored.
- screen tables (files) of the respective screens shown in FIGS. 7 to 9, 11, 12, and 14 to 20 described later are stored.
- the display device 218 as a display unit is configured to display an operation screen for operating the substrate processing apparatus 1.
- the operation screen of the display device 218 is, for example, a liquid crystal display panel.
- the operation screen of the display device 218 includes a screen for confirming the state of the substrate transport system and the substrate processing system.
- an input unit for inputting operation instructions to the substrate transport system 211A and the substrate processing system (the heating mechanism 212A, the gas exhaust mechanism 212B, and the gas supply system 212C) shown in FIG. It is also possible to provide each operation button.
- the display device 218 displays information generated in the substrate processing apparatus 100 on the operation screen via the operation screen.
- the display device 218 outputs information displayed on the operation screen to a device such as a USB memory inserted in the main controller 201.
- the display device 218 accepts operator input data (input instruction) from the operation screen and transmits the input data to the main controller 201.
- the display device 218 also instructs (controls) to execute an arbitrary substrate processing recipe (also referred to as a process recipe) out of a recipe developed in a memory (RAM) described later or a plurality of recipes stored in a storage unit described later. Instruction) is received and transmitted to the main controller 201.
- the data collection controller 215 executes the component management program, the stored screen tables are expanded and the data is read, so that FIGS. 7 to 9, 11, 12, and 14 to 20 are performed. Each screen shown is configured to be displayed on the display unit 218.
- the operation unit 201 includes a main control unit 220 including at least a CPU 224 and a memory 226, a communication unit 228 that transmits and receives data to and from an external computer via a network, and a storage unit 222 such as a hard disk drive.
- a configuration including a display unit such as a liquid crystal display and a user interface (UI) unit including a pointing device such as a keyboard and a mouse may be used.
- the control unit 220 may further include a communication unit 228.
- the main controller 201 transmits apparatus data such as the state of the substrate processing apparatus 1 to an external host computer, for example, a host computer, via a network (not shown).
- the substrate processing apparatus 1 is a vertical apparatus that performs, for example, oxidation, diffusion processing, and CVD processing on a substrate.
- the substrate processing apparatus 1 is controlled by the control system 240 based on each recipe file, each parameter file, and the like stored in the storage unit 222.
- the predetermined processing step is a substrate processing step which is one step of the semiconductor device manufacturing step is taken as an example.
- a substrate processing recipe (process recipe) corresponding to the substrate processing to be executed is developed in a memory such as a RAM in the process system controller 212, for example. Then, if necessary, an operation instruction is given from the main controller 201 to the process system controller 212 and the transport system controller 211.
- the substrate processing process performed in this manner includes at least a carry-in process, a film forming process, and a boat transfer process. Further, the transfer process (which may include a substrate loading process described later) may be included in the substrate processing process.
- the main controller 201 issues a drive instruction for the wafer transfer mechanism 24 to the transfer system controller 211. Then, while following the instruction from the transfer system controller 211, the wafer transfer mechanism 24 starts the transfer process of the wafer 18 from the pod 9 on the transfer stage 21 as a mounting table to the boat 26. This transfer process is performed until all the scheduled loading of wafers 18 into the boat 26 (wafer charge) is completed.
- the inside of the processing chamber 29 is evacuated by a vacuum evacuation device so as to have a predetermined film formation pressure (degree of vacuum) while following an instruction from the pressure controller 212b.
- the pressure in the processing chamber 29 is measured by a pressure sensor, and the pressure adjusting device is feedback-controlled based on the measured pressure information.
- the inside of the processing chamber 29 is heated by a heater so as to reach a predetermined temperature while following an instruction from the temperature control unit 212a.
- the current supply to the heater is feedback-controlled based on temperature information detected by a temperature sensor as a temperature detector so that the temperature in the processing chamber 29 becomes a predetermined temperature (film formation temperature).
- a predetermined gas processing gas
- predetermined processing for example, film formation
- the boat 26 holding the processed wafers 18 is extremely effectively cooled by the clean air 36 blown out from the clean unit 35. For example, when cooled to 150 ° C. or lower, the processed wafer 18 is removed from the boat 26 (wafer discharge) and transferred to the pod 9, and then a new unprocessed wafer 18 is transferred to the boat 26. Is done.
- the substrate processing apparatus 1 can, for example, form a silicon film on the wafer 18 with high throughput. .
- Maintenance parts to be monitored will be described with reference to FIG.
- Maintenance parts of semiconductor manufacturing apparatuses are usually described in a spare parts list and provided to customers.
- Three categories of spare parts are defined as part categories. That is, a part corresponding to the category defined in FIG. 5 is a part that requires maintenance (maintenance) described in the spare parts list (that is, a maintenance part). Further, although not shown in FIG. 5, the spare part list describes the part life and the maintenance cycle for each spare part part.
- expensive parts include various quartz parts, heaters (including jacket heaters), thermocouples (TC), magnetic seals, APC valves, transport system parts such as drivers, and various controllers. .
- parts that require overhaul include various quartz parts, heaters (including jacket heaters), thermocouples (TCs), magnetic seal motors, and transport system parts such as drivers.
- parts that should be maintained with an equipment manufacturer service company include a wafer transfer mechanism (substrate transfer mechanism) as a transfer machine among transfer system parts such as APC valves, magnetic seals, and drivers. ) 24.
- wafer transfer mechanism substrate transfer mechanism
- FIGS. 6A and 6B are flowcharts for explaining the processing flow of the maintenance parts management function in the substrate processing apparatus 1 in this embodiment.
- the device data is reported to the operation unit 201 from the processing control unit 212 at regular intervals.
- the operation unit 201 extracts the component monitoring data to be monitored from the collected device data, and reports the component monitoring data to the data collection controller 215 at a constant cycle.
- the data collection controller 215 Comparison with the threshold set for each component monitoring data. When at least one of the component monitoring data in the monitoring item list screen (FIG. 8) described later and the component monitoring data in the component management screen (FIG. 9) described later exceeds this threshold, Information that the threshold is exceeded (threshold over information) is notified to the operation unit 201 (threshold over notification).
- the operation unit 201 displays alert information or alarm information indicating that the monitoring data has exceeded the threshold value for the maintenance part on the display unit 218.
- the operation unit 201 may display a screen that prompts replacement work.
- the operation unit 201 refers to the device management data for managing the device state stored in the storage unit 222 in advance, and the state of the module composed of the maintenance parts whose monitoring data exceeds the threshold is determined as the next operation. It is determined whether the maintenance designation such as waiting for execution is possible, and if the condition is such that the maintenance can be shifted, the maintenance designation is instructed.
- the processing control unit 212 receives the maintenance designation, shifts the state of the corresponding module to the maintenance waiting state, and disables execution of the next operation.
- maintenance transition display step only maintenance target modules are designated for maintenance.
- This maintenance designation is indispensable particularly for an apparatus having a plurality of process modules. For example, by specifying maintenance, the corresponding process module can be separated from automatic operation, and a degenerate operation that enables processing to be continued by a process module other than the process module specified for maintenance is enabled.
- maintenance is executed for the process module specified for maintenance. For example, when the accumulated film thickness of the process module is abnormal, a cleaning recipe is executed, or in the case of a vertical apparatus, recovery processing such as replacement of the boat 26 is performed. After the restoration process, a predetermined setup operation is performed and the maintenance is completed.
- the maintenance control unit After the device administrator or device engineer maintains the target module, the maintenance control unit issues a command to the processing control unit 212 through the operation screen of the operation unit 201. For example, a command for canceling the maintenance designation is issued to the control unit 212 at the timing when the quartz setup of the process module is completed and the wafer process is ready, and the control unit 212 changes the status of the target module, for example, The state is changed to the next operation execution waiting state, and the module usable by the control unit 212 is set.
- the operation unit 201 executes a maintenance release designation, and then displays a log that prompts initialization of parts monitoring data of maintenance parts to prompt initialization or resetting.
- the function of displaying this dialog box is not essential and may be omitted from this flowchart. Needless to say, an effect of suppressing forgetting to initialize the part monitoring data after maintenance can be expected by displaying on the display unit 218 a screen prompting the initialization of the part monitoring data.
- the operation unit 201 is configured to display a screen for prompting initialization of the component monitoring data to be maintained and to determine whether or not the component monitoring data to be maintained is initialized. When there is no need to initialize, the flowchart is ended, and when there is component monitoring data that needs to be initialized, which component is the initialization target component is selected. When the initialization target part is selected, the operation unit 201 instructs the data collection controller 215 to initialize the part monitoring data of the maintenance part related to the maintenance-completed module.
- the data collection controller 215 is configured to initialize the component monitoring data to be initialized based on an instruction from the operation unit 201. For example, when the monitor value of the component monitoring data to be initialized is cleared to zero (sometimes referred to as reset), the reset count is counted up. With such a configuration, forgetting to initialize after maintenance can be suppressed.
- the operation unit 201 may receive an operator input from the display unit 218 so that the monitor value of the component monitoring data can be cleared to zero. In this way, it is more efficient from the viewpoint of component life monitoring. It is possible to grasp the operation status of parts well.
- the monitor value on the monitoring item data list screen in FIG. 8 described later is configured so that the monitor value cannot be cleared to zero on the component management program, and only the monitor value on the component management screen in FIG. It is configured so that it can be cleared to zero.
- FIG. 7 is an example of a selection screen for selecting a screen for managing maintenance parts.
- the maintenance parts management selection screen shown in FIG. 7 is displayed.
- FIG. 7 shows an example in which a warning (alert) has occurred in a monitoring item on the monitoring item data list screen.
- ALM an abnormality (alarm) has occurred in a monitoring item of each unit.
- each unit as a management area in which an alarm is generated may be configured to be inoperable until the cause of the alarm is removed. This is because, for example, a device including a unit in which a component life alarm has occurred cannot guarantee stable operation.
- the parts maintenance function screen (maintenance parts management selection screen shown in FIG. 7) may be displayed only when a special terminal is connected according to the operation method.
- FIG. 8 which is an example of a monitoring item data list screen relating to maintenance parts, will be described.
- FIG. 8 is configured to display the monitoring item data list screen when the data collection controller 215 executes the component management program as in FIG.
- FIG. 8 is configured to be displayed when the monitoring item data list button in FIG. 7 is pressed.
- the monitoring item data list screen mainly displays a list of monitoring items selected as maintenance parts in each unit.
- the monitor information as the monitor information displayed here may be referred to as lifetime information.
- the lifetime information may include a setting information for setting a threshold for notifying an alert or an alarm and the monitor information.
- the monitoring item data list screen shown in FIG. 8 may be displayed only when a special terminal is connected, as in FIG.
- the monitoring items shown in the monitoring item data list screen of FIG. 8 are the source of monitoring information for monitoring monitor values as component monitoring data such as the movement distance, usage frequency, and energization time of the maintenance components to be monitored as maintenance components. Information.
- the lifetime information for this monitoring item is configured to be retained without being initialized even during parts replacement or maintenance.
- For selection of monitoring items to be monitored for maintenance parts constituting each unit, for example, the number of AV open times and the MFC integrated flow rate required on the Gas System parts management screen described later are items that are particularly important in film formation. To be monitored. In addition, this monitoring item is configured to be arbitrarily added or deleted for each unit.
- the data collection controller 215 notifies the operation unit 201 of an alert or alarm when the component monitoring data exceeds the threshold specified by the setting information on the monitoring item data list screen of FIG. Since the flow of the parts management program after notification overlaps with the description of FIG. 6, only the differences will be described.
- the data collection controller 215 In response to a data initialization instruction from the operation unit 201 for shifting to the initialization process shown in FIG. 6, the data collection controller 215 initializes the component monitoring data (monitor value) on FIGS. 9A to 9G described later. (Monitor value is set to 0).
- the object to be initialized by the component management program shown in FIG. 6 is the component monitoring data on the component management screen shown in FIG. 9 (FIGS. 9A to 9G) described later.
- the component monitoring data is configured not to be initialized by the component management program as lifetime information (cumulative information) even during component replacement or maintenance.
- the maintenance component is basically replaced. This is because the setting information (number of times, time, etc.) in consideration of the life of each component is selected as the setting information on the monitoring item data list screen in FIG. That is, it is considered that the component life has been reached.
- the setting information in FIG. 9 may be different even for settings for the same maintenance part, such as when the replacement period can be extended by a recovery process such as a cleaning process for a quartz part or a grease-up process in a transport system.
- the maintenance staff can update the monitor value and the number of resets, which are monitor information, by directly performing a predetermined operation on the screen of FIG.
- the monitor value can be set to 0 only when the maintenance staff initializes on the screen. For example, when replacing consumable parts such as heaters and boats with new ones, initialization is possible.
- the maintenance staff can perform a process of returning the number of resets to 0 by a predetermined operation in the same manner as the monitor information.
- the maintenance staff can add one reset count.
- the number of resets on the screen of FIG. 9 is configured so that the number of resets cannot be reset to zero unless the maintenance staff operates.
- the monitor value as the monitoring item data it may be configured such that it is automatically converted into a CSV file periodically, for example, on a daily or monthly basis. For example, it is preferable not to check the file immediately, such as setting the file name to a date or a monitoring item name.
- each data management screen is displayed when the data collection controller 215 executes the parts management program. Note that display may be possible only when a special terminal is connected, as in FIGS.
- the maintenance parts and details of the maintenance parts are appropriately selected based on the monitoring items of FIG.
- the monitor information including setting information for setting the threshold value of the maintenance component, component monitoring data of the maintenance component, and the number of times the maintenance component has been reset is displayed as the component management information related to this monitoring item. Respectively.
- the data collection controller 215 sends an alert or alarm to the operation unit 201. Notify The flow of the component management program after the notification overlaps with the description of FIG.
- the data collection controller 215 causes component monitoring data (monitor value) displayed in FIG. 9 (FIGS. 9A to 9G) to be described later. ) Is initialized (monitor value is set to 0). Further, with respect to FIG. 6, the reset count displayed in FIG. 9 (FIGS.
- FIG. 9A is an example of a component management screen showing the Furnace Unit shown in FIGS. 7 and 8.
- monitoring data of maintenance parts related to the furnace port is displayed.
- the parts corresponding to the following (1) to (4) are targeted for maintenance parts.
- (4) It is necessary to contact the service base in advance before exchanging expensive parts.
- this heater thermocouple is configured to be managed by the heater ON time as a monitoring item. Furthermore, as a monitoring item, the heater temperature history is configured, and specifically, the temperature range used when the heater is turned on is displayed. For example, if the life of the heater exceeds 800 ° C., the life is remarkably affected. Therefore, in terms of management of maintenance parts, it is necessary to display up to which temperature range it is used. For example, when the heater ON time setting value (for example, 10000H) is a setting for low temperature film formation at a temperature of 400 ° C., the actual process is subjected to an annealing process at a temperature of 800 ° C. due to a specification change or the like.
- the heater ON time setting value for example, 10000H
- thermocouple T / C
- T / C the heater thermocouple
- the heater has a significant effect on the life of the heater when the temperature is higher than the high temperature range (for example, 800 ° C.). If the usage record at a high temperature is high, even if the elapsed time is not a guideline for replacement, it can be replaced for stable operation in the future.
- the high temperature range for example, 800 ° C.
- FIG. 9B is an example of a component management screen showing the DeviceMechanisms Unit shown in FIGS. 7 and 8.
- This screen is mainly used for monitoring maintenance parts constituting a transport mechanism including a pod transport mechanism 15, a wafer transfer mechanism 24, a boat elevator 32, and the like, which are mechanisms for transporting the substrate 18.
- monitoring data of maintenance parts related to the drive system including these transport mechanisms is displayed.
- the parts constituting the drive system the parts corresponding to the following (1) to (4) are set as the maintenance parts as in FIG. 9A. (1) It is described in the spare parts list. (2) Overhaul and maintenance by equipment manufacturer engineers are required. (3) It is an important part for stable operation. (4) It is necessary to contact the service base in advance before replacing expensive parts.
- the unit 7 is a unit that operates by ON / OFF using AirN2.
- Each transfer mechanism is managed by the power ON time, and in particular, the pod transfer mechanism 15 and the wafer transfer mechanism 24 are also managed by the number of ON / OFF times. This is because there may be a case where the apparatus is not actually operating even when the power is on only.
- the unit 17 is a unit that operates by motor control.
- Each axis of the pod transfer mechanism 15 and the wafer transfer mechanism 24 has a time during which the transfer mechanism is not actually operated even when the power is turned on. But manage. As a result, although the maintenance is currently proposed in a period such as half a year, an appropriate maintenance proposal is expected from the power ON time and the number of ON / OFF times.
- the monitoring item in FIG. 8 is the Z axis (No. 9)
- the maintenance part selected by the monitoring item (No. 9) in FIG. 8 is the monitoring item (No. 10 in FIG. 9B).
- Z axis of the transfer machine If the content of the maintenance is a transfer system, for example, the Z axis of the transfer machine is greased, the monitor value of the monitoring item (No. 10: Z axis of the transfer machine) in FIG. 9B is cleared to zero and the number of resets Is configured to be counted up. However, the monitor value of the Z-axis (No. 9) in FIG. Therefore, the number of resets is not counted up.
- grease-up will be given regarding grease-up.
- Grease up is an operation to remove and apply new grease to the drive shaft because grease is consumed and soiled due to repeated operation.
- a transfer machine and a boat elevator in a transport system are greased once every three months as a guide, and parts are not normally replaced at this timing.
- the setting information of the maintenance part (No. 10: Z axis of the transfer machine) in FIG. 9B is set in accordance with the grease-up cycle, and the monitoring item (No. 9) in FIG. A conscious setting is made.
- efficient parts management can be performed by making different maintenance timing setting information for the same parts.
- the monitor value of the monitoring item (No. 10: Z axis of the transfer machine) in FIG. 9B is configured to be cleared to zero and the number of resets is counted up.
- the monitoring item (No. 9) in FIG. From the instruction, the monitor value is cleared to zero and the number of resets is also counted up.
- the monitoring item in FIG. 8 is “transfer machine”
- the maintenance part selected by the monitoring item (transfer machine) in FIG. 8 is the monitoring item (No. 10: Z axis of transfer machine, No. 11: Y axis of transfer machine, No. 12: X axis of transfer machine, No. 13: V axis of transfer machine). That is, this is an example in which a plurality of maintenance parts in FIG. 9 are selected for one monitoring item in FIG.
- the monitor value of the monitoring item (No. 10: Z axis of the transfer machine) in FIG. Is configured to be counted up.
- the monitor value of the transfer machine is the monitor value of the transfer machine as it is. If the content of the maintenance is replacement of the Z-axis part of the transfer machine, the monitor value of No. 10: No. 10: Z-axis of the transfer machine is cleared to zero and the number of resets is counted up. Configured to be. However, the monitor item of FIG. 8 is the monitor value of the transfer machine as it is. When the transfer machine is replaced with a new one for maintenance, the monitor value of the monitoring item in FIG. 8 and the monitor value of the maintenance part selected by the monitoring item in FIG. 9 are each cleared to zero, and the number of resets is also counted up. .
- the operation on the monitoring item list screen (FIG. 8) after maintenance differs depending on the relationship between the monitoring item and the maintenance part selected by the monitoring item. Further, the count up of the number of resets also differs depending on the relationship between the monitoring item and the maintenance part selected by the monitoring item. Therefore, in order to simplify handling after maintenance, the monitoring item selected in FIG.
- the relationship of maintenance parts selected by this monitoring item is preferably 1: 1.
- FIG. 9C is an example of a component management screen showing the GasSystem Unit shown in FIGS. 7 and 8. Mainly, monitoring data of maintenance parts related to the gas supply system is displayed. Among the parts constituting the gas system, parts corresponding to the following (1) to (3) are targeted for maintenance parts. (1) It is described in the spare parts list. (2) Overhaul and maintenance by equipment manufacturer engineers are required. (3) It is an important part for stable operation.
- the maintenance component corresponds to MFC (Mass Flow Controller) or valve AV. Further, not only the addition of MFC (or valve) but also the addition of other components (for example, a pipe heater provided in a pipe for supplying gas into the furnace) can be appropriately performed as necessary.
- MFC Mass Flow Controller
- valve AV valve AV
- other components for example, a pipe heater provided in a pipe for supplying gas into the furnace
- information related to maintenance of maintenance parts is displayed.
- the MFC and the valve are configured not only to determine whether to perform maintenance based on the power ON time as monitoring items, but also to determine the maintenance time using the integrated flow rate value for the MFC and the number of open times for the valve as the monitoring items.
- the relationship between the monitoring item selected in FIG. 8 and the maintenance parts selected by this monitoring item is preferably 1: 1.
- the monitoring item selected in FIG. 8 is preferably 1: 1.
- FIG. 9D is an example of a component management screen showing the Exhaust System Unit shown in FIGS. 7 and 8. It is a screen for monitoring maintenance parts constituting an exhaust system mainly including an APC (Auto Pressure Controller) valve as a monitoring item.
- APC Auto Pressure Controller
- FIG. 9D monitoring data of maintenance parts related to these exhaust systems is displayed.
- parts constituting the exhaust system parts corresponding to the following (1) to (4) are targeted for maintenance parts as in FIG. 9A and the like. (1) It is described in the spare parts list. (2) Overhaul and maintenance by equipment manufacturer engineers are required. (3) It is an important part for stable operation. (4) It is necessary to contact the service base in advance before replacing expensive parts.
- maintenance parts include a valve AV (No. 4 to No. 6) including an APC valve, a vacuum system (No. 1 to No. 3) including a dry pump and a mechanical booster pump, pressure sensors ( No. 7 to No. 9) are applicable.
- AV No. 4 to No. 6
- vacuum system No. 1 to No. 3
- pressure sensors No. 7 to No. 9
- other components for example, a pipe heater provided in a pipe for exhausting gas from the furnace can be added as appropriate.
- the valve AV can determine the maintenance time not only by the apparatus power ON time but also by the number of times of opening as in the case of the valve described above in the gas supply system of FIG. 9C. It is configured as follows. Further, the pump system is configured so that the maintenance time can be determined not only by the ON time but also by the accumulated film thickness.
- FIG. 9E to FIG. 9G are examples of parts management screens showing the Equipment Unit shown in FIG. 7 and FIG.
- FIG. 9E is a screen for monitoring maintenance parts related to the device-mounted controller.
- FIG. 9F is a screen for monitoring maintenance parts constituting the apparatus housing.
- FIG. 9G is a screen for monitoring maintenance parts related to quartz parts.
- the parts related to the device-mounted controller shown in FIG. 9E the parts corresponding to the following (1) to (3) are set as maintenance parts. (1) It is described in the spare parts list. (2) It is an important part for stable operation. (3) It is necessary to contact the service base in advance before replacing expensive parts.
- parts corresponding to the following (1) to (4) are targeted for maintenance parts.
- (1) It is described in the spare parts list.
- (3) It is an important part for stable operation.
- (4) It is necessary to contact the service base in advance before replacing expensive parts.
- FIG. 9E monitoring data of maintenance parts related to the device-mounted controller is displayed.
- FIG. 9F monitoring data of maintenance parts related to the apparatus housing is displayed.
- FIG. 9G monitoring data of maintenance parts related to the quartz parts is displayed.
- the controller as the maintenance component is monitored as the monitoring item for the apparatus power ON time.
- the clean unit as the maintenance part is monitored as a monitoring item for the elapsed time of the filter.
- the quartz part is managed by the cumulative film thickness value.
- heater temperature history management it is configured to display in which temperature zone the heater is used when the heater is turned on. For example, if the life of the heater exceeds 800 ° C., the life is remarkably affected. Therefore, in terms of management of maintenance parts, it is necessary to display up to which temperature range it is used. For example, when the set value of the cumulative film thickness value (for example, 1000 nm) is set for low-temperature film formation at a temperature of 400 ° C., the actual process is performed by annealing at a temperature of 800 ° C. due to a specification change or the like.
- the set value of the cumulative film thickness value for example, 1000 nm
- the actual process is performed by annealing at a temperature of 800 ° C. due to a specification change or the like.
- maintenance and replacement are recommended by referring to the monitoring item data of the maintenance part on the monitoring item list screen shown in FIG. 8 and the maintenance part management screen shown in FIGS. 9A to 9G.
- Service proposals can be implemented by picking up maintenance parts that have reached the limit.
- an error (or alert) generated in a maintenance target part is grasped on the maintenance part management selection screen shown in FIG.
- the GasSystem management is a button in FIG. 7 and is pressed to move to the maintenance part management screen (Gassystem management) in FIG. Can be confirmed.
- the maintenance part management screen (Gassystem management) in FIG. Can be confirmed.
- the number of times of use of the valve AV is high, replacement work can be proposed as maintenance while checking the screen.
- an error (or alert) generated in a maintenance target part is grasped on the maintenance part management selection screen shown in FIG.
- the DeviceMechanism Unit Management is a button in FIG. Check the details. For example, since an alert is generated for a unit other than the transfer machine repaired this time, a service proposal can be made. Moreover, it is possible to reset the monitor value of the transfer machine maintained this time.
- FIG. 11 shows the relationship between the moving distance of the transfer device (X axis) of the vertical apparatus and the date and time (time). This makes it possible to compare the moving distance of the transfer device (X axis) of the vertical apparatus with the overhaul threshold value and determine an appropriate maintenance time while viewing the movement distance on the screen.
- the data collection controller 215 is configured to display the movement distance integrated value of the X axis (transfer machine X axis) of the wafer transfer mechanism 24 in a graph.
- the integrated value of the travel distance, the recommended overhaul date and the recommended overhaul date due to the elapsed time after the maintenance (maintenance) can be compared.
- the vertical apparatus transfer machine (wafer transfer mechanism 24) needs to periodically overhaul. Conventionally, since the moving distance data of the axis of the transfer machine has not been acquired, overhaul is performed based on the elapsed time.
- the present embodiment it is possible to predict the optimal overhaul scheduled date by acquiring the movement distance data of the transfer machine X-axis of the maintenance parts management function. Furthermore, by superimposing the scheduled date recommended for the number of elapsed days so far on the graph, it is possible to recognize the date and time of arrival as the scheduled overhaul date.
- the APC valve used in the exhaust system is implemented with maintenance at the timing of cleaning and replacement of the quartz parts.
- the number of times of opening can be specified as a guideline for replacement, so the cumulative number of times of opening Is stored as monitoring item data, the scheduled replacement date can be predicted.
- the device administrator refers to the main screen (FIG. 7) of the maintenance component management function of the data collection controller to grasp the management area having components whose monitoring data exceeds the threshold. Touch the button in the management area to confirm the unit composed of maintenance parts that exceed the threshold. In this way, the device administrator can determine replacement or maintenance by referring to the main screen of maintenance parts management and looking at specific numerical values that take into account the operating status of the device in addition to the elapsed time.
- the service engineer of the device manufacturer responds to the failure of the semiconductor manufacturing apparatus installed in the device manufacturer by handling the failure of the device parts. For example, after performing failure handling, it is possible to make a proposal for a future device maintenance service by referring to the monitoring data of maintenance parts and displaying the graph to see the tendency of the monitoring data to be accumulated.
- a maintenance contract it is possible to propose a maintenance service that can contribute to the stable operation of the apparatus by obtaining the operating status of the apparatus and the accumulated value of the monitoring data from the device manufacturer.
- it is possible to optimize stock by preparing systematically only maintenance parts close to the replacement limit.
- a substrate processing apparatus 1 includes a process chamber (Process Chamber, abbreviated as PM) as a processing chamber for processing a substrate, and a vacuum robot that transports the substrate in a reduced pressure state.
- a transfer module Transfer Module, abbreviated as TM
- TM Transfer Module
- Loadlock Module Loadlock Module
- Equipment Front End Module Equipment Front End Module, abbreviated as EFEM
- EFEM Equipment Front End Module
- EFEM carrier delivery load port
- LP carrier delivery load port
- a single wafer semiconductor manufacturing apparatus is obviously different in that the number of process modules (PMs) as processing chambers for processing substrates increases, but there is no significant difference except for this point. The description is omitted.
- PMs process modules
- FIG. 14 is a maintenance part management selection screen when the present invention is applied to a cluster type single wafer semiconductor manufacturing apparatus
- FIG. 15 is a monitoring item data list screen.
- differences from the case of applying to the vertical substrate processing apparatus 1 will be mainly described, and overlapping portions will be omitted.
- each monitoring item has a difference due to the difference in configuration between the vertical apparatus and the single wafer apparatus.
- an ALT icon or an ALM icon is clearly indicated.
- the ALT icon is displayed in yellow for an alert
- the ALM icon is displayed in red for an alarm.
- each monitoring country is a button, and by pressing this button, it is possible to shift to the parts management screen.
- parts corresponding to the following (1) to (4) are set as maintenance parts to be suppressed.
- (1) It is described in the spare parts list.
- (3) It is an important part for stable operation.
- (4) It is necessary to contact the service base in advance before replacing expensive parts.
- FIG. 15 is a monitoring item data list screen. There are items indicating EFEM management, LM management, TM management, PM management, etc., and the selected monitoring data is an example. Equipment is monitoring data that contributes to the entire apparatus. Also in the present embodiment, the maintenance parts selected according to the monitoring items of FIG. 15 are configured to be managed on the parts management screens of FIGS.
- FIG. 16 is an example of a parts management screen when EFEM management is pressed.
- FIG. 16 mainly displays monitoring data of maintenance parts related to FOUP and the like on the load port.
- the FOUP can determine the maintenance time not only by the apparatus power ON time but also by the number of times of opening or mapping.
- FIG. 17 shows an example of a parts management screen when LM management is pressed.
- monitoring data of maintenance parts related to the parts constituting the LM is mainly displayed.
- the gate valve can determine the maintenance time not only by the apparatus power ON time but also by the number of times of opening.
- FIG. 18 shows an example of a parts management screen when TM management is pressed.
- monitoring data of maintenance parts related to the parts constituting the TM is mainly displayed.
- the gate valve can determine the maintenance time not only by the apparatus power ON time but also by the number of times of opening.
- the maintenance time can be determined not only by the apparatus power ON time but also by the moving distance of the vacuum robot as a monitoring item.
- FIG. 19 shows an example of a parts management screen when PM (Heather) management is pressed.
- FIG. 19 mainly displays maintenance component monitoring data related to the heater of the process module (PM).
- the heater is determined by the heater ON time as a monitoring item.
- the mechanism for moving the heater up and down is determined not only by the apparatus power ON time but also by the heater position elevation distance as a monitoring item.
- FIG. 20 shows an example of a parts management screen when PM (Chamber) management is pressed.
- FIG. 20 mainly displays maintenance part monitoring data related to the processing chamber (chamber) of the process module (PM).
- the maintenance time can be determined not only by the apparatus power ON time but also by the number of film formations as a monitoring item.
- the maintenance time can be determined by the lamp ON time and the lamp ON frequency as monitoring items.
- the RF power supply the maintenance time can be determined by the RF application time as a monitoring item.
- maintenance parts management screens related to Controller Box management, PM (GasUnit) management, and PM (ChamberExhaust) management are respectively used for Controller management, GasSystem management, and ExhaustSystem management in the vertical apparatus. Since the configuration and items are substantially the same as those of the maintenance part management screen corresponding to, or monitoring data, they are omitted here.
- the units composed of the respective maintenance parts are different depending on the configuration differences between the vertical apparatus and the single-wafer apparatus. Therefore, only the monitoring items of the maintenance parts are different as described above.
- the technical idea in the present invention is the same.
- the substrate processing apparatus has an effect that the stable operation of the substrate processing apparatus and the reduction of the lot-out ratio can be achieved by grasping the maintenance timing of the component parts of the substrate processing apparatus. It goes without saying that the same effect can be achieved whether it is a vertical device or a single wafer device.
- (a) it is possible to hold the monitoring information for monitoring the moving distance of the maintenance parts, the usage frequency, the energization time, and the number of times the monitoring information of the maintenance parts after the maintenance is initialized. Since it is possible to grasp the recommended maintenance timing before the failure of a maintenance part, it is possible to more stably operate the apparatus and reduce the lot-out ratio. In addition, by referring to the number of times maintenance component monitoring information has been initialized, the number of parts replacement and maintenance can be ascertained, so the part-specific properties (for example, ease of calibration deviation) and the guideline for replacement based on the number of maintenance Can know.
- the module and the transport mechanism configured with the target maintenance parts cannot be used as a maintenance waiting state, and if it is in operation, the next execution operation is not performed. This has the advantage of preventing loss of engineer's recovery work and downtime of the vertical device.
- the monitoring information to be monitored such as the moving distance, the usage frequency, the energization time, etc. of the maintenance parts and the number of times the monitoring information of the maintenance parts has been initialized can be held.
- a maintenance part In the case of a maintenance part that has a replacement cycle after being executed once, it can be left as a monitor value that is not initialized at the maintenance timing, and can be used in accordance with both the maintenance cycle and the component replacement cycle.
- D semiconductor manufacturing equipment is commonly used and resold. According to this embodiment, monitoring item information remains in the device as common lifetime information of the semiconductor manufacturing equipment system, so it is necessary based on information that holds parts replacement and maintenance necessary for restarting the equipment. Appropriate measures can be taken for used semiconductor manufacturing equipment, such as minimizing maintenance costs and replacing them early in consideration of future use conditions.
- the operator can be initialized without forgetting it at the end of the maintenance, so the target maintenance part information is correctly initialized at the time of replacement, adjustment, and maintenance. Management operations can be performed.
- F Normally, when an engineer performs maintenance of a maintenance part, a command such as maintenance designation for the target module or transport mechanism is set in the apparatus, and the target module is designated as being in a state where maintenance is possible. According to this embodiment, a dialog is displayed so as to prompt the initialization of the monitoring data of the maintenance component function, and the monitoring screen of the maintenance component related to the target module is automatically switched to the component maintenance screen of the target module.
- the configuration is to be initialized, it is possible to reliably cancel the maintenance designation when returning the apparatus to a module that can be produced after the maintenance work is completed.
- the maintenance component monitoring information can be displayed in a graph on the time axis, so that the maintenance time can be predicted from the increasing tendency of the monitored value of the monitored component on the operation screen. Maintenance parts can be prepared in advance.
- the analysis incorporating the unique information and accumulated data of the semiconductor manufacturing apparatus can contribute to the stable operation of the substrate processing apparatus.
- replacement of parts and maintenance are conventionally set by the elapsed time after the operation of the device, and can be determined by numerical values based on the operation status of the parts such as the movement distance of the shaft.
- the device manufacturer apparatus administrator grasps a management area having parts whose monitoring data exceeds the threshold by referring to the maintenance parts management main screen. Touch the button in the management area to check the maintenance part unit that exceeds the threshold. In this way, the device manufacturer device administrator can determine replacement and maintenance by referring to the main screen of maintenance parts management and looking at specific numerical values that take into account the operating status of the device in addition to the elapsed time. Become.
- a service engineer of a device manufacturer performs a failure response of a semiconductor manufacturing apparatus installed in the device manufacturer by, for example, a failure response of the device component. For example, after performing failure handling, it is possible to make a proposal for a future device maintenance service by referring to the monitoring data of maintenance parts and displaying the graph to see the tendency of the monitoring data to be accumulated.
- a maintenance contract is made, it is possible to propose a maintenance service that can contribute to the stable operation of the apparatus by obtaining the operating status of the apparatus and the accumulated value of the monitoring data from the device manufacturer.
- it is possible to optimize stock by preparing systematically only maintenance parts close to the replacement limit.
- (k) in the second-hand sales of a semiconductor manufacturing apparatus in recent years, it is possible to carry out parts replacement and maintenance that are optimal for the purchaser and deliver them.
- the heater has a significant effect on the life of the heater when the heater is used at a temperature exceeding the high temperature range. If it is high, even if the elapsed time is not a guideline for replacement, it is possible to replace it for future stable operation.
- the substrate processing apparatus 1 in the embodiment of the present invention can be applied not only to a semiconductor manufacturing apparatus for manufacturing a semiconductor but also to an apparatus for processing a glass substrate such as an LCD device. Needless to say, the present invention is also applicable to various substrate processing apparatuses such as an exposure apparatus, a lithography apparatus, a coating apparatus, and a processing apparatus using plasma.
- the film forming process can be performed by a process for forming a thin film such as CVD or PVD, a process for forming an oxide film or a nitride film, or a process for forming a film containing metal.
- monitoring item information for displaying a monitoring item for monitoring a maintenance part selected as a monitoring target, setting information for setting a threshold value of the maintenance part, and monitoring of the maintenance part
- Monitoring item list information that holds data and monitoring information including the number of resets that initializes the maintenance component, and a component that holds the monitoring information for each unit configured with the maintenance component according to the monitoring item
- a data collection controller that holds the management information, and an operation unit that transfers the monitoring data from the device data collected from the unit to the data collection controller.
- the data collection controller includes the component management information And that the monitoring data included in at least one of the monitoring item list information has reached the threshold value.
- the operation unit transmits an instruction to initialize the monitoring data to the data collection controller after the maintenance in the unit where the monitoring data that has reached the threshold is generated, and the data collection controller
- the board processing is configured to initialize the monitoring data of the component management information, count up the number of resets, and initialize the monitoring data of the monitoring item list information according to the content of the maintenance An apparatus is provided.
- the substrate processing apparatus includes a control unit (processing control unit) that reports the apparatus data to the operation unit at a predetermined cycle, and a target maintenance part or maintenance part.
- a storage unit for storing device management data for managing the state of the unit (for example, module, transport mechanism, etc.) and the open / closed state of each valve related to the unit, and the operation unit has the monitoring data as the threshold value. If the state of the unit is waiting for execution of the next operation with reference to the storage unit at a timing when the control unit reaches the control unit, the control unit is instructed to designate maintenance, and the control unit maintains the state of the unit. By changing to the wait state, the next execution operation is not performed.
- the operation unit is configured not to instruct maintenance designation to the control unit when a unit composed of the maintenance parts is operating. Yes.
- the operation unit includes a display unit that displays the monitoring data in a time series graph, and the data collection controller displays the value of the monitoring data on a time axis.
- the operation unit is configured to display a screen for prompting initialization of the monitoring data on the display unit after performing maintenance.
- the operation unit instructs the control unit to release a maintenance instruction, and then displays a screen for prompting initialization of the monitoring data. It is configured to be displayed.
- the monitoring item list information is information on a basis of the component management information.
- the substrate processing apparatus is configured such that maintenance parts set in the parts management information are selected based on the monitoring item information of the monitoring item list information.
- the setting information set in the monitoring item list information and the setting information set in the component management information are configured so that the respective threshold values are different. Yes.
- the monitoring of each of the component management information and the monitoring item list information according to a relationship between the monitoring item and a maintenance component selected by the monitoring item.
- the data is initialized and the number of resets can be counted up.
- the operation unit is configured to prompt a replacement work. Yes.
- the monitoring item which displays the item which monitors the maintenance component selected as monitoring object, the setting information which sets the threshold value of the said maintenance component, the monitoring data of the said maintenance component , And monitoring item list information that holds monitoring information including the number of resets that initializes the maintenance component, and component management that holds the monitoring information for each unit configured with the maintenance component according to the monitoring item
- the computer having the data collection unit respectively holding information, and the operation unit for transferring the monitoring data from the device data collected from the unit to the data collection unit, the component management information and the monitoring item list information
- a component management program for causing a computer to execute a procedure for counting up and initializing
- monitoring item information for displaying a monitoring item for monitoring a maintenance part selected as a monitoring target, setting information for setting a threshold value of the maintenance part, the maintenance part Management item list information having monitoring data including monitoring information including the number of times of resetting the maintenance parts initialized, and component management having the monitoring information for each unit configured with the maintenance parts according to the monitoring items
- Setting information for setting a maintenance component threshold value from apparatus data collected from at least a unit composed of maintenance components in the step of holding information, the step of processing a substrate, and the step of processing the substrate, Collecting monitoring data for maintenance parts and monitoring information including the number of resets for initializing the maintenance parts, and the monitoring data reaches a threshold value;
- a step of maintaining a unit composed of the maintenance parts a step of receiving an instruction to initialize the monitoring data of the maintenance parts after completion of maintenance in the unit in which the monitoring data reaching the threshold value is generated, Initializing the monitoring data of parts management information, counting up the number of resets, and initializing
- monitoring item information for displaying a monitoring item for monitoring a maintenance part selected as a monitoring target, setting information for setting a threshold value of the maintenance part, monitoring data for the maintenance part, and the maintenance part A monitoring item list information having monitoring information including the number of resets performed, and a component management information having the monitoring information for each unit configured with the maintenance component according to the monitoring item, Collecting the monitoring information from apparatus data collected from at least a unit composed of maintenance parts, and after the maintenance in the unit where the monitoring data reaching the threshold is generated, the maintenance parts Receiving an instruction to initialize the monitoring data, and initializing the monitoring data of the component management information to reset the monitoring data Counting up the number, depending on the content of the maintenance, parts management method having a step of initializing the monitoring data of the monitoring item list information is provided.
- the substrate processing apparatus includes a control unit (processing control unit) that reports the device data to the operation unit at a predetermined cycle, and a target maintenance component or maintenance component.
- a storage unit for storing device management data for managing the state of the unit (for example, module, transport mechanism, etc.) and the open / closed state of each valve related to the unit, and the operation unit has the monitoring data as the threshold value. If the state of the unit is waiting for execution of the next operation with reference to the storage unit at a timing when the control unit reaches the control unit, the control unit is instructed to designate maintenance, and the control unit maintains the state of the unit. By changing to the wait state, the next execution operation is not performed.
- the operation unit is configured not to instruct maintenance designation to the control unit when a unit composed of the maintenance parts is operating. Yes.
- the operation unit includes a display unit that displays the monitoring data in a time series graph, and the data collection controller displays the value of the monitoring data on a time axis.
- the operation unit is configured to display a screen for prompting initialization of the monitoring data on the display unit after performing maintenance.
- the operation unit instructs the controller to release a maintenance instruction, and then displays a screen for prompting initialization of the monitoring data. It is configured to be displayed.
- a threshold value of the maintenance component is obtained from a process of processing a substrate, and apparatus data collected from a unit composed of at least the maintenance component when the substrate is processed.
- a step of accepting an instruction to initialize the monitoring data of the maintenance part after completion of maintenance in the unit in which the monitoring data that has reached the threshold is generated, and initializing the monitoring data and resetting the monitoring data
- a method of manufacturing a semiconductor device having a step of counting up the number of times.
- the present invention can be applied to management of components constituting a substrate processing apparatus that processes a substrate.
- substrate processing unit 18 wafer (substrate) 201 201
- transport system controller (transport control unit) 212 212 transport system controller (processing control unit) 2 215 display unit
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Abstract
Description
Claims (12)
- 監視対象として選定された保守部品を監視する監視項目を表示する監視項目情報と、前記保守部品の閾値を設定する設定情報、前記保守部品の監視データ、及び前記保守部品を初期化したリセット回数を含む監視情報とをそれぞれ保持する監視項目一覧情報と、前記監視項目に応じて前記保守部品で構成されるユニット毎の前記監視情報を保持する部品管理情報と、をそれぞれ保持するデータ収集コントローラと、前記ユニットから収集した装置データから前記監視データを前記データ収集コントローラに転送する操作部と、を有し、前記データ収集コントローラは、前記部品管理情報及び前記監視項目一覧情報のうち少なくともどちらか一方に含まれる前記監視データが前記閾値に到達したことを前記操作部に通知し、前記操作部は、前記閾値に到達した監視データが生成された前記ユニットにおけるメンテナンスの終了後、前記監視データを初期化する指示を前記データ収集コントローラに送信し、前記データ収集コントローラは、前記部品管理情報の前記監視データを初期化して前記リセット回数をカウントアップし、前記メンテナンスの内容に応じて、前記監視項目一覧情報の前記監視データを初期化するように構成されている基板処理装置。
- 所定の周期で前記装置データを前記操作部に報告する制御部と、対象とする保守部品又は保守部品で構成されたユニットの状態、これらに関連する各バルブ等の開閉状態等を管理する装置管理データを記憶する記憶部を備え、前記操作部は、前記監視データが前記閾値に到達したタイミングで、前記記憶部を参照して前記ユニットの状態が、次動作実行待ちの状態であれば、前記制御部にメンテナンス指定を指示し、前記制御部は、前記ユニットの状態をメンテナンス待ち状態に変更して、次の実行動作をしないように構成されている請求項1記載の基板処理装置。
- 前記操作部は、前記保守部品で構成されたユニットが動作中の場合は、前記制御部にメンテナンス指定を指示しないように構成されている請求項2記載の基板処理装置。
- 前記操作部は、前記監視データをグラフ表示する表示部を備え、前記データ収集コントローラは、前記保守部品の監視データの値を時間軸で前記表示部に表示させるよう構成されている請求項1記載の基板処理装置。
- 前記操作部は、メンテナンスを実施した後、前記監視データの初期化を促す画面を前記表示部に表示するよう構成されている請求項4記載の基板処理装置。
- 前記監視項目と前記監視項目により選定される保守部品の関係に応じて、前記部品管理情報と前記監視項目一覧情報のそれぞれの前記監視データの初期化及び前記リセット回数のカウントアップが可能なように構成されている請求項1記載の基板処理装置。
- 前記監視項目一覧情報は、前記部品管理情報の基の情報である請求項1記載の基板処理装置。
- 前記監視項目一覧情報の監視項目情報に基づいて、前記部品管理情報で設定される保守部品が選定される請求項1記載の基板処理装置。
- 前記監視項目一覧情報で設定される設定情報と前記部品管理情報で設定される設定情報は、異なるように構成されている請求項1記載の基板処理装置。
- 監視対象として選定された保守部品を監視する監視項目を表示する監視項目情報と、前記保守部品の閾値を設定する設定情報、前記保守部品の監視データ、及び前記保守部品を初期化したリセット回数を含む監視情報とをそれぞれ保持する監視項目一覧情報と、前記監視項目に応じて前記保守部品で構成されるユニット毎の前記監視情報を保持する部品管理情報と、をそれぞれ保持するデータ収集部と、前記ユニットから収集した装置データから前記監視データを前記データ収集部に転送する操作部と、を有するコンピュータにおいて、前記部品管理情報及び前記監視項目一覧情報のうち少なくともどちらか一方に含まれる前記監視データが前記閾値に到達したことを前記操作部に通知する手順と、前記閾値に到達した監視データが生成された前記ユニットにおけるメンテナンスの終了後、前記監視データを初期化する指示を前記データ収集部に送信する手順と、前記部品管理情報内の前記監視データを初期化して前記リセット回数をカウントアップし、前記メンテナンスの内容に応じて、前記監視項目一覧情報の前記監視データを初期化する手順と、をコンピュータに実行させる部品管理プログラムを記録したコンピュータ読取可能な記録媒体。
- 監視対象として選定された保守部品を監視する監視項目を表示する監視項目情報と、前記保守部品の閾値を設定する設定情報、前記保守部品の監視データ、及び前記保守部品を初期化したリセット回数を含む監視情報とを有する監視項目一覧情報と、前記監視項目に応じて前記保守部品で構成されるユニット毎の前記監視情報を有する部品管理情報と、をそれぞれ保持する工程と、基板を処理する工程と、前記基板を処理する際に、少なくとも保守部品で構成されるユニットから収集した装置データから前記監視情報を収集する工程と、前記監視データが前記閾値に到達し、前記保守部品で構成されるユニットをメンテナンスする工程と、前記閾値に到達した監視データが生成された前記ユニットにおけるメンテナンスの終了後、前記保守部品の前記監視データを初期化する指示を受け付ける工程と、前記部品管理情報の前記監視データを初期化して前記リセット回数をカウントアップし、前記メンテナンスの内容に応じて、監視項目一覧情報の前記監視データを初期化する工程と、を有する半導体装置の製造方法。
- 監視対象として選定された監視項目により選定された保守部品に関して、前記保守部品の閾値を設定する設定情報、前記保守部品の監視データ、及び前記保守部品を初期化したリセット回数を含む監視情報を保持する部品管理情報を、保持するデータ収集コントローラと、少なくとも前記保守部品で構成されるユニットから収集した装置データから前記監視データを前記データ収集コントローラに転送する操作部と、を有し、前記データ収集コントローラは、前記部品管理情報に含まれる前記監視データが前記閾値に到達したことを前記操作部に通知し、前記操作部は、前記閾値に到達した監視データが生成された前記ユニットにおけるメンテナンス終了後、前記監視データを初期化する指示を前記データ収集コントローラに送信し、前記データ収集コントローラは、前記監視データを初期化して前記リセット回数をカウントアップする基板処理装置。
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KR20170113669A (ko) | 2017-10-12 |
JPWO2016157402A1 (ja) | 2017-12-28 |
JP6446537B2 (ja) | 2018-12-26 |
KR102044617B1 (ko) | 2019-11-13 |
US20180024536A1 (en) | 2018-01-25 |
US10295991B2 (en) | 2019-05-21 |
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