JP2017531323A - 集積回路のモジュールのためのフレキシブル相互接続部並びにその製造方法およびその使用方法 - Google Patents

集積回路のモジュールのためのフレキシブル相互接続部並びにその製造方法およびその使用方法 Download PDF

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Publication number
JP2017531323A
JP2017531323A JP2017518344A JP2017518344A JP2017531323A JP 2017531323 A JP2017531323 A JP 2017531323A JP 2017518344 A JP2017518344 A JP 2017518344A JP 2017518344 A JP2017518344 A JP 2017518344A JP 2017531323 A JP2017531323 A JP 2017531323A
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JP
Japan
Prior art keywords
flexible
package
integrated circuit
multilayer
polymer substrate
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Pending
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JP2017518344A
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English (en)
Japanese (ja)
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JP2017531323A5 (enExample
Inventor
ダラル、ミトゥル
グプタ、サンジェイ
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MC10 Inc
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MC10 Inc
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Publication of JP2017531323A publication Critical patent/JP2017531323A/ja
Publication of JP2017531323A5 publication Critical patent/JP2017531323A5/ja
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    • H10W44/20—
    • H10W70/09—
    • H10W70/60—
    • H10W70/611—
    • H10W70/614—
    • H10W70/685—
    • H10W70/688—
    • H10W72/0198—
    • H10W72/20—
    • H10W72/30—
    • H10W72/50—
    • H10W90/00—
    • H10W90/401—
    • H10W99/00—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H10W44/209—
    • H10W44/248—
    • H10W70/099—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/07352—
    • H10W72/075—
    • H10W72/07507—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/07536—
    • H10W72/07553—
    • H10W72/07554—
    • H10W72/077—
    • H10W72/252—
    • H10W72/321—
    • H10W72/354—
    • H10W72/531—
    • H10W72/5434—
    • H10W72/5445—
    • H10W72/5522—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/701—
    • H10W72/853—
    • H10W72/874—
    • H10W72/884—
    • H10W72/932—
    • H10W72/9413—
    • H10W90/724—
    • H10W90/734—
    • H10W90/755—

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
JP2017518344A 2014-10-06 2015-10-02 集積回路のモジュールのためのフレキシブル相互接続部並びにその製造方法およびその使用方法 Pending JP2017531323A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462060147P 2014-10-06 2014-10-06
US62/060,147 2014-10-06
PCT/US2015/053647 WO2016057318A1 (en) 2014-10-06 2015-10-02 Flexible interconnects for modules of integrated circuits and methods of making and using the same

Publications (2)

Publication Number Publication Date
JP2017531323A true JP2017531323A (ja) 2017-10-19
JP2017531323A5 JP2017531323A5 (enExample) 2018-11-01

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JP2017518344A Pending JP2017531323A (ja) 2014-10-06 2015-10-02 集積回路のモジュールのためのフレキシブル相互接続部並びにその製造方法およびその使用方法

Country Status (7)

Country Link
US (2) US10297572B2 (enExample)
EP (1) EP3204963A4 (enExample)
JP (1) JP2017531323A (enExample)
KR (1) KR20170076698A (enExample)
CN (1) CN107112309A (enExample)
CA (1) CA2961035A1 (enExample)
WO (1) WO2016057318A1 (enExample)

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