JP2019067813A - 半導体モジュール - Google Patents

半導体モジュール Download PDF

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Publication number
JP2019067813A
JP2019067813A JP2017188647A JP2017188647A JP2019067813A JP 2019067813 A JP2019067813 A JP 2019067813A JP 2017188647 A JP2017188647 A JP 2017188647A JP 2017188647 A JP2017188647 A JP 2017188647A JP 2019067813 A JP2019067813 A JP 2019067813A
Authority
JP
Japan
Prior art keywords
terminal
bus bar
negative electrode
electrode side
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017188647A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019067813A5 (https=
Inventor
知生 岩出
Tomoo Iwade
知生 岩出
大輔 福岡
Daisuke Fukuoka
大輔 福岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2017188647A priority Critical patent/JP2019067813A/ja
Priority to PCT/JP2018/028790 priority patent/WO2019064904A1/ja
Priority to CN201880062126.8A priority patent/CN111133573A/zh
Priority to US16/634,658 priority patent/US11431255B2/en
Publication of JP2019067813A publication Critical patent/JP2019067813A/ja
Publication of JP2019067813A5 publication Critical patent/JP2019067813A5/ja
Priority to US16/814,260 priority patent/US20200211954A1/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/66—Remote control of cameras or camera parts, e.g. by remote control devices
    • H04N23/661—Transmitting camera control signals through networks, e.g. control via the Internet
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/90—Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
    • H10D84/401—Combinations of FETs or IGBTs with BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
    • H10D84/401—Combinations of FETs or IGBTs with BJTs
    • H10D84/403—Combinations of FETs or IGBTs with BJTs and with one or more of diodes, resistors or capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Closed-Circuit Television Systems (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Quality & Reliability (AREA)
JP2017188647A 2017-09-28 2017-09-28 半導体モジュール Pending JP2019067813A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017188647A JP2019067813A (ja) 2017-09-28 2017-09-28 半導体モジュール
PCT/JP2018/028790 WO2019064904A1 (ja) 2017-09-28 2018-08-01 半導体モジュール
CN201880062126.8A CN111133573A (zh) 2017-09-28 2018-08-01 半导体模块
US16/634,658 US11431255B2 (en) 2017-09-28 2018-08-02 Analysis system, analysis method, and program storage medium
US16/814,260 US20200211954A1 (en) 2017-09-28 2020-03-10 Semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017188647A JP2019067813A (ja) 2017-09-28 2017-09-28 半導体モジュール

Publications (2)

Publication Number Publication Date
JP2019067813A true JP2019067813A (ja) 2019-04-25
JP2019067813A5 JP2019067813A5 (https=) 2019-10-10

Family

ID=65901209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017188647A Pending JP2019067813A (ja) 2017-09-28 2017-09-28 半導体モジュール

Country Status (4)

Country Link
US (2) US11431255B2 (https=)
JP (1) JP2019067813A (https=)
CN (1) CN111133573A (https=)
WO (1) WO2019064904A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023088055A (ja) * 2021-12-14 2023-06-26 富士電機株式会社 半導体装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7268563B2 (ja) * 2019-09-30 2023-05-08 株式会社デンソー 半導体装置
WO2022208642A1 (ja) * 2021-03-30 2022-10-06 日本電気株式会社 認証装置、処理方法、プログラム

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JP2006295997A (ja) * 2005-04-05 2006-10-26 Denso Corp 電力変換装置
WO2014136271A1 (ja) * 2013-03-08 2014-09-12 株式会社東芝 車両用電力変換装置
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JP2017099140A (ja) * 2015-11-24 2017-06-01 トヨタ自動車株式会社 電力変換装置

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US7450638B2 (en) * 2003-07-21 2008-11-11 Sony Corporation Power-line communication based surveillance system
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KR100994722B1 (ko) * 2008-08-01 2010-11-16 포항공과대학교 산학협력단 카메라 핸드오프를 이용한 다중 카메라상의 연속적인 물체추적 방법
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JP2003218311A (ja) * 2002-01-21 2003-07-31 Aisin Seiki Co Ltd リード端子付電子部品
JP2006295997A (ja) * 2005-04-05 2006-10-26 Denso Corp 電力変換装置
WO2014136271A1 (ja) * 2013-03-08 2014-09-12 株式会社東芝 車両用電力変換装置
JP2016025298A (ja) * 2014-07-24 2016-02-08 セイコーエプソン株式会社 電子部品、電子部品の製造方法、電子機器、および移動体
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023088055A (ja) * 2021-12-14 2023-06-26 富士電機株式会社 半導体装置
JP7793967B2 (ja) 2021-12-14 2026-01-06 富士電機株式会社 半導体装置

Also Published As

Publication number Publication date
WO2019064904A1 (ja) 2019-04-04
US11431255B2 (en) 2022-08-30
US20200211954A1 (en) 2020-07-02
CN111133573A (zh) 2020-05-08
US20200204724A1 (en) 2020-06-25

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