JP2017531323A - 集積回路のモジュールのためのフレキシブル相互接続部並びにその製造方法およびその使用方法 - Google Patents

集積回路のモジュールのためのフレキシブル相互接続部並びにその製造方法およびその使用方法 Download PDF

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JP2017531323A
JP2017531323A JP2017518344A JP2017518344A JP2017531323A JP 2017531323 A JP2017531323 A JP 2017531323A JP 2017518344 A JP2017518344 A JP 2017518344A JP 2017518344 A JP2017518344 A JP 2017518344A JP 2017531323 A JP2017531323 A JP 2017531323A
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flexible
package
integrated circuit
multilayer
polymer substrate
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JP2017531323A5 (enExample
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ダラル、ミトゥル
グプタ、サンジェイ
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MC10 Inc
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MC10 Inc
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/755—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent insulating package substrate, interpose or RDL

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