JP2007073976A5 - - Google Patents

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Publication number
JP2007073976A5
JP2007073976A5 JP2006260304A JP2006260304A JP2007073976A5 JP 2007073976 A5 JP2007073976 A5 JP 2007073976A5 JP 2006260304 A JP2006260304 A JP 2006260304A JP 2006260304 A JP2006260304 A JP 2006260304A JP 2007073976 A5 JP2007073976 A5 JP 2007073976A5
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JP
Japan
Prior art keywords
thin film
film transistor
semiconductor device
wiring layers
thru
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006260304A
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English (en)
Japanese (ja)
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JP4777203B2 (ja
JP2007073976A (ja
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Publication date
Application filed filed Critical
Priority to JP2006260304A priority Critical patent/JP4777203B2/ja
Priority claimed from JP2006260304A external-priority patent/JP4777203B2/ja
Publication of JP2007073976A publication Critical patent/JP2007073976A/ja
Publication of JP2007073976A5 publication Critical patent/JP2007073976A5/ja
Application granted granted Critical
Publication of JP4777203B2 publication Critical patent/JP4777203B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2006260304A 2005-01-28 2006-09-26 半導体装置 Expired - Fee Related JP4777203B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006260304A JP4777203B2 (ja) 2005-01-28 2006-09-26 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005022214 2005-01-28
JP2005022214 2005-01-28
JP2006260304A JP4777203B2 (ja) 2005-01-28 2006-09-26 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2006017033A Division JP4777078B2 (ja) 2005-01-28 2006-01-26 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2007073976A JP2007073976A (ja) 2007-03-22
JP2007073976A5 true JP2007073976A5 (enExample) 2010-04-15
JP4777203B2 JP4777203B2 (ja) 2011-09-21

Family

ID=37935104

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006260304A Expired - Fee Related JP4777203B2 (ja) 2005-01-28 2006-09-26 半導体装置

Country Status (1)

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JP (1) JP4777203B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI626744B (zh) * 2008-07-31 2018-06-11 半導體能源研究所股份有限公司 半導體裝置及半導體裝置的製造方法
JP5616038B2 (ja) * 2008-07-31 2014-10-29 株式会社半導体エネルギー研究所 半導体装置の作製方法
US8945981B2 (en) * 2008-07-31 2015-02-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
TWI500160B (zh) * 2008-08-08 2015-09-11 Semiconductor Energy Lab 半導體裝置及其製造方法
JP5480554B2 (ja) * 2008-08-08 2014-04-23 株式会社半導体エネルギー研究所 半導体装置
KR101634411B1 (ko) 2008-10-31 2016-06-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 구동 회로, 표시 장치 및 전자 장치
US8841661B2 (en) * 2009-02-25 2014-09-23 Semiconductor Energy Laboratory Co., Ltd. Staggered oxide semiconductor TFT semiconductor device and manufacturing method thereof
KR101107158B1 (ko) * 2009-07-10 2012-01-25 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 그 제조 방법
KR102113064B1 (ko) 2009-09-16 2020-05-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 이의 제조 방법
KR102106817B1 (ko) * 2018-10-30 2020-05-14 재단법인대구경북과학기술원 색순도 조절 다층 구조 필터 및 이의 제조 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002100621A (ja) * 2000-09-20 2002-04-05 Seiko Epson Corp 成膜装置、成膜方法、これにより成膜された基板及びこの基板を用いた液晶装置
JP2003133691A (ja) * 2001-10-22 2003-05-09 Seiko Epson Corp 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、並びに非接触型カード媒体
JP4566578B2 (ja) * 2003-02-24 2010-10-20 株式会社半導体エネルギー研究所 薄膜集積回路の作製方法

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