JP5689066B2 - 高度に伸縮可能な電子部品 - Google Patents

高度に伸縮可能な電子部品 Download PDF

Info

Publication number
JP5689066B2
JP5689066B2 JP2011536465A JP2011536465A JP5689066B2 JP 5689066 B2 JP5689066 B2 JP 5689066B2 JP 2011536465 A JP2011536465 A JP 2011536465A JP 2011536465 A JP2011536465 A JP 2011536465A JP 5689066 B2 JP5689066 B2 JP 5689066B2
Authority
JP
Japan
Prior art keywords
electrical interconnects
islands
interconnect
electrical
elastomeric substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011536465A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012508984A5 (enExample
JP2012508984A (ja
Inventor
ジェイ． アローラ、ウィリアム
ジェイ． アローラ、ウィリアム
ガファリ、ローズビフ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MC10 Inc
Original Assignee
MC10 Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/575,008 external-priority patent/US9289132B2/en
Application filed by MC10 Inc filed Critical MC10 Inc
Publication of JP2012508984A publication Critical patent/JP2012508984A/ja
Publication of JP2012508984A5 publication Critical patent/JP2012508984A5/ja
Application granted granted Critical
Publication of JP5689066B2 publication Critical patent/JP5689066B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/564—Details not otherwise provided for, e.g. protection against moisture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00—Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/95—Instruments specially adapted for placement or removal of stents or stent-grafts
    • A61F2/958—Inflatable balloons for placing stents or stent-grafts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Measuring Leads Or Probes (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2011536465A 2008-11-12 2009-11-12 高度に伸縮可能な電子部品 Active JP5689066B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US11362208P 2008-11-12 2008-11-12
US61/113,622 2008-11-12
US12/575,008 US9289132B2 (en) 2008-10-07 2009-10-07 Catheter balloon having stretchable integrated circuitry and sensor array
US12/575,008 2009-10-07
PCT/US2009/064199 WO2010056857A2 (en) 2008-11-12 2009-11-12 Extremely stretchable electronics

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2015013537A Division JP5933773B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2015013538A Division JP6014178B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品

Publications (3)

Publication Number Publication Date
JP2012508984A JP2012508984A (ja) 2012-04-12
JP2012508984A5 JP2012508984A5 (enExample) 2012-12-27
JP5689066B2 true JP5689066B2 (ja) 2015-03-25

Family

ID=44279922

Family Applications (5)

Application Number Title Priority Date Filing Date
JP2011536465A Active JP5689066B2 (ja) 2008-11-12 2009-11-12 高度に伸縮可能な電子部品
JP2015013537A Active JP5933773B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2015013538A Active JP6014178B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2016185527A Active JP6411423B2 (ja) 2008-11-12 2016-09-23 高度に伸縮可能な電子部品
JP2018112663A Pending JP2018174335A (ja) 2008-11-12 2018-06-13 高度に伸縮可能な電子部品

Family Applications After (4)

Application Number Title Priority Date Filing Date
JP2015013537A Active JP5933773B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2015013538A Active JP6014178B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2016185527A Active JP6411423B2 (ja) 2008-11-12 2016-09-23 高度に伸縮可能な電子部品
JP2018112663A Pending JP2018174335A (ja) 2008-11-12 2018-06-13 高度に伸縮可能な電子部品

Country Status (3)

Country Link
EP (2) EP2902293B1 (enExample)
JP (5) JP5689066B2 (enExample)
WO (1) WO2010056857A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12178580B2 (en) 2019-12-23 2024-12-31 Alimetry Limited Electrode patch and connection system

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US9119533B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US9545216B2 (en) 2011-08-05 2017-01-17 Mc10, Inc. Catheter balloon methods and apparatus employing sensing elements
US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
EP2349440B1 (en) 2008-10-07 2019-08-21 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
EP2681538B1 (en) 2011-03-11 2019-03-06 Mc10, Inc. Integrated devices to facilitate quantitative assays and diagnostics
WO2012166686A2 (en) 2011-05-27 2012-12-06 Mc10, Inc. Electronic, optical and/or mechanical apparatus and systems and methods for fabricating same
US9757050B2 (en) 2011-08-05 2017-09-12 Mc10, Inc. Catheter balloon employing force sensing elements
JP6129838B2 (ja) 2011-09-01 2017-05-17 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 組織の状態を検出する電子装置
DE112012004146T5 (de) 2011-10-05 2014-11-06 Mc10, Inc. Herzkatheter mit Verwendung oberflächentreuer Elektronik zur Abbildung
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
US9247637B2 (en) 2012-06-11 2016-01-26 Mc10, Inc. Strain relief structures for stretchable interconnects
JP2015521894A (ja) 2012-07-05 2015-08-03 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 流量センシングを含むカテーテルデバイス
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
EP2906960A4 (en) 2012-10-09 2016-06-15 Mc10 Inc CONFORMING ELECTRONICS INTEGRATED WITH A DRESS
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
US9372123B2 (en) 2013-08-05 2016-06-21 Mc10, Inc. Flexible temperature sensor including conformable electronics
US10467926B2 (en) 2013-10-07 2019-11-05 Mc10, Inc. Conformal sensor systems for sensing and analysis
CA2930740A1 (en) 2013-11-22 2015-05-28 Mc10, Inc. Conformal sensor systems for sensing and analysis of cardiac activity
EP3092661A4 (en) 2014-01-06 2017-09-27 Mc10, Inc. Encapsulated conformal electronic systems and devices, and methods of making and using the same
US9380697B2 (en) * 2014-01-28 2016-06-28 Panasonic Intellectual Property Management Co., Ltd. Electronic device and manufacturing method for same
CA2940539C (en) 2014-03-04 2022-10-04 Mc10, Inc. Multi-part flexible encapsulation housing for electronic devices
TW201602549A (zh) 2014-03-12 2016-01-16 Ｍｃ１０公司 試驗中變化之定量技術
US9899330B2 (en) 2014-10-03 2018-02-20 Mc10, Inc. Flexible electronic circuits with embedded integrated circuit die
US10297572B2 (en) 2014-10-06 2019-05-21 Mc10, Inc. Discrete flexible interconnects for modules of integrated circuits
USD781270S1 (en) 2014-10-15 2017-03-14 Mc10, Inc. Electronic device having antenna
US9380698B1 (en) * 2014-12-05 2016-06-28 VivaLnk, Inc. Stretchable electronic patch having a foldable circuit layer
US10306755B2 (en) 2014-12-08 2019-05-28 Fujikura Ltd. Stretchable board
US10477354B2 (en) 2015-02-20 2019-11-12 Mc10, Inc. Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation
US10398343B2 (en) 2015-03-02 2019-09-03 Mc10, Inc. Perspiration sensor
WO2017015000A1 (en) 2015-07-17 2017-01-26 Mc10, Inc. Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
US10709384B2 (en) 2015-08-19 2020-07-14 Mc10, Inc. Wearable heat flux devices and methods of use
WO2017059215A1 (en) 2015-10-01 2017-04-06 Mc10, Inc. Method and system for interacting with a virtual environment
EP3359031A4 (en) 2015-10-05 2019-05-22 Mc10, Inc. METHOD AND SYSTEM FOR NEUROMODULATION AND STIMULATION
US10673280B2 (en) 2016-02-22 2020-06-02 Mc10, Inc. System, device, and method for coupled hub and sensor node on-body acquisition of sensor information
CN115175014A (zh) 2016-02-22 2022-10-11 美谛达解决方案公司 贴身传感器系统
CN109310340A (zh) 2016-04-19 2019-02-05 Mc10股份有限公司 用于测量汗液的方法和系统
US20190327829A1 (en) * 2016-07-12 2019-10-24 Fujikura Ltd. Stretchable board
FR3054640B1 (fr) * 2016-07-28 2020-06-12 Linxens Holding Dispositif emetteur de lumiere
US10447347B2 (en) 2016-08-12 2019-10-15 Mc10, Inc. Wireless charger and high speed data off-loader
JP6920040B2 (ja) 2016-09-15 2021-08-18 日東電工株式会社 生体貼付用積層体
JP2020107660A (ja) * 2018-12-26 2020-07-09 ソニー株式会社 フレキシブル配線基板及び電子機器
GB201907270D0 (en) * 2019-03-14 2019-07-10 Imp College Innovations Ltd Component for a stretchable electronic device
JP7316538B2 (ja) * 2019-03-20 2023-07-28 大日本印刷株式会社 配線基板及び配線基板の製造方法
US11123011B1 (en) 2020-03-23 2021-09-21 Nix, Inc. Wearable systems, devices, and methods for measurement and analysis of body fluids
DE102020120642A1 (de) 2020-08-05 2022-02-10 peptech GmbH Funktionseinheit, elektronisches Bauteil und Verfahren zur Herstellung einer Funktionseinheit

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5686697A (en) * 1995-01-06 1997-11-11 Metatech Corporation Electrical circuit suspension system
JP3359910B2 (ja) * 1998-01-22 2002-12-24 フラウンホーファー−ゲゼルシャフト・ツール・フェルデルング・デル・アンゲヴァンテン・フォルシュング・アインゲトラーゲネル・フェライン マイクロシステム及びマイクロシステムを製造する方法
US6360615B1 (en) * 2000-06-06 2002-03-26 Technoskin, Llc Wearable effect-emitting strain gauge device
US6775906B1 (en) * 2000-10-20 2004-08-17 Silverbrook Research Pty Ltd Method of manufacturing an integrated circuit carrier
US6743982B2 (en) * 2000-11-29 2004-06-01 Xerox Corporation Stretchable interconnects using stress gradient films
WO2003021679A2 (en) * 2001-09-03 2003-03-13 National Microelectronic Research Centre University College Cork - National University Of Ireland Cork Integrated circuit structure and a method of making an integrated circuit structure
US7491892B2 (en) * 2003-03-28 2009-02-17 Princeton University Stretchable and elastic interconnects
JP3811495B2 (ja) * 2004-02-05 2006-08-23 松下電器産業株式会社 アクチュエータ及びアクチュエータ用平板状電極支持体の製造方法
JP2006108431A (ja) * 2004-10-06 2006-04-20 Sharp Corp 半導体装置
US20090283891A1 (en) * 2006-04-07 2009-11-19 Koninklijke Philips Electronics N.V. Elastically deformable integrated-circuit device
EP2064710A4 (en) * 2006-09-06 2011-05-04 Univ Illinois CONTROLLED BUCKET STRUCTURES IN SEMICONDUCTOR CONNECTIONS AND NANOMEMBRANES FOR EXPANDABLE ELECTRONIC ARTICLES

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12178580B2 (en) 2019-12-23 2024-12-31 Alimetry Limited Electrode patch and connection system
US12245862B2 (en) 2019-12-23 2025-03-11 Alimetry Limited Electrode patch and connection system

Also Published As

Publication number Publication date
EP2902293B1 (en) 2020-03-04
WO2010056857A3 (en) 2010-07-15
HK1161421A1 (en) 2012-08-24
JP2018174335A (ja) 2018-11-08
EP2356680A4 (en) 2012-03-14
JP2015097290A (ja) 2015-05-21
EP2902293A3 (en) 2015-10-14
JP2015111713A (ja) 2015-06-18
EP2902293A2 (en) 2015-08-05
WO2010056857A2 (en) 2010-05-20
EP2356680B1 (en) 2015-04-08
JP2016213515A (ja) 2016-12-15
EP2356680A2 (en) 2011-08-17
JP6014178B2 (ja) 2016-10-25
JP2012508984A (ja) 2012-04-12
JP6411423B2 (ja) 2018-10-24
JP5933773B2 (ja) 2016-06-15

Similar Documents

Publication Publication Date Title
JP5689066B2 (ja) 高度に伸縮可能な電子部品
US9894757B2 (en) Extremely stretchable electronics
US8484836B2 (en) Flexible network
JP6537043B2 (ja) 伸張可能及び折畳み可能な電子デバイス
EP2712491B1 (en) Flexible electronic structure
JP2010503238A5 (enExample)
KR20150069079A (ko) 신축성 소자 및 그의 제조방법
CA2780747C (en) Extremely stretchable electronics
US20230403792A1 (en) Stretchable/conformable electronic and optoelectronic circuits, methods, and applications
JP2012508984A5 (enExample)
CN101416302A (zh) 可弹性变形的集成电路器件
WO2006035786A1 (ja) 面状素子モジュールおよびその製造方法並びに面状素子装置
JP2022545952A (ja) 可変剛性モジュール
CN110987042A (zh) 一种柔性可拉伸传感器的制作方法
KR100809284B1 (ko) 촉각센서 어레이 및 그 제조방법
HK1161421B (en) Extremely stretchable electronics
Rogers Materials and mechanics for stretchable electronics-from electronic eye cameras to conformal brain monitors
Li et al. Mechanics analysis of two-dimensionally prestrained elastomeric thin film for stretchable electronics

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20120106

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121108

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20121108

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140117

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140121

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20140418

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20140425

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20140521

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20140528

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140722

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150113

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150127

R150 Certificate of patent or registration of utility model

Ref document number: 5689066

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250