JP5689066B2 - 高度に伸縮可能な電子部品 - Google Patents

高度に伸縮可能な電子部品 Download PDF

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Publication number
JP5689066B2
JP5689066B2 JP2011536465A JP2011536465A JP5689066B2 JP 5689066 B2 JP5689066 B2 JP 5689066B2 JP 2011536465 A JP2011536465 A JP 2011536465A JP 2011536465 A JP2011536465 A JP 2011536465A JP 5689066 B2 JP5689066 B2 JP 5689066B2
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JP
Japan
Prior art keywords
electrical interconnects
islands
interconnect
electrical
elastomeric substrate
Prior art date
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Active
Application number
JP2011536465A
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English (en)
Japanese (ja)
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JP2012508984A5 (enExample
JP2012508984A (ja
Inventor
ジェイ. アローラ、ウィリアム
ジェイ. アローラ、ウィリアム
ガファリ、ローズビフ
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MC10 Inc
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MC10 Inc
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Publication date
Priority claimed from US12/575,008 external-priority patent/US9289132B2/en
Application filed by MC10 Inc filed Critical MC10 Inc
Publication of JP2012508984A publication Critical patent/JP2012508984A/ja
Publication of JP2012508984A5 publication Critical patent/JP2012508984A5/ja
Application granted granted Critical
Publication of JP5689066B2 publication Critical patent/JP5689066B2/ja
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/0283Stretchable printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H10W20/43
    • H10W42/00
    • H10W70/688
    • H10W72/00
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/95Instruments specially adapted for placement or removal of stents or stent-grafts
    • A61F2/958Inflatable balloons for placing stents or stent-grafts
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Measuring Leads Or Probes (AREA)
JP2011536465A 2008-11-12 2009-11-12 高度に伸縮可能な電子部品 Active JP5689066B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US11362208P 2008-11-12 2008-11-12
US61/113,622 2008-11-12
US12/575,008 2009-10-07
US12/575,008 US9289132B2 (en) 2008-10-07 2009-10-07 Catheter balloon having stretchable integrated circuitry and sensor array
PCT/US2009/064199 WO2010056857A2 (en) 2008-11-12 2009-11-12 Extremely stretchable electronics

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2015013538A Division JP6014178B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2015013537A Division JP5933773B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品

Publications (3)

Publication Number Publication Date
JP2012508984A JP2012508984A (ja) 2012-04-12
JP2012508984A5 JP2012508984A5 (enExample) 2012-12-27
JP5689066B2 true JP5689066B2 (ja) 2015-03-25

Family

ID=44279922

Family Applications (5)

Application Number Title Priority Date Filing Date
JP2011536465A Active JP5689066B2 (ja) 2008-11-12 2009-11-12 高度に伸縮可能な電子部品
JP2015013537A Active JP5933773B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2015013538A Active JP6014178B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2016185527A Active JP6411423B2 (ja) 2008-11-12 2016-09-23 高度に伸縮可能な電子部品
JP2018112663A Pending JP2018174335A (ja) 2008-11-12 2018-06-13 高度に伸縮可能な電子部品

Family Applications After (4)

Application Number Title Priority Date Filing Date
JP2015013537A Active JP5933773B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2015013538A Active JP6014178B2 (ja) 2008-11-12 2015-01-27 高度に伸縮可能な電子部品
JP2016185527A Active JP6411423B2 (ja) 2008-11-12 2016-09-23 高度に伸縮可能な電子部品
JP2018112663A Pending JP2018174335A (ja) 2008-11-12 2018-06-13 高度に伸縮可能な電子部品

Country Status (3)

Country Link
EP (2) EP2356680B1 (enExample)
JP (5) JP5689066B2 (enExample)
WO (1) WO2010056857A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12178580B2 (en) 2019-12-23 2024-12-31 Alimetry Limited Electrode patch and connection system

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US9119533B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
EP2349440B1 (en) 2008-10-07 2019-08-21 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US9723122B2 (en) 2009-10-01 2017-08-01 Mc10, Inc. Protective cases with integrated electronics
EP2681538B1 (en) 2011-03-11 2019-03-06 Mc10, Inc. Integrated devices to facilitate quantitative assays and diagnostics
JP2014523633A (ja) 2011-05-27 2014-09-11 エムシー10 インコーポレイテッド 電子的、光学的、且つ/又は機械的装置及びシステム並びにこれらの装置及びシステムを製造する方法
US9757050B2 (en) 2011-08-05 2017-09-12 Mc10, Inc. Catheter balloon employing force sensing elements
WO2013022853A1 (en) 2011-08-05 2013-02-14 Mc10, Inc. Catheter balloon methods and apparatus employing sensing elements
EP3470830A1 (en) 2011-09-01 2019-04-17 MC10 Inc. Electronics for detection of a condition of tissue
JP6277130B2 (ja) 2011-10-05 2018-02-14 エムシーテン、インコーポレイテッド 医療用の装置およびそれの製造方法
US9247637B2 (en) 2012-06-11 2016-01-26 Mc10, Inc. Strain relief structures for stretchable interconnects
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
JP2015521894A (ja) 2012-07-05 2015-08-03 エムシー10 インコーポレイテッドMc10,Inc. 流量センシングを含むカテーテルデバイス
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
CN105008949A (zh) 2012-10-09 2015-10-28 Mc10股份有限公司 与服装整合的保形电子装置
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
CA2920485A1 (en) 2013-08-05 2015-02-12 Mc10, Inc. Flexible temperature sensor including conformable electronics
CN105705093A (zh) 2013-10-07 2016-06-22 Mc10股份有限公司 用于感测和分析的适形传感器系统
CN105813545A (zh) 2013-11-22 2016-07-27 Mc10股份有限公司 用于感测和分析心搏的适形传感器系统
JP6549150B2 (ja) 2014-01-06 2019-07-24 エムシー10 インコーポレイテッドMc10,Inc. コンフォーマル電子デバイスの封入方法
US9380697B2 (en) * 2014-01-28 2016-06-28 Panasonic Intellectual Property Management Co., Ltd. Electronic device and manufacturing method for same
WO2015134588A1 (en) 2014-03-04 2015-09-11 Mc10, Inc. Multi-part flexible encapsulation housing for electronic devices
CN106062544B (zh) 2014-03-12 2020-07-07 Mc10股份有限公司 对测定变化的量化
US9899330B2 (en) 2014-10-03 2018-02-20 Mc10, Inc. Flexible electronic circuits with embedded integrated circuit die
US10297572B2 (en) * 2014-10-06 2019-05-21 Mc10, Inc. Discrete flexible interconnects for modules of integrated circuits
USD781270S1 (en) 2014-10-15 2017-03-14 Mc10, Inc. Electronic device having antenna
US9380698B1 (en) * 2014-12-05 2016-06-28 VivaLnk, Inc. Stretchable electronic patch having a foldable circuit layer
WO2016093210A1 (ja) * 2014-12-08 2016-06-16 株式会社フジクラ 伸縮性基板
US10477354B2 (en) 2015-02-20 2019-11-12 Mc10, Inc. Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12178580B2 (en) 2019-12-23 2024-12-31 Alimetry Limited Electrode patch and connection system
US12245862B2 (en) 2019-12-23 2025-03-11 Alimetry Limited Electrode patch and connection system

Also Published As

Publication number Publication date
WO2010056857A2 (en) 2010-05-20
JP2015111713A (ja) 2015-06-18
EP2356680A4 (en) 2012-03-14
JP5933773B2 (ja) 2016-06-15
WO2010056857A3 (en) 2010-07-15
JP2016213515A (ja) 2016-12-15
EP2902293A2 (en) 2015-08-05
EP2356680A2 (en) 2011-08-17
JP6014178B2 (ja) 2016-10-25
JP2018174335A (ja) 2018-11-08
JP2015097290A (ja) 2015-05-21
EP2356680B1 (en) 2015-04-08
EP2902293B1 (en) 2020-03-04
JP2012508984A (ja) 2012-04-12
JP6411423B2 (ja) 2018-10-24
EP2902293A3 (en) 2015-10-14
HK1161421A1 (en) 2012-08-24

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