JP5689066B2 - 高度に伸縮可能な電子部品 - Google Patents

高度に伸縮可能な電子部品 Download PDF

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Publication number
JP5689066B2
JP5689066B2 JP2011536465A JP2011536465A JP5689066B2 JP 5689066 B2 JP5689066 B2 JP 5689066B2 JP 2011536465 A JP2011536465 A JP 2011536465A JP 2011536465 A JP2011536465 A JP 2011536465A JP 5689066 B2 JP5689066 B2 JP 5689066B2
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JP
Japan
Prior art keywords
electrical interconnects
islands
interconnect
electrical
elastomeric substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011536465A
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English (en)
Japanese (ja)
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JP2012508984A5 (enExample
JP2012508984A (ja
Inventor
ジェイ． アローラ、ウィリアム
ジェイ． アローラ、ウィリアム
ガファリ、ローズビフ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MC10 Inc
Original Assignee
MC10 Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/575,008 external-priority patent/US9289132B2/en
Application filed by MC10 Inc filed Critical MC10 Inc
Publication of JP2012508984A publication Critical patent/JP2012508984A/ja
Publication of JP2012508984A5 publication Critical patent/JP2012508984A5/ja
Application granted granted Critical
Publication of JP5689066B2 publication Critical patent/JP5689066B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/43—Layouts of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00—Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/95—Instruments specially adapted for placement or removal of stents or stent-grafts
    • A61F2/958—Inflatable balloons for placing stents or stent-grafts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Measuring Leads Or Probes (AREA)
JP2011536465A 2008-11-12 2009-11-12 高度に伸縮可能な電子部品 Active JP5689066B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US11362208P 2008-11-12 2008-11-12
US61/113,622 2008-11-12
US12/575,008 US9289132B2 (en) 2008-10-07 2009-10-07 Catheter balloon having stretchable integrated circuitry and sensor array
US12/575,008 2009-10-07
PCT/US2009/064199 WO2010056857A2 (en) 2008-11-12 2009-11-12 Extremely stretchable electronics

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2015013538A Division JP6014178B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2015013537A Division JP5933773B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品

Publications (3)

Publication Number Publication Date
JP2012508984A JP2012508984A (ja) 2012-04-12
JP2012508984A5 JP2012508984A5 (enExample) 2012-12-27
JP5689066B2 true JP5689066B2 (ja) 2015-03-25

Family

ID=44279922

Family Applications (5)

Application Number Title Priority Date Filing Date
JP2011536465A Active JP5689066B2 (ja) 2008-11-12 2009-11-12 高度に伸縮可能な電子部品
JP2015013538A Active JP6014178B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2015013537A Active JP5933773B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2016185527A Active JP6411423B2 (ja) 2008-11-12 2016-09-23 高度に伸縮可能な電子部品
JP2018112663A Pending JP2018174335A (ja) 2008-11-12 2018-06-13 高度に伸縮可能な電子部品

Family Applications After (4)

Application Number Title Priority Date Filing Date
JP2015013538A Active JP6014178B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2015013537A Active JP5933773B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2016185527A Active JP6411423B2 (ja) 2008-11-12 2016-09-23 高度に伸縮可能な電子部品
JP2018112663A Pending JP2018174335A (ja) 2008-11-12 2018-06-13 高度に伸縮可能な電子部品

Country Status (3)

Country Link
EP (2) EP2902293B1 (enExample)
JP (5) JP5689066B2 (enExample)
WO (1) WO2010056857A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12178580B2 (en) 2019-12-23 2024-12-31 Alimetry Limited Electrode patch and connection system

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JP5646492B2 (ja) 2008-10-07 2014-12-24 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 伸縮可能な集積回路およびセンサアレイを有する装置
US9119533B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US9545216B2 (en) 2011-08-05 2017-01-17 Mc10, Inc. Catheter balloon methods and apparatus employing sensing elements
US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
EP2681538B1 (en) 2011-03-11 2019-03-06 Mc10, Inc. Integrated devices to facilitate quantitative assays and diagnostics
KR102000302B1 (ko) 2011-05-27 2019-07-15 엠씨10, 인크 전자, 광학, 및/또는 기계 장치 및 시스템, 그리고 이를 제조하기 위한 방법
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EP3470830A1 (en) 2011-09-01 2019-04-17 MC10 Inc. Electronics for detection of a condition of tissue
JP6277130B2 (ja) 2011-10-05 2018-02-14 エムシーテン、インコーポレイテッド 医療用の装置およびそれの製造方法
US9247637B2 (en) 2012-06-11 2016-01-26 Mc10, Inc. Strain relief structures for stretchable interconnects
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
KR20150031324A (ko) 2012-07-05 2015-03-23 엠씨10, 인크 유동 감지를 포함하는 카테터 장치
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US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
JP2016527649A (ja) 2013-08-05 2016-09-08 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 適合する電子機器を含む可撓性温度センサ
US10467926B2 (en) 2013-10-07 2019-11-05 Mc10, Inc. Conformal sensor systems for sensing and analysis
JP6711750B2 (ja) 2013-11-22 2020-06-17 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 心臓活動の検知および分析のためのコンフォーマルセンサシステム
CA2935372C (en) 2014-01-06 2023-08-08 Mc10, Inc. Encapsulated conformal electronic systems and devices, and methods of making and using the same
US9380697B2 (en) * 2014-01-28 2016-06-28 Panasonic Intellectual Property Management Co., Ltd. Electronic device and manufacturing method for same
US10485118B2 (en) 2014-03-04 2019-11-19 Mc10, Inc. Multi-part flexible encapsulation housing for electronic devices and methods of making the same
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Publication number Priority date Publication date Assignee Title
US12178580B2 (en) 2019-12-23 2024-12-31 Alimetry Limited Electrode patch and connection system
US12245862B2 (en) 2019-12-23 2025-03-11 Alimetry Limited Electrode patch and connection system

Also Published As

Publication number Publication date
EP2356680A2 (en) 2011-08-17
JP2015111713A (ja) 2015-06-18
EP2902293B1 (en) 2020-03-04
JP2018174335A (ja) 2018-11-08
JP2016213515A (ja) 2016-12-15
JP6411423B2 (ja) 2018-10-24
EP2356680A4 (en) 2012-03-14
EP2356680B1 (en) 2015-04-08
WO2010056857A3 (en) 2010-07-15
JP6014178B2 (ja) 2016-10-25
EP2902293A3 (en) 2015-10-14
JP2015097290A (ja) 2015-05-21
JP2012508984A (ja) 2012-04-12
WO2010056857A2 (en) 2010-05-20
EP2902293A2 (en) 2015-08-05
JP5933773B2 (ja) 2016-06-15
HK1161421A1 (en) 2012-08-24

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