JP2018032857A5 - - Google Patents

Download PDF

Info

Publication number
JP2018032857A5
JP2018032857A5 JP2017159933A JP2017159933A JP2018032857A5 JP 2018032857 A5 JP2018032857 A5 JP 2018032857A5 JP 2017159933 A JP2017159933 A JP 2017159933A JP 2017159933 A JP2017159933 A JP 2017159933A JP 2018032857 A5 JP2018032857 A5 JP 2018032857A5
Authority
JP
Japan
Prior art keywords
edge ring
plasma processing
processing chamber
sensor
wear indicator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017159933A
Other languages
English (en)
Japanese (ja)
Other versions
JP7227692B2 (ja
JP2018032857A (ja
Filing date
Publication date
Application filed filed Critical
Publication of JP2018032857A publication Critical patent/JP2018032857A/ja
Publication of JP2018032857A5 publication Critical patent/JP2018032857A5/ja
Application granted granted Critical
Publication of JP7227692B2 publication Critical patent/JP7227692B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2017159933A 2016-08-23 2017-08-23 半導体プロセスモジュールのためのエッジリングまたはプロセスキット Active JP7227692B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662378492P 2016-08-23 2016-08-23
US62/378,492 2016-08-23

Publications (3)

Publication Number Publication Date
JP2018032857A JP2018032857A (ja) 2018-03-01
JP2018032857A5 true JP2018032857A5 (enExample) 2020-10-01
JP7227692B2 JP7227692B2 (ja) 2023-02-22

Family

ID=61243362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017159933A Active JP7227692B2 (ja) 2016-08-23 2017-08-23 半導体プロセスモジュールのためのエッジリングまたはプロセスキット

Country Status (5)

Country Link
US (3) US20180061696A1 (enExample)
JP (1) JP7227692B2 (enExample)
KR (2) KR20180022593A (enExample)
CN (3) CN208908212U (enExample)
TW (3) TWM602281U (enExample)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116110846A (zh) 2016-01-26 2023-05-12 应用材料公司 晶片边缘环升降解决方案
KR102689380B1 (ko) 2016-01-26 2024-07-26 어플라이드 머티어리얼스, 인코포레이티드 웨이퍼 에지 링 리프팅 솔루션
US10177018B2 (en) 2016-08-11 2019-01-08 Applied Materials, Inc. Process kit erosion and service life prediction
US20180061696A1 (en) * 2016-08-23 2018-03-01 Applied Materials, Inc. Edge ring or process kit for semiconductor process module
US9947517B1 (en) 2016-12-16 2018-04-17 Applied Materials, Inc. Adjustable extended electrode for edge uniformity control
US10553404B2 (en) 2017-02-01 2020-02-04 Applied Materials, Inc. Adjustable extended electrode for edge uniformity control
US11075105B2 (en) 2017-09-21 2021-07-27 Applied Materials, Inc. In-situ apparatus for semiconductor process module
JP7033441B2 (ja) * 2017-12-01 2022-03-10 東京エレクトロン株式会社 プラズマ処理装置
US11538713B2 (en) * 2017-12-05 2022-12-27 Lam Research Corporation System and method for edge ring wear compensation
US11043400B2 (en) 2017-12-21 2021-06-22 Applied Materials, Inc. Movable and removable process kit
EP3562285A1 (de) * 2018-04-25 2019-10-30 Siemens Aktiengesellschaft Verbinden elektrischer bauelemente
JP7138474B2 (ja) * 2018-05-15 2022-09-16 東京エレクトロン株式会社 部品の修復方法及び基板処理システム
US10600623B2 (en) 2018-05-28 2020-03-24 Applied Materials, Inc. Process kit with adjustable tuning ring for edge uniformity control
JP7045931B2 (ja) * 2018-05-30 2022-04-01 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理方法
CN108766871A (zh) * 2018-06-13 2018-11-06 沈阳富创精密设备有限公司 一种应用于半导体行业的直接写入等离子喷涂技术
US11935773B2 (en) 2018-06-14 2024-03-19 Applied Materials, Inc. Calibration jig and calibration method
US11521872B2 (en) * 2018-09-04 2022-12-06 Applied Materials, Inc. Method and apparatus for measuring erosion and calibrating position for a moving process kit
US11289310B2 (en) 2018-11-21 2022-03-29 Applied Materials, Inc. Circuits for edge ring control in shaped DC pulsed plasma process device
US10903050B2 (en) * 2018-12-10 2021-01-26 Lam Research Corporation Endpoint sensor based control including adjustment of an edge ring parameter for each substrate processed to maintain etch rate uniformity
US11393663B2 (en) * 2019-02-25 2022-07-19 Tokyo Electron Limited Methods and systems for focus ring thickness determinations and feedback control
KR20210126783A (ko) * 2019-03-06 2021-10-20 램 리써치 코포레이션 기판 프로세싱 시스템을 위한 조정가능한 에지 링의 두께를 측정하기 위한 측정 시스템
JP2020155489A (ja) * 2019-03-18 2020-09-24 キオクシア株式会社 半導体製造装置および半導体装置の製造方法
US11101115B2 (en) 2019-04-19 2021-08-24 Applied Materials, Inc. Ring removal from processing chamber
US12009236B2 (en) * 2019-04-22 2024-06-11 Applied Materials, Inc. Sensors and system for in-situ edge ring erosion monitor
US11479849B2 (en) 2019-06-03 2022-10-25 Taiwan Semiconductor Manufacturing Company, Ltd. Physical vapor deposition chamber with target surface morphology monitor
US11913777B2 (en) * 2019-06-11 2024-02-27 Applied Materials, Inc. Detector for process kit ring wear
KR102689653B1 (ko) 2019-06-26 2024-07-31 삼성전자주식회사 센서 모듈 및 이를 구비하는 식각 장치
JP2021040076A (ja) * 2019-09-04 2021-03-11 東京エレクトロン株式会社 環状部材、基板処理装置及び基板処理装置の制御方法
JP7394601B2 (ja) 2019-11-28 2023-12-08 東京エレクトロン株式会社 プラズマ処理装置及び測定方法
JP7471810B2 (ja) * 2019-12-13 2024-04-22 東京エレクトロン株式会社 リングアセンブリ、基板支持体及び基板処理装置
CN114830317A (zh) * 2019-12-19 2022-07-29 朗姆研究公司 消耗性室部件中的封装式射频识别
US11668553B2 (en) * 2020-02-14 2023-06-06 Applied Materials Inc. Apparatus and method for controlling edge ring variation
KR102822822B1 (ko) * 2020-02-25 2025-06-19 에스케이하이닉스 주식회사 에지링 모니터링 장치, 에지링 관리 시스템 및 방법
US11915953B2 (en) * 2020-04-17 2024-02-27 Applied Materials, Inc. Apparatus, systems, and methods of measuring edge ring distance for thermal processing chambers
JP7580328B2 (ja) * 2020-06-05 2024-11-11 東京エレクトロン株式会社 プラズマ処理装置
CN111463165B (zh) * 2020-06-18 2020-09-29 中芯集成电路制造(绍兴)有限公司 固定机构、半导体机台及晶圆清洗装置
US20220051912A1 (en) * 2020-08-12 2022-02-17 Taiwan Semiconductor Manufacturing Company Limited Gas flow control during semiconductor fabrication
KR102867342B1 (ko) 2020-11-26 2025-10-01 삼성전자주식회사 플라즈마 처리 장치 및 이를 이용한 반도체 소자 제조방법
DE102020134672A1 (de) * 2020-12-22 2022-06-23 Krones Aktiengesellschaft Verschleißteil, Herstellungsverfahren und Vorrichtung zur Überwachung eines Verschleißzustands
US20220404716A1 (en) * 2021-06-17 2022-12-22 Taiwan Semiconductor Manufacturing Company, Ltd. Inspection tool for a semiconductor processing tool and methods of use
KR102632552B1 (ko) 2021-07-23 2024-02-02 한국표준과학연구원 플라즈마 진단기능 및 유전체 두께 측정기능을 갖는 센서, 이를 구비하는 공정장치 및 공정시스템
KR20240051153A (ko) * 2021-08-17 2024-04-19 도쿄엘렉트론가부시키가이샤 반도체 플라즈마 공정 챔버 내의 소모성 부품의 특성을 측정하기 위한 광센서
CN113607714B (zh) * 2021-10-08 2022-01-11 成都齐碳科技有限公司 分子膜成膜或表征器件、装置、方法以及生物芯片
JP7305076B1 (ja) * 2022-09-01 2023-07-07 三菱電機株式会社 データ収集分析システム、測定データ収集ユニット、および、データ収集分析方法
WO2024075423A1 (ja) * 2022-10-07 2024-04-11 東京エレクトロン株式会社 基板処理システム及びエッジリングの取り付け方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03148118A (ja) * 1989-11-02 1991-06-24 Fujitsu Ltd 半導体製造装置
JPH05136098A (ja) * 1991-11-15 1993-06-01 Seiko Epson Corp 半導体装置の製造装置及び半導体装置の製造方法
JPH08203865A (ja) * 1995-01-23 1996-08-09 Hitachi Ltd プラズマ処理装置
US6077387A (en) * 1999-02-10 2000-06-20 Stmicroelectronics, Inc. Plasma emission detection for process control via fluorescent relay
TW580735B (en) * 2000-02-21 2004-03-21 Hitachi Ltd Plasma treatment apparatus and treating method of sample material
US7349090B2 (en) * 2000-09-20 2008-03-25 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithography
US6891627B1 (en) * 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
JP4657521B2 (ja) * 2001-08-28 2011-03-23 東京エレクトロン株式会社 プラズマ処理装置
US6806949B2 (en) * 2002-12-31 2004-10-19 Tokyo Electron Limited Monitoring material buildup on system components by optical emission
US6894769B2 (en) * 2002-12-31 2005-05-17 Tokyo Electron Limited Monitoring erosion of system components by optical emission
JP2004335841A (ja) * 2003-05-09 2004-11-25 Tokyo Electron Ltd プラズマ処理装置の予測装置及び予測方法
US7001482B2 (en) * 2003-11-12 2006-02-21 Tokyo Electron Limited Method and apparatus for improved focus ring
JP4365226B2 (ja) * 2004-01-14 2009-11-18 株式会社日立ハイテクノロジーズ プラズマエッチング装置及び方法
US7233878B2 (en) * 2004-01-30 2007-06-19 Tokyo Electron Limited Method and system for monitoring component consumption
JP4006004B2 (ja) * 2004-12-28 2007-11-14 株式会社東芝 半導体製造装置及び半導体装置の製造方法
US7602116B2 (en) * 2005-01-27 2009-10-13 Advanced Optoelectronic Technology, Inc. Light apparatus capable of emitting light of multiple wavelengths using nanometer fluorescent material, light device and manufacturing method thereof
JP4833890B2 (ja) * 2007-03-12 2011-12-07 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ分布補正方法
JP2009245988A (ja) * 2008-03-28 2009-10-22 Tokyo Electron Ltd プラズマ処理装置、チャンバ内部品及びチャンバ内部品の寿命検出方法
US7884925B2 (en) * 2008-05-23 2011-02-08 Lam Research Corporation Electrical and optical system and methods for monitoring erosion of electrostatic chuck edge bead materials
JP2010034416A (ja) * 2008-07-30 2010-02-12 Hitachi High-Technologies Corp プラズマ処理装置およびプラズマ処理方法
JP5496630B2 (ja) * 2009-12-10 2014-05-21 東京エレクトロン株式会社 静電チャック装置
US8740206B2 (en) * 2010-01-27 2014-06-03 Applied Materials, Inc. Life enhancement of ring assembly in semiconductor manufacturing chambers
JP5728770B2 (ja) * 2011-02-03 2015-06-03 株式会社昭和真空 基板処理装置、基板処理方法、ならびに、プログラム
CN103187225B (zh) * 2011-12-28 2015-10-21 中微半导体设备(上海)有限公司 一种可监测刻蚀过程的等离子体处理装置
GB2499816A (en) * 2012-02-29 2013-09-04 Oxford Instr Nanotechnology Tools Ltd Controlling deposition and etching in a chamber with fine time control of parameters and gas flow
CN106030242B (zh) * 2014-02-18 2020-06-19 诺维尔里斯公司 用于对薄层进行非接触式测量的光声装置和方法
JP6383647B2 (ja) * 2014-11-19 2018-08-29 東京エレクトロン株式会社 測定システムおよび測定方法
US10041868B2 (en) * 2015-01-28 2018-08-07 Lam Research Corporation Estimation of lifetime remaining for a consumable-part in a semiconductor manufacturing chamber
US10014198B2 (en) * 2015-08-21 2018-07-03 Lam Research Corporation Wear detection of consumable part in semiconductor manufacturing equipment
US20180061696A1 (en) * 2016-08-23 2018-03-01 Applied Materials, Inc. Edge ring or process kit for semiconductor process module

Similar Documents

Publication Publication Date Title
JP2018032857A5 (enExample)
JP7227692B2 (ja) 半導体プロセスモジュールのためのエッジリングまたはプロセスキット
TWI840510B (zh) 用於監測原位邊緣環腐蝕的設備及方法
RU2015129803A (ru) Обнаружение бляшки с использованием потокового зонда
WO2011151585A3 (fr) Procédé et dispositif de mesure de l'épaisseur d'une couche de revêtement sur une bande en défilement.
GB2515420A (en) Measurement of downhole component stress and surface conditions
JP2014137275A5 (enExample)
WO2010075281A3 (en) Plasma ion process uniformity monitor
JP2017517729A5 (enExample)
JP2017092435A5 (enExample)
TWI459328B (zh) 煙感測器
WO2010015248A3 (de) Verfahren und vorrichtung zur überwachung und bestimmung der gebirgsspannung
JP2019501389A5 (enExample)
JP2013057660A5 (enExample)
SA519410321B1 (ar) طريقة لقياس حركة أداة في حفرة بئر
CN204099407U (zh) 滚动轴承及具有该滚动轴承的测量装置
MX363398B (es) Dispositivo fotoacustico y metodo para la medicion sin contacto de capas delgadas.
JP2008541081A5 (enExample)
RU2015105258A (ru) Маркировка компонентов турбомашины
JP2013254584A5 (ja) 電子増幅用ガラス基板およびその製造方法並びに検出器
EA201900107A1 (ru) Газовый сенсор, мультисенсорная линейка хеморезистивного типа на основе окисленного двумерного карбида титана (максена) и способ его изготовления
JP2013057526A5 (enExample)
WO2017105281A3 (ru) Способ внутритрубной дефектоскопии стенок трубопроводов
JP2015087314A5 (enExample)
CN106546376A (zh) 压力传感器