CN111133573A - 半导体模块 - Google Patents

半导体模块 Download PDF

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Publication number
CN111133573A
CN111133573A CN201880062126.8A CN201880062126A CN111133573A CN 111133573 A CN111133573 A CN 111133573A CN 201880062126 A CN201880062126 A CN 201880062126A CN 111133573 A CN111133573 A CN 111133573A
Authority
CN
China
Prior art keywords
terminal
side terminal
bus bar
electrode side
positive electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201880062126.8A
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English (en)
Chinese (zh)
Inventor
岩出知生
福冈大辅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of CN111133573A publication Critical patent/CN111133573A/zh
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/66—Remote control of cameras or camera parts, e.g. by remote control devices
    • H04N23/661—Transmitting camera control signals through networks, e.g. control via the Internet
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/90—Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
    • H10D84/401—Combinations of FETs or IGBTs with BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
    • H10D84/401—Combinations of FETs or IGBTs with BJTs
    • H10D84/403—Combinations of FETs or IGBTs with BJTs and with one or more of diodes, resistors or capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Closed-Circuit Television Systems (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Quality & Reliability (AREA)
CN201880062126.8A 2017-09-28 2018-08-01 半导体模块 Withdrawn CN111133573A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-188647 2017-09-28
JP2017188647A JP2019067813A (ja) 2017-09-28 2017-09-28 半導体モジュール
PCT/JP2018/028790 WO2019064904A1 (ja) 2017-09-28 2018-08-01 半導体モジュール

Publications (1)

Publication Number Publication Date
CN111133573A true CN111133573A (zh) 2020-05-08

Family

ID=65901209

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880062126.8A Withdrawn CN111133573A (zh) 2017-09-28 2018-08-01 半导体模块

Country Status (4)

Country Link
US (2) US11431255B2 (https=)
JP (1) JP2019067813A (https=)
CN (1) CN111133573A (https=)
WO (1) WO2019064904A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7268563B2 (ja) * 2019-09-30 2023-05-08 株式会社デンソー 半導体装置
WO2022208642A1 (ja) * 2021-03-30 2022-10-06 日本電気株式会社 認証装置、処理方法、プログラム
JP7793967B2 (ja) * 2021-12-14 2026-01-06 富士電機株式会社 半導体装置

Citations (5)

* Cited by examiner, † Cited by third party
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JP2003218311A (ja) * 2002-01-21 2003-07-31 Aisin Seiki Co Ltd リード端子付電子部品
JP2006295997A (ja) * 2005-04-05 2006-10-26 Denso Corp 電力変換装置
JP2012100457A (ja) * 2010-11-04 2012-05-24 Denso Corp 電力変換装置
CN105306002A (zh) * 2014-07-24 2016-02-03 精工爱普生株式会社 电子部件、电子部件的制造方法、电子设备以及移动体
CN105556664A (zh) * 2013-09-16 2016-05-04 株式会社电装 半导体装置

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US7394916B2 (en) * 2003-02-10 2008-07-01 Activeye, Inc. Linking tracked objects that undergo temporary occlusion
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US7450638B2 (en) * 2003-07-21 2008-11-11 Sony Corporation Power-line communication based surveillance system
JP4893649B2 (ja) * 2008-02-08 2012-03-07 富士通株式会社 帯域制御サーバ及び帯域制御プログラム並びに監視システム
KR100994722B1 (ko) * 2008-08-01 2010-11-16 포항공과대학교 산학협력단 카메라 핸드오프를 이용한 다중 카메라상의 연속적인 물체추적 방법
US20100245588A1 (en) * 2009-03-31 2010-09-30 Acuity Systems Inc. Tag tracking system
WO2010144566A1 (en) * 2009-06-09 2010-12-16 Wayne State University Automated video surveillance systems
JP5402431B2 (ja) * 2009-09-11 2014-01-29 沖電気工業株式会社 カメラ制御装置
IL201129A (en) * 2009-09-23 2014-02-27 Verint Systems Ltd A system and method for automatically switching cameras according to location measurements
JP5213883B2 (ja) 2010-01-19 2013-06-19 三菱電機株式会社 合成表示装置
WO2011114799A1 (ja) * 2010-03-15 2011-09-22 オムロン株式会社 監視カメラ端末
KR101248054B1 (ko) * 2011-05-04 2013-03-26 삼성테크윈 주식회사 물체의 이동 경로를 추적하는 물체 추적 시스템 및 그 방법
KR101970197B1 (ko) * 2012-10-29 2019-04-18 에스케이 텔레콤주식회사 복수의 카메라 제어 방법과 그를 위한 카메라 제어 장치
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US20170208355A1 (en) * 2014-07-15 2017-07-20 Motorola Solutions, Inc Method and apparatus for notifying a user whether or not they are within a camera's field of view
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JP6555906B2 (ja) 2015-03-05 2019-08-07 キヤノン株式会社 情報処理装置、情報処理方法、およびプログラム
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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003218311A (ja) * 2002-01-21 2003-07-31 Aisin Seiki Co Ltd リード端子付電子部品
JP2006295997A (ja) * 2005-04-05 2006-10-26 Denso Corp 電力変換装置
JP2012100457A (ja) * 2010-11-04 2012-05-24 Denso Corp 電力変換装置
CN105556664A (zh) * 2013-09-16 2016-05-04 株式会社电装 半导体装置
CN105306002A (zh) * 2014-07-24 2016-02-03 精工爱普生株式会社 电子部件、电子部件的制造方法、电子设备以及移动体

Also Published As

Publication number Publication date
WO2019064904A1 (ja) 2019-04-04
US11431255B2 (en) 2022-08-30
JP2019067813A (ja) 2019-04-25
US20200211954A1 (en) 2020-07-02
US20200204724A1 (en) 2020-06-25

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