JP2012508984A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2012508984A5 JP2012508984A5 JP2011536465A JP2011536465A JP2012508984A5 JP 2012508984 A5 JP2012508984 A5 JP 2012508984A5 JP 2011536465 A JP2011536465 A JP 2011536465A JP 2011536465 A JP2011536465 A JP 2011536465A JP 2012508984 A5 JP2012508984 A5 JP 2012508984A5
- Authority
- JP
- Japan
- Prior art keywords
- islands
- electrical interconnect
- electrical
- isolated
- elastomeric substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11362208P | 2008-11-12 | 2008-11-12 | |
| US61/113,622 | 2008-11-12 | ||
| US12/575,008 US9289132B2 (en) | 2008-10-07 | 2009-10-07 | Catheter balloon having stretchable integrated circuitry and sensor array |
| US12/575,008 | 2009-10-07 | ||
| PCT/US2009/064199 WO2010056857A2 (en) | 2008-11-12 | 2009-11-12 | Extremely stretchable electronics |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015013538A Division JP6014178B2 (ja) | 2008-11-12 | 2015-01-27 | 高度に伸縮可能な電子部品 |
| JP2015013537A Division JP5933773B2 (ja) | 2008-11-12 | 2015-01-27 | 高度に伸縮可能な電子部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012508984A JP2012508984A (ja) | 2012-04-12 |
| JP2012508984A5 true JP2012508984A5 (enExample) | 2012-12-27 |
| JP5689066B2 JP5689066B2 (ja) | 2015-03-25 |
Family
ID=44279922
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011536465A Active JP5689066B2 (ja) | 2008-11-12 | 2009-11-12 | 高度に伸縮可能な電子部品 |
| JP2015013538A Active JP6014178B2 (ja) | 2008-11-12 | 2015-01-27 | 高度に伸縮可能な電子部品 |
| JP2015013537A Active JP5933773B2 (ja) | 2008-11-12 | 2015-01-27 | 高度に伸縮可能な電子部品 |
| JP2016185527A Active JP6411423B2 (ja) | 2008-11-12 | 2016-09-23 | 高度に伸縮可能な電子部品 |
| JP2018112663A Pending JP2018174335A (ja) | 2008-11-12 | 2018-06-13 | 高度に伸縮可能な電子部品 |
Family Applications After (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015013538A Active JP6014178B2 (ja) | 2008-11-12 | 2015-01-27 | 高度に伸縮可能な電子部品 |
| JP2015013537A Active JP5933773B2 (ja) | 2008-11-12 | 2015-01-27 | 高度に伸縮可能な電子部品 |
| JP2016185527A Active JP6411423B2 (ja) | 2008-11-12 | 2016-09-23 | 高度に伸縮可能な電子部品 |
| JP2018112663A Pending JP2018174335A (ja) | 2008-11-12 | 2018-06-13 | 高度に伸縮可能な電子部品 |
Country Status (3)
| Country | Link |
|---|---|
| EP (2) | EP2902293B1 (enExample) |
| JP (5) | JP5689066B2 (enExample) |
| WO (1) | WO2010056857A2 (enExample) |
Families Citing this family (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
| JP5646492B2 (ja) | 2008-10-07 | 2014-12-24 | エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． | 伸縮可能な集積回路およびセンサアレイを有する装置 |
| US9119533B2 (en) | 2008-10-07 | 2015-09-01 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
| US9545216B2 (en) | 2011-08-05 | 2017-01-17 | Mc10, Inc. | Catheter balloon methods and apparatus employing sensing elements |
| US9123614B2 (en) | 2008-10-07 | 2015-09-01 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
| US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
| US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
| WO2011041727A1 (en) | 2009-10-01 | 2011-04-07 | Mc10, Inc. | Protective cases with integrated electronics |
| EP2681538B1 (en) | 2011-03-11 | 2019-03-06 | Mc10, Inc. | Integrated devices to facilitate quantitative assays and diagnostics |
| KR102000302B1 (ko) | 2011-05-27 | 2019-07-15 | 엠씨10, 인크 | 전자, 광학, 및/또는 기계 장치 및 시스템, 그리고 이를 제조하기 위한 방법 |
| US9757050B2 (en) | 2011-08-05 | 2017-09-12 | Mc10, Inc. | Catheter balloon employing force sensing elements |
| EP3470830A1 (en) | 2011-09-01 | 2019-04-17 | MC10 Inc. | Electronics for detection of a condition of tissue |
| JP6277130B2 (ja) | 2011-10-05 | 2018-02-14 | エムシーテン、インコーポレイテッド | 医療用の装置およびそれの製造方法 |
| US9247637B2 (en) | 2012-06-11 | 2016-01-26 | Mc10, Inc. | Strain relief structures for stretchable interconnects |
| US9226402B2 (en) | 2012-06-11 | 2015-12-29 | Mc10, Inc. | Strain isolation structures for stretchable electronics |
| US9295842B2 (en) | 2012-07-05 | 2016-03-29 | Mc10, Inc. | Catheter or guidewire device including flow sensing and use thereof |
| KR20150031324A (ko) | 2012-07-05 | 2015-03-23 | 엠씨10, 인크 | 유동 감지를 포함하는 카테터 장치 |
| WO2014058473A1 (en) | 2012-10-09 | 2014-04-17 | Mc10, Inc. | Conformal electronics integrated with apparel |
| US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
| US9706647B2 (en) | 2013-05-14 | 2017-07-11 | Mc10, Inc. | Conformal electronics including nested serpentine interconnects |
| JP2016527649A (ja) | 2013-08-05 | 2016-09-08 | エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． | 適合する電子機器を含む可撓性温度センサ |
| US10467926B2 (en) | 2013-10-07 | 2019-11-05 | Mc10, Inc. | Conformal sensor systems for sensing and analysis |
| JP6711750B2 (ja) | 2013-11-22 | 2020-06-17 | エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． | 心臓活動の検知および分析のためのコンフォーマルセンサシステム |
| CA2935372C (en) | 2014-01-06 | 2023-08-08 | Mc10, Inc. | Encapsulated conformal electronic systems and devices, and methods of making and using the same |
| US9380697B2 (en) * | 2014-01-28 | 2016-06-28 | Panasonic Intellectual Property Management Co., Ltd. | Electronic device and manufacturing method for same |
| US10485118B2 (en) | 2014-03-04 | 2019-11-19 | Mc10, Inc. | Multi-part flexible encapsulation housing for electronic devices and methods of making the same |
| US9810623B2 (en) | 2014-03-12 | 2017-11-07 | Mc10, Inc. | Quantification of a change in assay |
| US9899330B2 (en) | 2014-10-03 | 2018-02-20 | Mc10, Inc. | Flexible electronic circuits with embedded integrated circuit die |
| US10297572B2 (en) * | 2014-10-06 | 2019-05-21 | Mc10, Inc. | Discrete flexible interconnects for modules of integrated circuits |
| USD781270S1 (en) | 2014-10-15 | 2017-03-14 | Mc10, Inc. | Electronic device having antenna |
| US9380698B1 (en) * | 2014-12-05 | 2016-06-28 | VivaLnk, Inc. | Stretchable electronic patch having a foldable circuit layer |
| US10306755B2 (en) | 2014-12-08 | 2019-05-28 | Fujikura Ltd. | Stretchable board |
| WO2016134306A1 (en) | 2015-02-20 | 2016-08-25 | Mc10, Inc. | Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation |
| WO2016140961A1 (en) | 2015-03-02 | 2016-09-09 | Mc10, Inc. | Perspiration sensor |
| US10653332B2 (en) | 2015-07-17 | 2020-05-19 | Mc10, Inc. | Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers |
| US10709384B2 (en) | 2015-08-19 | 2020-07-14 | Mc10, Inc. | Wearable heat flux devices and methods of use |
| US10300371B2 (en) | 2015-10-01 | 2019-05-28 | Mc10, Inc. | Method and system for interacting with a virtual environment |
| CN108289630A (zh) | 2015-10-05 | 2018-07-17 | Mc10股份有限公司 | 用于神经调节和刺激的方法和系统 |
| US10277386B2 (en) | 2016-02-22 | 2019-04-30 | Mc10, Inc. | System, devices, and method for on-body data and power transmission |
| WO2017147053A1 (en) | 2016-02-22 | 2017-08-31 | Mc10, Inc. | System, device, and method for coupled hub and sensor node on-body acquisition of sensor information |
| CN109310340A (zh) | 2016-04-19 | 2019-02-05 | Mc10股份有限公司 | 用于测量汗液的方法和系统 |
| US20190327829A1 (en) * | 2016-07-12 | 2019-10-24 | Fujikura Ltd. | Stretchable board |
| FR3054640B1 (fr) * | 2016-07-28 | 2020-06-12 | Linxens Holding | Dispositif emetteur de lumiere |
| US10447347B2 (en) | 2016-08-12 | 2019-10-15 | Mc10, Inc. | Wireless charger and high speed data off-loader |
| JP6920040B2 (ja) | 2016-09-15 | 2021-08-18 | 日東電工株式会社 | 生体貼付用積層体 |
| JP2020107660A (ja) * | 2018-12-26 | 2020-07-09 | ソニー株式会社 | フレキシブル配線基板及び電子機器 |
| GB201907270D0 (en) * | 2019-03-14 | 2019-07-10 | Imp College Innovations Ltd | Component for a stretchable electronic device |
| JP7316538B2 (ja) * | 2019-03-20 | 2023-07-28 | 大日本印刷株式会社 | 配線基板及び配線基板の製造方法 |
| JP7767288B2 (ja) | 2019-12-23 | 2025-11-11 | アリメトリー リミテッド | 電極パッチおよび接続システム |
| US11123011B1 (en) | 2020-03-23 | 2021-09-21 | Nix, Inc. | Wearable systems, devices, and methods for measurement and analysis of body fluids |
| DE102020120642A1 (de) | 2020-08-05 | 2022-02-10 | peptech GmbH | Funktionseinheit, elektronisches Bauteil und Verfahren zur Herstellung einer Funktionseinheit |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5686697A (en) * | 1995-01-06 | 1997-11-11 | Metatech Corporation | Electrical circuit suspension system |
| JP3359910B2 (ja) * | 1998-01-22 | 2002-12-24 | フラウンホーファー−ゲゼルシャフト・ツール・フェルデルング・デル・アンゲヴァンテン・フォルシュング・アインゲトラーゲネル・フェライン | マイクロシステム及びマイクロシステムを製造する方法 |
| US6360615B1 (en) * | 2000-06-06 | 2002-03-26 | Technoskin, Llc | Wearable effect-emitting strain gauge device |
| US6775906B1 (en) * | 2000-10-20 | 2004-08-17 | Silverbrook Research Pty Ltd | Method of manufacturing an integrated circuit carrier |
| US6743982B2 (en) * | 2000-11-29 | 2004-06-01 | Xerox Corporation | Stretchable interconnects using stress gradient films |
| WO2003021679A2 (en) * | 2001-09-03 | 2003-03-13 | National Microelectronic Research Centre University College Cork - National University Of Ireland Cork | Integrated circuit structure and a method of making an integrated circuit structure |
| US7491892B2 (en) * | 2003-03-28 | 2009-02-17 | Princeton University | Stretchable and elastic interconnects |
| JP3811495B2 (ja) * | 2004-02-05 | 2006-08-23 | 松下電器産業株式会社 | アクチュエータ及びアクチュエータ用平板状電極支持体の製造方法 |
| JP2006108431A (ja) * | 2004-10-06 | 2006-04-20 | Sharp Corp | 半導体装置 |
| WO2007116344A1 (en) * | 2006-04-07 | 2007-10-18 | Koninklijke Philips Electronics N.V. | Elastically deformable integrated-circuit device |
| WO2008030960A2 (en) * | 2006-09-06 | 2008-03-13 | The Board Of Trustees Of The University Of Illinois | Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics |
-
2009
- 2009-11-12 JP JP2011536465A patent/JP5689066B2/ja active Active
- 2009-11-12 EP EP15157469.6A patent/EP2902293B1/en active Active
- 2009-11-12 WO PCT/US2009/064199 patent/WO2010056857A2/en not_active Ceased
- 2009-11-12 EP EP09826745.3A patent/EP2356680B1/en active Active
-
2015
- 2015-01-27 JP JP2015013538A patent/JP6014178B2/ja active Active
- 2015-01-27 JP JP2015013537A patent/JP5933773B2/ja active Active
-
2016
- 2016-09-23 JP JP2016185527A patent/JP6411423B2/ja active Active
-
2018
- 2018-06-13 JP JP2018112663A patent/JP2018174335A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2012508984A5 (enExample) | ||
| US10297572B2 (en) | Discrete flexible interconnects for modules of integrated circuits | |
| JP6411423B2 (ja) | 高度に伸縮可能な電子部品 | |
| US10470304B2 (en) | Flexible electronics apparatus and associated methods | |
| TWI541968B (zh) | 晶片封裝體 | |
| US20180308799A1 (en) | Flexible electronic circuits with embedded integrated circuit die and methods of making and using the same | |
| JP2009130104A5 (enExample) | ||
| WO2012071487A3 (en) | Integrated circuit device with die bonded to polymer substrate | |
| JP2011142264A5 (enExample) | ||
| RU2015136239A (ru) | Архитектура создания гибких корпусов | |
| GB2521619A (en) | An apparatus and associated methods for flexible carrier substrates | |
| JP2009110983A5 (enExample) | ||
| JP2010192747A5 (enExample) | ||
| CN105705328A (zh) | 电互连薄片 | |
| JP2018515918A5 (enExample) | ||
| JP2012015504A5 (enExample) | ||
| JP2014165238A5 (enExample) | ||
| JP2011176340A5 (enExample) | ||
| KR20150112775A (ko) | 플렉서블 기판 상의 전기 회로 | |
| EP2017883A3 (en) | Electronic device manufacturing method and electronic device | |
| EP1780791A3 (en) | Power circuit package and fabrication method | |
| WO2011141886A3 (en) | Pressure sensor | |
| JP2009231815A5 (enExample) | ||
| JP2007073976A5 (enExample) | ||
| JP2011005556A5 (enExample) |