JP2017092435A5 - - Google Patents
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- Publication number
- JP2017092435A5 JP2017092435A5 JP2016054585A JP2016054585A JP2017092435A5 JP 2017092435 A5 JP2017092435 A5 JP 2017092435A5 JP 2016054585 A JP2016054585 A JP 2016054585A JP 2016054585 A JP2016054585 A JP 2016054585A JP 2017092435 A5 JP2017092435 A5 JP 2017092435A5
- Authority
- JP
- Japan
- Prior art keywords
- consumable
- computer readable
- voltage
- piezoelectric transducer
- current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 18
- 238000006467 substitution reaction Methods 0.000 description 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/934,624 US10985078B2 (en) | 2015-11-06 | 2015-11-06 | Sensor and adjuster for a consumable |
| US14/934,624 | 2015-11-06 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017092435A JP2017092435A (ja) | 2017-05-25 |
| JP2017092435A5 true JP2017092435A5 (enExample) | 2019-04-18 |
| JP6794124B2 JP6794124B2 (ja) | 2020-12-02 |
Family
ID=58663646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016054585A Active JP6794124B2 (ja) | 2015-11-06 | 2016-03-18 | 消耗品のためのセンサおよびアジャスタ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10985078B2 (enExample) |
| JP (1) | JP6794124B2 (enExample) |
| KR (2) | KR102660512B1 (enExample) |
| CN (1) | CN106684013B (enExample) |
| SG (2) | SG10201601918VA (enExample) |
| TW (1) | TWI692046B (enExample) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6888007B2 (ja) | 2016-01-26 | 2021-06-16 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | ウェハエッジリングの持ち上げに関する解決 |
| WO2017131927A1 (en) | 2016-01-26 | 2017-08-03 | Applied Materials, Inc. | Wafer edge ring lifting solution |
| KR20180033995A (ko) * | 2016-09-27 | 2018-04-04 | 삼성전자주식회사 | 모니터링 유닛, 이를 포함하는 플라즈마 처리 장치 및 그를 이용한 반도체 칩의 제조 방법 |
| US9947517B1 (en) | 2016-12-16 | 2018-04-17 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
| US10553404B2 (en) | 2017-02-01 | 2020-02-04 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
| KR102258054B1 (ko) * | 2017-07-24 | 2021-05-28 | 램 리써치 코포레이션 | 이동가능한 에지 링 설계들 |
| US10510185B2 (en) | 2017-08-25 | 2019-12-17 | Advanced Micro Devices, Inc. | Variable rate shading |
| US11075105B2 (en) | 2017-09-21 | 2021-07-27 | Applied Materials, Inc. | In-situ apparatus for semiconductor process module |
| CN118380374A (zh) * | 2017-11-21 | 2024-07-23 | 朗姆研究公司 | 底部边缘环和中部边缘环 |
| CN109841536A (zh) * | 2017-11-29 | 2019-06-04 | 长鑫存储技术有限公司 | 边缘补偿系统、晶圆载台系统及晶圆安装方法 |
| CN111466019B (zh) | 2017-12-05 | 2025-03-11 | 朗姆研究公司 | 用于边缘环损耗补偿的系统和方法 |
| US11043400B2 (en) | 2017-12-21 | 2021-06-22 | Applied Materials, Inc. | Movable and removable process kit |
| US11201037B2 (en) | 2018-05-28 | 2021-12-14 | Applied Materials, Inc. | Process kit with adjustable tuning ring for edge uniformity control |
| US11935773B2 (en) | 2018-06-14 | 2024-03-19 | Applied Materials, Inc. | Calibration jig and calibration method |
| JP6859426B2 (ja) * | 2018-08-13 | 2021-04-14 | ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ | エッジリングの位置決めおよびセンタリング機構を組み込んだプラズマシース調整のための交換可能および／または折りたたみ式エッジリングアセンブリ |
| US11289310B2 (en) | 2018-11-21 | 2022-03-29 | Applied Materials, Inc. | Circuits for edge ring control in shaped DC pulsed plasma process device |
| WO2020180656A1 (en) * | 2019-03-06 | 2020-09-10 | Lam Research Corporation | Measurement system to measure a thickness of an adjustable edge ring for a substrate processing system |
| US11279032B2 (en) | 2019-04-11 | 2022-03-22 | Applied Materials, Inc. | Apparatus, systems, and methods for improved joint coordinate teaching accuracy of robots |
| WO2020214327A1 (en) * | 2019-04-19 | 2020-10-22 | Applied Materials, Inc. | Ring removal from processing chamber |
| US12009236B2 (en) * | 2019-04-22 | 2024-06-11 | Applied Materials, Inc. | Sensors and system for in-situ edge ring erosion monitor |
| US12165905B2 (en) | 2019-05-20 | 2024-12-10 | Applied Materials, Inc. | Process kit enclosure system |
| US10964584B2 (en) | 2019-05-20 | 2021-03-30 | Applied Materials, Inc. | Process kit ring adaptor |
| US11626305B2 (en) | 2019-06-25 | 2023-04-11 | Applied Materials, Inc. | Sensor-based correction of robot-held object |
| US11211269B2 (en) | 2019-07-19 | 2021-12-28 | Applied Materials, Inc. | Multi-object capable loadlock system |
| US11443923B2 (en) * | 2019-09-25 | 2022-09-13 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus for fabricating a semiconductor structure and method of fabricating a semiconductor structure |
| US11370114B2 (en) | 2019-12-09 | 2022-06-28 | Applied Materials, Inc. | Autoteach enclosure system |
| US12486120B2 (en) | 2020-03-23 | 2025-12-02 | Applied Materials, Inc. | Substrate processing system carrier |
| US12027397B2 (en) | 2020-03-23 | 2024-07-02 | Applied Materials, Inc | Enclosure system shelf including alignment features |
| KR20260010464A (ko) | 2020-03-23 | 2026-01-20 | 램 리써치 코포레이션 | 기판 프로세싱 시스템들에서의 중간-링 부식 보상 |
| USD954769S1 (en) | 2020-06-02 | 2022-06-14 | Applied Materials, Inc. | Enclosure system shelf |
| USD980176S1 (en) | 2020-06-02 | 2023-03-07 | Applied Materials, Inc. | Substrate processing system carrier |
| WO2022076227A1 (en) * | 2020-10-05 | 2022-04-14 | Lam Research Corporation | Moveable edge rings for plasma processing systems |
| KR102585286B1 (ko) | 2020-10-15 | 2023-10-05 | 세메스 주식회사 | 기판 처리 장치 및 소모성 부품의 마모도 측정 방법 |
| US12159795B2 (en) | 2021-03-08 | 2024-12-03 | Applied Materials, Inc. | Enclosure system having walls comprising sidewalls and radio-frequency identifier holder coupled to rear wall |
| US12077880B2 (en) * | 2021-04-28 | 2024-09-03 | Applied Materials, Inc. | In-situ film growth rate monitoring apparatus, systems, and methods for substrate processing |
| US11721569B2 (en) | 2021-06-18 | 2023-08-08 | Applied Materials, Inc. | Method and apparatus for determining a position of a ring within a process kit |
| US12067649B2 (en) | 2021-06-29 | 2024-08-20 | Advanced Micro Devices, Inc. | Per-pixel variable rate shading controls using stencil data |
| JP7229444B1 (ja) * | 2022-07-25 | 2023-02-27 | 三菱電機株式会社 | プラズマ処理装置および劣化判定方法 |
| US12528207B2 (en) | 2022-12-12 | 2026-01-20 | Applied Materials, Inc. | Carrier with rotation prevention feature |
| DE102024130855A1 (de) * | 2024-10-23 | 2026-04-23 | Festo Se & Co. Kg | System zum Ausrichten eines Ringkörpers |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001135873A (ja) * | 1999-11-08 | 2001-05-18 | Minolta Co Ltd | 圧電変換素子 |
| US6543466B2 (en) | 2000-03-02 | 2003-04-08 | Rajinder S. Gill | Mass flow controller and method of operation of mass flow controller |
| US6314991B1 (en) | 2000-03-02 | 2001-11-13 | Rajinder S. Gill | Mass flow controller |
| JP3388228B2 (ja) * | 2000-12-07 | 2003-03-17 | 株式会社半導体先端テクノロジーズ | プラズマエッチング装置、及びプラズマエッチング方法 |
| US6579151B2 (en) * | 2001-08-02 | 2003-06-17 | Taiwan Semiconductor Manufacturing Co., Ltd | Retaining ring with active edge-profile control by piezoelectric actuator/sensors |
| US6964201B2 (en) * | 2003-02-25 | 2005-11-15 | Palo Alto Research Center Incorporated | Large dimension, flexible piezoelectric ceramic tapes |
| US7001482B2 (en) * | 2003-11-12 | 2006-02-21 | Tokyo Electron Limited | Method and apparatus for improved focus ring |
| US7682985B2 (en) * | 2004-03-17 | 2010-03-23 | Lam Research Corporation | Dual doped polysilicon and silicon germanium etch |
| JP2005340693A (ja) * | 2004-05-31 | 2005-12-08 | Nec Kansai Ltd | プラズマエッチング装置 |
| US7578301B2 (en) * | 2005-03-28 | 2009-08-25 | Lam Research Corporation | Methods and apparatus for determining the endpoint of a cleaning or conditioning process in a plasma processing system |
| US7544270B2 (en) * | 2005-11-14 | 2009-06-09 | Infineon Technologies Ag | Apparatus for processing a substrate |
| US20100139374A1 (en) * | 2008-12-03 | 2010-06-10 | Dermody Daniel L | Methods for rheological testing of multiple samples and systems therefor |
| JP5657262B2 (ja) * | 2009-03-27 | 2015-01-21 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| CN102965632A (zh) * | 2011-09-01 | 2013-03-13 | 上海华力微电子有限公司 | 用于物理气相沉积腔室的靶磁场强度稳定装置及其方法 |
| CN102965623B (zh) * | 2012-11-09 | 2015-07-01 | 沈阳黎明航空发动机(集团)有限责任公司 | 一种DZ125叶片表面NiCrAlYSi涂层的修复方法 |
-
2015
- 2015-11-06 US US14/934,624 patent/US10985078B2/en active Active
-
2016
- 2016-03-11 SG SG10201601918VA patent/SG10201601918VA/en unknown
- 2016-03-11 TW TW105107506A patent/TWI692046B/zh active
- 2016-03-11 SG SG10202004091TA patent/SG10202004091TA/en unknown
- 2016-03-11 KR KR1020160029758A patent/KR102660512B1/ko active Active
- 2016-03-18 CN CN201610156777.6A patent/CN106684013B/zh active Active
- 2016-03-18 JP JP2016054585A patent/JP6794124B2/ja active Active
-
2024
- 2024-04-19 KR KR1020240052972A patent/KR102932188B1/ko active Active
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